CN1846938A - Chamfer processing method and device for rectangular plate - Google Patents

Abstract

The invention relates to a chamfer processor with packed rectangle plate of piezoelectric vibrator, to reduce processing cost and improve processing accuracy, wherein it has a seamless cylinder and a cylinder rotator; said cylinder is used to pack the layered rectangle plate and the grind material; the cylinder rotator can repeatedly reverse the distance from the rotation axle of cylinder to one end of cylinder and the distance from the rotation axle to another end, to rotate the cylinder and change the rotation speed of cylinder.

Description

The chamfer processing method and device of rectangular flat

[technical field]

The present invention relates to chamfering (face the is got リ) processing unit (plant) of rectangular flat, particularly relate to the chamfer processing method and device of the cover of enclosing the ceramic package that piezoelectric vibration piece is arranged.

[background technology]

In electronic circuit,, extensively utilize piezoelectric vibrator in order to obtain certain frequency.Particularly carry the electronic equipment of usefulness, necessary miniaturization is so utilize the piezoelectric vibrator of enclosing the ceramic package that piezoelectric vibration piece is arranged.The piezoelectric vibrator 100 of ceramic package shown in Figure 8, piezoelectric vibration piece 102 has been installed after, will be as the glass plate top loading of cover 104, make the inner vacuum that keeps.By making the inner vacuum that keeps, can obtain stable resonant frequency.

At this, as if the installation site dislocation of cover 104 with respect to packaging part 101, then the outside at packaging part 101 is exposed in the bight of cover 104.Particularly be formed with the occasion of circular arc recess 101a in the bight of packaging part 101, the bight of cover 104 is exposed in the possibility of circular arc recess 101a part big.When very little masterpiece was used for exposed portions serve, breach often appearred in this part, cracks.If this crackle further develops, then make packaging part inside can not keep vacuum.So, to the bight chamfering 105 of cover 104.

Existing chamfer processing method as shown in Figure 9, be performed such, promptly at first that several covers are so big or small glass substrate 110 is fixed on processing with above the auxiliary glass 112, with circular diamond sawblade 114 glass substrate 110 is cut into 1 cover size so, and then chamfered part is cut off.Specifically, as shown in figure 10, at first, just can obtain the cover 104 of rectangle by cutting off line 116 along in length and breadth to cutting off.By cutting off line 118, cutting off along oblique, just across corner is carried out chamfering again.Use such chamfering method, the amount of movement of circular diamond sawblade is little, and process velocity is fast.

Existing chamfer processing method, during by the cut-out line 118 of Figure 10, along oblique the cut-out, the central portion of the parts all around 106 of cover 104 is cut off.As a result, parts 106 are discarded, and can only use about half of glass substrate 110 as cover 104.Because its lumber recovery is low, so there is the high problem of processing cost.

In addition, on the section that cuts off with circular diamond sawblade 114 (with reference to Fig. 9), be attached with glass dust.This glass dust on attached to piezoelectric vibration piece, then exists the problem that can not obtain stable resonant frequency from piezoelectric vibrator if sneak into packaging part inside in the manufacture process of piezoelectric vibrator.And the section of circular diamond sawblade is coarse, often cracks from this part.If the crackle that is produced enlarges, then exist to make the inner problem that keeps vacuum of packaging part.

[summary of the invention]

The present invention is conceived to the problems referred to above and studies, and its objective is chamfer processing method and device thereof that a kind of rectangular flat that cuts down finished cost is provided.In addition, the purpose of this invention is to provide a kind of chamfer processing method and device thereof that improves the rectangular flat of machining accuracy.

In order to achieve the above object, the chamfer processing method of rectangular flat of the present invention is to constitute like this, promptly, duplexer that the rectangular flat that has the cap of piezoelectric vibration piece to use inclosure is laminated and grinding-material are enclosed in the cylindrical body, by making above-mentioned duplexer in the enterprising line slip campaign of the inwall of above-mentioned cylindrical body, carry out the chamfer machining of above-mentioned duplexer, the radius of above-mentioned cylindrical body is set as the radius R of satisfied (3) formula or near the radius of this value.

$R=\frac{L}{2}\sqrt{{\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">r</figure-callout>}}^2+1}\left(\mathrm{mm}\right)---\left(3\right)$

In the formula, L is the length (mm) on the long limit of above-mentioned rectangular flat, and r is the length of the chamfered part on the long limit of above-mentioned rectangular flat and the length ratio rate of the chamfered part on the minor face.Therefore, compare with existing chamfer processing method, because the lumber recovery raising, so can cut down finished cost.And, can carry out desirable chamfer machining, so can improve machining accuracy.And the cylindrical body of available minor diameter is carried out chamfer machining, and the middle body on the long limit of rectangular flat can not ground by grinding-material.Therefore, can improve machining accuracy.

The chamfer machining of best above-mentioned duplexer is carried out like this, that is, the length of the chamfered part on the long limit of above-mentioned rectangular flat and the length ratio rate of the chamfered part on the minor face are more than 1.0, below 4.0.Ratio is made as more than 1.0, just can not be because of the too small process velocity that reduces of the radius of cylindrical body.Ratio is made as below 4.0, just can crack from this part near the right angle because of chamfered part.

The sliding motion of above-mentioned duplexer be by the limit make distance from the hollow shaft of above-mentioned cylindrical body to an end of above-mentioned cylindrical body and put upside down repeatedly from the hollow shaft of above-mentioned cylindrical body to the size of the distance of the other end of above-mentioned cylindrical body, the limit makes above-mentioned cylindrical body revolution, make above-mentioned duplexer above-mentioned cylindrical body axially on relatively move.By making duplexer not only make progress but also also relatively move in the axial direction, can improve chamfer machining speed in the week of cylindrical body.Therefore, can cut down finished cost.

In addition, the sliding motion of above-mentioned duplexer be by the limit make distance from the hollow shaft of above-mentioned cylindrical body to an end of above-mentioned cylindrical body and put upside down repeatedly from the hollow shaft of above-mentioned cylindrical body to the size of the distance of the other end of above-mentioned cylindrical body, the limit makes above-mentioned cylindrical body revolution, make simultaneously the revolution direction counter-rotating 1 time of above-mentioned cylindrical body at least, make above-mentioned duplexer above-mentioned cylindrical body axially on relatively move.By making the revolution direction counter-rotating of cylindrical body, just can make duplexer on the circumferencial direction of cylindrical body, relatively move direction conversely.Therefore, can carry out chamfer machining equably, can improve machining accuracy for each bight of duplexer.

Above-mentioned rectangular flat can be a glass component.Like this, the glass plate for as the cover of ceramic package piezoelectric vibrator can carry out high-precision chamfer machining with low cost.In addition, can not sneak into packaging part inside attached on the piezoelectric vibration piece, can obtain stable resonant frequency because of glass dust.And, can not crack on the chamfered part, can make the inner vacuum that keeps of packaging part.Use the cover of glass plate, laser is crossed glass plate be radiated on the piezoelectric vibration piece, can adjust resonant frequency as the ceramic package piezoelectric vibrator.

Above-mentioned rectangular flat also can be quartzy parts.Like this, the crystal slab for as the cover of ceramic package piezoelectric vibrator can carry out high-precision chamfer machining with low cost.And, can be consistent with the coefficient of thermal expansion of piezoelectric vibration piece.In addition, above-mentioned rectangular flat also can be a ceramic component.Like this, the ceramic wafer for as the cover of ceramic package piezoelectric vibrator can carry out high-precision chamfer machining with low cost.And, can be consistent with the coefficient of thermal expansion of packaging part.

Also can make such structure, that is, the above-mentioned duplexer that has guard block on the surface be enclosed the inside of above-mentioned cylindrical body.The above-mentioned duplexer that has guard block on the surface forms like this; being about to the stacked and bonding of substrate gets up; after clinging above-mentioned guard block on thereon; cut into the long limit size of above-mentioned rectangular flat; stacked and bonding is got up with the intermediate after cutting off, and makes its horizontal commentaries on classics, and after being bonded at guard block on its top and bottom; cut into the minor face width dimensions of rectangular flat, just form above-mentioned duplexer.Like this, protected owing to make chamfer machining part part in addition leave grinding-material, so can improve machining accuracy.And, can prevent that in chamfer machining duplexer from resolving into the rectangular flat of monolithic.

Inclosure of the present invention has the chamfer processing method and device of the rectangular flat of piezoelectric vibration piece to have seamless cylindrical body and cylindrical body revolution mechanism, and wherein seamless cylindrical body is used for the rectangular flat that is laminated on thickness direction is enclosed inside with grinding-material; Cylindrical body revolution mechanism limit make distance from the hollow shaft of above-mentioned cylindrical body to an end of above-mentioned cylindrical body and put upside down repeatedly from the hollow shaft of above-mentioned cylindrical body to the size of the distance of the other end of above-mentioned cylindrical body, the limit makes above-mentioned cylindrical body revolution, and variable its revolution speed ground formation.Therefore, lumber recovery improves, so can cut down finished cost.In addition, owing to adopt seamless cylindrical body,, can improve machining accuracy on the inner peripheral surface of cylindrical body so the duplexer in relatively moving can not be subjected to the impulsive force of seam portion.And, reduce by the revolution speed that makes cylindrical body, just can make and enclose inner duplexer upset.Therefore, can carry out chamfer machining equably, can improve machining accuracy.In addition, also can make such structure, that is, above-mentioned cylindrical body revolution mechanism can reversally form the revolution direction of above-mentioned cylindrical body.Like this, can improve machining accuracy.

In addition, make such structure, promptly have the bight that the minor face to the long limit of above-mentioned duplexer and above-mentioned duplexer constitutes and carry out the 1st chamfer machining, guarantee the operation of the length of the chamfered part on the long limit of above-mentioned rectangular flat; Carry out the 2nd chamfer machining with the bight that minor face to the hypotenuse of the above-mentioned chamfered part of above-mentioned duplexer and above-mentioned duplexer constitutes, guarantee the operation of the length of the chamfered part on the minor face of above-mentioned rectangular flat.Can make such structure, that is, above-mentioned the 2nd chamfer machining is to enclose than carrying out in the little cylindrical body of the internal diameter of employed above-mentioned cylindrical body when above-mentioned the 1st chamfer machining having carried out the above-mentioned duplexer of above-mentioned the 1st chamfer machining and grinding-material.Like this, similar R processing is carried out on the long limit of duplexer and the bight of minor face formation, concentrated so on each bight, can not produce stress.And, can not make the chamfer machining time significant prolongation of duplexer, so can cut down finished cost.

Also can make such structure, that is, above-mentioned the 2nd chamfer machining is carried out the grinding-material additional input in employed above-mentioned cylindrical body when above-mentioned the 1st chamfer machining.After increasing the grinding-material amount, between inner surface of tube and duplexer, enter a lot of grinding-materials, so the print effect of inner surface of tube weakens.As a result, by increasing the grinding-material amount, can obtain and the same effect of occasion that reduces pipe diameter.Therefore, the duplexer that does not need to finish the 1st chamfer machining from big-inch pipe is transferred in the minor diameter pipe, can cut down finished cost.

[description of drawings]

Fig. 1 is the key diagram of the formation method of duplexer.

Fig. 2 is the key diagram of the pipe of form of implementation 1.

Fig. 3 is the key diagram of the determining method of pipe radius, and Fig. 3 (1) is the sectional drawing perpendicular to axis of pipe, and Fig. 3 (2) is the enlarged drawing of H portion.

Fig. 4 is the key diagram of the drum apparatus of form of implementation 1, and Fig. 4 (1) is the plane sectional drawing along the E-E line of Fig. 4 (2), and Fig. 4 (2) is the side view of Fig. 4 (1).

Fig. 5 is the side sectional drawing along the F-F line of Fig. 4, and Fig. 5 (1) is the key diagram of the circumferential movement of duplexer, and Fig. 5 (2) is the key diagram of chamfer machining that duplexer is carried out.

Fig. 6 (1) is the plane sectional drawing along the E-E line of Fig. 4, is the key diagram of the axially-movable of duplexer, and Fig. 6 (2) is the enlarged drawing of the A portion of Fig. 5 (1), is the key diagram of chamfer machining that duplexer is carried out.

Fig. 7 is the key diagram of duplexer topsy-turvydom.

Fig. 8 is the key diagram of the piezoelectric vibrator of ceramic package, and Fig. 8 (1) is the side sectional drawing along the T-T line, and Fig. 8 (2) is a vertical view.

Fig. 9 is the key diagram of existing chamfer processing method and device.

Figure 10 is the key diagram of existing chamfer processing method.

Figure 11 is the key diagram of the variation of drum apparatus, and Figure 11 (1) is the plane sectional drawing along the U-U line of Figure 11 (2), and Figure 11 (2) is the side view of Figure 11 (1).

Figure 12 is the key diagram of the chamfer processing method of form of implementation 2.

Figure 13 is expression change condition, carries out chamfer machining, the result's of the L2 size of mensuration Figure 12 (2) figure.

Figure 14 is to use the big grinding-material of particle diameter to carry out the enlarged drawing in each bight under the chamfer machining situation.

[specific embodiment]

With reference to the accompanying drawings the chamfer processing method and device of rectangular flat of the present invention and the desirable form of implementation of method thereof are at length described.In addition, the following stated only be a kind of form of form of implementation of the present invention, the present invention is not limited to this.

At first, form of implementation 1 is described.Fig. 2 represents the key diagram of the pipe of form of implementation 1, and Fig. 4 represents the key diagram of the drum apparatus of form of implementation 1.The chamfer processing method and device of the rectangular flat of this form of implementation has pipe 10 and drum apparatus 20, and wherein the inside of pipe 10 is enclosed rectangular glass sheet stacked on thickness direction (hereinafter referred to as duplexer) 8 and grinding-material 12; The drum apparatus limit make distance from the hollow shaft of pipe 10 to an end of pipe 10 and put upside down repeatedly from the hollow shaft of pipe 10 to the size of the distance of the other end of pipe 10, the limit makes pipe 10 revolution, simultaneously variable this revolution speed ground formation.Below, be that example describes with chamfer machining as the glass plate of the cover of ceramic package piezoelectric vibrator.This glass plate for example is that long limit L is that 3mm and minor face S are the rectangular small flat board of 1.3mm.In addition, also can similarly carry out chamfer machining, they covers as the ceramic package piezoelectric vibrator can be used for metallic plate, crystal slab or ceramic wafer etc.Crystal slab is used as cover, can be consistent with the coefficient of thermal expansion of piezoelectric vibration piece.In addition, ceramic wafer is used as cover, can be consistent with the coefficient of thermal expansion of packaging part.

Above-mentioned the sort of rectangular glass plate is stacked at thickness direction, form duplexer.Fig. 1 represents the key diagram of the formation method of duplexer.At first, shown in Fig. 1 (1), the glass substrate 1 that several covers are so big or small is stacked.In addition, configuration is as dividing plate (dummy) glass 2 of guard block on end face and the lower surface thereon, and integral body is bonding to thermoplastic resin.Then, at cut-out line 3 places it is cut into the size of the long limit L of cover.At this moment, owing on top and bottom, dispose partition glass 2, on glass substrate 1, can not produce the bits of coming in and going out and forming because of the diamond disk saw.Turn 90 degrees the part of cutting off like this is horizontal, become the intermediate 4 shown in Fig. 1 (2).

Then, shown in Fig. 1 (3) that intermediate 4 is transversely arranged, the following thereon partition glass 6 of going up configuration as guard block all is bonding to thermoplastic resin.In addition, partition glass also can be separately fixed on each intermediate 4.Then, at cut-out line 7 places it is cut into the minor face width S size of cover.In this case, also owing on top and bottom, disposing partition glass 6, so on glass substrate 1, can not produce bits.Turn 90 degrees the part of cutting off like this is horizontal, just become the duplexer 8 shown in Fig. 1 (4).Duplexer 8 is that the glass plate that will grow limit L and minor face S is laminated on thickness direction.

In addition, has partition glass 2,6 on a part of face of duplexer 8.Part beyond the chamfer machining part of partition glass protection duplexer 8 is avoided the grinding-material wearing and tearing, works as guard block.Therefore, the section at cut-out line 7 places of Fig. 1 (3) also is preferably in and cuts off back bond separator glass.Like this, on whole faces of duplexer 8, all has guard block.

The bond thermoplastic resin of stacked glass substrate preferably uses the water miscible binding agent that helps environmental protection.But if carry out chamfer machining under high humidity environment, then water-soluble binder dissolves, and duplexer can resolve into the monolithic glass plate.About this point, if adhere above-mentioned partition glass 6 on the surface of duplexer, then this partition glass 6 plays firmly duplexer of bundle.Therefore, even carry out the occasion of chamfer machining under high humidity environment, duplexer can not resolve into the monolithic glass plate yet.

Duplexer 8 inclosures that form are as described above made in the pipe of cylindrical body.Figure 2 shows that the key diagram of the pipe of form of implementation 1.Pipe 10 is formed by stainless steel and other metal materials.In addition, pipe 10 if use seamless pipe, then makes duplexer 8 relatively move on the pipe inner peripheral surface and when carrying out chamfer machining, duplexer 8 partly can not be subjected to impulsive force in seam (joints).Therefore, can improve the chamfer machining precision.But, when the inner peripheral surface of pipe 10 was mirror status, coefficient of friction was little, and is too time-consuming during chamfer machining.Therefore, preferably make pipe 10 after the roughening of inner peripheral surface appropriateness.In addition, pipe is not limited to have circular cross section, also can have rectangular cross section.

The radius of pipe 10 decides in order to following method.Fig. 3 represents to determine the key diagram of the method for pipe radius.Fig. 3 (1) is the sectional drawing perpendicular to axis of pipe, and Fig. 3 (2) is the enlarged drawing of the H portion of Fig. 3 (1).At first, the size of the decision chamfering that should form.In Fig. 3 (2), the ratio r (r=LO/SO) of the length L O of the chamfered part on the long limit of duplexer 8 and the length SO of the chamfered part on the minor face is 4.0 when above, the angle that the minor face of the hypotenuse of chamfered part and duplexer 8 constitutes has lost the meaning of carrying out chamfering near 90 degree.About this point, be desirable though ratio r is 1.0 situation, can realize that the radius of pipe of such chamfering is very little.As a result, the difficulty that relatively moves of the duplexer 8 of tube interior, chamfer machining is very time-consuming.Therefore, the chamfer dimesion that should form is that ratio r is defined as more than 1.0, below 4.0.

Then, decision can realize the pipe radius R of the chamfering of this ratio r.In Fig. 3 (1), suppose that the inner peripheral surface of pipe 10 and the contact of duplexer 8 are Q.In addition, suppose that the line of tube connector subcenter O and contact Q, the angle that constitutes with vertical line by the pipe center O are θ.So general following formula is set up.

$R\sin \mathrm{\&theta;}=\frac{L}{2}\left(\mathrm{mm}\right)---\left(4\right)$

Here, L is the length (mm) on the long limit of glass plate.In addition, for chamfer machining, carry out with tangent line at the pipe inner peripheral surface at contact Q place at the duplexer 8 of the inside of pipe 10 with paralleling.Therefore, ask the radius R of pipe 10, the hypotenuse of the chamfering that should form is paralleled with above-mentioned tangent line.At this, shown in Fig. 3 (2), the hypotenuse of the chamfering that should form equates with above-mentioned angle θ with the angle that long limit constitutes.Thereby following formula is set up.

$\sin \mathrm{\&theta;}=\frac{\mathrm{SO}}{\sqrt{{\mathrm{<figure-callout\; id="2"\; label="LO"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">LO</figure-callout>}}^2+{\mathrm{<figure-callout\; id="2"\; label="SO"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">SO</figure-callout>}}^2}}=\frac{1}{\sqrt{{\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">r</figure-callout>}}^2+1}}---\left(5\right)$

According to co-relation, can ask the radius R of pipe with following formula.

$R=\frac{L}{2}\sqrt{{\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">r</figure-callout>}}^2+1}\left(\mathrm{mm}\right)---\left(6\right)$

Then, as shown in Figure 2, duplexer 8 is enclosed the inside of pipe 10.Duplexer 8 is enclosed with the mode that axially parallels of pipe 10 with its stacked direction.In addition, the number of enclosing the duplexer 8 in 1 pipe 10 is not only limited to 1, and several also can.And, the grinding-material 12 of duplexer 8 is enclosed the inside of pipes 10.Grinding-material 12, the diameter that use is made of materials such as SiC are the abrasive material (grain) about 20 μ m.After duplexer 8 and grinding-material 12 enclosed, packaged unit 14 is installed in the both ends of pipe 10, prevents that duplexer 8 and grinding-material 12 from flowing out in pipe 10.

In addition, form the revolution mechanism of drum apparatus as pipe 10.Figure 4 shows that the key diagram of the drum apparatus of form of implementation 1.Fig. 4 (1) is the plane sectional drawing along the E-E line of Fig. 4 (2), and Fig. 4 (2) is the side view of Fig. 4 (1).On drum apparatus 20, be provided with the container 18 of several pipes 10 of folding and unfolding.For example, can be enclosed in about 30 the pipe 10 that does up on the diametric(al) in 1 container.In addition, for simplicity, only put down in writing 2 containers 18 among Fig. 4, but the number of container 18 also can be more than 2.

Container 18 is configured between in opposite directions 2 flywheels 22.Each flywheel 22 is that the center is turned round with same phase mutually with gyroaxis 23.In addition, flywheel 22 is set as the form that can change its speed of gyration.On the position in opposite directions of each flywheel 22, be equipped with through hole 24.Container 18 is configured to the form of gyroaxis 23 obliques of its central shaft and flywheel.Bar 19 is connected on the two ends of container 18 with the gyroaxis 23 of flywheel 22 with paralleling.And, bar 19 is inserted in the through hole 24 of each flywheel 22 supporting container 18.In this state, when making flywheel 22 revolutions, container 18 is around gyroaxis 23 revolution.Thereupon, the pipe 10 of folding and unfolding in container 18 also revolved round the sun around the gyroaxis 23 of flywheel 22.

Be provided with gear mechanism 30 between the gyroaxis 23 of flywheel 22 and the bar 19 of container 18.Specifically, the gyroaxis 23 with flywheel 22 disposes the 1st gear 36 coaxially.For the 1st gear 36 is not turned round, its position is fixed utterly.In addition, the 2nd gear 32 is fixed on the bar 19 of container 18.Be set as the pitch diameter of the 2nd gear 32 identical with the pitch diameter of the 1st gear 36.The 2nd gear 32 can rotate around the 1st gear 36 by idler gear 34.Therefore, container 18 can not change its gyroaxis 23 revolution that center on to direction flywheel up and down.Thereupon, the pipe 10 that is placed in the container 18 also can not changed gyroaxis 23 revolution that it centers on to direction flywheel 22 up and down.

Figure 11 shows that the key diagram of the variation of drum apparatus.Figure 11 (1) is the plane sectional drawing along the U-U line of Figure 11 (2), and Figure 11 (2) is a side view.Central shaft 223 is fixed on this drum apparatus 220, and flywheel 222 is around these central shaft 223 revolutions.Make flywheel 222 revolutions by motor 226 by belt 227.Like this, container 218 can be around central shaft 223 revolution.

In addition, between the bar 219 of central shaft 223 and container 218, be provided with belt mechanism 230.Specifically, belt 234 is housed being fixed on the 1st belt pulley 236 on the central shaft 223 and being fixed between the 2nd belt pulley 232 on the bar 219 of container 218.It is identical with the diameter of the 1st belt pulley 236 that the diameter of the 2nd belt pulley 232 is set as.Like this, container 218 can not change its up and down direction ground around central shaft 223 revolution.

The chamfer processing method and device of rectangular flat with this form of implementation of said structure uses as following.

As mentioned above, duplexer is enclosed tube interior with grinding-material.Make several such pipes, on diametric(al), do up and come and pool together.Then, will do up next pipe folding and unfolding in the container of drum apparatus.

Then, make the drum apparatus running.Specifically, on the drum apparatus 20 of Fig. 4, make each flywheel 22 with identical phase place revolution.Its rotating speed is for example 180rpm.When flywheel 22 turned round, the power of gyratory directions was from its through hole 24, act on the container 18 by bar 19.Therefore, container 18 is that hollow shaft revolves round the sun with the gyroaxis of flywheel 22 as A, B, C and the D of Fig. 5 (1).Simultaneously, the pipe 10 of folding and unfolding in container 18 is that hollow shaft revolves round the sun with the gyroaxis of flywheel 22 also.Thereupon, centrifugal action is on the duplexer 8 of enclosing pipe 10 inside.In addition, owing to not changing up and down, pipe 10 do not revolve round the sun to direction, so duplexer 8 is made sliding motion along circumferencial direction on the inner peripheral surface of pipe 10.Duplexer 8 slides a week on the inner peripheral surface of pipe 10 with the process of A to D.

Figure 6 shows that the key diagram of duplexer along the axial sliding motion of pipe.Fig. 6 (1) is the plane sectional drawing of part that is equivalent to the E-E line of Fig. 4 (2), and Fig. 6 (2) is the side sectional drawing of pipe 10 of the A portion of Fig. 5 (1).As mentioned above, container 18 is configured to the form of the gyroaxis oblique of its central shaft and flywheel, so the pipe 10 of folding and unfolding in container 18 is configured to the oblique with hollow shaft G-G.Therefore, when making pipe 10 revolution, from hollow shaft G-G to pipe the distance of an end 10a of 10 and from hollow shaft G-G to pipe the magnitude relationship of the distance of 10 other end 10b put upside down repeatedly.In addition, along with the revolution of pipe 10, on the duplexer 8 of centrifugal action in pipe 10, thus duplexer 8 from the less end of the distance of hollow shaft G-G to moving with the bigger end of the distance of hollow shaft G-G.That is, duplexer 8 is on the inner peripheral surface of pipe 10, carry out sliding motion in the axial direction.Specifically, shown in Fig. 6 (1), when container 18 was revolved round the sun from A to C, then duplexer 8 moved to end 10a from the end 10b shown in the arrow.When container 18 was revolved round the sun from C to A, then duplexer 8 moved to end 10b from the end 10a shown in the arrow.As a result, shown in Fig. 6 (2), the bight W and the X of the duplexer 8 that contacts for the inner peripheral surface with pipe 10 carry out chamfer machining by friction.

In addition, for bight Y and Z to opposition side also carry out chamfer machining, the revolution speed of container 18 and even pipe 10 is reduced.Figure 7 shows that the revolution speed that makes pipe reduces the key diagram of occasion.Fig. 7 is the side sectional drawing of pipe 10 of the B portion of Fig. 5 (1).When making the revolution speed reduction of pipe 10, the centrifugal force that acts on duplexer 8 reduces.So as shown in Figure 7, the duplexer 8 that is positioned at pipe 10 tops is fallen the below because of the gravity effect, and makes duplexer 8 upsets.Then, if the revolution speed of pipe 10 is risen, then across corner Y and Z carry out chamfer machining.In addition, for chamfer machining is carried out in each bight that is configured in the duplexer 8 in the whole pipes 10 in each container 18 equably, revolution speed is reduced.

In addition, owing on the chamfer processing method and device of this form of implementation, be provided with above-mentioned gear mechanism,, container do not revolve round the sun to direction up and down so not changing it.Therefore, even flywheel 2 turns round as the A-D of Fig. 5 (1), the pipe 10 that is configured in the container 18 does not change its direction up and down yet.But, preferably so that the mode that the direction up and down of pipe 10 changes is bit by bit carried out rotation.Like this, above-mentioned duplexer 8 carries out on the each different positions along axial the moving of pipe 10, and the pipe inner peripheral surface can not produce eccentric wear and decrease.Thereby, can improve the precision of chamfer machining.

Because pipe 10 does not change its direction up and down, so shown in Fig. 5 (2), produce between the duplexer 8 of inclosure pipe 10 inside and the inner peripheral surface of pipe 10 and slide.In the contact point of the inner peripheral surface of pipe 10 and duplexer 8, effect has bigger centrifugal force on the contact point of the front side of the direction of advance 50 of duplexer 8, so and the chamfer machining of the bight X of the corresponding duplexer of contact point of this front side, than carrying out soon with the chamfer machining of the corresponding bight W of the contact point of rear side.As mentioned above, owing to being reduced, revolution speed makes duplexer 8 upsets, so the chamfer machining of bight Z is also carried out soon than the chamfer machining of bight Y.

Therefore, the out of position of axial both ends of the pipe 10 of folding and unfolding in container 18 come.So the direction of advance 50 of the duplexer 8 on pipe 10 inner peripheral surfaces conversely.Like this, just with above-mentioned opposite, the chamfer machining of bight W is carried out soon than the chamfer machining of bight X.In addition, revolution speed is reduced, and when making duplexer 8 upsets, then the chamfer machining of bight Y is also carried out soon than the chamfer machining of bight Z.Thereby, can carry out chamfer machining equably to all bights.In addition, not with axially the putting upside down of pipe 10, and the gyratory directions of flywheel that makes drum apparatus is conversely the time, and the direction of advance 50 of duplexer 8 is just opposite.In this case, also can obtain and above-mentioned same result.

Use the chamfer processing method and device of this form of implementation according to the method described above, just can reduce the cost of chamfer machining with said structure.This point is used existing chamfer processing method, and lumber recovery is low, chamfer machining spent cost height.

The chamfer processing method of this form of implementation is to constitute like this, that is, stacked duplexer that forms of glass plate and grinding-material that cap is used are enclosed in the pipe, carries out the chamfer machining of duplexer in the enterprising line slip campaign of tube inner wall by making duplexer.Therefore, compare with existing chamfer processing method, lumber recovery improves, so can cut down finished cost.

In addition, the radius of above-mentioned cylindrical body is set as the radius R that satisfies following formula or near the radius of this value.

$R=\frac{L}{2}\sqrt{{\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">r</figure-callout>}}^2+1}\left(\mathrm{mm}\right)---\left(7\right)$

In the formula, L is the length (mm) on the long limit of above-mentioned rectangular flat, and r is the length of the chamfered part on the long limit of above-mentioned rectangular flat and the length ratio rate of the chamfered part on the minor face.Like this, can carry out desirable chamfer machining, so can improve machining accuracy.In addition, available minor diameter pipe carries out chamfer machining, and the long limit middle body of glass plate can not ground by grinding-material.Therefore, can improve machining accuracy.

The chamfer machining of above-mentioned duplexer preferably is processed into the length of the chamfered part on the long limit of above-mentioned rectangular flat and the length ratio rate of the chamfered part on the minor face is more than 1.0, below 4.0.Ratio is made as more than 1.0, process velocity is reduced.Ratio is made as below 4.0, does not approach the right angle and crack from this part and can not consolidate chamfered part.

In addition, the sliding motion of duplexer is to constitute like this, that is, the limit make distance from the hollow shaft of pipe to pipe one end and put upside down repeatedly from the hollow shaft of pipe to the size of the distance of the other end of pipe, the limit makes the pipe revolution, like this, just, make duplexer pipe axially on relatively move.By making duplexer not only make progress but also also relatively move in the axial direction, chamfer machining speed is improved in the week of pipe.Therefore, can cut down finished cost.

Again, the sliding motion of duplexer constitutes like this, promptly, the limit make distance from the hollow shaft of pipe to pipe one end and put upside down repeatedly from the hollow shaft of pipe to the size of the distance of the other end of pipe, the limit makes the pipe revolution, meanwhile, make the revolution direction counter-rotating 1 time of pipe at least, perhaps make 1 time out of position of axial both ends of pipe at least, like this, just, make duplexer pipe axially on relatively move.By making the revolution direction counter-rotating of pipe, perhaps the axial both ends by making pipe is out of position, just makes duplexer relatively move direction conversely on the pipe circumferencial direction.Therefore, can carry out chamfer machining equably, can improve machining accuracy each bight of duplexer.In addition, before and after conversely, make the every reduction of revolution speed 1 time of pipe at least, make the duplexer upset, then can carry out chamfer machining more equably, can improve machining accuracy.

In addition, make the structure that the surface is had the duplexer inclosure tube interior of guard block.Like this, can protect chamfer machining part part in addition not worn and torn by grinding-material, so can improve machining accuracy.And, can prevent in chamfer machining that duplexer from resolving into the single, rectangular piece flat board.Again, pipe is a seamless pipe.Therefore, the duplexer in the process that relatively moves on the inner peripheral surface of pipe can not be subjected to the impulsive force of seam portion, can improve machining accuracy.

As mentioned above, adopt the chamfer processing method and device and the method thereof of the rectangular flat of this form of implementation, can carry out the good chamfer machining of precision to glass plate with low cost as the cover of ceramic package piezoelectric vibrator.Therefore, can not sneak into packaging part inside attached on the piezoelectric vibration piece, can obtain stable resonant frequency because of glass dust.And chamfered part can not crack, and can make the inner vacuum that keeps of packaging part.Thereby, can use the cover of glass plate as the ceramic package piezoelectric vibrator.

In addition, the resonant frequency of adjusting piezoelectric vibrator is indispensable, and this adjustment is performed such, and promptly by laser is shone quality is reduced.And for fear of adjusted variation of resonant frequency, the adjustment of resonant frequency is preferably in makes piezoelectric vibrator and carries out later on.On the other hand, glass plate has the character through laser.Therefore,, after making piezoelectric vibrator, cross the glass plate irradiating laser, can carry out the adjustment of resonant frequency by using the cover of glass plate as the ceramic package piezoelectric vibrator.

Below, form of implementation 2 is described.Shown in Figure 12 (1), when the ratio r (r=L1/S1) of the length L 1 of the chamfered part on the long limit of duplexer and the length S1 of the chamfered part on the minor face was big, the angle of the bight K of the hypotenuse of chamfered part and the minor face of duplexer was near 90 degree.As a result, there is such problem, promptly produces stress and concentrate, make the cover breakage of piezoelectric vibrator, can not remain potted the air-tightness of part at bight K place.In addition, ratio r hour, angle θ shown in Figure 3 increases, so the little pipe 10 of use internal diameter carries out chamfer machining.But if use the little pipe 10 of internal diameter, then the slippage of duplexer 8 on the pipe peripheral direction is little.Therefore, the long problem of chamfer machining time that has duplexer 8.

So the chamfer processing method of form of implementation 2 is to carry out the 1st chamfer machining in the bight that the long limit of duplexer and minor face constitute, guarantee the length of the chamfered part on the long limit of rectangular flat.After the length of having guaranteed this chamfered part, carry out the 2nd chamfer machining in the bight that the minor face of the hypotenuse of the chamfered part of duplexer and duplexer constitutes again, guarantee the length of the chamfered part on the minor face of rectangular flat.

That is, at first shown in Figure 12 (1),, the 1st chamfer machining is carried out on the long limit of duplexer and the bight J of minor face formation for the length L 1 that makes the chamfered part on the long limit of rectangular flat is consistent with final goal value Lf.In the 1st chamfer machining operation, set the length S1 of the chamfered part on the minor face of rectangular flat littler than final goal value Sf.Therefore, ratio r 1 (r1=L1/S1) is bigger than final goal value rf (rf=Lf/Sf), and angle θ shown in Figure 3 diminishes, so can use the bigger pipe of internal diameter 10.Thereby, can shorten the chamfer machining time.Then, shown in Figure 12 (2), for the length of the chamfered part on the minor face that makes rectangular flat is consistent with final goal value Sf, the bight K that the minor face of the hypotenuse of the chamfered part of duplexer and duplexer is constituted carries out the 2nd chamfer machining.The ratio r 2 (r2=L2/S2) of the 2nd chamfer machining operation is set for a short time than the r1 of the 1st chamfer machining operation.That is the internal diameter of the pipe that uses of the 2nd chamfer machining operation little than the 1st chamfer machining operation.But, the processing capacity of the 2nd chamfer machining operation lacks than the processing capacity of the 1st chamfer machining operation, so time that can the significant prolongation chamfer machining.

Above result, shown in Figure 12 (2), the angle of the bight P that the minor face of the bight M that the long limit of duplexer and the hypotenuse that forms by the 1st chamfer machining constitute, the bight N that constitutes by the 1st chamfer machining hypotenuse that forms and the hypotenuse that forms by the 2nd chamfer machining and the hypotenuse that forms by the 2nd chamfer machining and duplexer constitutes all substantially exceeds 90 degree, spends near 180.That is, approach the state that R processes is carried out on the long limit of duplexer and the bight J of minor face formation.Like this, can not produce stress in each bight concentrates.Therefore, the breakage of the cover of piezoelectric vibrator can be prevented, the air-tightness of part can be remained potted.

In addition, shown in Figure 12 (3), also can prolong for the 2nd chamfer machining time, form the hypotenuse of rf (=Lf/Sf ')=r2.This form of implementation is used large diameter pipe in the 1st chamfer machining, so compare with the situation from the pipe of initial use minor diameter, can shorten the chamfer machining time.

Yet when carrying out above-mentioned the 2nd chamfer machining, the duplexer that must will finish the 1st chamfer machining from big-inch pipe moves on in the pipe of minor diameter.But the employed big-inch pipe of the 1st chamfer machining by the additional input grinding-material, can be used for the 2nd chamfer machining.

The processing method of above-mentioned chamfering of the present invention is to be replicated in the chamfer machining that form on the duplexer 8 is carried out duplexer with the inner surface configuration with pipe 10.At this, grind the grinding-material amount if increase, the grinding-material that then enters between inner surface of tube and the duplexer is many, and the print effect of inner surface of tube dies down.As a result, by increasing the grinding-material amount, just can obtain and the same effect of situation that reduces pipe diameter.Figure 13 (1) is depicted as the plot ratio that changes grinding-material and carries out chamfer machining, the result's of the L2 size of mensuration Figure 12 (2) figure.At this, the plot ratio of so-called grinding-material means that the volume of employed grinding-material in the 2nd chamfer machining accounts for the ratio of tube interior total measurement (volume).In addition, the revolution speed of drum apparatus is 180RPM, and the chamfer machining time is 2 hours.According to this figure, the grinding-material plot ratio is the occasion of 10%-30%, and L2 is of a size of 0, but the grinding-material plot ratio is 40% occasion, and L2 is of a size of 0.02mm.Its result shows, in the less occasion of grinding-material plot ratio, does not carry out the 2nd chamfer machining, only proceeds the 1st chamfer machining, but if increase the grinding-material plot ratio, just can advance the 2nd chamfer machining.

Figure 13 (2) is depicted as result's the figure that the revolution speed that changes drum apparatus carries out chamfer machining, measures the L2 size of Figure 12 (2).The grinding-material plot ratio is 20%, and the chamfer machining time is 2 hours.According to this figure, revolution speed is the occasion of 180RPM, and L2 is of a size of 0, but revolution speed is the occasion of 100RPM, and L2 is of a size of 0.03mm.Judge that according to resulting result revolution speed is occasion faster, grinding-material is difficult for entering between duplexer and the inner surface of tube, just proceeds the 1st chamfer machining by the print effect of inner surface of tube.In addition,, can judge that then grinding-material enters between duplexer and the inner surface of tube easily, enter the 2nd chamfer machining if reduce revolution speed.

Figure 13 (3) is depicted as the result's who changes the L2 size of carrying out chamfer machining process time, measuring Figure 12 (2) figure.The grinding-material plot ratio is 20%, and the revolution speed of drum apparatus is 180RPM.According to this figure, the chamfer machining time is 2 hours occasion, and L2 is of a size of 0.03mm, and the chamfer machining time is 4 hours occasion, and L2 is of a size of 0.1mm.This expression chamfer machining time and the proportional relation of chamfer machining amount.

According to above experimental result, with the grinding-material plot ratio be made as about 20%, the revolution speed of drum apparatus is made as about 100RPM and be made as that to carry out the 2nd chamfer machining about 4 hours be only process time.At first, about the grinding-material plot ratio, this value is big more, and the 2nd chamfer machining is easy more carries out, and on the other hand, must consider the problem of the service efficiency reduction of grinding-material.So the grinding-material plot ratio is about 5% when the 1st chamfer machining, when the 2nd chamfer machining it is increased to about 20%.About the revolution speed of drum apparatus, this revolution speed is low more, and the 2nd chamfer machining is easy more carries out, and on the other hand, must consider the problem that prolong process time.So the revolution speed of drum apparatus is about 180RPM when the 1st chamfer machining, when the 2nd chamfer machining, it is reduced to about 100RPM.In addition, can suitably set the chamfer machining time, make the L2 size of Figure 12 (2) and S2 size reach desired value.

Yet if use the less grinding-material of particle diameter to carry out the 1st and the 2nd chamfer machining, bight M, N shown in Figure 12 (2) and the front end of P are sharp shape.In this case, produce stress at the front end in each bight and concentrate, the cover that can make piezoelectric vibrator is damaged and destroy its air-tightness.Therefore, use the bigger grinding-material of particle diameter, carry out the 1st and the 2nd chamfer machining.Specifically, use the above grinding-material of particle diameter 20 μ m.The enlarged drawing in each bight when Figure 14 carries out chamfer machining for using the bigger grinding-material of particle diameter.As shown in the drawing, at the front end of each bight M, N and P,, produce processing fillet layer (roughing) owing to the percussion of the bigger grinding-material of particle diameter.This processing fillet layer is similar to the state that carries out tiny R processing continuously.Like this, can not produce stress in each bight and concentrate, can prevent the breakage of the cover of piezoelectric vibrator, can keep its air-tightness.

Duplexer that the rectangular flat that cap is used is laminated and grinding-material are enclosed cylindrical body, by making above-mentioned duplexer in the enterprising line slip campaign of the inwall of above-mentioned cylindrical body, carry out the chamfer machining of above-mentioned duplexer, owing to make such structure, so can cut down finished cost.

The radius of above-mentioned cylindrical body is set as the radius R that satisfies following formula or near the radius of this value.

$R=\frac{L}{2}\sqrt{{\mathrm{<figure-callout\; id="2"\; label="r"\; filenames="A20061008170400201.png,A20061008170400211.png"\; state="\{\{state\}\}">r</figure-callout>}}^2+1}\left(\mathrm{mm}\right)---\left(8\right)$

In the formula, L is the length (mm) on the long limit of above-mentioned rectangular flat, and r is the length of the chamfered part on the long limit of above-mentioned rectangular flat and the length ratio rate of the chamfered part on the minor face.Like this, can improve machining accuracy.

Claims (3)

1. the chamfer processing method and device of a rectangular flat is characterized in that, has seamless cylindrical body and cylindrical body revolution mechanism, and the rectangular flat that wherein seamless cylindrical body is used for being laminated on thickness direction is enclosed its inside with grinding-material; Cylindrical body revolution mechanism limit make distance from the hollow shaft of above-mentioned cylindrical body to an end of above-mentioned cylindrical body and put upside down repeatedly from the hollow shaft of above-mentioned cylindrical body to the size of the distance of the other end of above-mentioned cylindrical body, the limit makes above-mentioned cylindrical body revolution, and the revolution speed of variable above-mentioned cylindrical body.

2. the chamfer processing method and device of rectangular flat according to claim 1 is characterized in that, above-mentioned cylindrical body revolution mechanism can reversally form the revolution direction of above-mentioned cylindrical body.

3. the chamfer processing method and device of rectangular flat according to claim 1 and 2 is characterized in that, the radius of above-mentioned cylindrical body is set as the radius R of satisfied (2) formula or near the radius of this value,

$R=\frac{L}{2}\sqrt{r^2+1}\left(\mathrm{mm}\right)\&CenterDot;\&CenterDot;\&CenterDot;\left(2\right)$

In the formula, L is the length (mm) on the long limit of above-mentioned rectangular flat, and r is the length of the chamfered part on the long limit of above-mentioned rectangular flat and the length ratio rate of the chamfered part on the minor face.

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