CN1873783A - Micro drive unit with a integrated cable, and bracket of having soldering contact - Google Patents
Micro drive unit with a integrated cable, and bracket of having soldering contact Download PDFInfo
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- CN1873783A CN1873783A CN 200510075619 CN200510075619A CN1873783A CN 1873783 A CN1873783 A CN 1873783A CN 200510075619 CN200510075619 CN 200510075619 CN 200510075619 A CN200510075619 A CN 200510075619A CN 1873783 A CN1873783 A CN 1873783A
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- magnetic head
- sway brace
- solder contacts
- cable
- microdrive
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Abstract
The invention is a micro driver of magnetic head folding piece combination, comprising: a frame; first group of welded contacts arranged at one end of the frame and second group of welded contacts arranged at the other end of the frame; and cables integrated with the frame, where the cables connect the first group of welded contacts with the second groups of welded contacts.
Description
Technical field
The present invention relates to the information recording disk drive unit, refer to a kind of magnetic head fold piece combination (HEAD GIMBAL ASSEMBLY, HGA) microdrive in of disk drive especially.Specifically, the present invention is a kind of microdrive that designs at reducing cable vibration.
Background technology
The information-storing device that everybody is familiar with refers generally to disk drive, and it utilizes the magnetic medium canned data, one movably magnetic head place and be used on the described magnetic medium optionally reading or write data from disk.
For this kind magnetic disk drive, the consumer always constantly pursues bigger memory space, the faster read-write operation more accurately that reaches.Like this, the manufacturer of magnetic disk drive improves constantly the memory space of disc driver, for example increases the dense degree of information stores by reducing track width and track pitch.Yet the magnetic disk drive increase of track density each time all requires W head correspondingly to improve the position control performance, makes it can carry out rapid and precise read-write operation when using more highdensity disk.Along with the increase of track density, read/write head is positioned also to become more and more difficult on the customizing messages track on the storage medium quickly and accurately with known technology.Therefore, the disc driver manufacturer constantly seeks to improve the method for W head position control.
A kind of effective means of being improved being used for of being taked compact disk W head position control performance by the disk drive manufacturer is to introduce second driver at present, be called microdrive, it is worked with master driver and makes the position control of W head become fast and accurately.The disc driver that contains microdrive is generally known as the double drive system.
For the operating rate that increases the read/write head on the high density storage medium particular track and improve its fine position function, in the past the multiple double drive of exploitation system.These double drive systems generally include a keynote coil motor (VOICE-COIL MOTOR, VCM) driver and one microdrive, for example a piezoelectric element microdrive (PZT MICRO-ACTUATOR).Described voice coil motor driver is controlled by servo-control system, and the position of the read/write head on the storage medium particular channel is adjusted in its turn in order to the actuating arm that supports read/write head.Piezo-electric micro driver and voice coil motor drive one and are used from the locating speed of the read/write head of raising on particular channel and the accuracy of fine setting.Like this, voice coil motor driver is carried out big adjustment to the position of read/write head, and piezo-electric micro driver is then made fine setting with respect to the position of storage medium to read/write head.Voice coil motor driver and the associated working of piezoelectric element microdrive just can read and write data from the high density storage medium accurately and efficiently.
Existing a kind of microdrive of realizing the piezoelectric element of the fine setting of W head.Thereby the auxiliary circuit that this type of piezo-electric micro driver comprises can excite the piezoelectric element on the microdrive that it is optionally expanded or shrink.Because the such structure of piezo-electric micro driver, thereby the expansion of piezoelectric element or contraction can cause that all moving of microdrive causes moving of read/write head.Compare this position that to adjust read/write head of moving with the disc drive unit of independent employing voice coil motor driver faster and betterly.Similarly piezo-electric micro driver was JP 2002-133803 at number of patent application once, patented claim and number of patent application that name is called " microdrive and magnetic head fold piece combination " are JP 2002-074871, name be called " be equipped with the fine setting driver magnetic head fold piece combination, be provided with the disc drive unit of described magnetic head fold piece combination and the manufacture method of magnetic head fold piece combination " patented claim in disclosed.
Fig. 1 has showed a kind of existing disc drive unit, and has showed the disk 101 that is loaded on the Spindle Motor 102, and described Spindle Motor is in order to the described disk 101 of turn.Voice coil motor actuating arm 104 supports magnetic head fold piece combination 100, and described magnetic head fold piece combination 100 comprises that 105, one of microdrives are provided with the magnetic head 103 of read/write head.Thereby voice coil motor is used for the motion of controlling and driving arm 104 makes magnetic head 103 move on to another track from a track on disk 101 surfaces, thereby realizes that read/write head reads and write the function of data from disk 101.In the operation, be equipped with that air between the disk 101 of the magnetic head 103 of read/write head and rotation is interactive can to produce a lifting force.Described lifting force is elastic force equal and opposite in direction, the direction opposite reaction that the cantilever part with magnetic head fold piece combination 100 applies, thereby makes magnetic head can keep a predetermined flying height on spinning disk 101 surfaces in the overall diameter stroke (FULL RADIAL STROKE) of actuating arm 104.
Fig. 2 is the magnetic head fold piece combination 100 of the existing disk drive of introducing double drive device shown in Figure 1.Yet, because voice coil motor (VCM) and the intrinsic tolerance (TOLERANCE) of magnetic head cantilever spare combination influence the ability that read/write head accurately reads and writes data thereby magnetic head 103 can't obtain rapid and precise position control from disk.Therefore a kind of aforesaid piezo-electric micro driver 105 is used to improve the position control of magnetic head and read/write head.Specifically, compare with voice coil motor, the amplitude that piezo-electric micro driver 105 can be less is adjusted the displacement of magnetic head 103, thus the resonance tolerance that compensation voice coil motor and magnetic head cantilever combination are produced.For example, utilize microdrive 105, can use littler track part record spacing (TRACK PITCH), and make the TPI value (' TRACKS PER INCH ' VALUE) of disc drive unit increase by 50%, effectively the reduction magnetic head is sought rail and positioning time (SEEKING AND SETTLINGTIME) simultaneously.Like this, piezo-electric micro driver 105 can make the surface recording density of the disk in the disk drive obviously increase.
As shown in Figure 2, described magnetic head fold piece combination 100 comprises a cantilever part 106 that contains flexible element 108.Described flexible element 108 has comprised a cantilevered tab 110 that is used to support piezo-electric micro driver 105 and magnetic head 103.In the relative both sides of cantilevered tab 110, flexible element 108 also comprises two outwards outstanding cables 112,114.Each cable 112,114 has an end portion that links to each other with float plate 116 and another end portion that links to each other with composite cable 118, and described composite cable 118 electrically connects with solder contacts 120.
With reference to Fig. 3, existing piezo-electric micro driver 105 comprises a metal frame 130, and its two side arms 136,138 by top sway brace 132, end sway brace 134 and connection top sway brace 132 and end sway brace 134 constitute.All connect a piezoelectric element 140,142 on described each side arm 136,138.Described magnetic head 103 is supported on the top sway brace 132.
With reference to Fig. 4, piezo-electric micro driver 105 passes through the end sway brace 134 of metal frame 130 with cantilevered tab 110 physical connections.End sway brace 134 can be connected on the cantilevered tab 110 by for example epoxy glue or laser bonding.Three are electrically connected and receive 150 (gold goal welding or tin ball bonding meet GBB or SBB) link to each other piezo-electric micro driver 105 with the cantilever cable 118 that is positioned at each piezoelectric element 140,142 1 side.Other has four Metal Ball 152 (gold goal or tin ball) that magnetic head 103 is connected with cable 118 and realizes the electric connection of read/write converter.When applying voltage by cantilever cable 118, piezoelectric element 140,142 expands or shrinks and make two side arms 136,138 in the same side bending.This bending can cause metal frame 130 detrusions, for example, causes moving of top sway brace 132 thereby script becomes the metal frame 130 of rectangle roughly to become parallelogram.This will make connection magnetic head 103 thereon move, and then magnetic head 103 is moved and the position of fine setting read/write head on disc tracks.In this way, can realize that the displacement control of magnetic head 103 is to reach accurate fine position.
Fig. 5 has showed when when piezoelectric element 140,142 applies voltage, the course of work of piezo-electric micro driver 105.For example, when positive sinusoidal voltage puts on the microdrive piezoelectric element 140 with positive polarization direction, in first semiperiod, piezoelectric element 140 will shrink and cause side arm 136 to produce ripples deformation shape.Because magnetic head 103 is placed on the top sway brace 132, above-mentioned distortion can cause magnetic head to be offset left.In like manner, when negative sinusoidal voltage puts on the microdrive piezoelectric element 142 with positive polarization direction, second half period, piezoelectric element 142 will shrink and cause side arm 138 to produce ripples deformation shape, thereby cause magnetic head to be offset to the right.Certainly, this operation depends on the polarised direction of electric control circulation and piezoelectric element, but principle of work is well-known.
With reference to Fig. 6, two outwards outstanding cables 112,114 are used for the float plate 116 that electrically connects composite cable 118 and electrically connect with magnetic head 103.In order to reduce cable resistance that cable hardness brings and the function of keeping microdrive in operation, be bent moulding and extend at the relative both sides of cantilevered tab 110 cable 112,114.Seek when advancing sex work in rail and the position fixing process when microdrive carries out magnetic head at disk drive, this kind design causes cable 112,114 vibration and displacements, and this will cause magnetic head to be overstepped the limit.For a high-revolving DVD multidisc (HIGH RPM MULTI-PLATE) disk drive,, the cable 112,114 of excurvation also will cause wind drift because of gas shock cable or cantilever part.These two problems make magnetic head PES (position error signal) and NRRO (NON-REPEATABLE RUNOUT) performance become even worse, and these will limit the memory capacity and the performance of disk drive.
For example, Fig. 6 has demonstrated the action of microdrive 105 cable 112,114 when work.As shown in the figure, when voltage input microdrive 105, the motion of side arm 136,138 may make cable 112 towards the back side oscillation of cantilever part 106, and another cable 114 is towards the top side swing of magnetic head 103.This type of action will cause cantilever part resonance action, and this also is to cause one of derailed reason of magnetic head.
The displacement result of cable action when Fig. 7 has demonstrated the work of prior art microdrive.As mentioned above, the design of prior art comprises 112,114 of outwards outstanding cable.The displacement of described cable is measured at different frequency.As shown in the figure, displacement trend comprises three crests 160 (for example in 4 KHz, when 6.3 KHz and 8.5 KHz).
Fig. 8 has showed the measurement of correlation data of prior art magnetic head NRRO performance.As shown in the figure, crest 170 has been demonstrated the probability number percent that magnetic head is overstepped the limit under different frequency.Because the action of cable, it is relatively large to show derailed probability among the figure.
Therefore, we need a kind of improved system to overcome above mentioned weak point.
Summary of the invention
One object of the present invention is to provide a kind of microdrive that reduces cable vibration.
Another object of the present invention is to provide a kind of microdrive, it has a framework that has integrated cable and solder contacts support.
Another purpose of the present invention is to provide a kind of microdrive that is used for magnetic head fold piece combination, and it comprises framework; Be located at first solder contacts and the second batch of solder contacts that is located at the framework other end of framework one end; And being integrated into cable on the framework, described cable interconnects first solder contacts and second batch of solder contacts.
Another aspect of the present invention relates to a kind of microdrive that is used for magnetic head fold piece combination.Sway brace at the bottom of described microdrive comprises one links to each other with the cantilever part of magnetic head fold piece combination; A top sway brace is used for supporting the magnetic head of magnetic head fold piece combination; The side arm of a pair of connection top sway brace and end sway brace; Be loaded on the piezoelectric element on each side arm; Each piezoelectric element is excited and causes that side arm optionally moves, thereby drives the motion of top sway brace and magnetic head is moved; And solder contacts support that is connected with the top sway brace and extends out from the top sway brace; Described solder contacts support comprises the magnetic head solder contacts, be used for and magnetic head on corresponding contact electrically weld.
And the magnetic head fold piece combination that another aspect of the present invention relates to comprises: microdrive; Magnetic head; And the cantilever part of support microdrive and magnetic head.Described microdrive comprises: with the end sway brace that epoxy glue connects or the mode of welding links to each other with cantilever part; Support the top sway brace of magnetic head; The side arm of sway brace and top sway brace at the bottom of a pair of connection; Be contained in the piezoelectric element on each side arm.Described each piezoelectric element is excited and causes that side arm optionally moves, thereby drives the motion of top sway brace and magnetic head is moved.Solder contacts support and top sway brace fuse and extend out from the top sway brace.Described solder contacts support comprise be used for and magnetic head on the electrical magnetic head solder contacts of welding in corresponding each contact.
And another aspect of the present invention relates to disk drive.Described disk drive comprises: magnetic head fold piece combination; Described magnetic head fold piece combination comprises microdrive, magnetic head and is used for supporting the cantilever part of microdrive and magnetic head; The actuating arm that links to each other with magnetic head fold piece combination; Disk; Reach Spindle Motor in order to spinning disk.Described microdrive comprises: with the end sway brace that epoxy glue connects or welding manner links to each other with cantilever part; Support the top sway brace of magnetic head; The side arm of sway brace and top sway brace at the bottom of a pair of connection; And be loaded on piezoelectric element on each side arm; Described each piezoelectric element is excited and causes that side arm optionally moves, thereby drives the motion of top sway brace and magnetic head is moved.Solder contacts support and top sway brace fuse and extend out from the top sway brace.Described solder contacts support comprises the magnetic head solder contacts, be used for and magnetic head on corresponding contact electrically weld.
A further aspect of the invention relates to the microdrive framework that is used for magnetic head fold piece combination.The described microdrive framework that is used for magnetic head fold piece combination comprises: the end sway brace that links to each other with the cantilever part of magnetic head fold piece combination; A top sway brace that is used for supporting the magnetic head of magnetic head fold piece combination; The side arm of a pair of connection top sway brace and end sway brace; Be located at first solder contacts and the second batch of solder contacts that is located at the top sway brace of end sway brace; And be connected on the described framework and between described side arm, laid the cable of (LAMINATED), described cable connects first solder contacts and second batch of solder contacts.
Other aspects of the present invention, feature and advantage can clearly reflect from the detailed description below in conjunction with accompanying drawing, and this equally also is the part of summary of the invention, and this part is set forth by specific embodiments of the invention, inventive principle.
Description of drawings
The following drawings becomes the present invention's specific embodiment not of the same race and is more readily understood.
Fig. 1 is the stereographic map of existing disc drive unit.
Fig. 2 is the stereographic map of existing magnetic head fold piece combination.
Fig. 3 is the magnetic head of magnetic head fold piece combination among Fig. 2 and the stereographic map of piezo-electric micro driver.
Fig. 4 is the partial perspective view of magnetic head fold piece combination among Fig. 2.
Fig. 5 is the magnetic head of magnetic head fold piece combination among Fig. 2 and the piezo-electric micro driver vertical view when using.
Fig. 6 is the partial perspective view when magnetic head fold piece combination is used among Fig. 2.
Fig. 7 has showed cable action displacement result of the prior art.
Fig. 8 has showed the NRRO performance of magnetic head in the prior art.
Fig. 9 is the stereographic map of an embodiment that the present invention includes the magnetic head fold piece combination of piezo-electric micro driver.
Figure 10 is the partial perspective view of magnetic head fold piece combination among Fig. 9.
Figure 11 is the exploded view of magnetic head fold piece combination among Figure 10.
Figure 12 is the side view of magnetic head fold piece combination among Figure 10.
Figure 13 has showed the cable action displacement result of magnetic head fold piece combination among Fig. 9.
Figure 14 has showed the NRRO performance of magnetic head fold piece combination magnetic head among Fig. 9.
Figure 15 is the magnetic head of another specific embodiment of the present invention and the stereographic map of piezo-electric micro driver.
Figure 16 is the magnetic head of the another specific embodiment of the present invention and the stereographic map of piezo-electric micro driver.
Figure 17 is the present invention magnetic head of a specific embodiment and the stereographic map of piezo-electric micro driver again.
Figure 18 is the exploded view of another embodiment that the present invention includes the magnetic head fold piece combination of piezo-electric micro driver.
Figure 19 goes back the stereographic map of a specific embodiment magnetic head and piezo-electric micro driver for the present invention.
Stereographic map on the cantilever part that Figure 20 is loaded on magnetic head fold piece combination for the magnetic head among Figure 19 and piezo-electric micro driver.
Figure 21 is the magnetic head of the multiple specific embodiment of the present invention and the stereographic map of piezo-electric micro driver.
Embodiment
Set forth the several different most preferred embodiments of the present invention below with reference to the accompanying drawings, label identical among the wherein different figure is represented identical parts.As mentioned above, the present invention is designed to be used for reducing the cable vibration of magnetic head fold piece combination when using microdrive to excite magnetic head.One aspect of the present invention provides a kind of microdrive, and it comprises the cable vibration that an integrated cable and solder contacts support are used for reducing magnetic head fold piece combination.By reducing the cable vibration in the magnetic head fold piece combination, the performance characteristic of this device is improved.
Below will set forth a kind of several different most preferred embodiments of microdrive that are used for magnetic head fold piece combination.It should be noted that microdrive of the present invention can be applied on any one disk drive that contains microdrive that is fit to, and no matter the concrete structure of magnetic head fold piece combination how in the accompanying drawing, it is used to reduce cable vibration.That is the present invention can be applied on the device that contains microdrive in arbitrary industrial circle.
Fig. 9-12 has showed that the present invention introduces first embodiment of the magnetic head fold piece combination 210 of piezo-electric micro driver 212.Described magnetic head fold piece combination 210 comprises a piezo-electric micro driver 212, magnetic head 214 and is used to support or hang the cantilever part 216 of piezo-electric micro driver 212 and magnetic head 214.
Described cantilever part 216 comprises the inside and outside cantilever part cable 226,227 on substrate 218, load beam 220, articulated part 222, flexible element 224 and the flexible element 224.Described substrate 218 comprises that one is used for cantilever part 216 is connected to fixed orifice 228 on the actuating arm of disk drive voice coil motor.The profile of substrate 218 depends on the structure and the pattern of disk drive, and simultaneously, for stable support is positioned at cantilever part 216 on the voice coil motor actuating arm, described substrate 218 is made of hard relatively material, for example metal.
Described articulated part 222 is installed on substrate 218 and the load beam 220 by the mode of for example welding.Described articulated part 222 comprises a hole 230, and this hole 230 aligns with the hole 228 that is distributed on the substrate 218.Articulated part 222 also comprises a support stick 232 that is used to support load beam 220.
Described load beam 220 is installed on the support stick 232 of articulated part 222 by the mode of for example welding.Load beam 220 is provided with a projection 234, is used for supporting flexible element 224 (seeing Figure 12).Load beam 220 plays the effect of a spring or vibroshock, in order to the acting force of 214 pairs of cantilever parts 216 of buffering magnetic head.One selectable carries and stretches sheet 236 and be installed on the load beam 220, is used for mentioning magnetic head fold piece combination 210 from disk under the situation that disk does not rotate.
As the most significantly showing among Figure 10 and Figure 11, solder contacts 244 directly is connected on the interior cantilever part cable 226 in order to cantilever part cable in electrically connecting 226 and the solder contacts 246 that is distributed on the piezo-electric micro driver 212.Similarly, solder contacts 248 directly is connected on the outer cantilever part cable 227 in order to cantilever part cable in electrically connecting 227 and the solder contacts 250 that is distributed on the piezoelectric element 242.
The voice coil motor of being located on the disk drive is used for controllably driving actuating arm and magnetic head fold piece combination 210, thereby makes magnetic head fold piece combination 210 magnetic head 214 and the read/write head that is attached thereto can be positioned the particular channel on the disk of disk drive.Piezo-electric micro driver 212 is used for realizing disk drive position control and reduce the operation magnetic head and seek rail and positioning time accurately and rapidly.Therefore, when magnetic head fold piece combination 210 is introduced into disk cartridge drive postpone, the double drive system has just formed, and wherein voice coil motor driver is carried out big adjustment to the position of read/write head, and piezo-electric micro driver 212 is then made fine setting to the position of read/write head.
Figure 11 has showed piezo-electric micro driver 212 and the magnetic head 214 that takes off from cantilever part 216.As shown in the figure, piezo-electric micro driver 212 comprises microdrive framework 252 and the piezoelectric element of being located on the microdrive framework 252 242.Microdrive framework 252 comprises top sway brace 254, end sway brace 256, connects top sway brace 254 and the side arm 258 of end sway brace 256 and the solder contacts support 260 that extends out from top sway brace 254.Microdrive framework 252 can be by any suitable material, and for example metal is made,, and can any suitable technology make.
Show clearly that as Figure 10 end sway brace 256 is designed to connect microdrive framework 252 and cantilever part 216.Specifically, end sway brace 256 partly is installed on the cantilevered tab 238 of flexible element 224 by modes such as for example epoxy connection, resin or laser bonding.Equally, cantilever part solder contacts 246, for example four solder contacts are distributed on the end sway brace 256.Cantilever part solder contacts 246 is by electrically connecting 262, and for example the line welding process electrically connects with each solder contacts 244 on the cantilever part 216.So just with end sway brace 256 with cantilever part 216 couples together and microdrive framework 252 and interior cantilever part cable 226 electrically connected.For piezo-electric micro driver 212 be can move freely in use, between piezo-electric micro driver 212 and cantilevered tab 238, also be formed with parallel clearance 280.
Described top sway brace 254 is used to connect microdrive framework 252 and magnetic head 214.Specifically, magnetic head solder contacts 264, for example four solder contacts are distributed in from top sway brace 254 outward extending solder contacts supports 260.As shown in figure 11, described magnetic head solder contacts 264 is reached electric connection by the cable 266 that is integrated on the framework 252 with cantilever part solder contacts 246.Described magnetic head 214 is provided with solder contacts 268 at the one end corresponding to the position of the magnetic head solder contacts 264 of solder contacts support 260, for example four contacts.The corresponding contact 268 that described top sway brace 254 support levels magnetic head 214 thereon, the magnetic head solder contacts 264 on the solder contacts support 260 are received by being electrically connected on (gold goal or tin ball) 270 (seeing Figure 10 and Figure 12) and the magnetic head 214 electrically connects.So just with top sway brace 254 with magnetic head 214 couples together and magnetic head 214 and read/write element thereof are electrically connected with the interior cantilever part cable on the cantilever part 216 226.
In this embodiment, cable 266 is included in four electric wires between four magnetic head solder contacts 264 and four the cantilever part solder contacts 246.Yet the contact of any suitable quantity and cable can be used.As shown in figure 11, the center section 272 of relative cable curves inwardly each other.Yet cable can be any suitable structure.
Described side arm 258 couples together top sway brace 254 and end sway brace 256.Piezoelectric element 242 is installed on each side arm 258 of microdrive framework 252 and is used to form piezo-electric micro driver 112.Each piezoelectric element 242 can be formed by the diaphragm of lamination in the form of sheets, and described diaphragm comprises piezoelectric, for example PZT and as Ni-Ag or the Pt or the gold of electrode.In another specific embodiment, piezoelectric element 242 can be the ceraminator of single or multiple lift.Yet one or more piezoelectric elements 242 can be installed on the side arm 258 in any suitable manner.
The cantilever part 216 of described magnetic head and piezo-electric micro driver assembling 274 and magnetic head fold piece combination 210 electrically connects.As mentioned above, electrically connecting 262 is used to electrically connect the cantilever part solder contacts 246 on the end sway brace 256 of microdrive framework 252 and is connected in solder contacts 244 on the interior cantilever part cable 226 of cantilever part 216.In addition, the piezoelectric element on the piezo-electric micro driver 212 242 is reached electric connection with outer cantilever part cable 227.Specifically, the solder contacts 250 on the piezoelectric element 242, two contacts solder contacts 248 on (gold goal or tin ball) and the outer cantilever part cable 227 of receiving by being electrically connected for example, for example two solder contacts electric connections.This can make the electric current that is applied pass to piezoelectric element 242 by outer cantilever part cable 227.
In the use,, for example apply voltage thereon, and it is optionally expanded and shrink by exciting piezoelectric element 242.Because the structure of piezo-electric micro driver 212 itself, piezoelectric element 242 expands and contraction can cause the motion of side arm 258, and drives the motion of top sway brace 254, thereby causes the motion that connects magnetic head 214 thereon.
Because cable 266 and solder contacts support 260 are integrated in microdrive framework 252, so these elements can not produce excessive vibration when piezo-electric micro driver 212 work.By reducing the vibration of cable in the magnetic head fold piece combination, the performance of disk drive improves.In addition, because these elements are not yielding in the manufacture process of cantilever part, magnetic head fold piece combination and disk drive, can improve processing output so have the piezo-electric micro driver 212 of integrated cable 266 and solder contacts support 260.
Cable action displacement result when Figure 13 has showed piezo-electric micro driver 212 work.Compare with adopting the result of prior art among Fig. 7, promptly three crests 284 among Figure 13 improve to some extent with respect to three crests 160 among Fig. 7 (for example in 4 KHz, when 6.3 KHz and 8.5 KHz).
Figure 14 has showed the test data of the magnetic head NRRO performance that is used for piezo-electric micro driver 212.Compare with adopting the result of prior art among Fig. 8, the crest 286 among Figure 14 improves to some extent.
As mentioned above, the cable that is used to connect magnetic head solder contacts 264 and cantilever part solder contacts 246 can be any suitable structure.For example, Figure 15 has showed piezo-electric micro driver 312 another kind of specific embodiments of the present invention.In this embodiment, the center section 272 of two of cable 366 relative cables is also outwardly-bent away from each other.Remaining other elements of piezo-electric micro driver 312 are identical with piezo-electric micro driver 212 in fact, and with identical label sign.
Figure 16 has showed the piezo-electric micro driver 412 of another specific embodiment of the present invention.In the present embodiment, the end 472 of the relative cable of described cable 466 curves inwardly each other.Remaining other elements of piezo-electric micro driver 412 are identical with piezo-electric micro driver 212 in fact, and with identical label sign.
Figure 17 has showed the piezo-electric micro driver 512 of another specific embodiment of the present invention.In the present embodiment, the relative cable of described cable 566 is parallel to each other in fact.Remaining other elements of piezo-electric micro driver 512 are identical with piezo-electric micro driver 212 in fact, and with identical label sign.
Figure 18 has showed the also piezo-electric micro driver 612 of a specific embodiment of the present invention.In the present embodiment, described cable 666 is positioned at the rear side of framework 652.Described cable 666 can have above-mentioned any suitable structure.As mentioned above, opening or window 690 are formed on the described solder contacts support 660 so that magnetic head solder contacts 264 be exposed with magnetic head 214 welding.In addition, anisotropic conductive film (ACF) 692 or other suitable materials can be used to the contact 244 on physics and electric connection cantilever part solder contacts 246 and the cantilever part 216.Remaining other elements of piezo-electric micro driver 612 are identical with piezo-electric micro driver 212 in fact, and with identical label sign.
Figure 19 and Figure 20 have showed the piezo-electric micro driver 712 of another specific embodiment of the present invention.In the present embodiment, the end sway brace 256 of described framework 252 can comprise an extension 794, and for example the long-tail guide rod is connected with cantilever part 216 with convenient.For example described end sway brace 256 can be installed on the cantilevered tab 238 of described cantilever part 216 by physics by for example laser bonding or epoxy glue.
Described extension 794 comprises cantilever part solder contacts 246, and this cantilever part solder contacts 246 can electrically weld, and for example supersonic welding is connected to contact 244 corresponding on the cantilever part 216.Remaining other elements of piezo-electric micro driver 712 are identical with piezo-electric micro driver 212 in fact, and with identical label sign.
Figure 21 has showed the piezo-electric micro driver 812 of another specific embodiment of the present invention.In the present embodiment, the end sway brace 256 of described framework 252 can comprise extension 894, and for example the long-tail guide rod is connected with aforesaid cantilever part 216 with convenient.In addition, the cable 866 of described connection magnetic head solder contacts 264 and cantilever part solder contacts 246 is located on framework 852 rear sides.Described cable 866 can have above-mentioned any structure.As mentioned above, an opening 890 is formed on the described solder contacts support 860, so that magnetic head solder contacts 264 is exposed to weld with magnetic head 214.Remaining other elements of piezo-electric micro driver 812 are identical with piezo-electric micro driver 212 in fact, and with identical label sign.
Magnetic head fold piece combination 210 with the piezo-electric micro driver 212,312,412,512,612,712,812 in the embodiment of the invention can be applicable in the disk drive (HDD).Described disk drive can be with reference to the type shown in the figure 1.Because the structure of disk drive, work and assembling process are known to those skilled in the art, Gu do not describing in detail at this.Described piezo-electric micro driver can be applicable to any suitable disk drive with microdrive or has in other devices of microdrive.In one embodiment, piezo-electric micro driver is used in the high rotating speed disk drive.
Above disclosed only is preferred embodiment of the present invention, can not limit the present invention's interest field certainly with this, and therefore the equivalent variations of being done according to the present patent application claim still belongs to the scope that the present invention is contained.
Claims (43)
1. microdrive that is used for magnetic head fold piece combination, described microdrive comprises:
Framework;
Be located at first solder contacts and the second batch of solder contacts that is located at the framework other end of framework one end; And being integrated into cable on the framework, described cable interconnects first solder contacts and second batch of solder contacts.
2. microdrive as claimed in claim 1 is characterized in that: described framework comprises the solder contacts support that is integrated on it, one of described first solder contacts of described solder contacts stent support and second batch of solder contacts.
3. microdrive as claimed in claim 1, it is characterized in that: described framework comprises the solder contacts support that is integrated on it, and described solder contacts support has at least one opening in order to support and to expose one of described first solder contacts and second batch of solder contacts.
4. microdrive that is used for magnetic head fold piece combination, described microdrive comprises:
Sway brace at the bottom of one links to each other with the cantilever part of magnetic head fold piece combination;
A top sway brace is used for supporting the magnetic head of magnetic head fold piece combination;
The side arm of a pair of connection top sway brace and end sway brace;
Be loaded on the piezoelectric element on each side arm; Each piezoelectric element is excited and causes that side arm optionally moves, thereby drives the motion of top sway brace and magnetic head is moved; And
A solder contacts support that is connected with the top sway brace and extends out from the top sway brace; Described solder contacts support comprises the magnetic head solder contacts, be used for and magnetic head on corresponding contact electrically weld.
5. microdrive as claimed in claim 4 is characterized in that: sway brace of the described end comprises the cantilever part solder contacts, be used for cantilever part on corresponding contact electrically weld.
6. microdrive as claimed in claim 5 is characterized in that: described cantilever part solder contacts electrically connects by cable and the magnetic head solder contacts that is integrated on end sway brace, top sway brace and the solder contacts support.
7. microdrive as claimed in claim 6 is characterized in that: described cable comprises relative cable, and the center section of described cable curves inwardly each other.
8. microdrive as claimed in claim 6 is characterized in that: described cable comprises relative cable, and the center section of described cable is crooked outwardly away from each other.
9. microdrive as claimed in claim 6 is characterized in that: described cable comprises relative cable, and the end of described cable curves inwardly each other.
10. microdrive as claimed in claim 6 is characterized in that: described cable comprises cable relative, that be parallel to each other in fact.
11. microdrive as claimed in claim 6 is characterized in that: described cable is integrated into the described front surface of front surface of end sway brace, top sway brace solder contacts support towards magnetic head.
12. microdrive as claimed in claim 6 is characterized in that: described cable is integrated into the rear surface combination of end sway brace, top sway brace, solder contacts support, and described rear surface is away from magnetic head.
13. microdrive as claimed in claim 12 is characterized in that: described solder contacts support comprises the opening that exposes the magnetic head solder contacts, makes the magnetic head solder contacts electrically to weld with corresponding contact on the magnetic head by this opening.
14. microdrive as claimed in claim 4, it is characterized in that further comprising the extension that is integrated into end sway brace and extends out from end sway brace, described extension comprises the cantilever part solder contacts, and this cantilever part solder contacts can electrically be welded in contact corresponding on the cantilever part.
15. microdrive as claimed in claim 14 is characterized in that: described cantilever part solder contacts by be integrated into end sway brace, top sway brace and solder contacts props up and the extension that extends out from end sway brace on cable and magnetic head solder contacts electrically connect.
16. microdrive as claimed in claim 15 is characterized in that: described cable comprises relative cable, and the center section of described cable curves inwardly each other.
17. microdrive as claimed in claim 15 is characterized in that: described cable is integrated into end sway brace, top sway brace, solder contacts support and the front surface of the extension that extends out from end sway brace, and described front surface is towards magnetic head.
18. microdrive as claimed in claim 15 is characterized in that: described cable is integrated into end sway brace, top sway brace, solder contacts support and the rear surface of the extension that extends out from end sway brace, and described rear surface is away from magnetic head.
19. microdrive as claimed in claim 6 is characterized in that: described solder contacts support comprises the opening that exposes the magnetic head solder contacts, makes the magnetic head solder contacts electrically to weld with corresponding contact on the magnetic head by this opening.
20. a magnetic head fold piece combination comprises:
Microdrive; Magnetic head; And the cantilever part of support microdrive and magnetic head; It is characterized in that:
Described microdrive comprises:
With the end sway brace that epoxy glue connects or the mode of laser bonding links to each other with cantilever part;
Support the top sway brace of magnetic head;
The side arm of sway brace and top sway brace at the bottom of a pair of connection;
Be contained in the piezoelectric element on each side arm, described each piezoelectric element is excited and causes that side arm optionally moves, thereby drives the motion of top sway brace and magnetic head is moved; And
Be integrated into the top sway brace and from the extended solder contacts support of top sway brace, described solder contacts support comprise be used for and magnetic head on the electrical magnetic head solder contacts of welding in corresponding each contact.
21. magnetic head fold piece combination as claimed in claim 20 is characterized in that: described magnetic head comprises the read/write element of magnetic recording.
22. magnetic head fold piece combination as claimed in claim 20 is characterized in that: the cantilevered tab of sway brace of the described end and cantilever part links to each other.
23. magnetic head fold piece combination as claimed in claim 20 is characterized in that: sway brace of the described end comprises the cantilever part solder contacts, be used for cantilever part on corresponding contact electrically weld.
24. magnetic head fold piece combination as claimed in claim 23 is characterized in that: described cantilever part solder contacts is by electrically connecting with the cable and the magnetic head solder contacts that are integrated on end sway brace, top sway brace and the solder contacts support.
25. magnetic head fold piece combination as claimed in claim 24 is characterized in that: described cable comprises relative cable, and the center section of described cable curves inwardly each other.
26. magnetic head fold piece combination as claimed in claim 24 is characterized in that: described cable comprises relative cable, and the center section of described cable is crooked outwardly away from each other.
27. magnetic head fold piece combination as claimed in claim 24 is characterized in that: described cable comprises relative cable, and the end of described cable curves inwardly each other.
28. magnetic head fold piece combination as claimed in claim 24 is characterized in that: described cable comprises cable relative, that be parallel to each other in fact.
29. magnetic head fold piece combination as claimed in claim 24 is characterized in that: described cable is integrated into the front surface of end sway brace, top sway brace, solder contacts support, and described front surface is towards magnetic head.
30. magnetic head fold piece combination as claimed in claim 24 is characterized in that: described cable is integrated into the rear surface of end sway brace, top sway brace, solder contacts support, and described rear surface is away from magnetic head.
31. magnetic head fold piece combination as claimed in claim 30 is characterized in that: described solder contacts support comprises the opening that exposes the magnetic head solder contacts, makes the magnetic head solder contacts electrically to weld with corresponding contact on the magnetic head by this opening.
32. magnetic head fold piece combination as claimed in claim 20, it is characterized in that further comprising the extension that is integrated into end sway brace and extends out from end sway brace, described extension comprises the cantilever part solder contacts, and this cantilever part solder contacts can electrically be welded in contact corresponding on the cantilever part.
33. magnetic head fold piece combination as claimed in claim 32 is characterized in that: described cantilever part solder contacts is by electrically connecting with the cable and the magnetic head solder contacts that are integrated on end sway brace, top sway brace and solder contacts support and the extension.
34. magnetic head fold piece combination as claimed in claim 33 is characterized in that: described cable comprises relative cable, and the center section of described cable curves inwardly each other.
35. magnetic head fold piece combination as claimed in claim 33 is characterized in that: described cable is integrated into the front surface of end sway brace, top sway brace, solder contacts support, and described front surface is towards magnetic head.
36. magnetic head fold piece combination as claimed in claim 33 is characterized in that: described cable is integrated into the rear surface of end sway brace, top sway brace, solder contacts support, and described rear surface is away from magnetic head.
37. magnetic head fold piece combination as claimed in claim 36 is characterized in that: described solder contacts support comprises the opening that exposes the magnetic head solder contacts, makes the magnetic head solder contacts electrically to weld with corresponding contact on the magnetic head by this opening.
38. a disk drive comprises:
Magnetic head fold piece combination; Described magnetic head fold piece combination comprises microdrive, magnetic head and is used for supporting the cantilever part of microdrive and magnetic head; The actuating arm that links to each other with magnetic head fold piece combination; Disk; Reach Spindle Motor in order to spinning disk; It is characterized in that:
Described microdrive comprises:
With the end sway brace that epoxy glue connects or the laser bonding mode links to each other with cantilever part;
Support the top sway brace of magnetic head;
The side arm of sway brace and top sway brace at the bottom of a pair of connection; And
Be loaded on the piezoelectric element on each side arm; Described each piezoelectric element is excited and causes that side arm optionally moves, thereby drives the motion of top sway brace and magnetic head is moved; And
A solder contacts support that is integrated into the top sway brace and extends out from the top sway brace; Described solder contacts support comprises the magnetic head solder contacts, be used for and magnetic head on corresponding contact electrically weld.
39. disk drive as claimed in claim 38 is characterized in that: sway brace of the described end comprises the cantilever part solder contacts, be used for cantilever part on corresponding contact electrically weld.
40. disk drive as claimed in claim 38 is characterized in that: described cantilever part solder contacts is by electrically connecting with the cable and the magnetic head solder contacts that are integrated on end sway brace, top sway brace and the solder contacts support.
41. a microdrive framework that is used for magnetic head fold piece combination is characterized in that comprising:
Sway brace at the bottom of one links to each other with the cantilever part of magnetic head fold piece combination;
A top sway brace is used for supporting the magnetic head of magnetic head fold piece combination;
The side arm of a pair of connection top sway brace and end sway brace;
Be located at first solder contacts and the second batch of solder contacts that is located at the top sway brace of end sway brace; And
Be integrated on the described framework and laid the cable of (LAMINATED) between described side arm, described cable connects first solder contacts and second batch of solder contacts.
42. microdrive framework as claimed in claim 41 is characterized in that further comprising the solder contacts support that is integrated into the top sway brace and extends out from the top sway brace; The described second batch of solder contacts of described solder contacts stent support.
43. microdrive framework as claimed in claim 41 is characterized in that: described cable comprises cable relative, that have the end that curves inwardly each other, and (LAMINATED) laid on end sway brace in described aduncate each other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510075619 CN1873783A (en) | 2005-05-31 | 2005-05-31 | Micro drive unit with a integrated cable, and bracket of having soldering contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510075619 CN1873783A (en) | 2005-05-31 | 2005-05-31 | Micro drive unit with a integrated cable, and bracket of having soldering contact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1873783A true CN1873783A (en) | 2006-12-06 |
Family
ID=37484224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510075619 Pending CN1873783A (en) | 2005-05-31 | 2005-05-31 | Micro drive unit with a integrated cable, and bracket of having soldering contact |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1873783A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799130A (en) * | 2016-09-02 | 2018-03-13 | 株式会社东芝 | The manufacture method of disk device and disk device |
| CN113393869A (en) * | 2020-03-11 | 2021-09-14 | 日本发条株式会社 | Suspension for magnetic disk device |
-
2005
- 2005-05-31 CN CN 200510075619 patent/CN1873783A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799130A (en) * | 2016-09-02 | 2018-03-13 | 株式会社东芝 | The manufacture method of disk device and disk device |
| CN107799130B (en) * | 2016-09-02 | 2019-09-06 | 株式会社东芝 | The manufacturing method of disk device and disk device |
| CN113393869A (en) * | 2020-03-11 | 2021-09-14 | 日本发条株式会社 | Suspension for magnetic disk device |
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