CN1855485A - Semiconductor circuit on integrated wafer and its adjustable method and system - Google Patents
Semiconductor circuit on integrated wafer and its adjustable method and system Download PDFInfo
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Abstract
The invention provides a kind of semiconductor circuit of chip unit with integration single crystal and its adjustable method and system, involving a semiconductor circuit, related circuit design and one adjustment system. The semiconductor's circuit includes: at least one standard module, at least one module which can be reorganized and at least one link layer. Its standard module has the function verified. In accordance with reservation design, recombined modules can be programmed, and the standard and module which can be reorganized can link mutually. The modules which can be reorganized have at least a storage module and an output and input module. The invention can reduce the steps needed to complete the whole SOC, also reduce the manufacturing process steps needed to complete the prototype circuit. After passing to verify the design of prototype circuit, the formal product chip needs to clean only need not of module, if the position of each module needed and corresponding link are relocated, it can reduce base area.
Description
Technical field
The invention relates to semiconductor element, particularly about many special projects wafer (multi-project wafer of can recombinate (reconfigurable), MPW) semi-conductive utilization, shorten launch time, reduce development cost and reduce current conformability single-chip (system-on-chip, SOC) design on potential risk.
Background technology
Along with semiconductor technology evolves to epoch of deep-sub-micrometer (deep sub-micron) size, and becoming increasingly complex of becoming of conformability single-chip design, processing flow, research and development time, R﹠D costs and the technical risk of developing these circuit are all grown up rapidly.The circuit of a complexity may need Digital Signal Processing (digital signalproce ssing), second, and too module (highspeed input/output module), analog-digital converter (analog-to-digital converter are gone in network (Ethernet), memory, high speed output, ADC), digital analog converter (digital-to-analogconverter, DAC) or other special circuit.In traditional circuit chip design, before being incorporated into entire circuit, the usefulness of each individual modules all must design earlier and verify.Then, the operation usefulness of entire circuit just can be verified.Circuit designers has spent considerable time and money, is used for these elements of prototype (prototype) and makes them be enough to insert product.Yet, because cross interference (cross-talk), electromigration (electro-migration), wiring delay (wire delay) or the like reason, the function performance of deep-sub-micrometer element may be seriously influenced, and therefore, has often caused extra risk for the research and development plan.The experimental period that such flow process has caused light shield consuming time and wafer to come and go has caused the delay of time to market (TTM), the surge of R﹠D costs, the complexity of process step and the increase of technical risk.
Therefore, need be a kind of additional criteria design that is applicable to multiple product now, and, can leave the action of customized (customization) for last several roads product fabrication steps, save down money and time.In the field of conformability single-chip circuit design, also need an efficient method to research and develop prototype and product circuit, see through the recombinated module that use cost is shared, reduce the time of research and development of products to listing.
Summary of the invention
The invention provides the semiconductor circuit on the wafer of special project more than.This semiconductor circuit includes at least one standard module, at least one module and at least one articulamentum of recombinating.This standard module has the function of verifying.Can be according to a predetermined design, this module of can recombinating can be by sequencing, and this standard module and this module of can recombinating can interconnect.This standard module includes at least one storage module and module is gone in an output.
The invention provides a kind of a kind of semiconductor circuit on the wafer of special project more than, this semiconductor circuit includes: at least one standard module has the function of verifying; At least one module of recombinating; And at least one articulamentum, can be according to a predetermined design, come this module and connect this standard module and this module of can recombinating of can recombinating of sequencing; Wherein, this standard module includes at least one storage module and module is gone in an output.
A kind of semiconductor circuit on the wafer of special project more than of the present invention, this semiconductor circuit has a plurality of standard modules, and these standard modules are designed by different vendor.
A kind of semiconductor circuit on the wafer of special project more than of the present invention, this semiconductor circuit has a plurality of standard modules, and these standard modules are to determine arbitrarily according to user's demand.
A kind of semiconductor circuit on the wafer of special project more than of the present invention, this articulamentum is in a manufacturing process, by the step manufacturing that includes last one metal procedure.
The present invention provides a kind of method in order at least one semiconductor circuit of design on the wafer of special project more than again.This method includes the following step: at least one standard module is provided, has the function of verifying; In at least one articulamentum, produce at least one connection, with at least one module of recombinating of sequencing; And, according to predetermining circuit design, connect this by the recombinated module of sequencing and this standard module.This standard module comprises at least one storage module and module is gone in an output.Before sequencing, this standard module and this module of can recombinating has at least one metal level that completes, and this sequencing and connection are at least one articulamentums that is implemented in after this metal level.
Method in order at least one semiconductor circuit of design on the wafer of special project more than of the present invention, this method provides a plurality of standard modules, and these standard modules are designed by different vendor.
Method in order at least one semiconductor circuit of design on the wafer of special project more than of the present invention, this method provides a plurality of standard modules, and these standard modules are to determine arbitrarily according to user's demand.
Method in order at least one semiconductor circuit of design on the wafer of special project more than of the present invention, this method provides a plurality of articulamentums, and these articulamentums include a plurality of metal wires and a plurality of articulamentum (interlayer) connects.
Method in order at least one semiconductor circuit of design on the wafer of special project more than of the present invention, more include another step: the circuit according on this many special projects wafer removes unwanted standard module on a product wafer.
The present invention also is provided at the adaptive system (adaptive system) on conformability single-chip (SOC) unit.This adaptive system includes at least one standard module and at least one module of recombinating.This standard module has the function of verifying, and is designed by at least one manufacturer.This module of can recombinating has at least one function, and this function can start through produce at least one connection at least one articulamentum.This connection is to produce and be positioned at last at least one articulamentum of this wafer cell according to a predetermined circuit design, and connects this standard module and this module of can recombinating.
A kind of adjustability system on an integrated wafer of the present invention, this adaptive system has a plurality of standard modules, and these standard modules are to determine arbitrarily according to user's demand.
A kind of adjustability system on an integrated wafer of the present invention, before this function activated, this module of can recombinating had at least one metal level.
A kind of adjustability system on an integrated wafer of the present invention, module has a scene recomposition unit (field reconfigurableunit) but this can be recombinated.
A kind of adjustability system on an integrated wafer of the present invention, this module of can recombinating has a logical block (logic unit).
A kind of adjustability system on an integrated wafer of the present invention, this module of can recombinating has a memory cell (memory unit).
A kind of adjustability system on an integrated wafer of the present invention, module has a mask recomposition unit (mask reconfigurableunit) but this can be recombinated.
A kind of adjustability system on an integrated wafer of the present invention, this module of can recombinating has at least one output/input unit.
Of the present invention in an a kind of adjustability system of integrate giving birth on the wafer, this module of can recombinating has at least one usefulness module (performancereconfigurable module) of can recombinating.
A kind of adjustability system on an integrated wafer of the present invention, this module of can recombinating has at least one clock pulse speed (clock rate) module of can recombinating.
Semiconductor circuit on the integrated wafer of the present invention and adjustable method thereof and system can reduce and finish the needed step of whole SOC, have also reduced simultaneously and will finish the needed fabrication steps of prototype circuit.After the design of checking prototype circuit, formal product wafer only needs to remove no module, rearranges each position that needs module and corresponding connection, just can reduce area of base.
Description of drawings
Fig. 1 is a standard adaptability SOC on a reconstitutable MPW before customized;
Fig. 2 is according to one embodiment of the invention, is the layout of the client SOC after customized;
Fig. 3 shows the layout of a SOC product wafer according to one embodiment of the invention;
Fig. 4 shows the production flow process 400 according to one embodiment of the invention, for using the production flow process of adaptability SOC.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
This specification provides a kind of method, and (multi-project wafer, MPW) semiconductor are researched and developed customer service circuit design (customcircuit design) to use reconstitutable many special projects wafer.Perhaps, a special MPW has several crystal grain (die), and each crystal grain may have different circuit design.Each crystal grain can be considered as the SOC of an adaptability, has cost and shares unit or reorganization module.When the reorganization module is in the end several manufacturing layer, just by customized and have a function of needs.When these functions can be worked as the client demand is arranged, just customized and realize.Before reorganization layer was made, this cost is shared the unit can have the metal level that one deck has at least completed.The action of reorganization can be in the end several be realized in the manufacturing layer, or, if possible, only in last one is made layer, realized.
The different designs module that provided by different vendor or intelligence wealth also can be provided the SOC of adaptability, and (intellectual property IP), is made to the last several manufacturings layers then.The product of the SOC of these adaptabilities of can recombinating can utilize the module of can recombinating, several built-in memory cell for example, or reconstitutable logical block.Reconstitutable logical block can see through the sequencing action that some last several articulamentums provided, and realizes any boolean (Boolean) function.SOC also can recombinate according to the scene, light shield is recombinated or the usefulness recombination function is sorted out.But the recombinated module with scene recombination function also can be recombinated to apply the electric current and voltage mode after whole SOC completes.The scene element of can recombinating can be one-time programmable (one-timeprogrammable, OPT) or repeatedly programmable (multiple-timeprogrammable, MTP) on-the-spot programmable gate array (field programmablegate array, FPGA), complicated programmable logic element (complexprogrammable logic device, CPLD), flash memory (Flash RAM) or nonvolatile memory (non-volatile RAM) element.Recombinated module with light shield recombination function only can in the mode that light shield or electron beam write, come sequencing in addition in manufactory.The mask read-only memory is one of them example.Recombinated module with usefulness recombination function relatively focuses on the effect, and on the not function.These adjustable effects or usefulness can be speed (speed), circuit clock pulse (circuit rate), frequency range (bandwidth), position cut width (bit slice width), simulation usefulness or accuracy.In brief, the module of can recombinating can be various element, for example, and Application Specific Integrated Circuit (ASIC), memory, output/input circuit, simulation intelligence wealth, wireless, mixed mode intelligence wealth, MEM, PLA or PLD element.
Though in this this invention is to utilize the built-in storage module and a kind of research and development of the logic module of can recombinating visitor system circuit design method is represented, but the present invention is limited in an illustrated embodiment, because under the condition that does not break away from spirit of the present invention, many adjustment or structural variation can be implemented according to this, and these adjustment or structural variation all may still fall within the impartial category of claim.
Fig. 1 is a standard adaptability SOC 100 on a reconstitutable MPW before customized.The general standard module build in being can recombinate or the substrate (substrate) of adaptability SOC 100 in, keep for customized circuit to use.But adaptability SOC 100 includes a reconfigurable memory module 104, can recombinate logic module 106, several data/address buss (data bus) zone 108 and some other standard functionality modules of verifying (for example mixed signal (Mixed Signal), phase-locked loop (phase Lock loop, PLL), ADC, DAC or the like).In this example, these standard functionality modules are provided to H by vendor A, when meeting customized circuit, and the needed function of various kinds.Before customized or reorganization, adaptability SOC 100 has at least one articulamentum that has completed.Standard module all or part will be used for meeting the demand of final circuit.These standard modules were all tested, so for the function of these modules, also do not need extra debug action.Any standard module of not using still can be treated on circuit substrate, just is not connected to this prototype (prototype unit).The signal that the output of the standard module that these are not used is gone into may pin at VDD or GND is to avoid useless leakage current.The standard module that these are not used, on the product wafer in, can be removed, reduce the area of base of product wafer.In addition, on a MPW, can have at many different SOC of different product design or the wafer that independently separates individually, because in essence, this wafer is the wafer of a test usefulness, and the shared together wafer of different SOC or wafer can be saved cost.And charge method can look which standard module the user has chosen and on a fixed cost, extra increasing paid, so the mode that is not to use the person to pay basically.
Built-in memory module 104 and reorganization logic module 106 can be by customized to meet on client's function and the demand on the intraconnections.Coiling between the standard module (routing) also can be finished simultaneously in addition.For example, (realign) also can be reorientated in data/address bus coiling zone 108, with the transmission of guaranteeing that data are whether correct.So except last several metal level fabrication steps or last several articulamentum, this use verified that the manufacturing process of the adaptability SOC of module roughly finished.These last several interior articulamentums allow this standard adaptability SOC by sequencing or customized, all needed standard modules near the circuit also can connecting.Therefore, can be contemplated that the design and the turnaround time (turnaround time) of checking will be very short.The benefit of implementing customized design like this like this is, holds inhibition and generation and can be in the end several just be implemented during metal level, therefore, can dwindle the processing procedure time that other need finish whole SOC.That is to say that the module of the overwhelming majority before customized, all made or produced some in advance and made layer.In case customized needed action one decision, wafer just can directly then begin next step processing procedure after those make layer, thereby shortens production time and cost.
Fig. 2 is according to one embodiment of the invention, is the layout of the client SOC200 after customized.Client SOC 200 is final circuit requirements that design meets a special product.In other words, many standard feature modules on adaptability SOC 100, though it is all deleted on figure, but in fact its circuit is still to exist on the wafer, and other functional module group, comprised built-in storage module 104 and some logic modules 106 of can recombinating, all for a particular electrical circuit client's product, and by customized.
Comparison diagram 1 just can be found with the layout of Fig. 2, very clearly, because modules such as IP# 1, mixed signal 1 and the I/O that can recombinate have not all suffered at Fig. 2, so in Fig. 2, those zones are just represented with spot 202, mean the wafer substrates of not using.In other words, client SOC 200 does not need the function of those modules.Yet this is not to mean that those modules disappear on the wafer, in fact at this point, those modules still can appear in the prototype layout, (for example, mixed signal 1 will appear in the spot 204), they just do not connect away, or say, not running.Note that the module that those are not used, just pass through at last customized after, in fact the relative position in Fig. 2 does not change.Metal connects and connection wire is just making of last several articulamentums (for example, last two metal layers) at the standard processing procedure, and therefore, the logic of can recombinating module can be suitable by sequencing, and what the standard module also can be suitable is joined together.
In the stage up till now, all have the module of connection just can come tested and checking at functional.Because, customized is that layer is made in the end several roads, so, compared to traditional semiconductor design methods and flow process, this client S0C 200 can be very fast manufactured come out be that standard module and other customized modules are just made when being in the end a few road manufacturing layer because the basal part office of standard do not change, uses.For example, utilize this adaptability SOC flow process, the production cycle of a SOC (cycletime) may be able to significantly shorten to 7 to 10 days from 60 days.Considering from the cost, for traditional 90 nanometers (nm) SOC design, because the quantity of customized light shield reduces, perhaps the cost of SOC can significantly taper to 7,000 5 hundred U.S. dollars that reconstitutable MPW is required from 70,000 5 thousand U.S. dollars that MPW is required.In other words, the client only needs to bear the expense of last several roads light shield, and other most main light shield expenses are all because a large amount of wafers of throwing sheets, and shares with other clients or spread out and carry.
Fig. 3 shows the layout of a SOC product wafer 300 according to one embodiment of the invention.In SOC product wafer 300, although equally be to have those standard modules that were verified (just built-in storage module 104, ADC, DAC or the like), whole layout is arrangement again, so that the circuit substrate zone 302 of not using can reduce to minimum.Thereby the same circuit design just can be embodied on the smaller crystal grain, increases wafer yield (wafer yield).This product wafer has met the demand on the customer service circuit function, but, see through customized for logic, memory and connection wire road of the use of the standard module of verifying and in the end several roads processing procedure, can significantly reduce time and cost that the traditional circuit designing institute needs.
This SOC has a memory module (static RAM (Static Random Access Memory for example at least, SRAM) module) and an output go into module, all see through metal and connect, be connected to the module of to recombinate, and formed in proper order or combinational logic circuit.This SOC has also been contained the multiple design for different clients, and the functional aspect of entire wafer is to see through the metal ways of connecting, produces needed function.
Fig. 4 shows the production flow process 400 according to one embodiment of the invention, for using the production flow process of adaptability SOC.Production flow process 400 is from step 402, selects the standard MPW that can recombinate for use, prepares to be used for a specific SOC design.This standard MPW that can recombinate has one or a plurality of adaptability SOC, for example SOC100.Adaptability SOC can be transformed into different elements according to the difference of specific some articulamentum coiling.That is to say that the function on some SOC can see through the difference that articulamentum winds the line, and activated.Production flow process 400 is execution in step 404 then, chooses the standard module that all meet final SOC designing institute needs.Carry out step 406 then, get rid of or remove the standard module that those do not meet final SOC designing institute needs.Just, those standard modules that do not meet final SOC designing institute needs can be connected away.Then carry out step 408, wherein, see through the connecting line be defined in last several metal levels, come the sequencing module of can recombinating, to finish final SOC design.For example, come the customized module of recombinating with last one deck articulamentum at least.Before last production stage was not also done, this MPW can reduce needed area of base in step 410 by reorientation and packing.At last, in step 412, this SOC on MPW just can carry out last several roads production stage.
Generally speaking, when that SOC will be used for designing a semiconductor circuit, can be found out or be chosen by at least one standard module that or a plurality of manufacturer verified.At least the reconstitutable logic module of on the SOC will be seen through one or more articulamentum by sequencing, produce one or a plurality of connection.The standard module sees through a design of being scheduled to each other with reconstitutable logic module and is connected.Then, entire circuit just is verified.Need be appreciated that the standard module has comprised at least one memory module and module is gone in an output, and to the sequencing of reconstitutable logic module and the connection between the module, is to see through in the semiconductor manufacture flow path, last several roads connect processing procedure to be finished.It can be to produce the metal connecting line or the processing procedure of interlayer attachment that so-called last several roads connect processing procedure.
For this SOC, except last several roads are used for the articulamentum of customized memory and logical design, the wafer substrates that production standard was verified all is to finish in advance.And through standard module of verifying and extra client's logic, memory and connection wire, the wafer substrates that a such standard was verified uses for many client's designing institutes.The functional requirement of a circuit design like this can determine in the last prototype which standard module will be selected and connect.As for will be not at other modules that substrate had in the end not using in the original design, but still can be parked on the wafer.It is to implement in the end several roads articulamentum that the reorganization of client's logic and client's module connect, and therefore can reduce and finish the needed step of whole SOC, has also reduced simultaneously and will finish the needed fabrication steps of prototype circuit.After the design of checking prototype circuit, formal product wafer only needs to remove no module, rearranges each position that needs module and corresponding connection, just can reduce area of base.
Though the present invention by the preferred embodiment explanation as above, this preferred embodiment is not in order to limit the present invention.Those skilled in the art without departing from the spirit and scope of the present invention, should have the ability this preferred embodiment is made various changes and replenished, so protection scope of the present invention is as the criterion with the scope of claims.
Being simply described as follows of symbol in the accompanying drawing:
Standard adaptability S0C:100
But reconfigurable memory module: 104
The logic of can recombinating module: 106
Data/address bus zone: 108
Client SOC:200
Spot: 202,204
SOC product wafer: 300
Circuit substrate zone: 302
Claims (19)
1. a kind of semiconductor circuit on the wafer of special project more than is characterized in that, this semiconductor circuit includes:
At least one standard module has the function of verifying;
At least one module of recombinating; And
At least one articulamentum can be according to a predetermined design, comes this module and connect this standard module and this module of can recombinating of can recombinating of sequencing;
Wherein, this standard module includes at least one storage module and module is gone in an output.
2. a kind of semiconductor circuit on the wafer of special project more than according to claim 1 is characterized in that this semiconductor circuit has a plurality of standard modules, and described standard module is designed by different vendor.
3. a kind of semiconductor circuit on the wafer of special project more than according to claim 1 is characterized in that this semiconductor circuit has a plurality of standard modules, and described standard module is to determine arbitrarily according to user's demand.
4. a kind of semiconductor circuit on the wafer of special project more than according to claim 1 is characterized in that this articulamentum is in a manufacturing process, by the step manufacturing that includes last one metal procedure.
One kind in order on the wafer of special project more than a design at least one semiconductor circuit method, it is characterized in that this method includes:
At least one standard module is provided, has the function of verifying;
In at least one articulamentum, produce at least one connection, with at least one module of recombinating of sequencing; And
According to predetermining circuit design, connect this by the recombinated module of sequencing and this standard module;
Wherein, this standard module comprises at least one storage module and module is gone in an output; And
Wherein, before sequencing, this standard module and this module of can recombinating has at least one metal level that completes, and this sequencing and connection are at least one articulamentums that is implemented in after this metal level.
6. the method in order at least one semiconductor circuit of design on the wafer of special project more than according to claim 5 is characterized in that this method provides a plurality of standard modules, and described standard module is designed by different vendor.
7. the method in order at least one semiconductor circuit of design on the wafer of special project more than according to claim 5 is characterized in that this method provides a plurality of standard modules, and described standard module is to determine arbitrarily according to user's demand.
8. the method in order at least one semiconductor circuit of design on the wafer of special project more than according to claim 5 is characterized in that this method provides a plurality of articulamentums, and described articulamentum includes a plurality of metal wires and a plurality of articulamentum connects.
9. the method in order at least one semiconductor circuit of design on the wafer of special project more than according to claim 5 is characterized in that, more includes another step:
Circuit according on this many special projects wafer removes unwanted standard module on a product wafer.
10. a kind of adjustability system on an integrated wafer is characterized in that this adjustability system includes:
At least one standard module has the function of verifying, and is designed by at least one manufacturer; And
At least one module of recombinating has at least one function, and this function can activate through produce at least one connection at least one articulamentum;
Wherein, this connection is to produce and be positioned at last at least one articulamentum of this wafer cell according to a predetermined circuit design, and connects this can recombinate module and this standard module.
11. a kind of adjustability system on an integrated wafer according to claim 10 is characterized in that this adaptive system has a plurality of standard modules, described standard module is to determine arbitrarily according to user's demand.
12. a kind of adjustability system on an integrated wafer according to claim 10 is characterized in that before this function activated, this module of can recombinating had at least one metal level.
13. a kind of adjustability system on an integrated wafer according to claim 10 is characterized in that module has a scene recomposition unit but this can be recombinated.
14. a kind of adjustability system on an integrated wafer according to claim 10 is characterized in that this module of can recombinating has a logical block.
15. a kind of adjustability system on an integrated wafer according to claim 10 is characterized in that this module of can recombinating has a memory cell.
16. a kind of adjustability system on an integrated wafer according to claim 10 is characterized in that module has a mask recomposition unit but this can be recombinated.
17. a kind of adjustability system on an integrated wafer according to claim 16 is characterized in that this module of can recombinating has at least one output/input unit.
18. a kind of adjustability system on an integrated wafer according to claim 16 is characterized in that, this module of can recombinating has at least one usefulness module of can recombinating.
19. a kind of adjustability system on an integrated wafer according to claim 18 is characterized in that, this module of can recombinating has at least one clock pulse speed module of can recombinating.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/119,086 | 2005-04-29 | ||
| US11/119,086 US7401302B2 (en) | 2004-04-29 | 2005-04-29 | System on chip development with reconfigurable multi-project wafer technology |
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| CN1855485A true CN1855485A (en) | 2006-11-01 |
| CN100508190C CN100508190C (en) | 2009-07-01 |
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| CN200810145354XA Expired - Fee Related CN101359908B (en) | 2005-04-29 | 2006-04-28 | Logic member based on programmable passing gate |
| CNB200610077245XA Expired - Fee Related CN100538881C (en) | 2005-04-29 | 2006-04-28 | The configurable logic storage block |
| CNB200610078986XA Active CN100508190C (en) | 2005-04-29 | 2006-04-29 | Semiconductor circuit on integrated wafer and its adjustable method and system |
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| CN200810145354XA Expired - Fee Related CN101359908B (en) | 2005-04-29 | 2006-04-28 | Logic member based on programmable passing gate |
| CNB200610077245XA Expired - Fee Related CN100538881C (en) | 2005-04-29 | 2006-04-28 | The configurable logic storage block |
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| CN (3) | CN101359908B (en) |
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| KR102201566B1 (en) * | 2017-08-18 | 2021-01-11 | 주식회사 엘지화학 | Customized bms module and method for designing thereof |
| TWI661676B (en) * | 2018-08-01 | 2019-06-01 | 新唐科技股份有限公司 | Programmable array logic |
| CN110364203B (en) * | 2019-06-20 | 2021-01-05 | 中山大学 | Storage system supporting internal calculation of storage and calculation method |
| US11088693B2 (en) * | 2019-07-08 | 2021-08-10 | Hossein Asadi | Configurable logic block for implementing a Boolean function |
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| JPH0695569B2 (en) * | 1984-11-20 | 1994-11-24 | 富士通株式会社 | Gate array LSI device |
| US5200907A (en) * | 1990-04-16 | 1993-04-06 | Tran Dzung J | Transmission gate logic design method |
| JPH04240768A (en) * | 1991-01-25 | 1992-08-28 | Matsushita Electron Corp | Read-only semiconductor memory device |
| JPH06224300A (en) * | 1993-01-26 | 1994-08-12 | Hitachi Ltd | Designing method for semiconductor integrated circuit and semiconductor integrated circuit for evaluation |
| JP3407975B2 (en) * | 1994-05-20 | 2003-05-19 | 株式会社半導体エネルギー研究所 | Thin film semiconductor integrated circuit |
| US6237132B1 (en) * | 1998-08-18 | 2001-05-22 | International Business Machines Corporation | Toggle based application specific core methodology |
| JP2002289817A (en) * | 2001-03-27 | 2002-10-04 | Toshiba Corp | Semiconductor integrated circuit device and its manufacturing method |
| US7170315B2 (en) * | 2003-07-31 | 2007-01-30 | Actel Corporation | Programmable system on a chip |
| US7032191B2 (en) * | 2004-02-27 | 2006-04-18 | Rapid Bridge Llc | Method and architecture for integrated circuit design and manufacture |
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- 2006-04-28 TW TW095115249A patent/TWI321841B/en active
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112106139A (en) * | 2020-08-13 | 2020-12-18 | 长江存储科技有限责任公司 | Flash memory device |
| US11456047B2 (en) | 2020-08-13 | 2022-09-27 | Yangtze Memory Technologies Co., Ltd. | Flash memory device with programmable logic circuit |
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| TWI315610B (en) | 2009-10-01 |
| CN100538881C (en) | 2009-09-09 |
| TW200644426A (en) | 2006-12-16 |
| CN101359908A (en) | 2009-02-04 |
| TWI321841B (en) | 2010-03-11 |
| CN100508190C (en) | 2009-07-01 |
| JP4730192B2 (en) | 2011-07-20 |
| CN1917082A (en) | 2007-02-21 |
| JP2006310869A (en) | 2006-11-09 |
| CN101359908B (en) | 2010-08-18 |
| TW200723501A (en) | 2007-06-16 |
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