CN1889231A - Micro-thin pen for direct writing electronical photoelectronic component and its constituting device - Google Patents
Micro-thin pen for direct writing electronical photoelectronic component and its constituting device Download PDFInfo
- Publication number
- CN1889231A CN1889231A CN 200610019740 CN200610019740A CN1889231A CN 1889231 A CN1889231 A CN 1889231A CN 200610019740 CN200610019740 CN 200610019740 CN 200610019740 A CN200610019740 A CN 200610019740A CN 1889231 A CN1889231 A CN 1889231A
- Authority
- CN
- China
- Prior art keywords
- pen
- micro
- pressure
- air
- nib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a mini pen of direct-writing electronic/photoelectronic component and its structure. The decompression device is located in the cap of the pen and connected with the pressing pipe on the top of the cap. The lower end of the cap is connected airtightly and movably with the upper end of the brush stand to form the bunker used to deposit the material that needs to deposit. The lower end of the brush stand is penpoint. The mini pen links with the air supply by two shunt-wound press controlling devices. The controller controls two gas paths and the relative movement of the mini pen to the base to form the direct-writing device. The mini pen can be used to create the electronic component and the photoelectronic component, for example, the polymer filter waveguide. Depending on the structure and polymer character of the mini pen, the polymer material can be put into the mini pen and direct write the filter waveguide. The wiring speed is rapid; the span of the wire width is large; the cost of producing and operating is low. The wiring speed is between 2 and 15mm/s and the wire width is between 0.06 and 2mm.
Description
Technical field
The invention belongs to electronics/photoelectron element and make the field, be specifically related to a kind of micro-pen of directly writing electronics/photoelectron element and reach by its device that constitutes.The present invention is particularly useful for making fast lead, resistance, electric capacity, inductance and fiber waveguide etc.
Background technology
The generation of large scale integrated circuit and development increase substantially current densities, and constantly develop to high accuracy, high density, fine rule, aperture, high reliability, low cost and automatic continuous production direction.Particularly in recent years, along with electronic product constantly to integrated, miniaturization, effect, small lot, many kinds direction develop in short-term, the factor that restriction electronic product quality further improves changes chip chamber interconnection line spacing, the i.e. size of substrate and wiring density into by original chip size size.Traditional printed circuit board process for making (as silk screen process, photochemistry etching etc.) more and more can not satisfy these requirements, and main cause is: manufacturing process is many, and minimum feature and distance between centers of tracks are very limited; Because the electric conducting material of erosion removal is many, the waste that causes is big; Environmental pollution is serious etc.In addition, the cycle of making wiring board of conventional fabrication processes is longer, can't effectively shorten the new product research and development cycle; Circuit board is in case the making completion can't be carried out necessary modification to designed conducting wire; For single-piece or small lot batch manufacture circuit board, manufacturing cost is higher.These deficiencies have restricted the application of this technology in some frontiers.
In recent years, direct writing technology has become one of the focus of attention of engineers and technicians in the electronic manufacturing field.So-called direct writing technology, in electronic manufacturing field, be meant and adopt special machining tool, can be according to computer program preset shape and dimensional requirement, remove or deposit specified various materials at specified substrate surface, form the technology and the technology of required functional structure.Compare with traditional substrate fabrication techniques, therefore advantages such as direct writing technology has does not need mask, accuracy of manufacture height, be easy to revise, the lead time is short, the material range of choice is wide, stock utilization is high, required cost is low, environmental pollution is little have broad application prospects in electronic manufacturing field.The process that can be used for directly writing is a lot, mainly is divided into two kinds of subtractive process and addition processes.Subtractive process refers to adopt particular tool to carry out removal processes such as etching or engraving at substrate surface, simple and reliable process, employed instrument can be focused ion beam, laser beam, diamond cutter etc., but the micro-structural function of manufacturing mainly is confined to the substrate associated materials.Addition process refers to adopt special instrument to add the process that new material forms micro-structural at substrate surface.Be that with the difference of subtractive process maximum the material that addition process is added is not subjected to the restriction of baseplate material, therefore the micro-structural kind that can prepare is more, and function is also more extensive.In numerous addition process direct writing technologies, comparative maturity and application mainly contain Micropen direct writing technology and M3D technology more widely.
The Micropen direct writing technology adopts electric slurry as adding material, control the output variable size of slurry by custom-designed micro-pen system---a kind of leading screw and nut mechanism is realized the plunger reciprocating motion---, slurry flows out by nozzle and appropriately contacts the formation rete with substrate surface, directly writes out designed pattern under the control of digital control system.This technology is introduced to the market by OhmCraft company by Sandia National Lab and University of New Mexico's cooperative research and development.When Micropen directly writes, rheological behavior such as viscosity, the surface tension etc. of material must be taken all factors into consideration, and the surface roughness of attention and substrate, straight writing rate and the isoparametric coupling of live width, the function element or the structure of better quality could be obtained.Micropen technology is the earliest direct writing technology to be introduced one of several technologies that electronic devices and components make fast, has initiative meaning aspect a lot, as directly writing out 13 layers electronic component and integrated RC filter etc.Be characterized in that micro-pen mechanism is suitable for the very slurry of wide range of viscosities.But its major defect is the equipment more complicated, and is prone to the step-out phenomenon when commutation, causes prepared component quality stability to reduce.The specific design method of directly writing wiring about Micropen sees United States Patent (USP) for details:
“Carl?E，Drumheller.Inking?System?for?Producing?Circuit?Patterns.UnitedStates，United?States?Patent，4485387，1984.”
M3D (Maskless Mesoscale Material Deposition) technology does not promptly have mask mesoscale material deposition technique, is one of very fast direct writing technology of development in recent years, by U.S. SandiaNational Lab research, Optomec Inc. exploitation.This technology atomization system atomized slurry, and in conjunction with the jet deposition system, with the slurry after the atomizing with the certain speed jet deposition to substrate, form desired electronics pattern.The characteristics of M3D are spacings of nozzle and substrate when changing within several millimeters, still can obtain uniform fine rule; Prepared characteristic line breadth is less, and it is more even to connect up, and can be used for the little manufacturing on the curved substrate and the three-dimensional manufacturing of other shape.But, the disadvantage of this technology be the slurry viscosity scope that can atomize too small, only in 0.7-1000 * 10
-3Between the PaS, the type of stock that therefore can be suitable for is less, the electronic devices and components kind that can prepare limited.
Summary of the invention
The object of the present invention is to provide a kind of micro-pen for preparing electronics/photoelectron element, this micro-pen is simple in structure, and cost is lower, and applicable slurry viscosity scope is wide; The present invention also provides the device that is made of this micro-pen, and this device can satisfy the quick manufacturing of multiple electronic devices and components and opto-electronic device.
A kind of micro-pen of directly writing electronics/photoelectron element provided by the invention, it is characterized in that: decompressor is positioned at the cap for brush, and link to each other with the tracheae of exerting pressure that is positioned at cap for brush top, the upper end activity of the lower end of the cap for brush and pen container, the formation that is tightly connected storage cavity, storage cavity is used to store the material of needs deposition, and the lower end of pen container is a nib.
By the device that above-mentioned micro-pen constituted, source of the gas links to each other with second pressure control device with first pressure control device of two parallel connections respectively by tracheae, first pressure control device links to each other with micro-pen by the tracheae of exerting pressure, be used for controlling exert pressure tracheae air pressure break-make and regulate its size, second pressure control device links to each other with the air-flow lead-in cavity of micro-pen by the atomizing tracheae, be used to control the break-make of atomization air flow and the size of regulating atomization air flow in the air-flow lead-in cavity, controller respectively with first pressure control device, second pressure control device links to each other, be used to control the break-make of two gas circuits, controller also links to each other with micro-pen, is used to control the motion of the relative substrate of micro-pen.
As the improvement project of above-mentioned micro-pen, the outer cover of above-mentioned pen container and nib is connected to a shell, forms the air-flow lead-in cavity between a shell and pen container and the nib, and a shell is provided with the atomizing tracheae, and the lower end of air-flow lead-in cavity is the valve coaxial with nib; The internal diameter of above-mentioned nib is 20 μ m-200 μ m, and external diameter is 120 μ m--260 μ m; Gap between nib and valve is 5 μ m--20 μ m.
Micro-pen of the present invention can constitute injection or direct-writing device, is fit to some manufacturings than the large tracts of land components and parts.The present invention has overcome existing both at home and abroad direct-writing device complex structure, cost height, shortcoming such as applicability is not strong.Compared with prior art, the present invention has following characteristics:
(1) micro-pen of the present invention is simple in structure, and processing and manufacturing is easy, and processing cost is low, and dismounting and cleaning are convenient during use.When directly writing, the preparation time is short, and is easy and simple to handle.
(2) this micro-pen can utilize gas pressure accurately control write out what of slurry, and then decision line thickness or thicknesses of layers, utilize the motion of the break-make of gas and lathe simultaneously and stop accurately to control the fine straight start-stop of writing, that can satisfy various complex micro structures directly writes technological requirement.
(3) this micro-pen has and uses with a kind of basic structure, realizes the ability of difference in functionality.Just when only adopting the basic structure of micro-pen, can carry out squash type and directly write, that satisfies narrow linewidth, heavy viscous material directly writes requirement.After adding a shell on the basic structure at micro-pen, then also can carry out injecting type and directly write, utilize the slurry divergence characterization of atomization process, realize the large tracts of land film forming fast, equably, to satisfy the needs that electronic devices and components are made in the electronics industry.
(4) this micro-pen not only is used to make electronic devices and components, but also can be used for making photoelectron element, as polymer optical wave guide.In conjunction with the design feature of this micro-pen and the characteristic of polymeric material, polymeric material can be placed in the micro-pen, on substrate, directly write out fiber waveguide.
(5) above-mentioned micro-pen and corresponding lathe and control device combination are formed the micro-pen direct-writing device, satisfy the quick manufacturing of multiple electronic devices and components and opto-electronic device.Apparatus of the present invention cloth linear velocity is fast, and the live width scope is big, and manufacturing and operating cost are low, and the wiring velocity interval is 2mms～15mm/s, and the live width scope is 0.06mm～2mm.
Description of drawings
Fig. 1 is the structural representation of micro-pen of the present invention;
Fig. 2 is the structural representation of another execution mode of micro-pen of the present invention;
Fig. 3 is the structural representation of the device of application micro-pen of the present invention;
Fig. 4 is the structural representation of a kind of application example of micro-pen of the present invention.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
As shown in Figure 1, the structure of micro-pen of the present invention is: decompressor 2 is positioned at the cap for brush 3, and link to each other with the tracheae 1 of exerting pressure that is positioned at the cap for brush 3 tops, the lower end of the cap for brush 3 seals by being threaded and guaranteeing with the upper end of pen container 6, constitute storage cavity 4, storage cavity 4 is used to store the material 5 of needs deposition, and the lower end of pen container 6 is the slurry outlet of micro-pen, and promptly nib 7.The effect of decompressor 2 is to make air pressure more gently to be added on the pen container 6, is unlikely to because the inside and outside excessive pressure differential of storage cavity makes slurry spray at a high speed.When reality was directly write, the size of the external pressure that applies was one of principal element that influences live width.The size of nib 7 bores is another factors that influence live width.Generally, the internal diameter of nib 7 is 20 μ m--200 μ m, and external diameter is 120 μ m--260 μ m, and its concrete numerical value is selected according to required line thickness of writing and the size that applies air pressure.When micro-pen moves, start corresponding baroswitch on substrate.Slurry in the storage cavity or other functional material just flow out by nib 7, write the lead of required form and live width or fiber waveguide figure etc. on substrate.
Another execution mode of micro-pen of the present invention as shown in Figure 2, pen container 6 is connected to a shell 10 with the outer cover of nib 7, form air-flow lead-in cavity 9 between shell 10 and pen container 6 and the nib 7, shell 10 is provided with atomizing tracheae 8, the lower end of air-flow lead-in cavity 9 is the valve 11 coaxial with nib, and the gap that nib 7 and valve are 11 is the 5 μ m--20 μ μ m right sides.Atomization air flow is after tracheae 7 enters air-flow lead-in cavity 9 by atomizing, and the electric slurry in air-flow and the pen container or other functional material are respectively from valve 11 and nib 7 coaxial ejections, and air-flow is at the lower end of nib 7 formation negative pressuren zone.Because negative pressure and add air pressure by 2 pairs of slurry institutes of tracheae 1 and decompressor applied pressure of exerting pressure makes the slurries in the pen container 6 evenly flow out continuously from nib 7.The slurry that flows out is atomized aerodynamic atomization and becomes droplet, descending with air-flow, when droplet at a high speed runs into substrate, just under deposition on the substrate, when nib 7 is mobile on substrate, when perhaps substrate moves with respect to nib 7,, just can on substrate, prepare needed electronic devices and components according to the route that graphic file is set.
By direct-writing device that above-mentioned micro-pen constituted as shown in Figure 3, source of the gas 12 links to each other with second pressure control device 18 with first pressure control device 14 respectively by tracheae 13, air pressure and throughput can be controlled and regulate to first pressure control device 14 and 18 parallel connections of second pressure control device independently.First pressure control device 14 links to each other with micro-pen 15 by the tracheae 1 of exerting pressure, and be used for controlling the exert pressure break-make of tracheae 1 air-flow and the size of regulating air pressure, and the slurry in the storage cavity of micro-pen 15 provides required pressure.When first pressure control device 14 is connected, in the pen container of micro-pen, exert pressure, slurry is flowed out from nib; Release the pressure in the pen container of micro-pen during disconnection, because the capillarity of nib makes slurry in time stop outflow.Second pressure control device 18 links to each other with the air-flow lead-in cavity 9 of micro-pen 15 by the tracheae 8 that atomizes, and is used to control the break-make of atomization air flow and the size of regulating atomization air pressures in the air-flow lead-in cavity 9, makes the slurry that nib flows out be atomized aerodynamic atomization formation droplet.The break-make of the break-make of atomization air flow and the air-flow of exerting pressure is synchronous generally speaking.Under normal conditions, the pressure by air pressure scope of exerting pressure in the pen container is 0.001Mpa-0.50Mpa, and the pressure limit of the atomization air pressure that air-flow lead-in cavity 9 is applied is 0.10Mpa-1.0Mpa.
Controller 17 in the direct-writing device links to each other with first pressure control device 14, second pressure control device 18 respectively, controller 17 mainly is made up of microcomputer, and computer sends corresponding instruction makes first pressure control device 14 and second pressure control device 18 that the break-make that corresponding action is controlled two-way gas respectively take place.Controller 17 is also controlled the motion of micro-pen 15 simultaneously.Under the general situation that substrate 16 is fixing, controller 17 by control micro-pen 15 on substrate 16 according to the moving line of program setting, just can on substrate 16, finish the preparation of electronics and photoelectron element.
Embodiment 1:
The formation of whole micro-pen direct-writing device as shown in Figure 4.First pressure control device 14 is identical with second pressure control device, 18 structures, and the former is in series by pressure regulating valve 25, Pressure gauge 26 and electromagnetically operated valve 27, and the latter is in series by pressure regulating valve 31, Pressure gauge 30 and electromagnetically operated valve 29.Compressed nitrogen source of the gas 19 links to each other with three-way pipe 24 with Pressure gauge 23 through gas source switch 20, Pressure gauge 21, pressure regulating valve 22 successively, and one of three-way pipe 24 brings out mouth and links to each other with pressure regulating valve 25 by tracheae, and other end outlet links to each other with pressure regulating valve 31 by tracheae.Substrate 16 is positioned on the workbench 28, and controller 17 is by the motion of Electric Machine Control workbench 28.Micro-pen 15 adopts structure shown in Figure 1, and wherein the internal diameter of nib 7 is 120 μ m.At first open gas source switch 20 during use, compressed nitrogen source of the gas 19 is just supplied with the gas of certain pressure, and its pressure is measured by Pressure gauge 21, and output pressure is regulated output pressure by pressure regulating valve 22, and output pressure is measured by Pressure gauge 23.The input air-flow is divided into two-way by three-way pipe 24.One the tunnel is the air-flow of exerting pressure, and it is the pressure after regulating by pressure regulating valve 25 by Pressure gauge 26 monitorings, and to guarantee to supply with by electromagnetically operated valve 27 air-flow of constant pressure, this air communication is crossed the tracheae 1 of exerting pressure and linked to each other with the pressure reducer 3 of micro-pen 15; Another road is an atomization air flow, and it is the pressure after regulating by pressure regulating valve 31 by Pressure gauge 30 monitorings, and to guarantee to supply with by electromagnetically operated valve 29 air-flow of constant pressure, this air communication is crossed atomizing tracheae 8 and linked to each other with the air-flow lead-in cavity 9 of micro-pen 15.
Carry out squash type when directly writing when direct-writing device adopts micro-pen structure shown in Figure 1,, therefore should close pressure regulating valve 31 because do not need atomization process.Controller 17 is controlled the break-make of electromagnetically operated valve 27 on the one hand, to guarantee micro-pen 15 operate as normal, also passes through the motion of Electric Machine Control workbench 28 on the other hand.Substrate 16 is fixed on the workbench, can do relative motion with micro-pen, and substrate 16 is to the adjustable height of micro-pen 15, and this highly directly has influence on the size of live width.
After above-mentioned work is ready, just can the start-up control device, pre-designed line pattern is directly write in beginning on substrate.As the air pressure P that exerts pressure that is adjusted to pen container
1=0.05MPa, cloth linear velocity V=10mm/s, slurry adopts the high temperature silver conductive paste, and the lead live width that obtains is 0.25mm.After measured, the conductivity of prepared lead is good, and its resistivity is 2.4 * 10
-6Ω cm meets the requirement of electronics industry standard fully.
When carrying out spray regime according to micro-pen shown in Figure 2 when directly writing, need to open second pressure control device 18 shown in Figure 4, gas circuit promptly atomizes.Spray when directly writing, the internal diameter of nib 7 is 120 μ m, and external diameter is 180 μ m, and the gap that nib 7 and valve are 11 is 10 μ m.
Adopt such apparatus structure can realize directly writing based on ejector principle.When directly writing, slurry will be atomized earlier, is deposited on then on the substrate, by the motion of Control work platform, obtains different shapes.When atomizing was directly write, nib is contact substrate not, therefore can make electronic devices and components on curved surface; Simultaneously, in when atomizing slurry is had disperse function, the resolution of live width will reduce when directly writing, and still carry out the large-area advantage that has when directly writing at needs.
Spray when directly writing, directly write equally with the squash type among the embodiment 1, need regulate the output pressure of source of the gas earlier, comprise the pressure of the pressure of the gas circuit of exerting pressure and the gas circuit that atomizes.In the gas circuit of exerting pressure, by the pressure of Pressure gauge 26 monitoring pressure regulating valves 25, to guarantee to supply with by electromagnetically operated valve 27 air-flow of constant pressure, this air communication is crossed the tracheae 1 of exerting pressure and is linked to each other with the pressure reducer 3 of micro-pen 15.In the atomizing gas circuit, atomization air flow enters atomization air flow lead-in cavity 9 by atomization air pressure pressure regulating valve 31 and electromagnetically operated valve 29 and atomizing tracheae 8.Electromagnetically operated valve 27,29 is controlled its break-make by controller 17 by control chip.Its break-make order is set according to application need by control device.The size of air pressure and atomization air pressure of exerting pressure is the principal element that influences thicknesses of layers and width, its size should according to the thicknesses of layers and the width that require directly to write set.
After regulating parameter such as air pressure, the designed graphic file of input in control device is regulated the height of nib and substrate, and the start-up control device just can directly be write desired figure on substrate.As the air pressure P that exerts pressure that is adjusted to pen container
1=0.07MPa, the atomization air pressure P of air-flow lead-in cavity
2=0.22MPa, cloth linear velocity V=10mm/s, substrate 16 are to the height H=0.4mm of micro-pen 15, and slurry adopts the high temperature silver conductive paste, and the lead live width that obtains like this is 0.37mm, and after measured, the conductivity of prepared lead is good, and its resistivity is 2.33 * 10
-6Ω cm meets the requirement of electronics industry standard fully.
The device that is adopted is identical with embodiment 1, and mode of operation is identical with embodiment 1 with step.But adopt the polymer of function admirable to replace electric slurry, at this moment this device can be used to directly writing light guide.
Regulate parameters such as air pressure, set control program, with device debugging good after, the fluorinated polyimide (PI) of in micro-pen, packing into, starting drive just can write out fiber waveguide on silicon substrate, about 100 microns of duct widths, thickness are about 5 microns.Prepared fiber waveguide is led to the light experiment, the loss of test light waveguide, minimal losses can reach 0.5dB/cm, can satisfy the manufacturing requirement of opto-electronic device.
Claims (5)
1, a kind of micro-pen of directly writing electronics/photoelectron element, it is characterized in that: decompressor (2) is positioned at the cap for brush (3), and link to each other with the tracheae of exerting pressure (1) that is positioned at the cap for brush (3) top, the upper end activity of the lower end of the cap for brush (3) and pen container (6), the formation that is tightly connected storage cavity (4), storage cavity 4 is used to store the material of needs deposition, and the lower end of pen container (6) is nib (7).
2, micro-pen according to claim 1, it is characterized in that: pen container (6) is connected to a shell (10) with the outer cover of nib (7), form air-flow lead-in cavity (9) between shell (10) and pen container (6) and the nib (7), shell (10) is provided with atomizing tracheae (8), and the lower end of air-flow lead-in cavity (9) is the valve (11) coaxial with nib.
3, micro-pen according to claim 1 and 2 is characterized in that: the internal diameter of described nib (7) is 20 μ m--200 μ m, and external diameter is 120 μ m--260 μ m.
4, micro-pen according to claim 2 is characterized in that: the gap between nib (7) and valve (11) is 5 μ m--20 μ m.
5, a kind of device that is constituted by claim 1 or 2 described micro-pens, it is characterized in that: source of the gas (12) links to each other with second pressure control device (18) with first pressure control device (14) of two parallel connections respectively by tracheae (13), first pressure control device (14) links to each other with micro-pen (15) by the tracheae of exerting pressure (1), be used for controlling the break-make of tracheae (1) air pressure of exerting pressure and regulate its size, second pressure control device (18) links to each other with the air-flow lead-in cavity (9) of micro-pen (15) by atomizing tracheae (8), be used to control the break-make of atomization air flow and the size of regulating the interior atomization air flow of air-flow lead-in cavity (9), controller (17) respectively with first pressure control device (14), second pressure control device (18) links to each other, be used to control the break-make of two gas circuits, controller (17) also links to each other with micro-pen (15), is used to control micro-pen (15) motion of substrate (16) relatively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100197405A CN100405539C (en) | 2006-07-27 | 2006-07-27 | Micro-thin pen for direct writing electronical photoelectronic component and its constituting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100197405A CN100405539C (en) | 2006-07-27 | 2006-07-27 | Micro-thin pen for direct writing electronical photoelectronic component and its constituting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1889231A true CN1889231A (en) | 2007-01-03 |
| CN100405539C CN100405539C (en) | 2008-07-23 |
Family
ID=37578496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100197405A Active CN100405539C (en) | 2006-07-27 | 2006-07-27 | Micro-thin pen for direct writing electronical photoelectronic component and its constituting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100405539C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011123A (en) * | 2010-11-26 | 2011-04-13 | 华中科技大学 | Special equipment for laser micro-cladding |
| CN102658256A (en) * | 2012-04-10 | 2012-09-12 | 温州大学 | Paste depositing pen |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5081069A (en) * | 1989-12-26 | 1992-01-14 | Texas Instruments Incorporated | Method for depositing a Tio2 layer using a periodic and simultaneous tilting and rotating platform motion |
| US6029881A (en) * | 1997-02-06 | 2000-02-29 | International Business Machines Corporation | Micro-scale part positioning by surface interlocking |
| US6261850B1 (en) * | 1998-09-03 | 2001-07-17 | Micron Technology, Inc. | Direct writing of low carbon conductive material |
| EP0989595A3 (en) * | 1998-09-18 | 2001-09-19 | Ims-Ionen Mikrofabrikations Systeme Gmbh | Device for processing a surface of a substrate |
| US7241420B2 (en) * | 2002-08-05 | 2007-07-10 | Palo Alto Research Center Incorporated | Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal |
| CN1220556C (en) * | 2003-05-23 | 2005-09-28 | 华中科技大学 | Slurry conveying mechanism |
-
2006
- 2006-07-27 CN CNB2006100197405A patent/CN100405539C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011123A (en) * | 2010-11-26 | 2011-04-13 | 华中科技大学 | Special equipment for laser micro-cladding |
| CN102011123B (en) * | 2010-11-26 | 2012-07-04 | 华中科技大学 | Special equipment for laser micro-cladding |
| CN102658256A (en) * | 2012-04-10 | 2012-09-12 | 温州大学 | Paste depositing pen |
| CN102658256B (en) * | 2012-04-10 | 2014-07-09 | 温州大学 | Paste depositing pen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100405539C (en) | 2008-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102011123B (en) | Special equipment for laser micro-cladding | |
| King et al. | Aerosol jet® direct write printing for mil-aero electronic applications | |
| CN100405539C (en) | Micro-thin pen for direct writing electronical photoelectronic component and its constituting device | |
| Abas et al. | Direct ink writing of flexible electronic circuits and their characterization | |
| CN200950436Y (en) | Super-thin pencil for writing directly electronic/photoelectronic component | |
| Zhou et al. | Fabrication of conductive paths on a fused deposition modeling substrate using inkjet deposition | |
| CN104999180A (en) | 3D printing method for ceramic microstructure based on recombination of nanosecond laser, picosecond laser and femtosecond laser | |
| CN100413598C (en) | Electronic device for direct slurry atomization and deposition | |
| CN108045105B (en) | Conductive pattern printing and linear scanning curing integrated system and method | |
| CN101609180B (en) | Method for preparing polymer optical waveguide | |
| CN201901704U (en) | Special laser micro-cladding equipment | |
| Hedges et al. | Mesoscale deposition technology for electronics applications | |
| CN2925008Y (en) | Electronic paste direct-write forming device | |
| WO2022205501A1 (en) | Online variable component photocuring 3d printing device and method | |
| KR20060025796A (en) | Patterning method of microelectronic circuit and a fabricating apparatus thereof, and a printed circuit board using the method | |
| CN215095634U (en) | Photocuring 3D printing device | |
| CN115648622A (en) | Array nozzle device and method for printing large-area high-density fine circuit | |
| CN209362867U (en) | Intelligent precise glue applying mechanism | |
| CN209829328U (en) | Piezoelectric atomization spraying equipment | |
| CN113580562A (en) | Micro-area synchronous curing electronic-jet printing device | |
| CN109996386B (en) | Precoating layer for realizing room-temperature sintering of nano-silver particle ink and preparation method thereof | |
| CN1220556C (en) | Slurry conveying mechanism | |
| CN115188603B (en) | Metal oxide-based miniature supercapacitor preparation equipment and preparation method thereof | |
| CN203578115U (en) | Coating device | |
| CN212472859U (en) | Template-free laser nanometer in-situ patterning equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHAN XINRUIDA LASER ENGINEERING CO., LTD. Free format text: FORMER OWNER: HUAZHONG SCINECE AND TECHNOLOGY UNIV Effective date: 20110303 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430074 NO.1037, LUOYU ROAD, HONGSHAN DISTRICT, WUHAN CITY, HUBEI PROVINCE TO: 430074 NO.7-4, GUANDONG SCIENCE AND TECHNOLOGY INDUSTRIAL PARK, DONGHU DEVELOPMENT AREA, WUHAN, HUBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110303 Address after: 430074, 7-4, Kanto science and Technology Industrial Zone, East Lake Development Zone, Hubei, Wuhan Patentee after: Wuhan New Research and Development Laser Co., Ltd. Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee before: Huazhong University of Science and Technology |