CN1862789B - 包括多层薄膜的薄膜晶体管阵列面板以及制造该面板的方法 - Google Patents
包括多层薄膜的薄膜晶体管阵列面板以及制造该面板的方法 Download PDFInfo
- Publication number
- CN1862789B CN1862789B CN2005100488586A CN200510048858A CN1862789B CN 1862789 B CN1862789 B CN 1862789B CN 2005100488586 A CN2005100488586 A CN 2005100488586A CN 200510048858 A CN200510048858 A CN 200510048858A CN 1862789 B CN1862789 B CN 1862789B
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- electrode
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- amorphous silicon
- film
- contact
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- 239000010409 thin film Substances 0.000 title claims abstract description 32
- 239000010408 film Substances 0.000 title claims description 149
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 104
- 239000004065 semiconductor Substances 0.000 claims abstract description 88
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000010410 layer Substances 0.000 claims description 220
- 238000002161 passivation Methods 0.000 claims description 55
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 39
- 229920005591 polysilicon Polymers 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 37
- 239000011229 interlayer Substances 0.000 claims description 36
- 239000012535 impurity Substances 0.000 claims description 31
- 239000012212 insulator Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 29
- 238000005516 engineering process Methods 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 19
- 239000004411 aluminium Substances 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000011368 organic material Substances 0.000 claims description 12
- 239000002356 single layer Substances 0.000 claims description 12
- 239000000428 dust Substances 0.000 claims description 5
- 238000007669 thermal treatment Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 56
- 238000003860 storage Methods 0.000 description 39
- 230000004888 barrier function Effects 0.000 description 20
- 239000003990 capacitor Substances 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 229910000838 Al alloy Inorganic materials 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 229910001182 Mo alloy Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000003550 marker Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000013528 metallic particle Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- -1 Al-Nd alloy.Here Chemical compound 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910000583 Nd alloy Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000009245 menopause Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0040059 | 2005-05-13 | ||
KR1020050040117A KR101209052B1 (ko) | 2005-05-13 | 2005-05-13 | 박막 트랜지스터 및 박막 트랜지스터 표시판의 제조 방법 |
KR1020050040059 | 2005-05-13 | ||
KR10-2005-0040117 | 2005-05-13 | ||
KR1020050040117 | 2005-05-13 | ||
KR1020050040059A KR20060117635A (ko) | 2005-05-13 | 2005-05-13 | 다층 박막, 이를 포함하는 박막 트랜지스터 및 박막트랜지스터 표시판의 제조 방법 |
KR10-2005-0043485 | 2005-05-24 | ||
KR1020050043485A KR101152121B1 (ko) | 2005-05-24 | 2005-05-24 | 표시 장치와 박막 트랜지스터 표시판 및 그 제조 방법 |
KR1020050043485 | 2005-05-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1862789A CN1862789A (zh) | 2006-11-15 |
CN1862789B true CN1862789B (zh) | 2010-06-16 |
Family
ID=37390169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005100488586A Expired - Fee Related CN1862789B (zh) | 2005-05-13 | 2005-12-31 | 包括多层薄膜的薄膜晶体管阵列面板以及制造该面板的方法 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20060117635A (zh) |
CN (1) | CN1862789B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101996928B (zh) * | 2009-08-14 | 2012-10-31 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的形成方法 |
KR102031682B1 (ko) | 2012-12-31 | 2019-10-14 | 엘지디스플레이 주식회사 | 각 화소에 보상용 박막 트랜지스터를 구비한 초고 해상도 액정 표시장치 |
KR101844284B1 (ko) | 2013-10-07 | 2018-04-02 | 엘지디스플레이 주식회사 | 표시장치 및 그의 제조방법 |
CN105720106B (zh) * | 2014-12-05 | 2019-04-26 | 昆山国显光电有限公司 | 晶体管及其制备方法、有机电致发光装置及其制备方法 |
CN107132683A (zh) * | 2017-06-20 | 2017-09-05 | 合肥市惠科精密模具有限公司 | 一种可避免环境光照影响的除湿型tft‑lcd显示屏 |
-
2005
- 2005-05-13 KR KR1020050040059A patent/KR20060117635A/ko not_active Application Discontinuation
- 2005-12-31 CN CN2005100488586A patent/CN1862789B/zh not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
JP特开平11-163289A 1999.06.18 |
Also Published As
Publication number | Publication date |
---|---|
KR20060117635A (ko) | 2006-11-17 |
CN1862789A (zh) | 2006-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD. Effective date: 20121130 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121130 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Electronics Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20201231 |
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CF01 | Termination of patent right due to non-payment of annual fee |