CN1904800A - Fan-free type radiating structure - Google Patents
Fan-free type radiating structure Download PDFInfo
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- CN1904800A CN1904800A CN 200510087127 CN200510087127A CN1904800A CN 1904800 A CN1904800 A CN 1904800A CN 200510087127 CN200510087127 CN 200510087127 CN 200510087127 A CN200510087127 A CN 200510087127A CN 1904800 A CN1904800 A CN 1904800A
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Abstract
The invention discloses a heat emission structure without fan that is mainly stuck heat conductor and heat radiator on heat source component. It could transfer most heat outside case by the method of improving heat exchanging to achieve the heat emission target.
Description
Technical field:
The present invention relates to a kind of heat abstractor, particularly a kind of fan-free type radiating structure, it can dispel the heat with regard to the thermal source assembly, need not use fan when particularly dispelling the heat, and its main means are at thermal source assembly be sticked heat conductor and radiator.
Prior art:
Known as units such as computing machine, data processor, LED-backlit modules, assemblies such as little processing compute chip CPU, image processing chip VGA, random memory DDR or the led light source crystal grain of its inside, be the main thermal source assembly that produces heat energy, it must make up as heat radiation in conjunction with radiating seat and the fan long-pending than large contact surface, to force the mode of thermal convection, reach the system radiating purpose.But for a long time, there are problems such as the fiduciary level of fan and noise jamming, reduce system maintenance cycle, phase in longevity and people because of interface condition.
Figure 1 shows that the heat radiation array mode of known thermal source assembly 1, radiator 2 and fan 3.Wherein the thermal source assembly 1, can be little processing compute chip.Fig. 2 is the random memory DDR 11 of another kind of thermal source assembly, and Fig. 3 is the LED crystal grain 12 of another thermal source.The assembly of the high pyrotoxin of above-mentioned these unit areas, when if fan 3 can not normal operation, thermal source assembly 1, random memory DDR 11, LED crystal grain 12 temperature will be increased to rapidly Celsius 90 the degree in addition Celsius 130 the degree more than, the overheated damage that will cause associated component and system.
Summary of the invention:
Fundamental purpose of the present invention is to cast out the design of fan radiating system, and a kind of radiator structure that improves system dependability and abate the noise and disturb is provided.
For reaching above-mentioned purpose, the invention provides a kind of fan-free type radiating structure that is used on the thermal source assembly, it is provided with:
Heat conductor is the heat conduction structure with equivalent area, is attached at thermal source assembly or the close thermal source assembly periphery that is sandwiched in;
Radiator is attached at heat conductor, and the heat energy that heat conductor conducted is dispelled the heat.
Fan-free type radiating structure as mentioned above, described heat conductor comprises the heat conduction component of right quantity, described heat conduction component be shaped as right cylinder, rectangular cylinder or correlation combiner body one of them.
Fan-free type radiating structure as mentioned above, the sectional area summation that is parallel to described thermal source assembly heating face of described heat conductor, at least greater than thermal source assembly heating surface long-pending 1/2nd.
Fan-free type radiating structure as mentioned above, wherein this heat conductor is can quick heat conducting heat pipe, is that column type, cast or dull and stereotyped heat pipe are wherein a kind of.
Fan-free type radiating structure as mentioned above, wherein this heat conductor and radiator material are the high conduction material.
Fan-free type radiating structure as mentioned above, wherein said high conduction material comprise the wherein a kind of of copper, aluminium, graphite, carbon fiber and associated alloys combination.
Fan-free type radiating structure as mentioned above, this radiator wherein, it is outside or press close to this casing surface to be fixed in the casing of the unit that comprises described thermal source assembly.
Fan-free type radiating structure as mentioned above, wherein this radiator includes some radiating fins.
Fan-free type radiating structure as mentioned above, described heat conductor is close top and the below that is sandwiched in the thermal source assembly simultaneously.
Adopt technique scheme, the present invention utilizes function, the heat conduction path area that increases heat conductor, can draw the heat that thermal source sends fast, utilize radiator natural convection, increase design such as area of dissipation, and the configuration characteristic of integration body, most heat is directly shifted out the casing outside, reach final heat radiation purpose.
Description of drawings:
Fig. 1 is for commonly using the fan heat radiation module synoptic diagram.
Fig. 2 is a synoptic diagram of commonly using thermal source assembly random memory DDR.
Fig. 3 is a synoptic diagram of commonly using thermal source component leds crystal grain.
Fig. 4 does not have fan radiator structure synoptic diagram for the present invention.
Fig. 5 is another heat conductor kenel synoptic diagram among the present invention.
Fig. 6 is a heat conductor kenel synoptic diagram again among the present invention.
Fig. 7 is the another no fan radiator structure synoptic diagram of the present invention.
Fig. 8 is another clad type heat conductor synoptic diagram among the present invention.
Embodiment:
Now careful just content of fan-free type radiating structure of the present invention and the effect that is produced thereof, conjunction with figs. is enumerated preferred embodiment and is described in detail as follows.
The pathway of heat energy and mode comprise heat conduction, thermal convection and heat radiation, and final radiating mode is thermal convection and heat radiation.Thermal convection can be divided into thermal natural convection again and force thermal convection, wherein forces thermal convection that higher radiating efficiency is arranged.Various heat transfer paths, its thermoflux size has strong relation with thermal conductance material, contact area, temperature difference, and various cooling mechanisms all need to carry out the distribution and the design of hot biography approach, conduct, to reach the purpose of heat radiation in response to the finite space and power of heat source condition.
The unit that generally has the inner heat source, for example arithmetical unit, scratch-pad memory, power provider etc. all have common characteristic:
(1) near the narrow space thermal source assembly.
(2) heating power of thermal source assembly is big.
Based on above restrictive condition, the fan-type radiator structure of the overwhelming majority, operational temperature conditions that all can Control Component.Radiator structure referring to Fig. 1, comprise radiator 2 and fan 3, the design of this radiator 2, for sharp fan 3 is carried out forced convertion heat radiation approach, significantly increase cooling surface area, the radiator 2 of general design, this surface area and volume ratio are about 10～30 times, perhaps higher, almost most heat is that the fin surface by radiator 2 sheds.
Fan 3 is forced the thermal convection cooling mechanisms, and adjustable rectification campaign amount flow rate is controlled the operating temperature of thermal source assembly, and the design focal point of this radiator 2 does not lie in heat accumulation, requires surface area much larger than volume, so the value of the thermal content in the unit volume is on the low side, heat storage capacity a little less than.When the forced convertion miopragia, the thermal source assembly temperature increases rapidly, and the unit interior environment temperature also increases relatively.
The radiator structure design of thermal natural convection, significantly area of dissipation still is the key factor of heat radiation, the temperature difference between radiator 2 and environment temperature determines the driving force that thermal natural convection dispels the heat.In view of this, the heat radiation power of natural convection is lower than forced convertion, and when increasing area of dissipation relatively, in fan-free type radiating structure, heat accumulation and thermal conductance function are design focal point.
For improving the machine set system fiduciary level and avoiding the fan sound to disturb, the present invention adopts fan-free type radiating structure, the emphasis of radiator structure structure design:
(1), designs the thermal capacitance heat absorption capacity of relative scale, the heat of extract heat source component institute output, and the stable operation temperature conditions of energy maintaining heat source component in response to the heating power of thermal source assembly.
(2) according to the unit finite space and thermal source assembly heating power condition, design heat conduction approach, with most heat " conduction " to the casing outside, the operational temperature conditions of the machine set system internal environment of avoiding raising.
See also shown in Figure 4ly, be fan-free type radiating structure synoptic diagram of the present invention, it comprises following heat radiation procedure declaration:
A. the thermal source assembly 1, the hot delivered power 1W～15W of every square centimeter of unit area or higher, wherein the unit area power maximum of being sent with LED crystal grain light source.
B. be the operating temperature of maintaining heat source component 1, fan-free type radiating structure need have " heat accumulation ", " conduction " concurrently and reach the design of " heat radiation " function, the function of heat accumulation and conduction wherein, general radiator structure different from the past.Radiator structure is reduced to two major functions, comprises heat conductor 4 and radiator 5, can cooperate the unit inner space to design allotment.
C. aforementioned heat conductor 4 is mainly carried out the function of heat accumulation and heat conduction; Radiator 5 except that keeping part heat accumulation function, increases the Natural Heat Convection function.
D. according to heat conduction parameters relationship Q=kA Δ T/ Δ y, wherein Δ y is the heat conduction spatial altitude, and k is a coefficient of heat conductivity, and A is a heat-conducting area; According to the heat radiation material characteristic and the finite space, basic " heat conduction " conduction surface of design heat conductor 4.Please refer to Fig. 5, disclose a kind of mode 41 that this heat conductor is implemented, main heat conduction path is the heat conduction member right cylinder 411 among the figure, and, the another kind of mode 42 implemented of heat conductor as shown in Figure 6, main heat conduction path is the heat conduction member rectangular parallelepiped 421 among the figure, this right cylinder 411 and rectangular parallelepiped 421 can reach most heat the radiator of heat conductor top, heat-conducting piece is parallel to the sectional area summation of thermal source assembly 1 heating face, greater than thermal source assembly 1 heating surface long-pending more than 1/2nd, the cross section total area is bigger, and it is better to conduct heat.Arround the radiating fin number, a part of thermal natural convection heat sinking function is provided.
E. heat storage capacity Demand Design, Natural Heat Convection power is not as forced convertion, and heat conductor 4 is still needed and is possessed the heat accumulation pooling feature, and the surface area of this kenel design and the ratio of volume are reduced to 1～20 times of scope.Can be according to the proportional relation of thermal capacitance and quality, Q=mc Δ T=ρ Vc Δ T, wherein m is a quality, and V is a volume, and c is a specific heat, the volume demand of the temporary thermal capacity of estimation, the volume demand of design heat conductor.
F. the design function of heat conductor 4, mainly based on heat accumulation and heat conduction, heat storage capacity especially can satisfy the moment thermal change of the above high-speed computation chip of 1GHz, also can be as the bridge of thermal source with final radiating seat, the thermally conductive heat flux 51 of this functional structure is higher than thermal convection thermoflux 52 (as Fig. 4).
G. this heat conductor, its material can be copper, aluminium, graphite, the contour transmitter of carbon fiber, or the combination of the associated alloys of above material; This shape can be geometric configuratioies such as several are cylindric, rectangular column.
H. this heat conductor also can be the heat pipe of high thermal conduction characteristic, and its heat conduction speed is more than 50～100 times of copper, aluminum, as good heat conduction path, with the heat of thermal source assembly 1 directly " transmission " to radiator 5.
See also shown in Figure 7 again, it discloses another form 43 of heat conductor, is column type or cast heat pipe, dull and stereotyped heat pipe etc. with Rapid Thermal conduction function, and the temperature difference scope can be controlled in 2 ℃, be the heat that effective extract heat conduit transmits, need to strengthen the heat accumulation function of radiator 5.
I. by the design characteristics of heat conductor 4 (being specially three kinds of forms 41,42,43), make this temperature difference that connects face up and down become very little, and with most of heat transferred to adjoining radiator 5.The base temperature value of radiator 5 also can increase relatively, increases the temperature difference of radiator 5 and environmental baseline, and increases the driving force of natural convection.
J. do not have the design of fan cooling mechanism, the cooling surface area demand of radiator 5 is higher than fan and forces more than 3～6 times of Natural Heat Convection area.
K. see also shown in Figure 8, be designed the 4th kind of form 44 of heat conductor of the DDR internal memory 13 that the present invention is directed to the upper and lower surface thermal source, in DDR internal memory 13 was coated on, this clad type heat conductor form 44 made the equal temperature characteristics of DDR internal memory 13 upper and lower surfaces less than 1 ℃.
The applicable heat radiation scope of the present invention, comprise various electronic motor equipment and product, for example: computing machine, data processor, backlight module (as: LED Backlight), light fixture (as: LED lamp) or the like, little processing compute chip (as: CPU) of its inside, image processing chip (as: VGA), random memory (as: DDR), light source spare part (as: LED crystal grain), and other thermal source spare part.
The present invention especially can be applicable to the control enclosure (device) of tool watertight, tight function, by increasing heat conduction contact area, or pathway, the heat of the overwhelming majority is derived control enclosure (device), to keep the operating environment temperature of internal system.
In sum, the design of no fan cooling system of the present invention, can effectively increase system dependability, get rid of noise jamming, avoid thermal source assembly and system injury, effective demand that solves the medium-term and long-term problem that exists of prior art and reach relevant user and long term consumer is utilized on industry really.
The aforesaid preferred embodiment of the present invention only is one of the mode that can specifically implement according to technical solution of the present invention, does not limit the present invention with this.
Claims (9)
1, a kind of fan-free type radiating structure is used for the thermal source assembly, it is characterized in that, is provided with:
Heat conductor is the heat conduction structure with equivalent area, is attached at thermal source assembly or the close thermal source assembly periphery that is sandwiched in;
Radiator is attached at heat conductor, and the heat energy that heat conductor conducted is dispelled the heat.
2, fan-free type radiating structure according to claim 1 is characterized in that described heat conductor comprises the heat conduction component of right quantity, described heat conduction component be shaped as right cylinder, rectangular cylinder or correlation combiner body one of them.
3, fan-free type radiating structure according to claim 1 is characterized in that, the sectional area summation that is parallel to described thermal source assembly heating face of described heat conductor, at least greater than thermal source assembly heating surface long-pending 1/2nd.
4, fan-free type radiating structure according to claim 1 is characterized in that, wherein this heat conductor is can quick heat conducting heat pipe, is that column type, cast or dull and stereotyped heat pipe are wherein a kind of.
5, fan-free type radiating structure according to claim 1 is characterized in that wherein this heat conductor and radiator material are the high conduction material.
As fan-free type radiating structure as described in the claim 5, it is characterized in that 6, wherein said high conduction material comprises the wherein a kind of of copper, aluminium, graphite, carbon fiber and associated alloys combination.
7, fan-free type radiating structure according to claim 1 is characterized in that, this radiator wherein, and it is outside or press close to this casing surface to be fixed in the casing of the unit that comprises described thermal source assembly.
8, fan-free type radiating structure according to claim 1 is characterized in that wherein this radiator includes some radiating fins.
9, fan-free type radiating structure according to claim 1 is characterized in that, described heat conductor is close top and the below that is sandwiched in the thermal source assembly simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510087127 CN1904800A (en) | 2005-07-26 | 2005-07-26 | Fan-free type radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510087127 CN1904800A (en) | 2005-07-26 | 2005-07-26 | Fan-free type radiating structure |
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|---|---|
| CN1904800A true CN1904800A (en) | 2007-01-31 |
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| CN 200510087127 Pending CN1904800A (en) | 2005-07-26 | 2005-07-26 | Fan-free type radiating structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100413392C (en) * | 2007-02-14 | 2008-08-20 | 南京理工大学 | Non-fan chip heat radiator |
| CN107734946A (en) * | 2017-11-30 | 2018-02-23 | 宁德时代新能源科技股份有限公司 | Method and apparatus for dissipating heat from printed circuit board in vehicle battery, computer readable storage medium, and vehicle battery |
| CN108885141A (en) * | 2016-04-08 | 2018-11-23 | 株式会社电装 | Heat flux meter and apparatus for diagnosis of abnormality |
-
2005
- 2005-07-26 CN CN 200510087127 patent/CN1904800A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100413392C (en) * | 2007-02-14 | 2008-08-20 | 南京理工大学 | Non-fan chip heat radiator |
| CN108885141A (en) * | 2016-04-08 | 2018-11-23 | 株式会社电装 | Heat flux meter and apparatus for diagnosis of abnormality |
| CN107734946A (en) * | 2017-11-30 | 2018-02-23 | 宁德时代新能源科技股份有限公司 | Method and apparatus for dissipating heat from printed circuit board in vehicle battery, computer readable storage medium, and vehicle battery |
| CN107734946B (en) * | 2017-11-30 | 2019-12-06 | 宁德时代新能源科技股份有限公司 | Method and apparatus for dissipating heat from printed circuit board in vehicle battery, computer readable storage medium, and vehicle battery |
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