CN1905189A - Semiconductor device and boosting circuit - Google Patents

Abstract

In the device, kick capacitors (C1 to C6) for accumulating a charge corresponding to a voltage of a direct current power supply VDD, switches (SW0 to SW5 and SW11 to SW 16) for connecting in parallel the kick capacitors (C1 to C6) to the direct current power supply VDD, and switches (SW2 to SW6 and SW17) for connecting in series the kick capacitors (C1 to C6) and direct current power supply VDD which are connected to each other in parallel are provided, and the kick capacitors C1 to C6 consist of a MOS capacitor having a SOI structure. Thereby, the invention can prevent the increase in the element area and a parasitic capacitance of a kick capacitor is reduced.

Description

Semiconductor device and booster circuit

Technical field

The present invention relates to semiconductor device and booster circuit, relate in particular to semiconductor device and booster circuit in the DC/DC converter that is applicable to switching capacity (switching capacitor) mode.

Background technology

Along with the development of semiconductor fabrication process in recent years, advance the integrated and multifunction of high density of semiconductor integrated circuit, the supply voltage of semiconductor integrated circuit inside tends to lower voltage.Also have, be accompanied by the multifunction of semiconductor integrated circuit, also advanced built-inization of the various power supplys that comprise high-voltage power supply.For example, with in the driver IC, need the above high voltage of 10V at the display element of nonvolatile memory such as flash memory, EEPROM or liquid crystal etc.Therefore, produce so high-tension booster circuit, adopt charge pump (chargepump) mode easily be built in the semiconductor integrated circuit, replace using switching regulator voltage regulator (regulator) mode of coil etc.As this charge pump mode, generally adopt Dickson formula charge pump circuit.

Also have, in order to obtain the conversion efficiency higher than charge pump circuit, in patent documentation 1, the open method that the DC/DC converter of switching capacity mode is used as booster circuit.This switching capacity mode, by the mode diverter switch element that is connected in series according to a plurality of boost charge containers (kickcapacitor) that apply supply voltage in parallel, thus can boosted output voltages.

Yet, constituting by the mos capacitance device if be used for the boost charge container of switching capacity mode, the depletion-layer capacitance that forms owing to the composition surface along trap and substrate plays a role as parasitic capacitance, therefore has the problem that reduces booster voltage.

On the other hand, if polysilicon layer is constituted the boost charge container as the ONO capacitor that upper electrode and lower electrode use, the problem that then exists the element area to increase.

Patent documentation 1: the spy opens the 2004-172631 communique

Summary of the invention

The present invention, its purpose is to provide a kind of increase of suppression element area, and can reduce the semiconductor device and the booster circuit of the parasitic capacitance of boost charge container.

In order to solve above-mentioned problem, the semiconductor device according to relevant one embodiment of the present invention is characterized in that, possesses: the BOX layer is formed on the semiconductor substrate; Semiconductor layer is formed on the above-mentioned BOX layer; A plurality of mos capacitance devices are formed in the above-mentioned semiconductor layer; And switch element, being formed in the above-mentioned semiconductor substrate, above-mentioned mos capacitance device is connected in parallel makes direct voltage be applied to jointly in the above-mentioned mos capacitance device, and switches and make the above-mentioned mos capacitance device that is connected in parallel be connected in series.

By the way, can make the BOX layer capacitance that the depletion-layer capacitance that is formed in the semiconductor substrate is carried out capacitive coupling in the mode of series connection, and can reduce the parasitic capacitance that acts on the mos capacitance device.Therefore, can reduce parasitic capacitance, and be configured for the boost charge container of switching capacity mode by the mos capacitance device, increase that in addition can the suppression element area, and increase booster voltage.

Also have, semiconductor device according to an embodiment of the present invention is characterized in that, above-mentioned switch element is formed in bulk (bulk) zone of above-mentioned semiconductor substrate.

By the way, even the mos capacitance utensil has under the situation of soi structure, also can prevent the withstand voltage deterioration of switch element, and can increase booster voltage.

In above-mentioned semiconductor device, the thickness of the filling oxide-film of above-mentioned soi structure is more than the 10nm, and the especially preferred film thicknesses of this filling oxide-film is, more than the 57nm.

Also have, booster circuit according to an embodiment of the present invention is characterized in that, possesses: first field-effect transistor, carry out conduction and cut-off work based on first control signal; And second field-effect transistor, carry out the conduction and cut-off work opposite based on above-mentioned first control signal with above-mentioned first field-effect transistor; And the 3rd field-effect transistor, carry out the conduction and cut-off work identical based on second control signal opposite with above-mentioned first field-effect transistor with the above-mentioned first control signal phase place; And the 4th field-effect transistor, constitute the mos capacitance device, wherein, the source electrode of above-mentioned first field-effect transistor and above-mentioned second field-effect transistor is connected with the grid of above-mentioned the 4th field-effect transistor, the drain electrode of above-mentioned first field-effect transistor is connected with the source electrode of above-mentioned the 3rd field-effect transistor, the drain electrode of above-mentioned the 3rd field-effect transistor is connected jointly with the source electrode and the drain electrode of above-mentioned the 4th field-effect transistor, and above-mentioned the 4th field-effect transistor has soi structure.

By the way, can make the BOX layer capacitance carry out capacitive coupling with the depletion-layer capacitance under the raceway groove that is formed on the 4th field-effect transistor in the mode of series connection, even constitute by the 4th field-effect transistor under the situation of mos capacitance device, also can reduce the parasitic capacitance that acts on the mos capacitance device.Therefore, can reduce parasitic capacitance, and be configured for the boost charge container of switching capacity mode by the mos capacitance device, increase that can the suppression element area, and increase booster voltage.

Also have, Xiang Guan booster circuit is characterized in that according to an embodiment of the present invention, and above-mentioned first～the 3rd field-effect transistor is formed on the bulk substrate.

By the way, even the mos capacitance utensil has soi structure, also can prevent the withstand voltage deterioration of first～the 3rd field-effect transistor, and can increase booster voltage.

Description of drawings

Fig. 1 is the circuit diagram of the schematic configuration of the relevant booster circuit of expression one embodiment of the present invention.

Fig. 2 is the circuit diagram of work of the booster circuit of presentation graphs 1.

Fig. 3 is the booster voltage of booster circuit of presentation graphs 1 and the figure of the relation between the parasitic capacitance.

Fig. 4 is that expression is with the structure of the boost charge container of the booster circuit of Fig. 1 and the figure that conventional example compares.

Fig. 5 is the figure of circuit structure of one-level of the booster circuit of presentation graphs 1.

Fig. 6 is the plane graph of layout patterns of one-level of the booster circuit of presentation graphs 1.

Among the figure: SW0～SW18-switch; C1～C6-boost charge container; CL-electric capacity; VDD, Va1, Va2-DC power supply; Csub1, Csub11, Csub21-parasitic capacitance; CB1～CB6, CB21-BOX layer capacitance; Cd1～Cd6, Cd11, Cd21-depletion-layer capacitance; 11,21-semiconductor substrate; The 12-trap; 13,23-depletion layer; 14,25-gate insulator mould; 15,26-gate electrode; 16,27-abutment wall (side wall); 17a, 28a-source layer; 17b, 28b-drain electrode layer; 18a, 18b-high concentration impurities diffusion zone; Cg11, Cg21-MOS electric capacity; The 22-insulating barrier; The 24-semiconductor layer; T1, T3, T4-N slot field-effect transistor; The T2-P slot field-effect transistor; The 31-semiconductor chip; R1-bulk (bulk) zone; R2-SOI forms the zone; G1～G4: gate electrode; N1～N3-N trap; The P1-P trap; DN1, DN2, DN3a, DN3b-N type impurity diffusion layer; DP1a, DP1b, DP21a, DP2b, DP3, DP4-P type impurity diffusion layer; H11～H15-lower-layer wiring layer; H21, H22-upper strata wiring layer.

Embodiment

Below, with reference to the semiconductor device of description of drawings embodiments of the present invention.

Fig. 1 is the circuit diagram of the schematic configuration of the booster circuit of expression one embodiment of the present invention.

In Fig. 1, in booster circuit, be provided with 6 grades and accumulate the boost charge container C 1～C6 that has corresponding to the electric charge of the voltage of DC power supply VDD.Also have, in booster circuit, be provided with switch SW 0～SW5, SW11～SW16 that boost charge container C 1～C6 and DC power supply VDD are connected in parallel, and be provided with switch SW 2～SW6, SW17 that the boost charge container C 1～C6 that will be connected in parallel and DC power supply VDD are connected in series.Be provided with the switch SW 18 of the booster voltage that output boosts by boost charge container C 1～C6 in addition, and be provided with the capacitor CL that switch SW 18 is separated with DC power supply VDD.

At this, boost charge container C 1～C6 can constitute by the mos capacitance device with soi structure.And if constitute boost charge container C 1～C6 by mos capacitance device with soi structure, then as the parasitic capacitance Csub1 of these boost charge container C 1～C6, depletion-layer capacitance Cd1～the Cd6 that is formed in the semiconductor substrate is added respectively, and BOX layer capacitance CB1～CB6 carries out capacitive coupling in the mode of series connection respectively to these depletion-layer capacitances Cd1～Cd6.

Fig. 2 is the circuit diagram of the work of the booster circuit of presentation graphs 1.

In Fig. 2 (a), in charging (charging) work, connect switch SW 0～SW5, SW11～SW16, and cut-off switch SW2～SW6, SW17, SW18, so that boost charge container C 1～C6 and DC power supply VDD are connected in parallel.By the way,, apply the voltage of supplying with from DC power supply VDD respectively, be accumulated in respectively among boost charge container C 1～C6 corresponding to the electric charge of DC power supply vdd voltage to boost charge container C 1～C6.

Then, in (pump up) work of boosting of Fig. 2 (b), cut-off switch SW0～SW5, SW11～SW16, and connect switch SW 2～SW6, SW17, SW18, so that boost charge container C 1～C6 and DC power supply VDD are connected in series.By the way, the voltage that is applied to voltage among boost charge container C 1～C6 and DC power supply VDD respectively added together export, thereby can obtain booster voltage corresponding to the connection progression of boost charge container C 1～C6.

At this, if having parasitic capacitance Csub1 in boost charge container C 1～C6, then the booster voltage that obtains by the work of boosting descends.

Fig. 3 is, expression is by the booster voltage of the booster circuit of Fig. 1 of calculating and the figure of the relation between the parasitic capacitance.

In Fig. 3, be judged as increase along with the parasitic capacitance Csub of boost charge container, the booster voltage HVOUT that obtains by the work of boosting descends.

At this, if the boost charge container C 1～C6 of the mos capacitance device pie graph 1 by having soi structure, then can make BOX layer capacitance CB1～CB6 that the depletion-layer capacitance Cd1～Cd6 that is formed on the semiconductor substrate is carried out capacitive coupling in the mode of series connection, can reduce the parasitic capacitance Csub1 that acts on boost charge container C 1～C6.Therefore, can reduce parasitic capacitance Csub1, and constitute again the boost charge container C 1～C6 that uses in the switching capacity mode by the mos capacitance device, increase that can the suppression element area, and increase booster voltage.

Fig. 4 is expression is compared the structure of the boost charge container of the booster circuit of Fig. 1 with conventional example profile and equivalent circuit diagram.Also have, Fig. 4 (a) is illustrated in the situation that forms the mos capacitance device on bulk (bulk) substrate, and Fig. 4 (b) is illustrated in the situation that forms the mos capacitance device on the SOI substrate.

In Fig. 4 (a), in semiconductor substrate 11, be formed with trap 12, and be formed with the depletion layer 13 that width is d1 along the composition surface between semiconductor substrate 11 and the trap 12.Also have, on semiconductor substrate 11, be formed with gate electrode 15, be formed with abutment wall (side wall) in the sidewall of gate electrode 15 via gate insulating film 14.Also have, in side's side of gate electrode 15, source layer 17a is formed in the trap 12, and in the opposing party's side of gate electrode 15, drain electrode layer 17b is formed in the trap 12.Also have around trap 12, be formed with the high concentration impurities diffusion zone 18a, the 18b that are used to obtain carrying on the back the grid connection.And gate electrode 15 is connected with source layer 17a, drain electrode layer 17b and high concentration impurity diffusion layer 18a, 18b jointly by DC power supply Va1.

At this, under the situation that is formed with the mos capacitance device on the bulk substrate, to the mos capacitance Cg11 of this mos capacitance device, the additional in parallel parasitic capacitance Csub11 that constitutes by depletion-layer capacitance Cd11.This depletion-layer capacitance Cd11 changes according to the impurity concentration Nsub of semiconductor substrate 11, the impurity concentration ND of trap 12 and the voltage E1 of DC power supply Va1.

Cd11 is by following formula 1 expression.

[formula 1]

$\mathrm{<figure-callout\; id="11"\; label="Cd"\; filenames="A20061009322400151.png,A20061009322400171.png"\; state="\{\{state\}\}">Cd</figure-callout>}11=\sqrt{\frac{q{\mathrm{\&epsiv;}}_{\mathrm{si}}\mathrm{Nsub}}{2(\mathrm{Vbi}+E1)}}...\left(1\right)$

In above-mentioned formula 1, q, ε _SiAnd Vbi, be respectively elementary charge (=1.60218 * 10 ^-19Coulomb), the dielectric constant (=1.053 * 10 of silicon ^-10F/m) and inherent potential (built-in potential), change according to ND.

At this, use under the situation of normally used p type silicon chip Nsub=*.Owing to keep the PN diode characteristic, so ND becomes the above concentration of Nub on the characteristic of CMOS processing.When ND=Nsub, Vbi=0.6V, if ND is big more, then Vbi is big more.Thereby according to formula 1, when E1=0V, the maximum of Cd11 becomes Cd11=120 μ Fm.

On the other hand, in Fig. 4 (b), on semiconductor substrate 21, be formed with insulating barrier 22, on insulating barrier 22, be formed with semiconductor layer 24.At this, in the semiconductor substrate 21, be formed with the depletion layer 23 that width is d2 along the interface between semiconductor substrate 21 and the insulating barrier 22.Also have,, for example, can use Si, Ge, SiGe, SiC, SiSn, PbS, GaAs, InP, GaP, GaN, ZnSe etc.,, for example, can use SiO as insulating barrier 22 as the material of semiconductor substrate 21 and semiconductor layer 24 ₂, SiON or Si ₃N ₄Deng insulating barrier or fill insulator die.Also have, on insulating barrier 22, be formed with the semiconductor substrate 21 of semiconductor layer 24, for example, can use the SOI substrate, as the SOI substrate, can use SIMOX (Separation by Implanted Oxgen) substrate, bonding substrate or laser annealing (Anneal) substrate etc.Replace semiconductor substrate 21 in addition, also can use insulating properties substrates such as sapphire, glass or pottery.

And, on semiconductor layer 24, be formed with gate electrode 26 via gate insulating film 25, on the sidewall of gate electrode 26, be formed with abutment wall (side wall) 27.And in side's side of gate electrode 26, source layer 28a is formed in the semiconductor layer 24, and in the opposing party's side of gate electrode 26, drain electrode layer 28b is formed in the semiconductor layer 24.And gate electrode 26 is connected with source layer 28a and drain electrode layer 28b jointly via DC power supply Va2.

At this, be formed with on the SOI substrate under the situation of mos capacitance device, to the mos capacitance Cg21 of this mos capacitance device, in parallel additional by carrying out the parasitic capacitance Csub21 that capacity coupled depletion-layer capacitance Cd21 constitutes in the mode of connecting with BOX layer capacitance CB21.

Therefore, become littler at the parasitic capacitance Csub21 of Fig. 4 (b) than the parasitic capacitance Csub11 of Fig. 4 (a), if on the SOI substrate, form the mos capacitance device, then compare with the situation that on bulk substrate, forms the mos capacitance device, can reduce the parasitic capacitance that is attached in the mos capacitance device.For example, if the film thickness of insulating barrier 22 is decided to be 2000[nm], the depletion-layer capacitance Cd21 of Fig. 4 (b) is equated with the depletion-layer capacitance Cd11 of Fig. 4 (a), then become Csub21=0.012[pF], parasitic capacitance Csub21 can be reduced about 70%.

CB21 and Csub21 are represented by following formula 2 and 3.

[formula 2]

$\mathrm{<figure-callout\; id="21"\; label="CB"\; filenames="A20061009322400151.png"\; state="\{\{state\}\}">CB</figure-callout>}21=\frac{{\mathrm{\&epsiv;}}_{\mathrm{sio}}}{d_{\mathrm{BOX}}}...\left(2\right)$

[formula 3]

$\mathrm{<figure-callout\; id="21"\; label="Csub"\; filenames="A20061009322400151.png"\; state="\{\{state\}\}">Csub</figure-callout>}21=\frac{\mathrm{<figure-callout\; id="21"\; label="C\; B"\; filenames="A20061009322400151.png"\; state="\{\{state\}\}">C</figure-callout>}{B}_{}{}_{21}\&times;{\mathrm{Cd}}_{21}}{\mathrm{<figure-callout\; id="21"\; label="C\; B"\; filenames="A20061009322400151.png"\; state="\{\{state\}\}">C</figure-callout>}{B}_{}{}_{21}+\mathrm{<figure-callout\; id="21"\; label="C\; d"\; filenames="A20061009322400151.png"\; state="\{\{state\}\}">C</figure-callout>}{d}_{}{}_{21}}...\left(3\right)$

In the following formula, ε _SioAnd d _BOX, be respectively the dielectric constant of silicon dioxide and the film thickness of filling oxide-film.The maximum of depletion-layer capacitance is 120 μ Fm.In order to make Csub21 become below the 30 μ Fm, preferably to become 10 μ Fm, thereby be set at more than the 19nm, especially be preferably set to more than the 57nm as the film thickness that preferably will fill oxide-film.By the way, more can reduce parasitic capacitance.

Fig. 5 is the figure of the circuit structure of the one-level of the booster circuit of presentation graphs 1.

In Fig. 5, for example, the switch SW 8 of Fig. 1 can can can be made of N slot field-effect transistor T4 N slot field-effect transistor T3, boost charge container C 3 P-channel field-effect transistor (PEFT) transistor T 2, switch SW 3 N slot field-effect transistor T1, switch SW 13.And N slot field-effect transistor T4 can constitute the mos capacitance device with soi structure.

At this, the source electrode of N slot field-effect transistor T1 and P-channel field-effect transistor (PEFT) transistor T 2 is connected with the grid of N slot field-effect transistor T4, the drain electrode of N slot field-effect transistor T1 is connected with the source electrode of N slot field-effect transistor T3, and the drain electrode of N slot field-effect transistor T3 is connected jointly with source electrode and the drain electrode of N slot field-effect transistor T4.

And, grid to N slot field-effect transistor T1 and P-channel field-effect transistor (PEFT) transistor T 2, input makes the first control signal XSC1 of N slot field-effect transistor T1 and P-channel field-effect transistor (PEFT) transistor T 2 conduction and cut-off, and to the grid of N slot field-effect transistor T3, input makes the second control signal XSC2 of N slot field-effect transistor T3 conduction and cut-off.Also have, the first control signal XSC1 can use phase place opposite pulse signal mutually with the second control signal XSC2.

And, in charging work, the first control signal XSC1 being set at low level, the second control signal XSC2 is set at high level.And, when N slot field-effect transistor T1 is ended, make P-channel field-effect transistor (PEFT) transistor T 2 and N channel field-effect pipe T3 conducting, so that in N slot field-effect transistor T4, apply DC power supply VDD, in N slot field-effect transistor T4, accumulate electric charge.

Then, in the work of boosting, the first control signal XSC1 is set at high level, the second control signal XSC2 is set at low level.And, when making N slot field-effect transistor T1 conducting, P-channel field-effect transistor (PEFT) transistor T 2 and N slot field-effect transistor T3 are ended, so that the output voltage from the boost charge container C 2 of prime is applied in the grid of N slot field-effect transistor T4, be applied in the boost charge container C 4 of back level from the output voltage of the source/drain of N slot field-effect transistor T4.

Fig. 6 is the plane graph of the layout patterns of the one-level of the booster circuit of presentation graphs 1.

In Fig. 6, in semiconductor chip 31, be provided with bulk (bulk) region R 1 and SOI and form region R 2.And in block (bulk) region R 1, be formed with N trap N1, N2 and P trap P1, form in the region R 2, be formed with N trap N3 at SOI.And the N slot field-effect transistor T1 of Fig. 5, T3, T4 are respectively formed among N trap N1, N2, the N3, and P-channel field-effect transistor (PEFT) transistor T 2 is formed among the P trap P1.

That is, on P trap P1, dispose gate electrode G3, and in P trap P1, be formed with the N type impurity diffusion layer DN3a, the DN3b that dispose in the mode that sandwiches gate electrode G3.Also have, around P trap P1, be formed with the p type impurity diffusion layer DP3 that is used to obtain carrying on the back the grid connection.

Also have, on N trap N1, dispose gate electrode G1, and be formed with p type impurity diffusion layer DP1a, the DP1b that disposes in the mode that sandwiches gate electrode G1.Also have, around N trap N1, be formed with the N type impurity diffusion layer DN1 that is used to obtain carrying on the back the grid connection.

Also have, on N trap N2, dispose gate electrode G2, and be formed with p type impurity diffusion layer DP2a, the DP2b that disposes in the mode that sandwiches gate electrode G2.Also have, around N trap N2, be formed with the N type impurity diffusion layer DN2 that is used to obtain carrying on the back the grid connection.

Also have, on N trap N3, dispose a plurality of gate electrode G4, and on N trap N3, be formed with the p type impurity diffusion layer DP4 that disposes in the mode that sandwiches gate electrode G4.

And N type impurity diffusion layer DN1 and p type impurity diffusion layer DP1b, DP2b connect via lower-layer wiring layer H11.Also have, gate electrode G4, p type impurity diffusion layer DP1a and N type impurity diffusion layer DN3a connect via lower-layer wiring layer H12.Also have, gate electrode G1, G3 connect via lower-layer wiring layer H13.Also have, N type impurity diffusion layer DN3b and p type impurity diffusion layer DP3 connect via lower-layer wiring layer H14.Also have, p type impurity diffusion layer DP2a, DP4 and N type impurity diffusion layer DN2 connect via lower-layer wiring layer H15.Also have lower-layer wiring layer H13 to be connected input control signal XSC21 in the wiring layer H21 of upper strata with upper strata wiring layer H21.Also have, lower-layer wiring layer H16 is connected with upper strata wiring layer H22, input control signal XSC2 in the wiring layer H22 of upper strata.

At this, even form in the region R 2 by N slot field-effect transistor T4 being formed on SOI, T4 constitutes under the situation of mos capacitance device by N channel field-effect pipe, also can reduce the parasitic capacitance that acts on the mos capacitance device.Therefore, reduce parasitic capacitance, and can be configured for the boost charge container of switching capacity mode by the mos capacitance device, the increase of suppression element area, and can increase booster voltage.

Also have, even by N slot field-effect transistor T1, T3 and P-channel field-effect transistor (PEFT) transistor T 2 are formed on boxed area R1, the mos capacitance utensil is had under the situation of soi structure, also can prevent to be used for the withstand voltage deterioration of the switch element of switching capacity mode, can increase booster voltage.

Claims (6)

1, a kind of semiconductor device,

Possess:

The BOX layer is formed on the semiconductor substrate;

Semiconductor layer is formed on the described BOX layer;

A plurality of mos capacitance devices are formed in the described semiconductor layer; And

Switch element is formed in the described semiconductor substrate, and described mos capacitance device is connected in parallel makes direct voltage be applied to jointly on the described mos capacitance device, and switches and make the described mos capacitance device that is connected in parallel be connected in series.

2, semiconductor device as claimed in claim 1 is characterized in that,

Described switch element is formed in the boxed area of described semiconductor substrate.

3, a kind of booster circuit,

Possess:

First field-effect transistor carries out conduction and cut-off work based on first control signal;

Second field-effect transistor carries out the conduction and cut-off work opposite with described first field-effect transistor based on described first control signal;

The 3rd field-effect transistor carries out the conduction and cut-off work identical with described first field-effect transistor based on second control signal opposite with the described first control signal phase place; And

The 4th field-effect transistor constitutes the mos capacitance device,

Wherein, the source electrode of described first field-effect transistor and described second field-effect transistor is connected with the grid of described the 4th field-effect transistor,

The drain electrode of described first field-effect transistor is connected with the source electrode of described the 3rd field-effect transistor,

The drain electrode of described the 3rd field-effect transistor is connected jointly with the source electrode and the drain electrode of described the 4th field-effect transistor,

Described the 4th field-effect transistor has soi structure.

4, booster circuit as claimed in claim 3 is characterized in that,

The film thickness of the filling oxide-film of described soi structure is more than the 10nm.

5, booster circuit as claimed in claim 3 is characterized in that,

The film thickness of the filling oxide-film of described soi structure is more than the 57nm.

6, booster circuit as claimed in claim 3 is characterized in that,

Described first～the 3rd field-effect transistor is formed on the bulk substrate.

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