CN1876897A - Electroplating aqueous solution for quick nickel plating of porous substrate - Google Patents
Electroplating aqueous solution for quick nickel plating of porous substrate Download PDFInfo
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- CN1876897A CN1876897A CN 200510031679 CN200510031679A CN1876897A CN 1876897 A CN1876897 A CN 1876897A CN 200510031679 CN200510031679 CN 200510031679 CN 200510031679 A CN200510031679 A CN 200510031679A CN 1876897 A CN1876897 A CN 1876897A
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Abstract
The invention discloses an electroplating solution which can be used for quick-speed nickel plating of cellular base material, in which the electroplating solution is prepared by adding 0.4-8 g/L rare-earth salts in quick-speed nickel plating solution. The said rare-earth salts can be single rare-earth element slats or mixed rare-earth element slats, especially the mixed rare-earth element slats with add-on lanthanum has the optimum plating effect. The said electroplating solution after the electrochemical treatment can make the cellular base material quickly plate nickel in great current density, the strength for extension of the cellular material by the heat treatment can be improved by more than 10% while the elongation and the flexibility can not be reduced, the said electroplating solution is stable, and the harmful impurities resistance of the said electroplating solution can be improved and is easy to control in production.
Description
Technical field
The present invention relates to a kind of electroplating aqueous solution of quick electronickelling, more particularly, relate to a kind of electroplating aqueous solution that is used for quick nickel plating of porous substrate.
Background technology
Wang Qingliang is at " application of rare earth in electroplating technology " literary composition (material protection 199528 (5): summarized the application of rare earth in common plating, compound plating, hot dip process, brush plating 10-11); from literary composition, can find the salt of different rare earth elements; different plated metal solution there is different effects, thereby the improved performance of metallic substance is also had difference.(material protection 200235 (6): investigated 21-22) with the stainless steel substrates is negative electrode to people such as Pan Bingsuo at " rare earth element is to nickel and nickel-cobalt alloy plating Effect on Performance " literary composition; in common nickel plating and nickel cobalt (alloy) electroplate liquid, add rare earth and different rare earth addition to electroplating the back effect of material performance; the hardness of material significantly improves behind the discovery interpolation rare earth, and the coating porosity reduces.However, we find in the plating experiment that this plating bath is applied to nickel foam production, in the electroplate liquid because a large amount of ammonium chlorides that use, make that the coating stress on the nickel porous base material is very big, the interpolation of rare earth does not only reduce stress, makes internal stress bigger on the contrary, and snappiness is very poor, this plating bath of life-time service is because of the nickel foam embrittlement of the more feasible production of cumulative function; Owing to chlorine ion concentration in the plating bath is very high, big on the other hand to the production unit corrosion; And plating bath is adapted at using under low temperature, the close condition of low current, therefore when being applied to actual production, reduces production efficiency.
The electroplate liquid of disclosed interpolation rare earth is when using in the prior art, and the metal sheet that is suitable for densification is a negative electrode, electroplates other metal thereon, to improve metal base hardness, Corrosion Protection, high-temperature oxidation resistance.And in the actual production of electronickelling that with the nonmetal porous substrate after the conductionization processing is negative electrode, because the Application Areas of porous material is to the specification of quality of material, unit elongation, tensile strength, snappiness is the mechanical performance index of three keys, require electroplate liquid can make porous metal material behind the high speed electrodeposition after conventional thermal treatment, do not reducing unit elongation and flexible while, improve the tensile strength of material, hardness to material, Corrosion Protection, high-temperature oxidation resistance does not have special requirement, owing to generally believe under general condition at present, hardness and unit elongation and snappiness are contradiction, intensity is relevant with hardness, therefore the electroplate liquid that adds rare earth does not appear in the newspapers with the application that improves the porous material performance all the time electroplating on the nonmetal porous substrate after the conductionization processing.
Summary of the invention
The object of the present invention is to provide a kind of nonmetal quick nickel plating of porous substrate electroplating aqueous solution that is used for after the conductionization processing, use this quick electronickelling electroplating aqueous solution to carry out galvanized porous metal material and cover nickel through high speed electrodeposition, again after conventional thermal treatment, tensile strength improves, the snappiness and the unit elongation of material still can reach application requiring simultaneously, improve the comprehensive mechanical performance of material.
The present invention's the electroplating aqueous solution that is used for quick nickel plating of porous substrate contains following solute composition and proportioning:
Single nickel salt (220-300) g/L nickelous chloride (25-35) g/L
Boric acid (30-40) g/L rare-earth salts (0.4-8) g/L
The pH value is 3.8-4.4.
Described rare-earth salts can be a kind of in the following salt: the muriate of the vitriol of single rare earth element, single rare earth element, the muriate of mishmetal, the vitriol of mishmetal; A kind of in the preferably following salt: lanthanum sulfat, ceric sulfate in the single rare earth elementary sulfur hydrochlorate, Lanthanum trichloride, Cerium II Chloride in the single rare earth element muriate, lanthanum rich mischmetal muriate; Be more preferably in the described lanthanum rich mischmetal muriate, the amount of lanthanoid metal is with La
2O
3Form calculate La
2O
3/ TREO is 50%-95% (weight ratio), and wherein TREO represents the total amount of rare earth with rare earth oxide calculating.
Temperature is 45-60 ℃ during plating.
The present invention's electroplating aqueous solution should be prepared as follows: at first according to the volume required electroplate liquid base fluid that does not contain rare-earth salts of conventional electronickelling solution compound method preparation, after then the rare-earth salts solid that takes by weighing being dissolved in another container fully with described an amount of electroplate liquid base fluid and filtering, the filtrate that will be dissolved with rare-earth salts is again integrated with remaining electroplate liquid base fluid, regulate pH to required scope, promptly get required electroplate liquid.For avoiding the rare-earth salts powder can not be dissolved in fully in the electroplate liquid because of other factorses such as impurity, to electroplate and bring adverse consequencess such as outward appearance is not good, deposition is inhomogeneous for plating back material thereby influence is normal, the rare-earth salts pressed powder should not directly add to be electroplated in the base fluid.In order to make the base material of producing have better condition of surface, also can add the nickel plating typical additives of convention amount in the electroplate liquid, as brightening agent: asccharin, 1,4-butynediol etc.; Anti-pinhole agent: sodium laurylsulfonate etc.
When the nonmetal porous substrate of conductionization processing is electroplated, keep temperature of electroplating solution at 45-60 ℃, control current density is 5A/dm
2-20A/dm
2, electroplating time is then determined by the nickel amount of base material area and required plating.If go up nickel amount 400g/m routinely
2Calculate, plate every square decimeter of sill required time and generally be controlled to be 14-60min.
Advantage of the present invention:
(1) mechanical property through the porous material after the electroplate liquid processing of the present invention improves.Non-metallic substrate after the conductionization processing, in different electroplate liquids, electroplate respectively, except that electroplate liquid middle-weight rare earths salt kind of using and concentration difference thereof, base material adopts polyurethane sponge, all the other plating conditions, heat-treat condition, detection method all identical with condition, and last nickel amount is routine value 400g/m
2, base fluid then represents not contain the electroplating aqueous solution of rare-earth salts, and the result is as shown in the table:
| Electroplate liquid | Tensile strength (MPa) | Longitudinal extension rate (%) | Vertical snappiness (inferior) |
| Base fluid | 1.25 | 7 | 8 |
| Base fluid+0.8-1.5g/L Lanthanum trichloride | 1.35 | 7 | 7 |
| Base fluid+3-5g/L ceric sulfate | 1.4 | 6 | 7 |
| Base fluid+3-5g/L lanthanum rich mischmetal muriate | 1.9 | 8 | 7 |
| Base fluid+3-5g/L Lanthanum trichloride | 1.75 | 7 | 6 |
Clearly explanation from last table, the tensile strength of the porous material after the tensile strength of the porous material after electroplate liquid of the present invention is handled is handled with conventional electroplate liquid on average can improve more than 10%, and unit elongation and snappiness are suitable, and therefore comprehensive mechanical performance gets a promotion.
(2) electroplate liquid is stable, and the ability of anti-detrimental impurity increases.After the time of identical length electroplates, it is relatively poor to electroplate the obvious visual appearance of product of coming out from base fluid, and after thermal treatment, the various performances of porous material are all whole to descend, as embrittlement, have that stain, crackle increase, degradation under the tensile strength, from the product that electroplate liquid of the present invention is electroplated out, above-mentioned phenomenon is less even do not have.
(3) realize that with compound plating mode the tensile strength that improves porous material compares, its great advantage is that it realizes there is not solid matter in the solution by the solution mode, and implementation is simple, is easy to control in the production.
Embodiment
The invention will be further described below in conjunction with embodiment.
Embodiment 1
At first according to the volume required electroplating aqueous solution base fluid that does not contain rare earth of conventional electronickelling solution compound method preparation, single nickel salt 220g/L wherein, nickelous chloride 35g/L, boric acid 40g/L, get then volume required in contained Lanthanum trichloride amount of solid, in other container, dissolve it with the above-mentioned base fluid of part fully, after the filtration, filtrate is integrated with remaining base fluid, the concentration that makes Lanthanum trichloride in the plating bath is 5g/L, regulate plating bath pH between the 4.0-4.4 with acid or alkali, get required electroplate liquid.When electroplating, keep temperature of electroplating solution at 50-55 ℃ through the nonmetal porous substrate of conductionization processing, control current density is 10A/dm
2, plating one square decimeter of base material required time and be about 30min, the nickel amount is about 400g/m on the base material
2
Electroplate after conventional thermal treatment gained porous metal material detects with industrial ordinary method, tensile strength is 1.75MPa, and the longitudinal extension rate is 7%, and vertically snappiness reaches 6 times.
Embodiment 2
At first according to the volume required electroplating aqueous solution base fluid that does not contain rare earth of conventional electronickelling solution compound method preparation, single nickel salt 280g/L wherein, nickelous chloride 30g/L, boric acid 35g/L, then by in volume required the amount of solid that should contain, take by weighing lanthanum sulfat, in other container, dissolve it with the above-mentioned base fluid of part fully, after the filtration, filtrate is integrated with remaining base fluid, and the concentration that makes lanthanum sulfat in the plating bath is 1g/L, to the asccharin that wherein adds 0.6g/L as brightening agent, regulate plating bath pH between the 4.0-4.2 with acid or alkali, get required electroplate liquid.When electroplating, keep temperature of electroplating solution at 50-55 ℃ through the nonmetal porous substrate of conductionization processing, control current density is 20A/dm
2, plating one square decimeter of base material required time is 14min, the nickel amount is about 400g/m on the base material
2
Electroplate after conventional thermal treatment gained porous metal material detects with industrial ordinary method, tensile strength is 1.35MPa, and the longitudinal extension rate is 7%, and vertically snappiness can reach 7 times.
Embodiment 3
At first according to conventional electronickelling solution methods and the volume required electroplating aqueous solution base fluid that does not contain rare earth of poly-preparation of step, single nickel salt 250g/L wherein, nickelous chloride 35g/L, boric acid 35g/L, take by weighing ceric sulfate by the amount of solid that should contain in volume required then, in other container, dissolve it with the above-mentioned base fluid of part fully, after the filtration, filtrate is integrated with remaining base fluid, the concentration that makes ceric sulfate in the plating bath is 3g/L, to the asccharin that wherein adds 0.4g/L as the sodium laurylsulfonate of brightening agent and conventional concentration as anti-pinhole agent, regulate plating bath pH between the 3.8-4.0 with acid or alkali, required electroplate liquid.When electroplating, keep temperature of electroplating solution at 55-60 ℃ through the nonmetal porous substrate of conductionization processing, control current density is 5A/dm
2, plating one square decimeter of base material required time is 58min, the nickel amount is about 400g/m on the base material
2
Electroplate after conventional thermal treatment gained porous metal material detects with industrial ordinary method, tensile strength is 1.4MPa, and the longitudinal extension rate is 6%, and vertically snappiness can reach 7 times.
Embodiment 4
At first according to conventional electronickelling solution methods and the volume required electroplating aqueous solution base fluid that does not contain rare earth of poly-preparation of step, single nickel salt 300g/L wherein, nickelous chloride 25g/L, boric acid 40g/L, by the amount of solid that should contain in volume required, take by weighing the lanthanum rich mischmetal muriate, wherein La then
2O
3/ TREO (weight ratio) is 60%-70%, in other container, dissolve it with the above-mentioned base fluid of part fully, after the filtration, filtrate is integrated with remaining base fluid, make that the muriatic concentration of lanthanum rich mischmetal is 8g/L in the plating bath, as brightening agent, regulate plating bath pH between the 3.8-4.0 to the asccharin that wherein adds 0.6g/L, get required electroplate liquid with acid or alkali.When electroplating, keep temperature of electroplating solution at 50-55 ℃ through the nonmetal porous substrate of conductionization processing, control current density is 15A/dm
2, plating one square decimeter of base material required time is 19min, the nickel amount is about 400g/m on the base material
2
Electroplate after conventional thermal treatment gained porous metal material detects with industrial ordinary method, tensile strength is 1.3MPa, and the longitudinal extension rate is 6%, and vertically snappiness can reach 7 times.
Embodiment 5
At first according to conventional electronickelling solution methods and the volume required electroplating aqueous solution base fluid that does not contain rare earth of poly-preparation of step, single nickel salt 280g/L wherein, nickelous chloride 28g/L, boric acid 40g/L, by the amount of solid that should contain in volume required, take by weighing the lanthanum rich mischmetal muriate, wherein La then
2O
3/ TREO (weight ratio) is 90%-95%, in other container, dissolve it with the above-mentioned base fluid of part fully, after the filtration, filtrate is integrated with remaining base fluid, making the lanthanum rich mischmetal chloride concentration in the plating bath is 5g/L, regulate plating bath pH between the 4.0-4.2 with acid or alkali, get required electroplate liquid.When electroplating, keep temperature of electroplating solution at 50-55 ℃ through the nonmetal porous substrate of conductionization processing, control current density is 10A/dm
2, plating one square decimeter of base material required time is 30mi n, the nickel amount is about 400g/m on the base material
2
Electroplate after conventional thermal treatment gained porous metal material detects with industrial ordinary method, tensile strength is 1.9MPa, and the longitudinal extension rate is 8%, and vertically snappiness can reach 7 times.
Embodiment 6
At first according to conventional electronickelling solution methods and the volume required electroplating aqueous solution base fluid that does not contain rare earth of poly-preparation of step, single nickel salt 280g/L wherein, nickelous chloride 28g/L, boric acid 40g/L, then by the amount of solid that should contain in volume required, take by weighing Cerium II Chloride, in other container, dissolve it with the above-mentioned base fluid of part fully, after the filtration, filtrate is integrated with remaining base fluid, making the Cerium II Chloride concentration in the plating bath is 1g/L, regulates plating bath pH between the 4.0-4.2 with acid or alkali, gets required electroplate liquid.When electroplating, keep temperature of electroplating solution at 50-55 ℃ through the nonmetal porous substrate of conductionization processing, control current density is 10A/dm
2, plating one square decimeter of base material required time is 30min, the nickel amount is about 400g/m on the base material
2
Electroplate after conventional thermal treatment gained porous metal material detects with industrial ordinary method, tensile strength is 1.3MPa, and the longitudinal extension rate is 7%, and vertically snappiness can reach 7 times.
Claims (6)
1, a kind of electroplating aqueous solution that is used for quick nickel plating of porous substrate, contained solute composition and proportioning are:
Single nickel salt 220-250g/L nickelous chloride 25-35g/L
Boric acid 30-40g/L rare-earth salts 0.4-8g/L
The pH value is 3.8-4.4.
2, the electroplating aqueous solution that is used for quick nickel plating of porous substrate as claimed in claim 1 is characterized in that: described rare-earth salts is a kind of in the following salt: the muriate of the vitriol of single rare earth element, single rare earth element, the muriate of mishmetal, the vitriol of mishmetal.
3, the electroplating aqueous solution that is used for quick nickel plating of porous substrate as claimed in claim 2 is characterized in that: the vitriol of described single rare earth element is lanthanum sulfat, ceric sulfate.
4, the electroplating aqueous solution that is used for quick nickel plating of porous substrate as claimed in claim 2 is characterized in that: the muriate of described single rare earth element is Lanthanum trichloride, Cerium II Chloride.
5, the electroplating aqueous solution that is used for quick nickel plating of porous substrate as claimed in claim 2 is characterized in that: the muriate of described mishmetal is the lanthanum rich mischmetal muriate.
6, the electroplating aqueous solution that is used for quick nickel plating of porous substrate as claimed in claim 5 is characterized in that: in the described lanthanum rich mischmetal muriate, and La
2O
3/ TREO is 50%-95% (weight ratio).
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101348934B (en) * | 2008-08-28 | 2010-04-21 | 上海应用技术学院 | Method for electroplating nickel rare earth-titanium diboride composite coating |
| CN102121124A (en) * | 2010-10-13 | 2011-07-13 | 成都亨通光通信有限公司 | Method for electroplating on surface of silica optical fiber |
| CN102839400A (en) * | 2012-09-28 | 2012-12-26 | 金鹏源康(广州)精密电路有限公司 | Electro-plated nickel solution without additive and electro-plating method thereof |
| CN106400059A (en) * | 2016-09-26 | 2017-02-15 | 河南理工大学 | Electrolyte additive used for electroforming high hardness and low stress nickel workpiece |
| CN111705332A (en) * | 2020-05-20 | 2020-09-25 | 上海应用技术大学 | Simple electrodeposited Co-Ce/NF electrode material and preparation and application thereof |
| CN111876797A (en) * | 2020-07-08 | 2020-11-03 | 佛山亚特表面技术材料有限公司 | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process |
| CN114016098A (en) * | 2021-10-21 | 2022-02-08 | 电子科技大学 | Copper-clad plate electroplating Ni-Co-Ce film plating solution for PCB and film preparation method |
-
2005
- 2005-06-08 CN CN 200510031679 patent/CN1876897A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101348934B (en) * | 2008-08-28 | 2010-04-21 | 上海应用技术学院 | Method for electroplating nickel rare earth-titanium diboride composite coating |
| CN102121124A (en) * | 2010-10-13 | 2011-07-13 | 成都亨通光通信有限公司 | Method for electroplating on surface of silica optical fiber |
| CN102839400A (en) * | 2012-09-28 | 2012-12-26 | 金鹏源康(广州)精密电路有限公司 | Electro-plated nickel solution without additive and electro-plating method thereof |
| CN102839400B (en) * | 2012-09-28 | 2013-11-13 | 广州金鹏源康精密电路股份有限公司 | Electro-plated nickel solution without additive and electro-plating method thereof |
| CN106400059A (en) * | 2016-09-26 | 2017-02-15 | 河南理工大学 | Electrolyte additive used for electroforming high hardness and low stress nickel workpiece |
| CN111705332A (en) * | 2020-05-20 | 2020-09-25 | 上海应用技术大学 | Simple electrodeposited Co-Ce/NF electrode material and preparation and application thereof |
| CN111705332B (en) * | 2020-05-20 | 2021-07-20 | 上海应用技术大学 | Simple electrodeposited Co-Ce/NF electrode material and preparation and application thereof |
| CN111876797A (en) * | 2020-07-08 | 2020-11-03 | 佛山亚特表面技术材料有限公司 | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process |
| CN111876797B (en) * | 2020-07-08 | 2021-10-15 | 佛山亚特表面技术材料有限公司 | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process |
| CN114016098A (en) * | 2021-10-21 | 2022-02-08 | 电子科技大学 | Copper-clad plate electroplating Ni-Co-Ce film plating solution for PCB and film preparation method |
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