CN1904730A - Structure of gluing developing apparatus and chip transmission process - Google Patents
Structure of gluing developing apparatus and chip transmission process Download PDFInfo
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- CN1904730A CN1904730A CN 200510046939 CN200510046939A CN1904730A CN 1904730 A CN1904730 A CN 1904730A CN 200510046939 CN200510046939 CN 200510046939 CN 200510046939 A CN200510046939 A CN 200510046939A CN 1904730 A CN1904730 A CN 1904730A
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Abstract
The invention relates to structure and wafer transferring technology method for gaining equally photoresist and pasting developing device of photoresist image. The pasting developing device includes wafer box station, box station robot, technology wall, technology robot, and technology station. The semiconductor wafer is penetrated, entered, and exported thought the technology wall by delivering transmission mode. The device structure can satisfy large scale high yield production demand, reduce pollution while wafer transferring, reduce device investment cost, and increase production efficiency.
Description
Technical field
The present invention relates in order on semiconductor wafer, to obtain the structure and the wafer transferring process of the gluing developing process treatment facility of uniform photoresist and photoresist figure, be specially wafer case station, process wall, technology station and be and parallelly arrange side by side, the technique unit of permeable structures is arranged in the process wall; In process treatment process, the transmission of semiconductor wafer is to carry out the transmission of two-way wafer by the mode of passing thoroughly that sees through process wall.
Background technology
At present, gluing development TRACK equipment mainly partly is made up of coating unit (or claim COT) and/or developing cell (or claiming DEV), baker unit (or claiming OVEN), limit portion exposure device (or claiming WEE), technology robot (or claiming PS-R), interim carrier, centering unit (or claiming CA), box station robot (or claiming CS-R), wafer case station etc., wafer is sent to centering unit or intermediate carrier by box station robot from wafer case, delivers to each technique unit after being taken out from centering unit or intermediate carrier by the technology robot again; Wafer after PROCESS FOR TREATMENT is sent to centering unit or intermediate carrier by the technology robot, sends back to wafer case after being taken out from centering unit or intermediate carrier by box station robot again.
Requirement along with the production capacity increasing, the centrifugal unit of TRACK equipment (or claiming SPIN) will increase, the cold dish of baker unit (or claiming CP), heat dish (or claiming HP and HHP), tackify unit (or claiming AD) also must correspondingly increase, the centering unit of wafer turnover, and technology robot workload strengthens.
Now, satisfy the requirement that strengthens production capacity and quality raising, method one is to increase TRACK equipment; Method two is the device structure adjustment, use to increase technology robot quantity at process section, or uses new and effective technology robot.
Summary of the invention
The structure and the wafer that the invention provides a kind of glue-spreading development equipment are passed transmission technology thoroughly, in order to overcome the deficiencies in the prior art, device structure are adjusted, and process wall is designed to pass-through type mechanism; Simultaneously, we change the transmission route of wafer, adopt wafer to see through process wall and enter process section for many mouthfuls, and wafer satisfies the needs that increasing production capacity and quality improve at the process route of process section through many mouthfuls of outputs of process wall.
Function of the present invention is achieved in that
A kind of structure of glue-spreading development equipment, have wafer case station, process wall, technology station, wafer case station, process wall, technology station are parallelly to arrange side by side, box station robot places between wafer case station and the process wall, between wafer case station and process wall, move, the technology robot places between process wall and the technology station, moves between process wall and technology station.
Described process wall is made up of two or more bakers unit and/or wafer limit portion processing unit; The sub-technique unit of baker unit has permeable structures in the process wall, is called penetrating technique unit, and there are two relative import and export this unit, and box station robot and technology robot can implement to fetch and deliver for the wafer of penetrating technique unit.
In each baker unit respectively by sub-technique unit: cold dish device, heat dish device, superthermal dish device, centralising device, tack producing device stack are formed.
Described technology station is made up of two or more gluings and/or developing process unit.
A kind of in glue-spreading development equipment wafer pass transmission process thoroughly, after wafer takes out from the wafer case station by box station robot, be delivered in the penetrating technique unit in the process wall, by the technology robot wafer is taken out respectively again, be sent to other technique unit and carry out PROCESS FOR TREATMENT, box station robot sometimes can the auxiliary process robot finishes the transmission between the penetrating technique unit of wafer some in process wall, get back in the interior penetrating technique unit of process wall through the wafer after the whole gluing developing process processing, take out respectively by box station robot again, send the wafer case station back to.
Box station robot transmission wafer between wafer case station and process wall, the technology robot is transmission wafer between process wall and technology station, and the penetrating technique unit in the process wall can realize that the bi-directional of wafer flows.
Advantage of the present invention and beneficial effect are:
1, the transmission technology mode of passing of the present invention has been broken through the traditional wafer transmission mode of glue-spreading development equipment, reduced " larynx joint " in the wafer transmission path, also reduce the work station of process section robot, made each technique unit of entire equipment enliven.
2, the present invention passs the leap that brought device structure of transmission technology mode thoroughly, passes the process wall of being made up of a plurality of technique unit devices, and wafer can many mouthfuls enters process wall, and wafer also can be from many mouthfuls of outputs of process wall.Device structure of the present invention has satisfied the production requirement of extensive, high production capacity gluing developing process.
3, use structural device of the present invention, floor area is little, has reduced environment effectively to the pollution of wafer in transmission course; Pass the enforcement of transmission technology mode thoroughly and injected cardiotonic for multiple trace-stacking production, reduced the cost of investment of equipment effectively, production efficiency is improved.
Description of drawings
Fig. 1 is a device structure synoptic diagram of the present invention.
Fig. 2 is the side-looking structural representation of Fig. 1.
Wherein, 1-centrifugal unit technology station (SPIN), 2-centrifugal unit air-intake device (FFU and THC), 3-technology robot (PS-R), 4-process wall, 5-limit portion exposure device (WEE), 6-wafer case station (CS), 7-box station robot (CS-R), 8-box station segment frames mechanism, 9-process section frame mechanism, a-coating unit (COT), b-developing cell (DEV), c-cold dish device (CP), d-heat dish device (HP), the superthermal dish device of e-(HHP), f-centralising device (CA), g-tack producing device (AD), h-wafer case etc.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in detail.
Shown in Fig. 1-2, this equipment consists of the following components: centrifugal unit technology station 1, centrifugal unit air-intake device 2, technology robot (PS-R) 3, process wall 4, limit portion exposure device (WEE) 5, wafer case station 6, box station robot (CS-R) 7, box station segment frames mechanism 8, process section frame mechanism 9 etc.The centrifugal unit technology station 1 that is mentioned to above is made up of coating unit (COT) a and two kinds of technique units of developing cell (DEV) b, is configured as the case may be; Process wall 4 is made up of the baker unit of difference configuration, being made up of stacks such as cold dish device (CP) c, heat dish device (HP) d, superthermal dish device (HHP) e, centralising device (CA) f, tack producing device (AD) g respectively in each baker unit, also is to carry out the difference configuration as the case may be; Wafer case station 6 is made up of slide holder and wafer case h, and quantity configuration is as the case may be and fixed.The operation of equipment platform of knowing altogether, various control system devices, the frame mechanism protective shield, chemicals supply stations etc. are not listed as in the drawings.Wafer takes out from wafer case by CS-R, be sent to AD or HP, deliver to each technique unit after taking out from AD or HP by CS-R and/or PS-R again, as CP, CA, SPIN, HP, HHP, WEE etc., be sent to HP or CA through the wafer after the processing of gluing developing process by PS-R or CS-R, send back to wafer case after taking out from HP or CA by CS-R again.Described SPIN is 4-10, is respectively COT and DEV, attaches most importance to stacking and puts; The quantity of described CA, HP, AD, WEE disposes according to actual conditions; Described WEE, COT, DEV have only import and export; Described AD, CP, CA, HP, HHP have two relative import and export.
Present embodiment is to be that example is described with 6-SPIN (2C4D) pattern, be configured to: 2 of coating units, 4 of developing cells, each 1 in baker unit 6 (4 technique unit positions being arranged, wherein 3 AD, 5 CP, 4 HP, 8 HHP, 2 CA in each unit), 2 of limit portion exposure devices (limit portion processing unit), technology robot and box station robots, 6 at wafer case station.
As depicted in figs. 1 and 2, add man-hour when carrying out coating technique, box station robot (CS-R) 7 will take out wafer from wafer case station 6, deliver among centralising device (CA) f of process wall 4, wafer after with centering takes out (PS-R) 3 of technology robot from the opposite side import/export of centralising device (CA) f, deliver among tack producing device (AD) g of process wall 4, wafer after the tackified finish is taken out by technology robot (PS-R) 3, deliver among cold dish device (CP) c of process wall 4, wafer after the cooling processing is taken out by technology robot (PS-R) 3, deliver among gluing centrifugal unit (COT) a and handle, wafer after gluing is handled is taken out by technology robot (PS-R) 3, deliver among superthermal dish device (HHP) e of process wall 4, wafer after post bake is handled is taken out by technology robot (PS-R) 3, deliver in the limit portion exposure device (WEE) 5, wafer after the exposure-processed is taken out by technology robot (PS-R) 3, deliver among superthermal dish device (HHP) e of process wall 4, wafer after the back baking is handled is taken out from the opposite side import/export of superthermal dish device (HHP) e by box station robot (CS-R) 7, send back in the wafer case station 6, finish the processing of monolithic coating technique.
Add man-hour when carrying out developing process, box station robot (CS-R) 7 will take out wafer from wafer case station 6, deliver among heat dish device (HP) d of process wall 4, wafer after with soft baking takes out from the opposite side import/export of heat dish device (HP) d in technology robot (PS-R) 3, deliver among cold dish device (CP) c of process wall 4, wafer after the cooling processing is taken out by technology robot (PS-R) 3, deliver among centralising device (CA) f of process wall 4, wafer after with centering takes out (PS-R) 3 of technology robot from the opposite side import/export of centralising device (CA) f, deliver among development centrifugal unit (DEV) b and handle, wafer after the development treatment is taken out by technology robot (PS-R) 3, deliver among superthermal dish device (HHP) e of process wall 4, wafer after the back baking is handled is taken out from the opposite side import/export of superthermal dish device (HHP) e by box station robot (CS-R) 7, send back in the wafer case station 6, finish the processing of monolithic developing process.
The present invention's heat dish, superthermal dish device be used for soft baking, the preliminary drying before developing before the gluing and develop after post bake cure etc., heating-up temperature is selected in a value between 85-140 ℃, superthermal dish temperature is slightly higher with respect to temperature of heat plate, also is selected in a value between 85-140 ℃.
The effect of cold dish device of the present invention has two, and the one, guarantee the value of temperature between 20-25 ℃ before wafer enters technique units such as gluing, development, the processing of limit portion, as 23 ℃; Another is the wafer of guaranteeing to come out from the high-temperature technology unit, and the value of the temperature before entering into next technique unit between 20-25 ℃ is as 23 ℃.
Centralising device of the present invention is that wafer is in relative center before guaranteeing that wafer enters centrifugal unit technology station, when wafer is placed in the centrifugal unit, and the vertical center line of wafer and hydro-extractor central axes.
Tack producing device of the present invention is before guaranteeing that wafer enters centrifugal unit technology station, and upper wafer surface has the thin and chemical solvent uniformly of one deck, and this chemical solvent has the glued membrane of increasing and wafer to be stained with sticking effect, and and glue effects such as chemical reaction are arranged.
The effect of centrifugal unit air-intake device of the present invention has three, and the one, guarantee the value of temperature constant between 20-25 ℃ in the centrifuging process unit, as 23 ℃; Another is the constant value of guaranteeing in the centrifuging process unit between 35-65%RH of humidity, as 45%RH; The 3rd, guarantee that pressure in the centrifuging process unit is greater than other unit.
Limit of the present invention portion exposure device exposes to the glued membrane that the ring-type or the linearity edge of wafer carries out 0-5mm deeply with the optical exposure principle, the glued membrane of micro-protuberance slightly so that get rid of unnecessary in the developing process unit.
Above process route illustrates equipment mechanism of the present invention and transmission technology as an example, and the actual process route may be different.
Because the glue-spreading development equipment type selecting and the technology difference of each semiconductor factory, machining process route is just different so, and production capacity is also just different, and this is relevant with factors such as the structure of equipment, process route, logistics and distribution managements.Therefore, for satisfying the demand of high production capacity, consider that semiconductor factory purifies the restriction in zone, reduce the pollution of wafer when non-PROCESS FOR TREATMENT, the main equipment that integrates multiple equipment just has required.Device structure that the present invention is mentioned and machining process route are one of schemes that addresses this problem, the present invention not only is suitable for the process equipment of gluing and development hybrid process, also is suitable for the multiple road equipment of single coating technique and the multiple road equipment of single developing process.
Claims (6)
1, a kind of structure of glue-spreading development equipment, have wafer case station, process wall, technology station, it is characterized in that: wafer case station, process wall, technology station are parallelly to arrange side by side, box station robot places between wafer case station and the process wall, between wafer case station and process wall, move, the technology robot places between process wall and the technology station, moves between process wall and technology station.
2, by the structure of the described glue-spreading development equipment of claim 1, it is characterized in that: described process wall is made up of two or more bakers unit and/or wafer limit portion processing unit; The sub-technique unit of baker unit has permeable structures in the process wall, is called penetrating technique unit, and there are two relative import and export this unit.
3, by the structure of the described glue-spreading development equipment of claim 2, it is characterized in that in each baker unit respectively by sub-technique unit: cold dish device, heat dish device, superthermal dish device, centralising device, tack producing device stack are formed.
4, by the structure of the described glue-spreading development equipment of claim 1, it is characterized in that: described technology station is made up of two or more gluings and/or developing process unit, overlapping placement.
5, a kind of in glue-spreading development equipment wafer pass transmission process thoroughly, it is characterized in that: after wafer takes out from the wafer case station by box station robot, be delivered in the penetrating technique unit in the process wall, by the technology robot wafer is taken out respectively again, be sent to other technique unit and carry out PROCESS FOR TREATMENT, box station auxiliary process robot of robot finishes the transmission between the penetrating technique unit of wafer in process wall, wafer after handling through whole gluing developing process is sent back in the penetrating technique unit in the process wall by the technology robot, take out respectively by box station robot again, send the wafer case station back to.
6, pass transmission process thoroughly by the described wafer of claim 5, it is characterized in that: box station robot transmission wafer between wafer case station and process wall, the technology robot is transmission wafer between process wall and technology station, and the penetrating technique unit in the process wall realizes that the bi-directional of wafer flows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2005100469392A CN1904730B (en) | 2005-07-27 | 2005-07-27 | Gluing developing apparatus and chip transmission process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2005100469392A CN1904730B (en) | 2005-07-27 | 2005-07-27 | Gluing developing apparatus and chip transmission process |
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| Publication Number | Publication Date |
|---|---|
| CN1904730A true CN1904730A (en) | 2007-01-31 |
| CN1904730B CN1904730B (en) | 2010-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2005100469392A Active CN1904730B (en) | 2005-07-27 | 2005-07-27 | Gluing developing apparatus and chip transmission process |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199031A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Full-automatic glue film coating and developing device |
| CN104576439A (en) * | 2013-10-29 | 2015-04-29 | 沈阳芯源微电子设备有限公司 | Quick wafer conveying method of gluing and developing machine |
| CN105321844A (en) * | 2014-07-29 | 2016-02-10 | 盛美半导体设备（上海）有限公司 | Stacked-layout semiconductor equipment |
| CN106707689A (en) * | 2015-11-12 | 2017-05-24 | 沈阳芯源微电子设备有限公司 | Parallel type glue spreading and developing equipment |
| CN108107680A (en) * | 2016-11-25 | 2018-06-01 | 沈阳芯源微电子设备有限公司 | Stack puddle development system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101615561B (en) * | 2008-06-25 | 2010-12-01 | 沈阳芯源微电子设备有限公司 | Process wall for glue spreading development equipment |
-
2005
- 2005-07-27 CN CN2005100469392A patent/CN1904730B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199031A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Full-automatic glue film coating and developing device |
| CN103199031B (en) * | 2012-01-04 | 2015-10-14 | 沈阳芯源微电子设备有限公司 | Full-automatic glue film coating, developing apparatus |
| CN104576439A (en) * | 2013-10-29 | 2015-04-29 | 沈阳芯源微电子设备有限公司 | Quick wafer conveying method of gluing and developing machine |
| WO2015062213A1 (en) * | 2013-10-29 | 2015-05-07 | 沈阳芯源微电子设备有限公司 | Quick wafer transmission method for coating device |
| CN105321844A (en) * | 2014-07-29 | 2016-02-10 | 盛美半导体设备（上海）有限公司 | Stacked-layout semiconductor equipment |
| CN106707689A (en) * | 2015-11-12 | 2017-05-24 | 沈阳芯源微电子设备有限公司 | Parallel type glue spreading and developing equipment |
| CN108107680A (en) * | 2016-11-25 | 2018-06-01 | 沈阳芯源微电子设备有限公司 | Stack puddle development system |
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| Publication number | Publication date |
|---|---|
| CN1904730B (en) | 2010-09-01 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |