CN1869714A - Probe structure of test card - Google Patents
Probe structure of test card Download PDFInfo
- Publication number
- CN1869714A CN1869714A CN 200610090899 CN200610090899A CN1869714A CN 1869714 A CN1869714 A CN 1869714A CN 200610090899 CN200610090899 CN 200610090899 CN 200610090899 A CN200610090899 A CN 200610090899A CN 1869714 A CN1869714 A CN 1869714A
- Authority
- CN
- China
- Prior art keywords
- probe
- test card
- overlay film
- film
- probe structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention provides a probe structure for a test card, mainly coating the probe surface on the test card, where the probe is made of conductive material, and the coating on the probe surface is conductive and 0-5 mm thick and made of conductive material with conductivity greater than 1*103(Ohm .m)-1. By the coating, the invention can make the probe repairable, reduce foreign matter adhesion, improve wearability, strengthen conductivity or insulating property and prevent electromagnetic interference.
Description
Technical field
The present invention relates to a kind of probe structure of test card; be particularly related to and a kind ofly bestow coating film treatment in detecting probe surface; make the surface form the overlay film protection, can repair, reduce foreign matter to reach and adhere to, increase wearing quality, increase electric conductivity or insulativity, prevent the probe structure of the test card of electromagnetic interference (EMI).
Background technology
General tested object is (as wafer, IC, DRAM etc.) must be via the test of tester table, whether meet design with the test tested object and go up desired functional characteristic, defective products is eliminated to ensure product quality, and the test card 1 on the tester table, see also Fig. 1, shown in Figure 2, mainly be to be provided with a circuit board 11, described circuit board 11 is provided with positioning seat 12, be to arrange to be fixed with several probes 13 on the described positioning seat 12, described probe 13 is to be equipped with lead 14 to be connected on the circuit board 11, and general probe 13 is made by metal or other conductive material of tool electric conductivity, as shown in Figure 3, one end of probe 13 is that stiff end 131 is to be fixed on the positioning seat 12, the other end is that contact jaw 132 is to be vertical bending to be suspended on the circuit board 11, contact jaw 132 by probe 13 contacts with the signal contact formation of tested object 19, so that directly to tested object 19 input signals and detecting output valve, carry out the transmission of electrical parameter measurement signal, test the yield of tested object 19, yet, existing probe 13 is to make with electric conductor, probe 13 is to adopt tight spacing to arrange, so can produce the phenomenon of short circuit in the slit of 13 of probe 13 and probes because of foreign matter drops, make the probe 13 can't normal operation, generally speaking, probe 13 has the abrasion of contact, the order of severity of abrasion can influence the fiduciary level and the serviceable life of test card 1 test, and contact jaw 132 surfaces, the 133 long-term uses of probe 13 are easy to wear, contact jaw 132 frayed surfaces 133 can be roughness, as shown in Figure 4, easily be attached with residue and dirt 18, easy-clear not, and the yield of tested object 19 tests is significantly reduced, the rate of resurveying increases, so must earlier the residue and the dirt 18 on surface be removed, with sand paper the surface 133 of contact jaw 132 is given cutting down again, can be again for using, but probe 13 its length after repeatedly finishing wears away can shorten, after being milled to certain-length, just can not use, must abandon, serviceable life is short, and the cost of the formula of survey card 1 is high, so uses the utmost point not to be inconsistent economic benefit; Edge this, the inventor is to concentrate on studies, improve because the probe of existing test card has as above-mentioned disappearance, is initiated out the present invention then.
Summary of the invention
The object of the present invention is to provide a kind of wearing quality that has, can increase electric conductivity and reduce friction, reducing residue and the dirt that detecting probe surface adheres to, and can conveniently repair, reuse, long service life, and make the probe structure that detects the test card that yield Da Fu promotes.
To achieve these goals, the invention provides a kind of probe structure of test card, be that detecting probe surface on test card is bestowed coating film treatment, described probe is that the material of tool electric conductivity is made, plate the overlay film of tool electric conductivity in detecting probe surface, the thickness that described overlay film forms be greater than 0 less than 5mm, the material of overlay film is that conductance is greater than 1 * 10
3(Ω m)
-1Conductive material.
The present invention has following advantage:
1. the present invention plates one deck overlay film and forms protection in the surface of probe, makes probe have more wearing quality, can reduce abrasion.
2. probe of the present invention can increase electric conductivity through surface treatment, can reduce residue and dirt that detecting probe surface adheres to, and removes easily.
3. the overlay film of detecting probe surface of the present invention can conveniently be repaired, and repeats plated film and re-use, and serviceable life is longer.
4. probe of the present invention can repeat plated film and re-use escapable cost.
5. the present invention can plate the overlay film of one deck tool electric conductivity in the needle surface of probe, plate one deck dielectric film in the needle body surface of probe again, can prevent the situation that foreign matter drops and is short-circuited between probe, make probe be stablized normal operation, the yield of test is better, and the rate of resurveying reduces.
Description of drawings
Fig. 1 is the stereographic map of test card;
Fig. 2 is the use synoptic diagram of test card;
Fig. 3 is the enlarged diagram of existing probe;
Fig. 4 is the synoptic diagram of existing probe wearing and tearing;
Fig. 5 is the enlarged diagram of probe of the present invention;
Fig. 6 plates the synoptic diagram of one deck overlay film for detecting probe surface of the present invention;
Fig. 7 is the synoptic diagram of the wearing and tearing of the overlay film on the probe of the present invention;
Fig. 8 is the synoptic diagram of overlay film finishing on the probe of the present invention;
Fig. 9 is for plating the synoptic diagram of overlay film once more on the probe of the present invention;
Figure 10 plates overlay film for the needle surface of another embodiment of the present invention probe, and needle body surface plates the synoptic diagram of dielectric film.
Description of reference numerals: 1 test card; 11 circuit boards; 12 positioning seats; 13 probes; 131 stiff ends; 132 contact jaws; 133 surfaces; 14 leads; 18 residues and dirt; 19 tested objects; 2 probes; 21 needle bodys; 22 syringe needles; 3 overlay films; 31 residues and dirt; 32 overlay films; 4 dielectric films.
Embodiment
About the present invention reaches above-mentioned application target and effect, the technological means that is adopted is enumerated preferable feasible embodiment, and cooperate graphic shown in, details are as follows.
At first; see also Fig. 5; shown in Figure 6; the present invention is that coating film treatment is bestowed on probe 2 surfaces on test card; described probe 2 can be made as by the material of tool electric conductivity such as tungsten metal or tungalloy made; probe 2 is placed coating apparatus; its coating apparatus can be made as the vacuum plating stove; the overlay film 3 that plates tool electric conductivity in probe 2 surfaces forms protection (as shown in Figure 6); the thickness that described overlay film 3 forms is less than 5mm greater than 0; the material of its overlay film 3 can plate unlike material in the surface of probe 2 according to the difference that detects different article or service condition, and the material of overlay film 3 can be conductance greater than 1 * 10
3(Ω m)
-1Conductive material, and overlay film 3 can be single or multiple lift, can the unlike material plated film be the overlay film 3 of multilayer again, and the plated film mode can adopt electric electrochemical plating (plating of electrolytic reaction is arranged) or wireless plating technology (plating of no electrolytic reaction), for example belong to the general plating that electric electrochemical plating are arranged, composite plating, alloy plating etc., and belong to the physical vaporous deposition of wireless plating technology, as the vacuum splashing and plating method, vacuum vapour deposition or ion beam coating embrane method etc., or belong to the atmospheric chemical vapor deposition of chemical vapour deposition technique, Low Pressure Chemical Vapor Deposition, plasma enhanced chemical vapor deposition method etc.
In addition, overlay film 3 when 2 surfaces of the probe on the test card can produce wearing and tearing after using, and residue and dirt 31 (as shown in Figure 7) are arranged in remained on surface, can bestow the finishing coating film treatment at 2 surfaces of the probe on the test card, at first, (as shown in Figure 8) repaired on the surface of probe 2, part that must plated film with test card and probe 2 is coated and is covered, only expose probe 2 syringe needles 22 surfaces that desire is handled, test card and probe 2 after will covering place coating apparatus again, the overlay film 32 that plates tool electric conductivity in uncovered syringe needle 22 surfaces again forms protection (as shown in Figure 9), so, its probe 2 can be not frayed, the position that is worn only is the overlay film 3 on probe 2 surfaces, and can be repaired after overlay film 3 experience wear, repeats plated film and re-uses, so repeat finishing, plated film can make increase the serviceable life of probe 2 and test card, can significantly reduce cost; And general probe has the abrasion of contact, the order of severity of abrasion can influence the fiduciary level and the serviceable life of test card, the present invention passes through in the plated film on probe 2 surfaces, can prolong the serviceable life of probe 2 on test card, and probe 2 in the use, can cause the surface of contact part material of tested person thing to be attached on the surface of probe because of contact test with the tested person thing, and probe 2 of the present invention is through coating film treatment, plate the overlay film 3 of one deck tool electric conductivity and wearing quality in the surface of probe 2,32, make its surface comparatively smooth, can reduce the phenomenon that tested person thing material adheres to, and remove than being easier to, can promote the yield of test, and probe 2 of the present invention can not need to carry out coating film treatment under the situation of taking off from test card, to not need all surface of coating film treatment to be coated, only will need the surface of plated film directly to be exposed to carry out plated film in the coating apparatus to get final product, it be very convenient to repeat plated film.
Again, if the probe 2 on the test card is arranged for tight spacing, produce the phenomenon of short circuit for preventing to have between probe 2 and the probe 2 because of foreign matter drops, then bestow coating film treatment in the needle body 21 surfaces of its probe 2, the first needle body 21 with probe 2 is partly coated to be covered, only expose syringe needle 22 positions, plate the overlay film 3 of tool electric conductivity in syringe needle 22 surfaces, the thickness that described overlay film 3 forms is less than 5mm greater than 0, the syringe needle 22 that again probe 2 is plated overlay film 3 is partly coated to be covered, only expose the needle body 21 positions, plate the dielectric dielectric film 4 of one deck again in the needle body 21 surfaces and form isolated protection, the thickness that described dielectric film 4 forms is less than 5mm greater than 0; So, plate the good overlay film 3 of one deck tool electric conductivity in syringe needle 22 surfaces of probe 2, plate the dielectric film 4 of the non-conductive and tool of one deck insulation material again in the needle body 21 surfaces of probe 2, as shown in figure 10, be subjected to completely cutting off of dielectric film 4 between probe 2 and the probe 2, the situation that can reduce electromagnetic interference (EMI) produces, and if the foreign matter residue drops in the slit of 2 of probe 2 and probes, do not have the situation generation of short circuit, make probe 2 be stablized normal operation, and the yield of test is better, and the rate of resurveying then greatly reduces.
Claims (5)
1. the probe structure of a test card, it is characterized in that: be that detecting probe surface on test card is bestowed coating film treatment, described probe is that the material of tool electric conductivity is made, plate the overlay film of tool electric conductivity in detecting probe surface, the thickness that described overlay film forms be greater than 0 less than 5mm, the material of overlay film is that conductance is greater than 1 * 10
3(Ω m)
-1Conductive material.
2. the probe structure of test card as claimed in claim 1, wherein, overlay film is an individual layer.
3. the probe structure of test card as claimed in claim 1, wherein, overlay film is a multilayer.
4. the probe structure of test card as claimed in claim 3, wherein, the overlay film of multilayer is a unlike material.
5. the probe structure of test card as claimed in claim 1 wherein, plates the overlay film of tool insulativity in the needle body surface of probe, and the thickness that described overlay film forms is less than 5mm greater than 0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610090899 CN1869714A (en) | 2006-07-06 | 2006-07-06 | Probe structure of test card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610090899 CN1869714A (en) | 2006-07-06 | 2006-07-06 | Probe structure of test card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1869714A true CN1869714A (en) | 2006-11-29 |
Family
ID=37443430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610090899 Pending CN1869714A (en) | 2006-07-06 | 2006-07-06 | Probe structure of test card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1869714A (en) |
-
2006
- 2006-07-06 CN CN 200610090899 patent/CN1869714A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20130018866A (en) | Contact probe | |
| KR101704892B1 (en) | Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board | |
| KR101161514B1 (en) | Electric contact member | |
| US9229031B2 (en) | Probes for testing integrated electronic circuits and corresponding production method | |
| KR20160129916A (en) | Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board | |
| KR101716988B1 (en) | Surface-treated copper foil and laminated board using same | |
| KR102427551B1 (en) | Wiring board manufacturing method and wiring board | |
| KR20150024393A (en) | Surface-treated copper foil and laminated sheet, printed wiring board, and electronic device using same, as well as method for producing printed wiring board | |
| KR20160099439A (en) | Treated copper foil, and copper-clad laminate and printed wiring board using the treated copper foil | |
| KR20110019699A (en) | Copper foil for flexible printed circuits and method for manufacturing the same | |
| KR20100095658A (en) | Adhesive-free flexible laminate | |
| US11877397B2 (en) | Printed circuit board | |
| KR20080099783A (en) | Cleaning apparatus for probe | |
| US20080122470A1 (en) | Probe installed to a probe card | |
| CN1869714A (en) | Probe structure of test card | |
| CN2906629Y (en) | Probe structure of test card | |
| KR101631423B1 (en) | Surface-treated copper foil and laminate using same | |
| EP0525956A2 (en) | Metal foil with improved bonding to substrates and method for making said foil | |
| EP0520640A1 (en) | Metal foil with improved peel strength and method for making said foil | |
| CN100504398C (en) | Method for treating surface of probe installed on testing card | |
| JP2008050638A (en) | Method of manufacturing metallized plastic film base material, and vacuum film deposition apparatus | |
| US20230164926A1 (en) | Printed wiring board | |
| TWM362994U (en) | Probe card | |
| KR20140072409A (en) | Method for processing a flexible cupper clad laminated film | |
| KR20230112638A (en) | Roughened copper foil, copper clad laminate, and printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |