CN1916919A - Implementing method for making up handset - Google Patents
Implementing method for making up handset Download PDFInfo
- Publication number
- CN1916919A CN1916919A CN 200610126881 CN200610126881A CN1916919A CN 1916919 A CN1916919 A CN 1916919A CN 200610126881 CN200610126881 CN 200610126881 CN 200610126881 A CN200610126881 A CN 200610126881A CN 1916919 A CN1916919 A CN 1916919A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- chained list
- coordinate
- making
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
A method for realizing mobile phone makeup includes designing single circuit bard information and confirming sizes of internal and external frames on makeup as well as setting coordinate of top point, setting up chain table of each point on said circuit board according to coordinate of top point, confirming chain table of stamp hole at connection joint between internal frame and circuit board and chain table of stamp hole at connection joint between circuit boards according to said chain table, plotting out makeup of mobile phone according to said chain tables of stamp holes.
Description
Technical field
The present invention relates to circuit board of mobile phone and make the field, relate in particular to a kind of making up handset implementation method.
Background technology
Layout is important technology in the circuit board making process, is about to several same PCB (Print CircuitBoard, printed circuit board (PCB)) plate and closes and make a PCB.This technology especially is fit to the production in enormous quantities of circuit board, can reduce cost, improve consistance, the saving material of circuit board specification, performance, raise the efficiency, such as, can be made into the layout of forming by two circuit boards as the single circuit board of Fig. 1, in fact as Fig. 2, layout piece number is many more, production cost is just low more, but considers processing technology, and general layout number is 8.
Yet above-mentioned technology is more effective for the circuit board of simple shape, as long as know the length and width of single circuit board, parameter such as thick, just can make layout.Yet for the pcb board of complex geometry, as the mobile phone board layout, as shown in Figure 3, making is got up, and promptly waste time and energy, and make mistakes easily, and because out-of-shape causes waste of material easily.For this reason, it is a kind of with the out-phase board joint method that prior art provides, i.e. negative and positive layout, and with reference to " board joint method of printed circuit board (PCB) ", application number: 200410018666.6, the applying date: on February 17th, 2004.
Though above-mentioned technology is to a certain extent, improved the efficient of complicated layout, also can handle stamp hole, still there are a lot of problems and defective.All need human configuration, very complicated when at first, the stamp hole that connects in this technology is located between the location of realizing single circuit board, stamp hole that frame is connected with veneer, veneer; In addition, this technology is not considered the branch plate, can not realize that the circular-arc limit in the layout connects, as shown in Figure 4 structure; At last, this technology can not embed in EDA (Electronic DesignAutomatic, electronics the designs automatically) software commonly used and use, thereby causes service efficiency on the low side.
Summary of the invention
The problem to be solved in the present invention provides a kind of making up handset implementation method, and, connection stamp hole complicated with veneer location during making up handset is made in the solution prior art located complicated defective.
In order to realize above purpose, the invention provides a kind of making up handset implementation method, may further comprise the steps:
A, single circuit board information is set;
B, determine the size of the housing and the inside casing of layout, and apex coordinate is set according to this circuit board information;
C, set up the chained list of each point on the single circuit board according to this apex coordinate;
D, determine the junction stamp hole chained list of inside casing and circuit board, the junction stamp hole chained list between the circuit board according to this chained list;
E, draw layout according to described stamp hole chained list.
Described chained list comprises the pointer of a previous point and a back point, and the coordinate of this point.
Described junction is straight line, circular arc or oblique line.
Described information comprises the length of single circuit board and the spacing between width, sheet frame width and each veneer.
Described inside casing and housing summit are square or circular arc.
Compared with prior art, the present invention has the following advantages:
The present invention is established as list structure by the coordinate with located in connection point, comprise the pointer of a previous and back point and the coordinate of this point in this chained list, by determining any one positioning point coordinate, can determine other anchor point coordinate of layout automatically, realize veneer and the automatic location that is connected stamp hole.And realized processing to circular-arc limit, and then improved the complexity and the accuracy of layout, saved the sheet material area.In addition, the present invention both can paint file to light separately and operate, and also can embed in the eda tool software (as ALLEGRO) commonly used to use, thereby improve designer's work efficiency, has reduced designer and manufacturer because of exchanging the not smooth misunderstanding that causes.
Description of drawings
Fig. 1 is the single board structure of circuit of regular shape in the prior art;
Fig. 2 is the layout structure that single circuit board is made among Fig. 1;
Fig. 3 is complex-shaped single board structure of circuit;
Fig. 4 is that fillet is the layout structure of camber line;
Fig. 5 is a making up handset implementation method process flow diagram of the present invention;
Fig. 6 is a layout structure of the present invention;
Fig. 7 is a housing coordinate Calculation method synoptic diagram in the present invention;
Fig. 8 is a partial schematic diagram in the layout structure of the present invention.
Embodiment
A kind of making up handset implementation method of the present invention may further comprise the steps as shown in Figure 5:
Step s101 is provided with single circuit board information.Comprise the length of single circuit board and the spacing between width, sheet frame width and each veneer.
Step s102 determines the size of the housing and the inside casing of layout according to this circuit board information, and apex coordinate is set.Suppose that this layout comprises 8 single circuit boards, as shown in Figure 6.Because the distance between sheet frame and each the single circuit board all be a constant, the single circuit board information of integrating step s101 setting can calculate the physical dimension of whole layout housing and inside casing, and the apex coordinate of this layout housing and inside casing is set.The coordinate Calculation method as shown in Figure 7, the inside casing coordinate at circular arc place, layout plate angle can adopt the normal computing method to obtain, other straight line portion coordinates of inside casing can be obtained by direct calculating or normal computing method; The housing coordinate extends out 80Mil (2.02mm) by the inside casing coordinate and calculates.
Step s103 sets up the chained list of each point on the single circuit board according to this apex coordinate.Line is made of point, except that place, 8 layout plate angles for the quadrant arc, be straight line, therefore, can adopt a little coordinate to note down the geometric element of line, make the coordinate of reference point become list structure.Wherein, chained list comprises the pointer (the storage of linked list address of this point of this pointed) of previous and back one point, and this coordinate.
Step s104 determines the junction stamp hole chained list of inside casing and circuit board, the junction stamp hole chained list between the circuit board according to this chained list.According to the inside casing coordinate, determine on the inside casing line with the continuous coordinate of stamp hole, to chained list do insertion operation.Each line of continuous stamp hole is formed rectangle or straight line between veneer, according to the set of stamps hole coordinate of user's input, can determine to be connected with another veneer the coordinate of stamp hole, and two parts coordinate is the coordinate of rectangle or straight line altogether, constitutes chained list.For example,, the stamp hole position can be divided into four parts for lower left corner circuit board among Fig. 6, promptly left, following, right, on.Be illustrated in fig. 8 shown below, 1,2,3,4,5,6,7,8,9 adhere to four parts separately.
Step s105 draws layout according to described stamp hole chained list.
More than disclosed only be several specific embodiment of the present invention, still, the present invention is not limited thereto, any those skilled in the art can think variation all should fall into protection scope of the present invention.
Claims (5)
1, a kind of making up handset implementation method is characterized in that, may further comprise the steps:
A, single circuit board information is set;
B, determine the size of the housing and the inside casing of layout, and apex coordinate is set according to this circuit board information;
C, set up the chained list of each point on the single circuit board according to this apex coordinate;
D, determine the junction stamp hole chained list of inside casing and circuit board, the junction stamp hole chained list between the circuit board according to this chained list;
E, draw layout according to described stamp hole chained list.
2, making up handset implementation method according to claim 1 is characterized in that described chained list comprises the pointer of a previous point and a back point, and the coordinate of this point.
3, making up handset implementation method according to claim 1 is characterized in that described junction is straight line, circular arc or oblique line.
4, making up handset implementation method according to claim 1 is characterized in that described information comprises the length of single circuit board and the spacing between width, sheet frame width and each veneer.
5, making up handset implementation method according to claim 1 is characterized in that described inside casing and housing summit are square or circular arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101268817A CN100449555C (en) | 2006-09-08 | 2006-09-08 | Implementing method for making up handset |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101268817A CN100449555C (en) | 2006-09-08 | 2006-09-08 | Implementing method for making up handset |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1916919A true CN1916919A (en) | 2007-02-21 |
| CN100449555C CN100449555C (en) | 2009-01-07 |
Family
ID=37737917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101268817A Active CN100449555C (en) | 2006-09-08 | 2006-09-08 | Implementing method for making up handset |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100449555C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684275A (en) * | 2013-12-03 | 2015-06-03 | 上海望友信息科技有限公司 | PCB jointing method and system |
| CN104797092A (en) * | 2015-04-08 | 2015-07-22 | 广州杰赛科技股份有限公司 | PCB (printed circuit board) jointing method and PCB jointing system |
| CN108153991A (en) * | 2018-01-11 | 2018-06-12 | 郑州云海信息技术有限公司 | A kind of Quick platy clamp keyline layout method based on Cadence skill |
| CN108617085A (en) * | 2018-07-13 | 2018-10-02 | 安徽芯瑞达科技股份有限公司 | A kind of single stamp hole circuit board of down straight aphototropism mode set |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW499825B (en) * | 1999-02-23 | 2002-08-21 | Samsung Electro Mech | Method and device for coupling PCB sheet |
| CN100504884C (en) * | 2004-02-17 | 2009-06-24 | 林惠宾 | Joining method for printed circuit board |
| CN1564647A (en) * | 2004-04-02 | 2005-01-12 | 楼方寿 | Method of making circuit board assembly from splitting boards of printed circuit board |
| US7297875B2 (en) * | 2004-04-27 | 2007-11-20 | Merrimac Industries, Inc. | Fusion bonded assembly with attached leads |
-
2006
- 2006-09-08 CN CNB2006101268817A patent/CN100449555C/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684275A (en) * | 2013-12-03 | 2015-06-03 | 上海望友信息科技有限公司 | PCB jointing method and system |
| CN104684275B (en) * | 2013-12-03 | 2018-09-14 | 上海望友信息科技有限公司 | PCB board joint methods and system |
| CN104797092A (en) * | 2015-04-08 | 2015-07-22 | 广州杰赛科技股份有限公司 | PCB (printed circuit board) jointing method and PCB jointing system |
| CN104797092B (en) * | 2015-04-08 | 2018-01-16 | 广州杰赛科技股份有限公司 | The board joint method and system of pcb board |
| CN108153991A (en) * | 2018-01-11 | 2018-06-12 | 郑州云海信息技术有限公司 | A kind of Quick platy clamp keyline layout method based on Cadence skill |
| CN108617085A (en) * | 2018-07-13 | 2018-10-02 | 安徽芯瑞达科技股份有限公司 | A kind of single stamp hole circuit board of down straight aphototropism mode set |
| CN108617085B (en) * | 2018-07-13 | 2023-10-31 | 安徽芯瑞达科技股份有限公司 | Single stamp hole circuit board for direct type backlight module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100449555C (en) | 2009-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108121862B (en) | Automatic engineering drawing labeling method based on three-dimensional geometric features | |
| CN102101391B (en) | Laser marking method based on CCD (Charge Coupled Device) image navigation | |
| CN1916919A (en) | Implementing method for making up handset | |
| CN201566213U (en) | Laser making device based on CCD image positioning | |
| US11568118B2 (en) | Electronic device, method for generating package drawing and computer readable storage medium | |
| CN104690420A (en) | Digital CCD-based FPC board edge positioning and processing method | |
| CN102990178A (en) | Method for improving programming speed and precision of soldering robot by using Gerber file | |
| CN104684275A (en) | PCB jointing method and system | |
| CN101075192A (en) | Method and apparatus for defining service flow in data system | |
| CN114663500A (en) | Vision calibration method, computer device and storage medium | |
| CN1667620A (en) | Method and apparatus for improving PCB design efficiency | |
| CN101201864A (en) | System and method for laying element | |
| CN109388812A (en) | A kind of modularization automatic map delivery method and system based on cloud computing | |
| CN101131709B (en) | Distributed circuit layout character face processing method and system thereof | |
| CN111581683A (en) | Display panel information extraction method and device and electronic equipment | |
| CN1421806A (en) | Computer aided circuit design and topological design | |
| CN1942055A (en) | Auxiliary designing system and method for circuit board | |
| CN101201866A (en) | System and method for managing circuit laying document | |
| US20090132978A1 (en) | Method for automatically modifying frame of circuit diagram | |
| CN1784120A (en) | Method for realizing reutilization in printed circuit board design | |
| CN111624860A (en) | Circuit board exposure reference positioning method and device | |
| CN201626162U (en) | Solder mask screen-printing device for 0.2-mm thin PCB | |
| CN204308793U (en) | A kind of positioner of pcb board | |
| CN204790949U (en) | Novel capacitive touch screen | |
| CN219107911U (en) | Shell and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |