CN1920587A - Multilayer wiring substrate and BVH broken wire detection method - Google Patents
Multilayer wiring substrate and BVH broken wire detection method Download PDFInfo
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- CN1920587A CN1920587A CN200610094310.XA CN200610094310A CN1920587A CN 1920587 A CN1920587 A CN 1920587A CN 200610094310 A CN200610094310 A CN 200610094310A CN 1920587 A CN1920587 A CN 1920587A
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Abstract
The present invention relates to a multilayer wiring board, and method of checking for BVH disconnection, which can easily check for disconnections of a BVH on a multilayer wiring board. A special pattern is formed on an unused part 54 of the multilayer wiring board. The special pattern consists of a specified BVH 71, passing through one of a pair of surface layers to a specified substrate 62 and having a first diameter, an annular conductor foil 72 formed concentric with the specified BVH on respective internal layers from one of the surface layers to the specified substrate 62, and a through hole 73 passing through the other of the pair of surface layers to the specified substrate 62, at a position corresponding to the position where the specified BVH, is formed. The annular conductor foil 72 has inside and outside diameters larger than the first diameter. The through hole 73 has a second diameter that is larger than the outside diameter of the annular conductor foil.
Description
Technical field
The present invention relates to a kind of BVH (Blind Via Hole that checks multi-layered wiring board; Buried ViaHole) Duan Xian method particularly relates to the method for the BVH broken string on the printed base plate that uses on the protecting secondary battery assembly of checking the holding circuit possess the rechargeable battery (secondary cell) that is used to protect lithium battery etc.
Background technology
In secondary cell, particularly owing to the unsuitable over-discharge can of lithium battery, overcharge, so be used to detect over-discharge state, surcharge state, the holding circuit of protecting secondary cell not to be in the over-discharge state and the state that overcharges is indispensable.Therefore, this secondary battery protection circuit possesses the over-discharge can of preventing mechanism and the mechanism that overcharges.Such secondary battery protection circuit is disclosed in for example patent documentation 1 (speciallyying permit No. 2872365 communique) and patent documentation 2 (spy opens the 2001-169477 communique).Usually, be to use IC chip (protection IC) as secondary battery protection circuit.
Such secondary battery protection circuit (protection IC) is to be assemblied in printed base plate (circuit substrate) to go up (for example, opening the 2001-268808 communique with reference to patent documentation 3-spy).On printed base plate, also be equipped with power MOSFET (Power IC) or a plurality of electronic components such as resistor and capacitor as discharge control switch and charging control switch action.The combination of printed base plate, secondary battery protection circuit, power MOSFET and a plurality of electronic components is called the protecting secondary battery assembly.
Be to use IVH (InterstitialVia Hole) or form the multi-layered wiring board of above-mentioned BVH as the printed base plate that uses on such protecting secondary battery assembly.In addition, generally not only to be that 1 protecting secondary battery assembly is made 1 printed base plate as multi-layered wiring board, but once make a plurality of printed base plates for a plurality of protecting secondary battery assemblies.
As everyone knows, multi-layered wiring board possess with many insulating material (matrix material) stacked structure, with the matrix material cambium layer that is clipped in the middle.Such multi-layered wiring board possesses: at a plurality of conductive patterns of each layer formation; And be used for a plurality of BVH that to be electrically connected between these conductive patterns.Multi-layered wiring board is divided into: the use part that is in the central portion that is equipped with a plurality of printed base plates; And the not use part that is in the substrate housing.On existing multi-layered wiring board, use part integral body to cover by Copper Foil.In addition, because the thickness of the insulating material (matrix material) that clips between each layer is extremely thin, thus can have an X-rayed, so-called as seen transparent.
As mentioned above, multi-layered wiring board possess with many insulating material (matrix material) stacked structure.Therefore, many matrix materials are being carried out when stacked, departing from from normal condition sometimes at the conductive pattern of each layer formation and the position relation that connects between the BVH of interlayer.If such departing from takes place, breaks on BVH sometimes.
But, on existing multi-layered wiring board, because it does not use part integral body to be covered with by Copper Foil, so can not with the naked eye confirm offset relation between the BVH of the conductive pattern of each layer and interlayer at an easy rate.
Summary of the invention
Therefore, problem of the present invention is to provide a kind of multi-layered wiring board and the BVH broken wire detection method that can check the broken string of the BVH on the multi-layered wiring board at an easy rate.
According to the 1st scheme of the present invention, it is that many matrix materials 61～63 have been carried out stacked multi-layered wiring board 50, this multi-layered wiring board has at a plurality of conductive patterns of each layer formation and in order to be electrically connected between will these a plurality of conductive patterns and connect a plurality of BVH of interlayer, this multi-layered wiring board is divided into use part 52 and does not use part 54, above-mentioned multi-layered wiring board possesses the specific matrix material 62 that 2 internal layers being adjoined each other clip, and can obtain having formed the multi-layered wiring board of special pattern in the above-mentioned part of using.Above-mentioned special pattern comprises: specific BVH71, its side from a pair of top layer penetrate into above-mentioned specific matrix material and have the 1st diameter D1; Ring-shaped conductor paper tinsel 72, it to form at each internal layer from the side on above-mentioned a pair of top layer to above-mentioned specific matrix material with one heart, has inside diameter D 2 and the outer diameter D 3 bigger than above-mentioned the 1st diameter in this specific BVH; And through hole 73, its with the corresponding position, position that has formed above-mentioned specific BVH, penetrate into above-mentioned specific matrix material from the opposing party on above-mentioned a pair of top layer, and have the 2nd diameter D4 bigger than the external diameter of above-mentioned ring-shaped conductor paper tinsel.
On the multi-layered wiring board according to the 1st scheme of the invention described above, the inside diameter D 2 of above-mentioned ring-shaped conductor paper tinsel 72 preferably is set at the size of above-mentioned the 1st diameter D1 being considered to have added tolerance.In addition, above-mentioned conductor foil can be made of for example Copper Foil.And then, above-mentioned special pattern preferably on the above-mentioned diagonal line that does not use part 54 2 relative local formation.
According to the 2nd scheme of the present invention, its be with many matrix materials 61～63 stacked multi-layered wiring board, above-mentioned multi-layered wiring board possesses: at a plurality of conductive patterns of each layer formation and in order to be electrically connected between will these a plurality of conductive patterns and connect a plurality of BVH of interlayer, this multi-layered wiring board is divided into use part 52 and does not use part 54, and a plurality of layers are divided into: a plurality of internal layer 50-2, the 50-3 that form in the inside of above-mentioned multi-layered wiring board; And the 1st and the 2nd top layer 50-4, the 50-1 that form on two surfaces of above-mentioned multi-layered wiring board, above-mentioned multi-layered wiring board possesses the specific matrix material 62 that 2 above-mentioned internal layers being adjoined each other clip, and can obtain forming the multi-layered wiring board of the 1st and the 2nd different mutually special patterns in the above-mentioned part of using.Above-mentioned the 1st special pattern comprises: the 1st specific BVH71, and it penetrates into above-mentioned specific matrix material and has the 1st diameter D1 from above-mentioned the 1st top layer 50-4; The 1st ring-shaped conductor paper tinsel 72, it to form at each internal layer from above-mentioned the 1st top layer 50-4 to above-mentioned specific matrix material with one heart, has inside diameter D 2 and the outer diameter D 3 bigger than above-mentioned the 1st diameter in the 1st specific BVH; And the 1st through hole 73, its with the corresponding position, position that has formed the above-mentioned the 1st specific BVH, penetrate into above-mentioned specific matrix material from above-mentioned the 2nd top layer 50-1, and have the 2nd diameter D4 bigger than the external diameter of above-mentioned the 1st ring-shaped conductor paper tinsel.Above-mentioned the 2nd special pattern comprises: the 2nd specific BVH71, and it penetrates into above-mentioned specific matrix material from above-mentioned the 2nd top layer 50-1, and has above-mentioned the 1st diameter D1; The 2nd ring-shaped conductor paper tinsel 72, it to form at each internal layer from above-mentioned the 2nd top layer 50-1 to above-mentioned specific matrix material with one heart, has above-mentioned inside diameter D 2 and above-mentioned outer diameter D 3 in the 2nd specific BVH; And through hole 73, its with the corresponding position, position that has formed the above-mentioned the 2nd specific BVH, penetrate into above-mentioned specific matrix material from above-mentioned the 1st top layer 50-4, and have above-mentioned the 2nd diameter D4.
On multi-layered wiring board according to the 2nd scheme of the invention described above, the above-mentioned the 1st and the inside diameter D 2 of the 2nd ring-shaped conductor paper tinsel preferably be set at the size of above-mentioned the 1st diameter D1 being considered to have added tolerance.In addition, above-mentioned conductor foil can be made of for example Copper Foil.And then, above-mentioned the 1st special pattern preferably on an above-mentioned side's who does not use part diagonal line 2 relative local formation, the 2nd special pattern preferably on above-mentioned the opposing party's who does not use part diagonal line 2 relative local formation.
According to the 3rd scheme of the present invention, its be with many matrix materials 61～63 stacked multi-layered wiring board 50, this multi-layered wiring board possesses at a plurality of conductive patterns of each layer formation and in order to be electrically connected between will these a plurality of conductive patterns and connect a plurality of BVH of interlayer, this multi-layered wiring board is divided into use part 52 and does not use part 54, can obtain crossing on above-mentioned multi-layered wiring board above-mentioned use part and the above-mentioned multi-layered wiring board that partly forms special pattern that uses.Above-mentioned special pattern comprises: the 1st specific BVH71-1, and it penetrates into specific internal layer 50-3 in above-mentioned use part 52 1 sides from top layer 50-4; The 2nd specific BVH71-2, it penetrates into above-mentioned specific internal layer in above-mentioned part 54 1 sides of not using from above-mentioned top layer; The 1st inner conductor paper tinsel 75, it forms on above-mentioned use part one side or the above-mentioned specific internal layer that does not use the side in part one side; The 2nd inner conductor paper tinsel 72, it forms on above-mentioned use part one side or the above-mentioned above-mentioned specific internal layer that does not use the opposing party in part one side, has the big inside diameter D 2 of diameter than the above-mentioned the 1st or the 2nd specific BVH; The 3rd inner conductor paper tinsel 76, it extends between above-mentioned the 1st inner conductor paper tinsel and above-mentioned the 2nd inner conductor paper tinsel at above-mentioned specific internal layer; The 1st skin conductor paper tinsel 77-1, its with the corresponding position of above-mentioned the 1st inner conductor paper tinsel, on above-mentioned top layer 50-4, form; The 1st skin conductor paper tinsel test point 78-1, it forms on the above-mentioned top layer 50-4 of above-mentioned use part; The 2nd skin conductor paper tinsel 79-1, it extends between the conductor foil test point on above-mentioned the 1st skin conductor paper tinsel and above-mentioned the 1st top layer; The 3rd skin conductor paper tinsel 77-2, its with the corresponding position of above-mentioned the 2nd inner conductor paper tinsel, on above-mentioned top layer 50-4, form; The 2nd skin conductor paper tinsel test point 78-2, it forms on the above-mentioned above-mentioned top layer 50-4 that does not use part 54; And the 4th skin conductor paper tinsel 79-2, it extends between above-mentioned the 3rd skin conductor paper tinsel and above-mentioned the 2nd skin conductor paper tinsel test point.
On the multi-layered wiring board according to the 3rd scheme of the invention described above, the inside diameter D 2 of above-mentioned the 2nd inner conductor paper tinsel preferably is set at the size of the diameter D1 of above-mentioned BVH being considered to have added tolerance.Above-mentioned conductor foil can be made of for example Copper Foil.
And then, according to the 4th scheme of the present invention, can obtain checking method according to the broken string of the BVH of the multi-layered wiring board of the 3rd scheme of the invention described above, it is characterized in that: make a pair of probe of disconnected/test for short-circuit machine contact the above-mentioned the 1st and the 2nd skin conductor paper tinsel test point, judge the broken string that has or not above-mentioned BVH.
In the of the present invention the 1st and the 2nd scheme, owing to partly form special pattern (the 1st and the 2nd special pattern) in the not use of multi-layered wiring board, so can with the naked eye check the broken string of BVH.In addition, in the 3rd scheme of the present invention, because the use of spanning multilayer wiring substrate part and do not use part that special pattern is connected, so can be as the 4th scheme of the present invention, with the broken string of the test for short-circuit electromechanical check BVH that breaks.
Description of drawings
Fig. 1 is the figure of protecting secondary battery assembly of the printed base plate of the expression BVH broken wire detection method that use to be suitable for an embodiment of the invention; (A) vertical view of expression protecting secondary battery assembly; (B) upward view of expression protecting secondary battery assembly; (C) front view of expression protecting secondary battery assembly, (D) side view of expression protecting secondary battery assembly.
Fig. 2 is the vertical view that the multi-layered wiring board of a plurality of printed base plates shown in Figure 1 has been assembled in expression.
Fig. 3 is the figure that does not use the partial cross section of part of expression multi-layered wiring board shown in Figure 2, (A) being the 1st special pattern that does not use part to form that is illustrated in multi-layered wiring board, (B) is the 2nd special pattern that does not use part to form that is illustrated in multi-layered wiring board.
Fig. 4 amplifies the amplification plan view that does not use the part (wanting portion) of part that shows multi-layered wiring board shown in Figure 1.
Fig. 5 is the partial top view of not using the 1st special pattern that partly forms at multi-layered wiring board that is used to illustrate the 1st embodiment of the present invention.
Fig. 6 is the figure of expression from the state of the BVH of through hole observation, (A) is the correct state (normal condition) that forms of expression BVH, (B) is the state (departing from state) that expression BVH departs from formation.
Fig. 7 is the figure of broken wire detection method that is used to illustrate the BVH of the 2nd embodiment of the present invention, (A) be illustrated in the use part of multi-layered wiring board and the pattern that does not use portion boundary internal layer partly to form, (B) be illustrated in the use part of multi-layered wiring board and the pattern of the top layer formation of not using the portion boundary part.
Among the figure
11-printed base plate; 50-multi-layered wiring board; 50-1-the 1st layer (the 2nd top layer); 50-2-the 2nd layer (internal layer); 50-3-the 3rd layer (internal layer); 50-4-the 4th layer (the 1st top layer); 50a-interarea; 50b-reverse side; 52-use part; 54-do not use part; 61-the 1 matrix material; 62-the 2 matrix material (specific matrix material); 63-the 3 matrix material; 71-specific BVH; The BVH that 71-1-the 1st is specific; The BVH that 71-2-the 2nd is specific; 72-circular Copper Foil (the 2nd internal layer Copper Foil); 73-through hole; 75-the 1 internal layer Copper Foil; 76-the 3 internal layer Copper Foil; 77-1 the 1st top layer Copper Foil; 77-2-the 3rd top layer Copper Foil; 78-1-the 1st top layer Copper Foil test point; 78-2-the 2nd top layer Copper Foil test point; 79-1-the 2nd top layer Copper Foil; 79-2-the 4th top layer Copper Foil.
Embodiment
The following protecting secondary battery assembly 10 that uses the printed base plate of the BVH broken wire detection method that is suitable for an embodiment of the invention with reference to description of drawings.In Fig. 1, (A) be the vertical view of protecting secondary battery assembly 10, (B) be the upward view of protecting secondary battery assembly 10, (C) be the front view of protecting secondary battery assembly 10, (D) be the side view of protecting secondary battery assembly 10.
Protecting secondary battery assembly 10 is to be electrically connected with the secondary cell (not having diagram) of lithium battery etc. as described later.Secondary cell possesses anode terminal and cathode terminal.Protecting secondary battery assembly 10 is called battery component with the combination of secondary cell.
Protecting secondary battery assembly 10 possesses printed base plate 11.Printed base plate 11 possesses the interarea 11a and the reverse side 11b on mutual opposite.The thickness of illustrated printed base plate 11 is about 0.7mm.
On the interarea 11a of printed base plate 11, be equipped with secondary battery protection circuit (protection IC) 12, power MOSFET (Power IC) 13 of moving and a plurality of electronic components 14 of resistor and capacitor etc. as discharge control switch and charging control switch.
Secondary battery protection circuit 12 is over-discharge state, the overcharge condition that are used to detect secondary cell, and the protection secondary cell is not in the circuit of over-discharge state and overcharge condition.Power MOSFET 13 places the switching mechanism of opening/closing to carry out work by the control of secondary battery protection circuit 12 as discharge that makes secondary cell and charging.
In order to be electrically connected with the anode terminal and the cathode terminal of secondary cell, protecting secondary battery assembly 10 possesses couple of conductor 21,22 on the interarea 11a of printed base plate 11.Each lead the 21, the 22nd is made of the nickel wire line that for example contains 99% nickel composition.In couple of conductor, the lead 21 that is connected with the anode terminal of secondary cell is called positive wire, and the lead 22 that is connected with the cathode terminal of secondary cell is called cathode wire.
On the other hand, shown in Fig. 1 (B), in order to be connected with load or charger, protecting secondary battery assembly 10 possesses pair of outer splicing ear 31,32 on the reverse side 11b of printed base plate 11.On the pair of outer splicing ear, a side is a positive terminal 31, and the opposing party is a negative terminal 32.On these positive terminals 31 and negative terminal 32, applied gold-plated.The thickness of positive terminal 31 and negative terminal 32 is thicker than 0.5 μ m.
Inside distribution (conductive pattern) by printed base plate 11 between positive wire 21 and cathode wire 22 is connected with secondary battery protection circuit (protection IC) 12.Inside distribution (conductive pattern) by printed base plate 11 between cathode wire 22 and negative terminal 32 is connected with power MOSFET (power supply IC) 13.
Shown in Fig. 1 (D), the couple of conductor 21,22 that is connected with the anode terminal and the cathode terminal of secondary cell has the shape of L font separately.That is: L font lead 21,22 is respectively by (assembling) assembled portion 21a, 22a on the interarea 11a of printed base plate 11 and coupling part 21b, the 22b formation that is connected with the terminal (anode terminal or cathode terminal) of secondary cell are installed.
The circuit component that is assemblied on the interarea 11a of printed base plate 11 is that secondary battery protection circuit 12, power MOSFET 13, electronic component 14 are by resin 40 sealings.
Figure 2 illustrates the multi-layered wiring board 50 that has assembled a plurality of above-mentioned printed base plates 11.As everyone knows, multi-layered wiring board 50 possess with many insulating material (matrix material) stacked structure, matrix material is clipped in forms a plurality of layer therebetween respectively.Owing to the thickness of the insulating material (matrix material) that is clipped in each interlayer is extremely thin, thus can have an X-rayed, so-called as seen transparent.
Though do not illustrate, well-known in this technical field, multi-layered wiring board 50 possesses: at a plurality of conductive patterns of each layer formation; And a plurality of BVH that connect interlayer in order to be electrically connected between these conductive patterns.
As shown in Figure 2, multi-layered wiring board 50 is divided into: the use part 52 that is in the central portion that has assembled a plurality of printed base plates 11; And the not use part 54 that is in substrate housing (being left and right edges) in Fig. 2.In addition are final uses and owing to do not use part 54 by idle part as printed base plate, so be also referred to as idle baseplate part (
The て baseplate part).
As mentioned above, in existing multi-layered wiring board, use part integral body to cover by Copper Foil.Therefore, can not with the naked eye check the broken string of the BVH of each printed base plate 11 at an easy rate.
Fig. 3 represents a part of cross section of not using part 54 of multi-layered wiring board 50.In Fig. 3, (A) be illustrated in the 1st special pattern that forms that do not use on the part 54 of multi-layered wiring board 50, (B) be illustrated in the 2nd special pattern that forms on the part 54 that do not use of multi-layered wiring board 50.In illustrated example, multi-layered wiring board 50 expressions are occasions of 4 layers.
Illustrated multi-layered wiring board 50 is made of the 1st to the 3rd insulating material (matrix material) 61,62 and 63.Therefore, multi-layered wiring board 50 is made of the 1st layer of 50-1, the 2nd layer of 50-2, the 3rd layer of 50-3, the 4th layer of 50-4.The 1st layer of 50-1 is that the surface (the interarea 50a of multi-layered wiring board 50) at the 1st matrix material 61 is gone up and formed.The 2nd layer of 50-2 forms between the 1st matrix material 61 and the 2nd matrix material 62.The 3rd layer of 50-3 forms between the 2nd matrix material 62 and the 3rd matrix material 63.The 4th layer of 50-4 is that the surface (the reverse side 50b of multi-layered wiring board 50) at the 3rd matrix material 63 is gone up and formed.
Because the 2nd layer of 50-2 and the 3rd layer of 50-3 form in the inside of multi-layered wiring board 50, so be called internal layer.On the other hand, because the 1st layer of 50-1 and the 4th layer of 50-4 form on two surfaces of multi-layered wiring board 50, so be called skin or top layer.In addition,, the 4th layer of 50-4 is called the 1st top layer here, the 1st layer of 50-1 is called the 2nd top layer.The 2nd matrix material 62 that the 2nd layer of 50-2 that will be adjoined each other in addition, and the 3rd layer of 50-3 clip is called specific matrix material.In addition, in this example, the tolerance of multi-layered wiring board 50 is decided to be ± 0.1mm.
Fig. 4 is the amplification plan view that amplifies a part of not using part 54 (wanting portion) that shows multi-layered wiring board 50.
Except Fig. 3 (A), Fig. 4, the 1st special pattern that forms on the part 54 that do not use at multi-layered wiring board 50 of the 1st embodiment of the present invention is described with reference to Fig. 5 also.
Shown in Fig. 5 (A), on the 4th layer of 50-4 and the 3rd layer of 50-3, form the 1st specific BVH71 of the diameter D1=0.35mm that connects the 3rd matrix material 63.In other words, the 1st specific BVH71 penetrates into specific matrix material 62 from the 1st top layer 50-4.On the 3rd layer of 50-3 and the 4th layer of 50-4, concentric with above-mentioned the 1st BVH71, form the 1st circular Copper Foil 72 of inside diameter D 2=0.65mm, outer diameter D 3=0.95mm.In other words, the 1st circular Copper Foil 72 is concentric with the 1st specific BVH71, forms at each internal layer from the 1st top layer 50-4 to specific matrix material 62.Here, the inside diameter D 2 of the 1st circular Copper Foil 72 is set at the size of diameter D1 being considered to have added tolerance.That is: since tolerance be ± 0.1mm, so the radius D2/2 of the inboard of the 1st circular Copper Foil 72 is set at than the size that has added 0.1mm on the radius D1/2 of 1BVH71 (D2/2＞D1/2+0.1) greatly.The 1st circular Copper Foil 72 possesses inner periphery 72a and neighboring 72b.
Shown in Fig. 5 (B),, on the 1st layer of 50-1 and the 2nd layer of 50-2, form the 1st through hole 73 of the diameter D4=1.25mm that connects the 1st matrix material 61 in the position corresponding with the position that is provided with the 1st BVH71.As long as the diameter D4 of the 1st through hole 73 is than the outer diameter D 3 of the 1st circular Copper Foil 72 greatly.
Thus, shown in Fig. 5 (C), can have an X-rayed at the 3rd layer of 50-3 and the 4th layer of the 1st circular Copper Foil 72 that 50-4 forms by the 2nd matrix material (specific matrix material) 62 from the 1st through hole 73.
In addition, the 1st circular Copper Foil 72 and the 1st through hole 73 are circular, but also can be polygonal.
Not using on the 1st special pattern that forms on the part 54 of above-mentioned multi-layered wiring board 50, on the 1st layer of 50-1 and the 2nd layer of 50-2, have the 1st through hole 73, on the 3rd layer of 50-3 and the 4th layer of 50-4, form the 1st circular Copper Foil 72 and the 1st BVH71.
Different therewith, not using on the 2nd special pattern that forms on the part 54 of multi-layered wiring board 50, shown in Fig. 3 (B), on the 3rd layer of 50-3 and the 4th layer of 50-4, have the 2nd through hole 73, on the 1st layer of 50-1 and the 2nd layer of 50-2, form the 2nd circular Copper Foil 72 and the 2nd BVH71.
The 2nd special pattern that forms on the part 54 that do not use at multi-layered wiring board 50 of the 1st embodiment of the present invention is described below with reference to Fig. 3 (B) and Fig. 4.
On the 1st layer of 50-1 and the 2nd layer of 50-2, form the 2nd specific BVH71 of the diameter D1=0.35mm that connects the 1st matrix material 61.In other words, the 2nd specific BVH71 penetrates into specific matrix material 62 from the 2nd top layer 50-1.On the 2nd layer of 50-2 and the 1st layer of 50-1, concentric with above-mentioned 2BVH71, form the 2nd circular Copper Foil 72 of inside diameter D 2=0.65mm, outer diameter D 3=0.95mm.In other words, the 2nd circular Copper Foil 72 is concentric with the 2nd specific BVH71, forms at each internal layer from the 2nd top layer 50-1 to specific matrix material 62.Here, the inside diameter D 2 of the 2nd circular Copper Foil 72 is set at the size of diameter D1 being considered to have added tolerance.That is: since tolerance be ± 0.1mm, so the radius D2/2 of the inboard of the 2nd circular Copper Foil 72 is set at than the size that has added 0.1mm on the radius D1/2 of 2BVH71 (D2/2＞D1/2+0.1) greatly.The 2nd circular Copper Foil 72 possesses inner periphery 72a and neighboring 72b.
In the position corresponding, on the 4th layer of 50-4 and the 3rd layer of 50-3, form the 2nd through hole 73 of the diameter D4=1.25mm that connects the 3rd matrix material 63 with the position that is provided with 2BVH71.As long as the diameter D4 of the 2nd through hole 73 is than the outer diameter D 3 of the 2nd circular Copper Foil 72 greatly.
Thus, can have an X-rayed at the 1st layer of 50-1 and the 2nd layer of the 2nd circular Copper Foil 72 that 50-2 forms by the 2nd matrix material (specific matrix material) 62 from the 2nd through hole 73.
In addition, the 2nd circular Copper Foil 72 and the 2nd through hole 73 are circular, but also can be polygonal.
Can be clear and definite from Fig. 2, the 1st special pattern is to form in 2 relative places on a side's who does not use part 54 of multi-layered wiring board 50 diagonal line, and the 2nd special pattern is 2 relative local formation on the opposing party's who does not use part 54 of multi-layered wiring board 50 diagonal line.
In addition, in the above-described embodiment, used the 1st special pattern and 2 kinds of special patterns of the 2nd special pattern, but also can only use either party's special pattern.In addition, above-mentioned special pattern is as long as only form 1 place at least in the not use part 54 of multi-layered wiring board 50.
Figure 6 illustrates from the state of through hole 73 observed BVH71.In Fig. 6, (A) the correct state (normal condition) that forms of expression BVH71, (B) expression BVH71 departs from the state (state that departs from) of formation.
Can learn, under the normal condition shown in Fig. 6 (A), because the center of BVH71 is consistent with the center of circular Copper Foil 72 in fact, so BVH71 is accommodated in the scope of inner periphery 72a of circular Copper Foil 72.Different therewith, can learn, under the state that departs from shown in Fig. 6 (B), because the center of BVH71 and the center of circular Copper Foil 72 depart from, so the inner periphery 72a of the part of BVH71 and circular Copper Foil 72 is overlapping.
Therefore, in the occasion that observes with the naked eye the state that departs from shown in Fig. 6 (B), can judge that the BVH of printed base plate 11 breaks.
It on existing multi-layered wiring board the departing from of internal layer that can not with the naked eye confirm BVH.Different therewith, on the multi-layered wiring board 50 of present embodiment, to each layer of specific matrix material, be formed centrally circular Copper Foil 72 together a side with BVH71 from a pair of top layer, by leaving the through hole 73 that penetrates into having of the specific matrix material diameter bigger than the external diameter of circular Copper Foil 72 from the opposing party on a pair of top layer, naked eyes are confirmed departing between the internal layer of each printed base plate 11 and the BVH in appearance.
In above-mentioned the 1st embodiment of the present invention, be broken string, but in the 2nd embodiment of the present invention of stating below, be to use the broken string of disconnected/test for short-circuit electromechanical check BVH by visual check BVH.
The broken wire detection method of the BVH of the 2nd embodiment of the present invention is described with reference to Fig. 7.In this 2nd embodiment, the use part 52 by spanning multilayer wiring substrate 50 and do not use part 54 forms special pattern described later, the broken string of incoming call inspection BVH.
In Fig. 7, (A) be illustrated in the use part 52 of multi-layered wiring board 50 and the pattern of the last formation of the 3rd layer of (internal layer) 50-3 of the boundary member that does not use part 54, (B) be illustrated in the use part 52 of multi-layered wiring board 50 and do not use the pattern of the last formation of the 4th layer of (top layer, skin) 50-4 of the boundary member of part 54.In addition, the tolerance of multi-layered wiring board 50 also is ± 0.1mm in this example.
Shown in Fig. 7 (A), near using part 52 and not using use part 52 1 sides on the border between the part 54 to form the 1st specific BVH71-1 that penetrates into the diameter D1=0.35mm of the 3rd layer of (internal layer) 50-3 from the 4th layer of (the 1st top layer) 50-4.On the 3rd layer of (internal layer) 50-3, concentric with the 1st specific BVH71, form the 1st internal layer Copper Foil 75 of diameter D5=0.65mm.Here, the diameter D5 of the 1st internal layer Copper Foil 75 is as long as the diameter D1 of specific BVH71-1 greatly than the 1st.In addition, in illustrated example, the 1st internal layer Copper Foil 75 is circular, but is not limited to circle.
In addition, near using part 52 and not using not use part 54 1 sides on the border between the part 54, form the 2nd specific BVH71-2 that penetrates into the diameter D1=0.35mm of the 3rd layer of (internal layer) 50-3 from the 4th layer of (the 1st top layer) 50-4.On the 3rd layer of (internal layer) 50-3, concentric with the 2nd specific BVH71-2, form the 2nd internal layer Copper Foil 72 of inside diameter D 2=0.65mm, outer diameter D 3=0.95mm.That is: on idle substrate 54, form the 2nd internal layer Copper Foil 72 that only leaves the distance of 0.15mm with respect to the 2nd specific BVH71-2.Same with the occasion of above-mentioned the 1st embodiment, the inside diameter D 2 of the 2nd internal layer Copper Foil 72 is set at the size of the diameter D1 of the 2nd specific BVH71-2 being considered to have added tolerance.That is: since tolerance be ± 0.1mm, so the radius D2/2 of the inboard of the 2nd internal layer Copper Foil 72 is set at than the size that has added 0.1mm on the radius D1/2 of the 2nd specific BVH71-2 (D2/2＞D1/2+0.1) greatly.The 2nd internal layer Copper Foil 72 possesses inner periphery 72a and neighboring 72b.On the 3rd layer of (internal layer) 50-3, the 1st internal layer Copper Foil 75 and the 2nd internal layer Copper Foil 72 are electrically connected by the 3rd internal layer Copper Foil 76 that extends between them.
Shown in Fig. 7 (B), with the corresponding position of above-mentioned the 1st internal layer Copper Foil 75, concentric with the 1st specific BVH71-1 on the 4th layer of (top layer) 50-4 that uses part 52, form the 1st top layer Copper Foil 77-1 of diameter D5=0.65mm.Here, the diameter D5 of the 1st top layer Copper Foil 77-1 is as long as the diameter D1 of specific BVH71-1 greatly than the 1st.In illustrated example, the 1st top layer Copper Foil 77-1 is circular, but is not limited to circle.From the 1st top layer Copper Foil 77-1 to the inboard of using part 52 away from the position, on the 4th layer of (top layer) 50-4 that uses part 52, form the 1st top layer Copper Foil test point 78-1 of diameter D6=2.00mm.In illustrated example, the 1st top layer Copper Foil test point 78-1 is circular, but is not limited to circle.The 1st top layer Copper Foil 77-1 is connected by the 2nd top layer copper foil pattern 79-1 that extends between them with the 1st top layer Copper Foil test point 78-1.
And then, shown in Fig. 7 (B), with the corresponding position of above-mentioned the 2nd internal layer Copper Foil 72, concentric not using on the 4th layer of (top layer) 50-4 of part 54 with 2BVH71-2, form the 3rd top layer Copper Foil 77-2 of diameter D5=0.65mm.The diameter D5 of the 3rd top layer Copper Foil 77-2 is as long as the diameter D1 of specific BVH71-2 greatly than the 2nd.In illustrated example, the 3rd top layer Copper Foil 77-2 is circular, but is not limited to circle.From the 3rd top layer copper foil pattern 77-2 to the outside of not using part 52 away from the position, do not using on the 4th layer of (top layer) 50-4 of part 54, form the 2nd top layer Copper Foil test point 78-2 of diameter D6=2.00mm.In illustrated example, the 2nd top layer Copper Foil test point 78-2 is circular, but is not limited to circle.The 3rd top layer copper foil pattern 77-2 is connected by the 4th top layer Copper Foil 79-2 that extends between them with the 2nd top layer Copper Foil test point 78-2.
As described below, by forming the special pattern of this structure, can use disconnected/test for short-circuit machine (not having diagram) electric-examination to look into the broken string of the BVH that has or not each printed base plate 11.
Suppose that the BVH that forms does not depart from each printed base plate 11.This occasion, shown in Fig. 6 (A), the center of the 2nd specific BVH71-2 that forms on idle substrate 54 is consistent with the center of the 2nd internal layer Copper Foil 72 in fact.Therefore, the 2nd specific BVH71-2 includes in the scope of inner periphery 72a of the 2nd internal layer Copper Foil 72, becomes off-state between the 2nd specific BVH71-2 and the 2nd internal layer Copper Foil 72.Under such state, a pair of probe that can/test for short-circuit machine disconnected by making contacts the 1st and the 2nd top layer Copper Foil test point 78-1,78-2, and electric-examination is found between the 2nd specific BVH71-2 and the 2nd internal layer Copper Foil 72 and disconnected.That is: can judge in the BVH of each printed base plate 11, there is not broken string.
On the other hand, suppose on the BVH that forms on each printed base plate 11, to have and depart from.This occasion, shown in Fig. 6 (B), the center of the 2nd specific BVH71-2 that on idle substrate 54, forms and the misalignment of the 2nd internal layer Copper Foil 72.Its result, the part of the 2nd specific BVH71-2 and the inner periphery 72a of the 2nd internal layer Copper Foil 72 are overlapping, become short-circuit condition between the 2nd specific BVH71-2 and the 2nd internal layer Copper Foil 72.In this state, a pair of probe that can/test for short-circuit machine disconnected by making contacts the 1st and the 2nd top layer circular Copper Foil test point 78-1,78-2, and short circuit between the 2nd specific BVH71-2 and the 2nd internal layer Copper Foil 72 is found in electric-examination.That is: can judge that in the BVH of each printed base plate 11 broken string is arranged.
In addition, in the above-described 2nd embodiment, on the 3rd layer of 50-3, form the pattern shown in Fig. 7 (A), but can certainly on the 2nd layer of 50-2, form as specific internal layer as specific internal layer.In addition, at the pattern shown in the 4th layer of (the 1st top layer) 50-4 last formation Fig. 7 (B), but can certainly be in the last formation of the 1st layer of (the 2nd top layer) 50-1.
Abovely the present invention has been described, but the present invention is not limited to above-mentioned embodiment certainly according to preferred implementation.For example, in the above-described embodiment, used Copper Foil, but can certainly use other conductor foil as conductor foil.In addition, in the above-described embodiment, only illustrated that multi-layered wiring board is 4 layers a example, but can be applicable to the multi-layered wiring board of nengli more than 5 layers too certainly.
Claims (12)
1. a multi-layered wiring board is that many matrix materials have been carried out stacked multi-layered wiring board, it is characterized in that above-mentioned multi-layered wiring board possesses: at a plurality of conductive patterns of each layer formation; And in order to be electrically connected between will these a plurality of conductive patterns and connect a plurality of BVH of interlayer; This multi-layered wiring board is divided into the specific matrix material that uses part and do not use part, above-mentioned multi-layered wiring board to possess 2 internal layers being adjoined each other to clip, and forms special pattern in the above-mentioned part of using, and above-mentioned special pattern comprises:
Specific BVH, its side from a pair of top layer penetrates into above-mentioned specific matrix material and has the 1st diameter;
The ring-shaped conductor paper tinsel, it forming at each internal layer from the side on above-mentioned a pair of top layer to above-mentioned specific matrix material with one heart, and has internal diameter and the external diameter bigger than above-mentioned the 1st diameter in this specific BVH; And,
Through hole, its with the corresponding position, position that has formed above-mentioned specific BVH, penetrate into above-mentioned specific matrix material from the opposing party on above-mentioned a pair of top layer, and possess 2nd diameter bigger than the external diameter of above-mentioned ring-shaped conductor paper tinsel.
2. multi-layered wiring board according to claim 1 is characterized in that: the internal diameter of above-mentioned ring-shaped conductor paper tinsel is set at the size of above-mentioned the 1st diameter being considered to have added tolerance.
3. multi-layered wiring board according to claim 1 and 2 is characterized in that: above-mentioned conductor foil is a Copper Foil.
4. according to each described multi-layered wiring board of claim 1 to 3, it is characterized in that: above-mentioned special pattern is not use on the diagonal line partly 2 relative local formation above-mentioned.
5. a multi-layered wiring board is that many matrix materials have been carried out stacked multi-layered wiring board, it is characterized in that above-mentioned multi-layered wiring board possesses: at a plurality of conductive patterns of each layer formation; And in order to be electrically connected between will these a plurality of conductive patterns and connect a plurality of BVH of interlayer; This multi-layered wiring board is divided into the use part and does not use part, and a plurality of layers are divided into: a plurality of internal layers that form in the inside of above-mentioned multi-layered wiring board; And the 1st and the 2nd top layer that forms on two surfaces of above-mentioned multi-layered wiring board, above-mentioned multi-layered wiring board has the specific matrix material that 2 above-mentioned internal layers being adjoined each other clip, form the 1st and the 2nd different special pattern mutually in the above-mentioned part of not using
Above-mentioned the 1st special pattern comprises:
The 1st specific BVH, it penetrates into above-mentioned specific matrix material and possesses the 1st diameter from above-mentioned the 1st top layer;
The 1st ring-shaped conductor paper tinsel, it forming from above-mentioned the 1st top layer to each internal layer of above-mentioned specific matrix material with one heart, and has internal diameter and the external diameter bigger than above-mentioned the 1st diameter in the 1st specific BVH; And,
The 1st through hole, its with the corresponding position, position that has formed the above-mentioned the 1st specific BVH, penetrate into above-mentioned specific matrix material from above-mentioned the 2nd top layer, and have 2nd diameter bigger than the external diameter of above-mentioned the 1st ring-shaped conductor paper tinsel,
Above-mentioned the 2nd special pattern comprises:
The 2nd specific BVH, it penetrates into above-mentioned specific matrix material and has above-mentioned the 1st diameter from above-mentioned the 2nd top layer;
The 2nd ring-shaped conductor paper tinsel, it forming from above-mentioned the 2nd top layer to each internal layer of above-mentioned specific matrix material with one heart, and has above-mentioned internal diameter and above-mentioned external diameter in the 2nd specific BVH; And,
The 2nd through hole, its with the corresponding position, position that has formed the above-mentioned the 2nd specific BVH, penetrate into above-mentioned specific matrix material from above-mentioned the 1st top layer, and have above-mentioned the 2nd diameter.
6. multi-layered wiring board according to claim 5 is characterized in that: the above-mentioned the 1st and the internal diameter of the 2nd ring-shaped conductor paper tinsel be set at the size of above-mentioned the 1st diameter being considered to have added tolerance.
7. according to claim 5 or 6 described multi-layered wiring boards, it is characterized in that: above-mentioned conductor foil is a Copper Foil.
8. according to each described multi-layered wiring board of claim 5 to 7, it is characterized in that: above-mentioned the 1st special pattern is to form in 2 relative places on a side's of above-mentioned not use part diagonal line, and the 2nd special pattern is in 2 relative local formation on above-mentioned not use the opposing party's partly diagonal line.
9. multi-layered wiring board, be that many matrix materials have been carried out stacked multi-layered wiring board, it is characterized in that: above-mentioned multi-layered wiring board possesses at a plurality of conductive patterns of each layer formation and in order will these a plurality of conductive patterns to be electrically connected and to connect a plurality of BVH of interlayer, this multi-layered wiring board is divided into the use part and does not use part, on above-mentioned multi-layered wiring board, cross over above-mentioned use part and above-mentioned use part and form special pattern, above-mentioned special pattern comprises:
The 1st specific BVH, it penetrates into specific internal layer in above-mentioned use part one side from the top layer;
The 2nd specific BVH, it penetrates into above-mentioned specific internal layer in above-mentioned part one side of not using from above-mentioned top layer;
The 1st inner conductor paper tinsel, it forms on above-mentioned use part one side or an above-mentioned side's who does not use part one side above-mentioned specific internal layer;
The 2nd inner conductor paper tinsel, it forms on above-mentioned use part one side or above-mentioned the opposing party's who does not use part one side above-mentioned specific internal layer, has the big internal diameter of diameter than the above-mentioned the 1st or the 2nd specific BVH;
The 3rd inner conductor paper tinsel, it extends between above-mentioned the 1st inner conductor paper tinsel and above-mentioned the 2nd inner conductor paper tinsel at above-mentioned specific internal layer;
The 1st skin conductor paper tinsel, its with the corresponding position of above-mentioned the 1st inner conductor paper tinsel, form on the top layer;
The 1st skin conductor paper tinsel test point, its above-mentioned top layer in above-mentioned use part forms;
The 2nd skin conductor paper tinsel, it extends between above-mentioned the 1st skin conductor paper tinsel and above-mentioned the 1st skin conductor paper tinsel test point;
The 3rd skin conductor paper tinsel, its with the corresponding position of above-mentioned the 2nd inner conductor paper tinsel, form on above-mentioned top layer;
The 2nd skin conductor paper tinsel test point, it forms on the above-mentioned above-mentioned top layer of part of not using; And,
The 4th skin conductor paper tinsel, it extends between above-mentioned the 3rd skin conductor paper tinsel and above-mentioned the 2nd skin conductor paper tinsel test point.
10. multi-layered wiring board according to claim 9 is characterized in that: the internal diameter of above-mentioned the 2nd inner conductor paper tinsel is set at the size of the diameter of above-mentioned BVH being considered to have added tolerance.
11. according to claim 9 or 10 described multi-layered wiring boards, it is characterized in that: above-mentioned conductor foil is a Copper Foil.
12. BVH broken wire detection method, it is the method for checking the broken string of the BVH of each described multi-layered wiring board in the claim 9 to 11, it is characterized in that: make a pair of probe of disconnected/test for short-circuit machine contact the above-mentioned the 1st and the 2nd skin conductor paper tinsel test point, judge the broken string that has or not above-mentioned BVH.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005239792 | 2005-08-22 | ||
| JP2005-239792 | 2005-08-22 | ||
| JP2005239792A JP4844714B2 (en) | 2005-08-22 | 2005-08-22 | Multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1920587A true CN1920587A (en) | 2007-02-28 |
| CN1920587B CN1920587B (en) | 2011-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610094310XA Expired - Fee Related CN1920587B (en) | 2005-08-22 | 2006-06-29 | Multilayer wiring substrate and BVH broken wire detection method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4844714B2 (en) |
| CN (1) | CN1920587B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102870505A (en) * | 2011-03-28 | 2013-01-09 | 住友电气工业株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN103269564A (en) * | 2013-03-28 | 2013-08-28 | 淳华科技(昆山)有限公司 | Multilayer board local single-layer area inner layer cutting process |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125711A (en) * | 1984-11-26 | 1986-06-13 | Matsushita Electric Works Ltd | Method for detecting hole drilling position on multi-layer printing wiring board |
| JPS62181811A (en) * | 1986-02-07 | 1987-08-10 | Japan Steel Works Ltd:The | Boring of referential hold through multi-layer printed board |
| JPS62230095A (en) * | 1986-03-31 | 1987-10-08 | 松下電器産業株式会社 | Method of checking layer discrepancy of multilayer interconnection board |
| JPS63155668A (en) * | 1986-12-18 | 1988-06-28 | Sanyo Electric Co Ltd | Manufacture of semiconductor device |
| JPH0391993A (en) * | 1989-09-04 | 1991-04-17 | Fujitsu Ltd | Measuring method for inner layer deviation of multilayer printed wiring board |
| JPH04186798A (en) * | 1990-11-20 | 1992-07-03 | Fujitsu Ltd | Multi-layer printed wiring board and checking of inter-layer displacement |
| JP2001251062A (en) * | 2000-03-03 | 2001-09-14 | Sony Corp | Multilayer printed wiring board and inspection method of multilayer printed wiring board |
| JP2002100845A (en) * | 2000-09-25 | 2002-04-05 | Hitachi Kokusai Electric Inc | Circuit pattern for inspecting blind via hole misregistration |
| JP2003283145A (en) * | 2002-03-26 | 2003-10-03 | Sumitomo Bakelite Co Ltd | Method of inspecting misregistration of multilayer wiring board |
| JP4119702B2 (en) * | 2002-07-30 | 2008-07-16 | エルナー株式会社 | Inspection method for multilayer printed wiring boards |
-
2005
- 2005-08-22 JP JP2005239792A patent/JP4844714B2/en not_active Expired - Fee Related
-
2006
- 2006-06-29 CN CN200610094310XA patent/CN1920587B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102870505A (en) * | 2011-03-28 | 2013-01-09 | 住友电气工业株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN102870505B (en) * | 2011-03-28 | 2015-09-23 | 住友电气工业株式会社 | The manufacture method of printing distributing board and printing distributing board |
| CN103269564A (en) * | 2013-03-28 | 2013-08-28 | 淳华科技(昆山)有限公司 | Multilayer board local single-layer area inner layer cutting process |
| CN103269564B (en) * | 2013-03-28 | 2015-11-18 | 淳华科技(昆山)有限公司 | Multilayer board local single-layer area inner layer cutting technique |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007059454A (en) | 2007-03-08 |
| JP4844714B2 (en) | 2011-12-28 |
| CN1920587B (en) | 2011-07-13 |
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