CN1865344A - Adhesive resin composition and use thereof - Google Patents
Adhesive resin composition and use thereof Download PDFInfo
- Publication number
- CN1865344A CN1865344A CNA2005100680877A CN200510068087A CN1865344A CN 1865344 A CN1865344 A CN 1865344A CN A2005100680877 A CNA2005100680877 A CN A2005100680877A CN 200510068087 A CN200510068087 A CN 200510068087A CN 1865344 A CN1865344 A CN 1865344A
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- resin combination
- resin
- printed circuit
- flexible printed
- circuit substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an adhesive resin composition for flexible print circuit base board, which is characterized by the following: displaying flame-proof, adhesive, heat-insulating property with solidified glass transition temperature at 100 deg.c or more; making the stripping strength of 10 um thickness resin layer of resin combination and copper foil at 0.8 N per mm or more; keeping the stripping strength at 50 percent or more after 240 h at 150 deg.c.
Description
Technical field
The present invention relates to flexible circuit board resin combination and uses thereof.More particularly, the present invention relates to adhering agent layer can filming, and the flexible printed circuit substrate tackiness agent of flame retardant resistance, tackiness and excellent heat resistance.
Background technology
Flexible printed circuit substrate, can with the Copper Foil be the tinsel of representative and with the polyimide resin be the synthetic resin film of representative with tackiness agent bonding after, tinsel is made circuit makes.
In recent years, compactization along with electronic machines such as digital camera, camcorder, hard disk drive, printer and pocket telephones adopts flexible printed circuit substrate mostly.The consequent is higher to the requirement on the characteristic, require highly fire-retardantization, height thin plateization, highly flexibleization, consider the anti-lead-free solder of environmental factors high heat resistance, be accompanied by clinging power under the long term high temperature environment that the instrument working temperature rises keep performance etc.Though there are tackiness agents such as acrylonitrile-butadiene/Resins, epoxy in the past as tackiness agent, the but low problem of cohesively under high-temperature atmosphere, and be the poor fire of the security of guaranteeing electronic machine.At this problem, open the flame retardant resistance adhesion agent composition that utilizes brominated epoxy resin/ANTIMONY TRIOXIDE SB 203 99.8 PCT system in the clear 61-76579 communique the spy, in the public clear 58-13039 communique of spy, utilize the adhesion agent composition of allocating halogenide and inorganic combustion inhibitor into, open in the flat 2-301186 communique the spy and to utilize ethylene propylene copolymer and the additive of allocating Resins, epoxy/contain carboxyl into, the adhesion agent composition of allocating fire retardant into, tested and improved tackiness, solder heat resistance and flame retardant resistance.Yet, these tackiness agents, for giving the flame retardant particle that flame retardant resistance is added, along with the filming of adhesive coating can produce projection on metal covering, when forming, circuit causes the broken string of wiring, produce and impact, cause under the situation between crossover track that insulation impedance reduces between wiring, and then the adhering agent layer of formation skewness one, causing the inhomogenous problem of flame retardant resistance, need improve for these problems.
Open flat 05-315743 communique the spy, the spy opens the trial that this flame-retardant particle composition is removed in proposition in the 2002-69414 communique.Open the spy and to disclose the adhesion agent composition of forming by propylene elastomeric, phenol aralkyl resin, Resins, epoxy in the flat 05-315743 communique, but, use propylene elastomeric to have easier hydrolysis under water absorbability height, hydrolysis easily, the high temperature, the long-term low problem of conservation rate of clinging power at high temperature.And open in 2002-69414 number the spy, though disclose the adhesion agent composition of forming by ethylene-acrylate copolymer rubber, solidifying agent and Resins, epoxy, but owing to there is non-reacted ethylene-acrylate copolymer rubber, at high temperature change so have for a long time, cause the problem that adhesion strength reduces.
Patent documentation 1: the spy opens clear 61-76579 communique
Patent documentation 2: special public clear 58-13039 communique
Patent documentation 3: the spy opens flat 2-301186 communique
Patent documentation 4: the spy opens flat 05-315743 communique
Patent documentation 5: the spy opens the 2002-69414 communique
Summary of the invention problem of the present invention is to solve the problems referred to above that prior art has, and does not contain insoluble inorganic combustion inhibitor in a kind of solvent even provide, the adhesive resin composition that also can obtain to have abundant flame retardant resistance.More particularly, provide a kind of flame retardant resistance, tackiness, thermotolerance all good flexible printed circuit substrate adhesive resin composition.
The inventor etc. further investigate with regard to the resin adhesion composition for reaching above-mentioned purpose, and the result has finished the present invention.
That is the present invention,
At first relate to a kind of flexible printed circuit substrate resin combination, it is the flexible printed circuit substrate resin combination, second-order transition temperature after it is characterized in that solidifying is in more than 100 ℃, and the resin layer of 10 microns of thickness of forming by this resin combination and the stripping strength between Copper Foil be 0.8N/mm or more than, the stripping strength conservation rate after 150 ℃ of heating in following 240 hours be 50% or more than.
From the flame retardant resistance viewpoint, it is preferred that described resin combination contains the compound that elastomerics, (C) that (A) Resins, epoxy, (B) has carboxyl have the compound of phenolic hydroxyl group and (D) have an imidazolyl.
In addition, from the heat-resistant aging viewpoint, the elastomerics that described (B) has carboxyl is that the ethylene acrylic that does not contain unsaturated link(age) is rubber (ethylene-acrylic rubber), and the compound that (C) has phenolic hydroxyl group is that the resin (aralkyl resin) with aralkyl is preferred.
Second invention relates to the film with 1～15 micron of the thickness of above-mentioned adhesive resin composition manufacturing.The 3rd the present invention relates to a kind of flexible printed circuit substrate, it is characterized in that being forming with above-mentioned film adhesion.
Embodiment
Below describe the present invention in detail.
Resin combination of the present invention, second-order transition temperature after the curing be 100 ℃ or more than, and the conservation rate of clinging power after 150 ℃ of heating in following 240 hours be 50% or more than, and the resin layer of forming by this resin combination and the stripping strength between Copper Foil be 0.8N/mm or more than.
Second-order transition temperature after the curing be 100 ℃ or more than, be preferably 120 ℃ or more than, and solidify the back the adhesion conservation rate after 150 ℃ of heating in following 240 hours be 50% or more than, be preferred from the viewpoint of reliability of solder heat resistance etc.
Resin combination of the present invention can not obtain sufficient flame retardant resistance effect even do not contain mineral filler yet, so the thickness of dried adhering agent layer can be reduced to 1～15 micron.
And, resin layer that the thickness that is made of adhesion composition of the present invention is 10 microns and the stripping strength between Copper Foil be 0.8N/mm or more than, more preferably 1.0N/mm or more than.
As the Resins, epoxy that can use in the present invention, so long as have an above-mentioned characteristic just do not have a special restriction, can use over the known resin that in a molecule, contains two or more epoxide groups.Specifically can enumerate Resins, epoxy and bromo-derivatives thereof such as the polyglycidyl ether of Racemic glycidol ether type epoxies such as bisphenol-type epoxy resin, phenol lacquer resins, xylylene type oxybenzene compound, arylamine type Resins, epoxy.The polyglycidyl ether and the bromo-derivative thereof of Racemic glycidol ether type epoxies such as wherein preferred bisphenol-type epoxy resin, phenol lacquer resins, xylylene type oxybenzene compound, more preferably Racemic glycidol ether type epoxy and bromo-derivative thereof such as bisphenol-type epoxy resin, phenol lacquer resins.These Resins, epoxy can use separately or two or more mixing is used.
Among the present invention, for guaranteeing to realize that the required bromine content of flame retardant resistance only uses brominated epoxy resin, be used in combination with non-brominated epoxy resin with Resins, epoxy that the bromo rate is high and compare, the toughness of cured article improves, high temperature adaptation down improves, it is lower also water-intake rate to be suppressed to, so be a kind of preferred version from viewpoint of reliability.
A kind of so brominated Resins, epoxy of preferred use wherein has the elastomeric total amount of carboxyl with respect to (1) Resins, epoxy and (2) among the present invention, and bromine content is 20 weight parts or above and 40 weight parts or following.More preferably 24～30 weight parts.Often can not obtain flame retardant resistance when being lower than 20 weight parts.And surpass under the situation of 40 weight parts, clinging power often reduces.
As the elastomerics that contains carboxyl, though generally can enumerate carboxylated ethylene acrylic rubber, carboxylated nitrile divinyl rubber, carboxylated acrylic rubber etc., preferred use does not contain the carboxylated ethylene acrylic rubber of unsaturated link(age) among the present invention.Its consumption is preferably 20～100 weight parts with respect to 100 weight part all resins, more preferably 25～70 weight parts.Be preferably 30～60 weight parts especially.When being lower than in 20 weight part, clinging power is low, often is difficult to embody flame retardant resistance under the situation of 100 weight parts and surpass.As the carboxylated ethylene acrylic rubber that does not contain unsaturated link(age) that uses among the present invention, ベ-マ Star Network GLS (E.I.Du Pont Company's product) preferably.
As compound, two or more hydroxyls are arranged, the resin with aralkyl (aralkyl resin) that the aralkyl compound reaction of phenols shown below and general formula (1) expression is obtained in the preferred molecule with phenolic hydroxyl group.Can enumerate phenol, ortho-cresol, meta-cresol, p-cresol, Resorcinol, Resorcinol, pyrocatechol, dihydroxyphenyl propane, xenol, naphthyl alcohol, 2-Naphthol etc. as phenols.More preferably phenol, naphthyl alcohol, 2-Naphthol.
X-H2C-A-CH2-X (1)
In the general formula (1), phenylene, alkyl substituted phenylene, diphenylene, phenylbenzene ether or naphthylidene etc. can be enumerated, halogen atom or hydroxyls such as chlorine, bromine can be enumerated as X as A.
Addition with phenolic hydroxyl group compound is preferably 5～50 weight parts with respect to 100 weight part Resins, epoxy, more preferably 7～30 weight parts, preferred especially 10～25 weight parts.Too much or the very few tackiness of thermofixation that all can make of addition reduces.And have the hydroxyl equivalent of phenolic hydroxyl group compound, be preferably 100～300 gram/equivalents, more preferably 140～250 gram/equivalents.Hydroxyl equivalent is excessive or too small, and tackiness is reduced.
As compound with imidazolyl, for example can enumerate the 2-undecyl imidazole, 20 heptadecyl imidazoles, 2-ethyl-4-methylimidazole, the 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1 benzyl 2 methyl imidazole, 1-benzyl-2-phenylimidazole, 1-cyano ethyl-glyoxal ethyline, 1-cyano ethyl-2-ethyl-4-methylimidazole, 1-cyano ethyl-2-undecyl imidazole, 1-cyano ethyl-2-phenylimidazole, 1-cyano ethyl-2-undecyl imidazole quinoline father-in-law trimellitate, 1-cyano ethyl-2-benzylimidazoline father-in-law trimellitate, 2,4-diamino-6-[2 '-Methylimidazole-(1 ')]-the suitable triazine of ethyl, 2,4-diamino-6-[2 '-undecyl imidazole-(1 ')]-the suitable triazine of ethyl, 2,4-diamino-6-[2 ' ethyl-4 '-Methylimidazole-(1 ')]-the suitable triazine of ethyl, 2,4-diamino-6-[2 '-Methylimidazole-(1 ')]-the suitable triazine cyamelide affixture of ethyl, 2-phenylimidazole cyamelide affixture, glyoxal ethyline cyamelide affixture, 2-phenyl-4,5-dihydroxyl Methylimidazole, 2-phenyl-4-methyl-5-dihydroxyl Methylimidazole etc.Preferably 2,4-diamino-6-[2 '-undecyl imidazole-(1 ')]-ethyl is along triazine.
Imidazole compound preferably uses 0.7～4 weight part with respect to 100 weight part Resins, epoxy, more preferably 1.5～3.0 weight parts.When being lower than 0.7 weight part and surpassing 4 weight parts, often low and bad because of clinging power.
And except neccessary composition, can also add the curing catalyst that reaction speed is used.As curing catalyst, can enumerate the amine complex, 1 of acid anhydrides, boron trifluoride, 8-diazabicyclo (5,4,0) undecylene-7 etc.And except mentioned component, also can add the curing catalyst that reaction speed is used.Can enumerate the amine complex, 1 of imidazole compound, acid anhydrides, boron trifluoride, 8-diazabicyclo (5,4,0) undecylene-7 etc. as curing catalyst.
Resin combination of the present invention is dissolved in usually afterwards to be coated on the tackiness agent form in the solvent and is coated with on the body.As operable solvent, can enumerate methyl ethyl ketone, methyl iso-butyl ketone (MIBK), dioxane, ethanol, methyl Cellosolve, ethyl Cellosolve, propylene glycol monomethyl ether, dihydroxypropane single-ether, N-Methyl pyrrolidone, N, dinethylformamide, toluene, dimethylbenzene etc. use separately or use with the arbitrary proportion mixing according to purposes.In these solvents, from deliquescent viewpoint, preferable methyl ethyl ketone, propylene glycol monomethyl ether, N, dinethylformamide, toluene, dimethylbenzene.
Tackiness agent resin combination of the present invention uses with a liquid form though be dissolved in usually in the solvent, preferably the solution of host and solidifying agent etc. is separately made solution, before using two solution is mixed.Quantity of solvent determines optimum quantity by coating machine, adjusts to preferably that dry to make non-volatile content be in 15～60 weight % scopes.Above-mentioned tackiness agent resin combination is coated on the bodies to be coated such as polyimide film, polyester film, through after the B stageization, utilizes that hot pressing or hot rolling are stacked is pressing method on tinsels such as Copper Foil with it, obtains having the tellite of good characteristic.
The thickness of the adhering agent layer of forming by resin combination of the present invention, preferred 0.5～25 micron, more preferably 1～15 micron.The tackiness agent of forming by resin combination of the present invention, even the good thickness setting with adhering agent layer of adhesion strength under 10 microns the situation and the stripping strength between Copper Foil also be 0.8N/mm or more than, even under 150 ℃ through 240 hours the heating after, the conservation rate of stripping strength also be 50% or more than.
Preferably pressing temperature 50～200 ℃, to press pressure be to press in 0.1～10MPa scope, in order to obtain better adhesion strength, more preferably pressing temperature 80～200 ℃, to press pressure be to carry out in 0.5～8MPa scope.And preferred 100～190 ℃ of solidification value, more preferably 130～180 ℃.The substrate that the quilt that the usefulness of making like this resin combination of the present invention is formed is adhered can be used as tellite, particularly flexible printed circuit substrate.
Embodiment
Though following the present invention further specifies with embodiment and reference examples, content of the present invention is not limited to following example.
(evaluation method)
Utilize multiple spreader to go up the coating adhesive resin composition at polyimide film (カ プ ト Application H, 25 microns of thickness), making dry back coating thickness is 10 microns, and 140 ℃ made its B stageization down in dry 2 minutes.For observing condition of surface, its coating result makes its dried thickness reach 15,12,9,7,5 and 3 microns respectively.It is 25 microns two sided coatings that the flame retardant test sheet is equally also reached drying coated thickness.At line pressure is under 0.5 kg/cm, 100 ℃ and 0.6 meter/minute condition, to the uneven surface of this B stage product and rolled copper foil (18 microns of thickness) bonding after, hot-press solidifying under 160 ℃, 5.88MPa and 60 minutes conditions.The flame retardant test sheet directly be not suspended in it in stove under the adherent situation, solidifies 60 minutes down at 160 ℃.Utilize following method that the above test film of making is estimated.
Tackiness:, measure 90 ° of stripping strengths (copper-stripping) according to JIS C 6481.
Adhesion conservation rate: will, measure equally after 240 hours 150 ℃ of following thermal treatments with the same test film of tackiness evaluation with the tackiness evaluation.With representing with the ratio of handling preceding clinging power.
Tg: B stage product are overlapping, under above-mentioned equal condition of cure, solidify, make the test film of 3 mm thick.Utilize the dynamic viscoelastic testing apparatus to measure the Tg of this test film (heat-up rate: 5 ℃/minute).
Solder heat resistance: will be cut into the test film of 3 centimetres of 3 cm x, dipping after 10 seconds in 340 ℃ of scolders are bathed, the peeling off of visual observation adhering agent layer, swelling state.
Flame retardant resistance: according to UL standard 94 (V-0 is evaluated as zero).
Condition of surface is observed: visual observation polyimide film one side has or not expansion, aggregate.
The raw material that embodiment, reference examples are used
＜contain the elastomerics of carboxyl 〉
Carboxylated nitrile rubber: Japanese ゼ オ Application is made, ニ Port-Le 1072B
Carboxylated ethylene-propylene rubber(EPR): Mitsui デ ユ Port Application Port リ ケ ミ カ Le is made, ベ-マ Star Network GLS (registered trademark)
＜Resins, epoxy 〉
Bromo bisphenol-type epoxy resin (bromine content 48 weight %): Sumitomo Chemical is made ESB-400T
Bromo bisphenol-type epoxy resin (bromine content 21 weight %): the japan epoxy resin manufacturing,
エピコ-ト5046B80
Bromo bisphenol-type epoxy resin (bromine content 35 weight %): Japanese chemical drug manufacturing, BREN-S
Bisphenol-type epoxy resin (bromine content 0 weight %): the japan epoxy resin manufacturing,
エピコ-ト1001
＜have a compound of phenolic hydroxyl group 〉
Phenol is to penylene diformazan ethylene glycol dimethyl ether polycondensate (hydroxyl equivalent 175 gram/equivalents): Mitsui Chemicals manufacturing, ミ レ Star Network ス XLC-LL (registered trademark)
Phenol lacquer resins (hydroxyl equivalent 105 gram/equivalents): group Rong Huaxue makes PSM-4326
＜curing (promotion) agent 〉
Imidazole compound: four countries change into manufacturing, C11ZA
Imidazole compound: four countries change into manufacturing, キ ユ ァ ゾ-Le 2E4MZ
Dicyano diamide: japan epoxy resin manufacturing, エ ピ キ エ ァ DYCY15
Arylamine: イ Ha ラ chemistry is made キ ユ ァ Ha-De MED
＜mineral filler 〉
Talcum: the powder process of shallow field is made, FFR
Superfine silicon dioxide (aerosil): Japanese ァ エ ロ ジ Le is made, R972
＜fire retardant 〉
ANTIMONY TRIOXIDE SB 203 99.8 PCT: Japanese concentrate manufacturing, PATOX-S
Phosphoric ester amides: four countries change into manufacturing, SP-703
(embodiment 1)
The preparation of adhesive resin composition: 40 gram ベ-マ Star Network GLS, 55 gram ESB-400T, 45 gram エ ピ コ-ト 5046B80,15 gram ミ レ Star Network ス XLC-LL, 2 gram C11ZA and 366 gram methyl ethyl ketone/propylene glycol monomethyl ether=2/1 (count non-volatile part 30%) are added in the detachable flask of 1000 milliliters of glass together, and vigorous stirring is 1 hour under the room temperature.Stir and stop the back, make adhesive resin composition with the filtration of 325 order metal cloth filters.Resulting adhesive resin composition is estimated with aforesaid method, and evaluation result is shown among the table 2.
(embodiment 2～5 and reference examples 1～5)
Adopt method similarly to Example 1 to prepare the adhesive resin composition of forming shown in the table 1, and estimate with method similarly to Example 1.Evaluation result collects among the table 2.
Table 1
Table 2
The effect of invention
Even the adhering agent layer thin layer by composition of the present invention consists of does not have the flame retardant particle projection yet Or the danger between transcendental line. Therefore, can realize the adhering agent layer thin layer, can be used as the glass transformation temperature height, Heat-resistant aging is good, and equal good, the flexible printed circuit substrate particularly of anti-flammability and adherence Use with sticker.
Claims (5)
1. flexible printed circuit substrate resin combination, it is characterized in that, second-order transition temperature after the curing be 100 ℃ or more than, and the resin layer of 10 microns of thickness of forming by this resin combination and the stripping strength between Copper Foil be 0.8N/mm or more than, the stripping strength conservation rate after 150 ℃ of heating in following 240 hours be 50% or more than.
2. according to the described flexible printed circuit substrate resin combination of claim 1, it is characterized in that described resin combination contains elastomerics 10～100 weight parts that (A) brominated epoxy resin 100 weight parts, (B) have carboxyl, compound 5～50 weight parts that (C) has phenolic hydroxyl group and (D) has compound 0.7～4 weight part of imidazolyl.
3. according to the described flexible printed circuit substrate resin combination of claim 2, it is characterized in that, the elastomerics that (B) in the described resin combination has carboxyl is the ethylene acrylic rubber that does not contain unsaturated link(age), and the compound that (C) has phenolic hydroxyl group is the resin with aralkyl.
4. the film of 1～15 micron of the thickness made from any one described resin combination in the claim 1～3.
5. flexible printed circuit substrate is characterized in that, forms with the described film adhesion of claim 4.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004147176 | 2004-05-18 | ||
| JP2004147176 | 2004-05-18 | ||
| JP2004327555 | 2004-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1865344A true CN1865344A (en) | 2006-11-22 |
| CN100564447C CN100564447C (en) | 2009-12-02 |
Family
ID=41412464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100680877A Expired - Fee Related CN100564447C (en) | 2004-05-18 | 2005-05-16 | Adhesive resin composition and uses thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100564447C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105579542A (en) * | 2013-09-20 | 2016-05-11 | 东亚合成株式会社 | Flame-retardant adhesive composition, coverlay film using same, and flexible copper-clad laminate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4578425A (en) * | 1985-02-13 | 1986-03-25 | Schenectady Chemicals, Inc. | Phenolic resins, carboxylic resins and the elastomers containing adhesive |
-
2005
- 2005-05-16 CN CNB2005100680877A patent/CN100564447C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105579542A (en) * | 2013-09-20 | 2016-05-11 | 东亚合成株式会社 | Flame-retardant adhesive composition, coverlay film using same, and flexible copper-clad laminate |
| CN105579542B (en) * | 2013-09-20 | 2018-05-18 | 东亚合成株式会社 | Flame-retardant adhesive composition and use its cover film and flexibility coat copper plate |
| TWI640588B (en) * | 2013-09-20 | 2018-11-11 | 東亞合成股份有限公司 | Flame-retardant adhesive, cover film and flexible copper-clad laminate using the same |
| US10472496B2 (en) | 2013-09-20 | 2019-11-12 | Toagosei Co., Ltd. | Flame-retardant adhesive composition, coverlay film using same, and flexible copper-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100564447C (en) | 2009-12-02 |
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