CN1886008B - 长声道硅麦克风 - Google Patents

长声道硅麦克风 Download PDF

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Publication number
CN1886008B
CN1886008B CN2005100438958A CN200510043895A CN1886008B CN 1886008 B CN1886008 B CN 1886008B CN 2005100438958 A CN2005100438958 A CN 2005100438958A CN 200510043895 A CN200510043895 A CN 200510043895A CN 1886008 B CN1886008 B CN 1886008B
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sound channel
substrate
housing
gum cover
silicon microphone
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Expired - Fee Related
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CN1886008A (zh
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王显彬
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Goertek Microelectronics Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明涉及一种传声器，具体说是一种长声道硅麦克风。包括焊接有电子元件的基板、扣接在基板上的壳体，基板和壳体之间通过导电胶或焊料焊接或氩弧焊连接，基板上位于微机电系统的音腔正下方带有横声道，该横声道与外侧套装有胶套中的竖声道对接。本发明易于自动化生产、抗高频干扰性能强、能够增大输出信号和减小信号失真。

Description

长声道硅麦克风
技术领域
本发明涉及一种传声器，具体说是一种长声道硅麦克风。
背景技术
现有的硅麦克风结构由上盖、腔体和底板构成，空心圆柱状的腔体上面通过导电胶连接上盖、下面通过导电胶连接底板，底板上焊接电子无件，声孔设置在上盖或底板上。由于腔体与上盖和底板之间的连接都是平面连接，又由于受体积小的限制，腔体的侧壁厚度有限，连接的强度不高，抗高频干扰方面不如驻极体麦克风。
发明内容
本发明的目的是提供一种易于自动化生产、抗高频干扰性能强、能够增大输出信号和减小信号失真的长声道硅麦克风。
为达到上述目的，本发明采用如下的技术方案：
本发明所述的长声道硅麦克风包括焊接有电子元件的基板、扣接在基板上的壳体，基板和壳体之间通过导电胶或焊料焊接或氩弧焊连接，所述基板的上表面固定安装有微机电系统，基板上位于微机电系统的音腔正下方带有横声道，该横声道的一端在基板中延伸到其一侧开口，另一端位于微机电系统的音腔正下方并向上开口；基板和壳体的外侧套装有胶套，胶套与横声道对应的一侧带有竖声道，该竖声道的上端延伸到胶套的上端开口，下端延伸到横声道对应的位置向内侧开口并与横声道对接。
上述壳体的下端带有向外侧的翻边，该翻边的最外围边缘与基板的边缘对齐，胶套的内侧带有与翻边对应的台阶。
上述基板的上表面与壳体接触的位置设有台阶，台阶的宽度与外壳的侧边厚度相同。
本发明易于自动化生产、抗高频干扰性能强、能够增大输出信号和减小信号失真。
附图说明
图1是本发明的一个实施例的剖视图；
图2是胶套的俯视结构示意图；
图3是本发明另一个实施例的结构示意图。
具体实施方式
如图1、图2所示，本发明所述的长声道硅麦克风包括焊接有电子元件3的基板1、扣接在基板1上的壳体2，基板1和壳体2之间通过导电胶或焊料焊接或氩弧焊连接，基板1上位于的微机电系统11的音腔下方带有横声道4，该横声道4的一端在基板1中延伸到其一侧开口，另一端位于微机电系统的音腔正下方并向上开口；基板1和壳体2的外侧套装有胶套5，胶套5与横声道4对应的一侧带有竖声道6，该竖声道6的上端延伸到胶套5的上端开口，下端延伸到横声道4对应的位置向内侧开口并与横声道4对接。壳体2的下端带有向外侧的翻边7，该翻边7的最外围边缘与基板1的边缘对齐，胶套5的内侧带有与翻边7对应的台阶。
本发明将壳体2和基板1的导电层通过导电胶或焊料焊接或电阻焊连接起来，实现电路连接和密封连接，达到抗高频干扰和密封的效果。壳体2是采用金属材料或表面镀有金属的其他材料。基板1是采用2层或3层环氧树脂表面覆铜镀金的线路板材料复合而成，其中下面或中间的一层局部掏空，生成在线路板侧面开孔，上面的一层在微机电系统的音腔正下方开孔，保证微机电系统的音腔与通向外界的声道相通，实现拾音的效果。顾客在焊接完硅麦克风后，再将胶套5套在硅麦克风上，外界声音信号通过胶套5上的声道和基板1上面的声道传输到微机电系统，实现产信号的传输。胶套5通常采用硅橡胶或硅矽胶材料。
如图3所示，作为本发明的另一个实施例，基板1的外侧带有台阶，台阶的宽度与外壳2的侧边厚度相同。这种结构可以增加壳体2和基板1的接触面积，提高连接的强度，改善抗干扰性能。
当然，如图3所示的实施例也可以设计成两层或多层的台阶。

Claims (3)

1.长声道硅麦克风，包括焊接有电子元件(3)的基板(1)、扣接在基板(1)上的壳体(2)，基板(1)和壳体(2)之间通过导电胶或焊料焊接或氩弧焊连接，其特征在于：所述基板(1)的上表面固定安装有微机电系统(11)，基板(1)上位于微机电系统(11)的音腔正下方带有横声道(4)，该横声道(4)的一端在基板(1)中延伸到其一侧开口，另一端位于微机电系统(11)的音腔正下方并向上开口；基板(1)和壳体(2)的外侧套装有胶套(5)，胶套(5)与横声道(4)对应的一侧带有竖声道(6)，该竖声道(6)的上端延伸到胶套(5)的上端开口，下端延伸到横声道(4)对应的位置向内侧开口并与横声道(4)对接。
2.根据权利要求1所述的长声道硅麦克风，其特征在于：壳体(1)的下端带有向外侧的翻边(7)，该翻边(7)的最外围边缘与基板(1)的边缘对齐，胶套(5)的内侧带有与翻边(7)对应的台阶。
3.根据权利要求1所述的长声道硅麦克风，其特征在于：基板(1)的上表面与壳体(2)接触的位置设有台阶，台阶的宽度与外壳(2)的侧边厚度相同。
CN2005100438958A 2005-06-23 2005-06-23 长声道硅麦克风 Expired - Fee Related CN1886008B (zh)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008053327A1 (de) * 2008-10-27 2010-04-29 Epcos Ag Anordnung mit einem Mikrofon
EP2381698A1 (en) * 2010-04-21 2011-10-26 Nxp B.V. Microphone
KR101320573B1 (ko) * 2011-11-30 2013-10-28 주식회사 비에스이 멤스 마이크로폰
CN106412783B (zh) * 2016-11-23 2022-04-12 上海传英信息技术有限公司 送话器结构和移动终端

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366785A (zh) * 2000-04-26 2002-08-28 三菱电机株式会社 半导体驻极体电容器麦克风
WO2004107810A1 (ja) * 2003-05-27 2004-12-09 Hosiden Corporation 音響検出機構及びその製造方法
CN1578540A (zh) * 2003-07-25 2005-02-09 株式会社东芝 声电变换装置、振动分析方法和声音分析方法
CN1628486A (zh) * 2002-02-06 2005-06-15 星电株式会社 驻极体电容传声器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366785A (zh) * 2000-04-26 2002-08-28 三菱电机株式会社 半导体驻极体电容器麦克风
CN1628486A (zh) * 2002-02-06 2005-06-15 星电株式会社 驻极体电容传声器
WO2004107810A1 (ja) * 2003-05-27 2004-12-09 Hosiden Corporation 音響検出機構及びその製造方法
CN1578540A (zh) * 2003-07-25 2005-02-09 株式会社东芝 声电变换装置、振动分析方法和声音分析方法

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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268

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