CN1838730A - Image data generation method and element installation apparatus using the same - Google Patents
Image data generation method and element installation apparatus using the same Download PDFInfo
- Publication number
- CN1838730A CN1838730A CN 200610005108 CN200610005108A CN1838730A CN 1838730 A CN1838730 A CN 1838730A CN 200610005108 CN200610005108 CN 200610005108 CN 200610005108 A CN200610005108 A CN 200610005108A CN 1838730 A CN1838730 A CN 1838730A
- Authority
- CN
- China
- Prior art keywords
- substrate
- resolution
- view data
- image
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The present invention provides an image data forming method of generating high resolution image data by a technique of pixel staggering without preparing an additional optical moving mechanism within an imaging apparatus, and a components mounting apparatus using it. In the case of a fine sized component insufficient in recognition at image pick-up in standard resolution (S1 is NO), first, the image pick-up is performed at a reference position (S4); next, a loading head 36 is moved in X direction and Y direction by a half resolution from the reference position (S5). When a size of 1 pixel of imaging device 74 is 7 [mu]m*7 [mu]m, a moving amount F toward X axis and Y axis of the loading head 36 corresponding to 25 [mu]m of the half resolution is 25 [mu]m, and it can be solved by a fine moving function prepared in the loading head 36 originally. High fine image data can be obtained by the technique of pixel staggering in such a way that an image shifted in X axis direction and Y axis direction by the half resolution is picturized (S6), and that the image data of the 2 kinds are composed (S7).
Description
Technical field
The present invention relates to generate the image-data generating method of the view data of the high resolution of the true resolution that has than imaging apparatus, and the apparatus for mounting component that uses this method.
Background technology
In the past, substrate feedway, the distributor of existing production line upstream side, backflow (reflow) stove etc. with the line downstream side constitutes production line, and with electronic unit (below, abbreviate parts as) be installed to the printed circuit board (PCB) of sending in self device (below, abbreviate substrate as), the electronic component mounting apparatus (being designated hereinafter simply as apparatus for mounting component) of producing base board unit automatically.
Usually, this apparatus for mounting component, on top cover, have the supervision input unit that constitutes by CRT or LCD and touch-type input device, the warning light of report operating condition etc., on inner base station, have the substrate guide rail that has conveyer belt in the central, above the substrate guide rail, have the operation head that moves freely all around.On the operation head, a plurality of installation head that have free lifting usually and rotate freely.
And having parts in front and back apparatus main body, become the both sides of line on production line provides platform, supplies with on the platform at these parts a plurality of for example tape assembly feedwaies are installed.
The substrate guide rail is sent to substrate in the apparatus main body (apparatus for mounting component) from the production line upstream side.The installation head of operation head is equipped with adsorption nozzle at its front end, utilize this adsorption nozzle to supply with tape assembly feedway adsorption element on the platform from parts, with camera (comprising camera, video camera etc.) these parts are carried out image recognition, proofread and correct, these parts are installed on the substrate with executing location.So, produce base board unit (for example referring to patent documentation 1).
In this apparatus for mounting component, its resolution of imaging apparatus of the camera head that is used to utilize camera parts to be carried out image recognition is so not high.But, in recent years,,, require more high-resolution captured image data as the function of camera head along with the parts miniaturization.
But,, therefore, how high-resolution imaging apparatus can not be used on the apparatus for mounting component because imaging apparatus (CCD:Charge Couple Device-charge coupled device) is extremely expensive.But known a kind of image-data generating method generates the view data of the resolution higher than true resolution that imaging apparatus had.
For example, rise for fear of cost, method as the image quality of the rest image of attempting to improve shot by camera, exist in the time of to take resulting photographic images and be taken into by CCD as rest image, promptly when the method for utilizing the space pixel-shift obtains making a plurality of image of its optical axis generation deflection, physically move the method for active prism of control or passive prism.
(for example, referring to patent documentation 2)
Fig. 8 is the figure that the component identification method of apparatus for mounting component has been described, this apparatus for mounting component has adopted the method for utilizing physics to move this optical system of control to generate this image-data generating method of view data of the high resolution of the true resolution that has than imaging apparatus.In addition, Fig. 8 has shown as the operation head of the apparatus for mounting component of the structure of critical piece and the camera head that is used for these parts of image recognition.
As shown in the drawing, operation 1 absorption on the adsorption nozzle 3 that is installed on installation head 2 front ends is keeping parts 4.And, near installation head 2, have the LASER Light Source 6 of irradiation reference laser 5.So, remain in parts 4 in the operation 1 be still in camera head (component identification camera apparatus) 7 directly over.
Camera head 7 has: lighting device 8, throw light on to parts 4; Lens 9 are taken parts; Speculum 11, in lens 9, roughly rectangular laterally to the right the direction that makes that the optical axis of incident from the top down is altered to figure with it; Piezoelectric element 12, the angle of inclination that makes this speculum 11 is towards the predetermined direction fine motion; And semi-transparent semi-reflecting lens 13 will branch into direct projection and direction vertically downward from the reflected light path of speculum 11.
In addition, camera head 7 has: component identification is used to make the direct light imaging from semi-transparent semi-reflecting lens 13 with imaging apparatus 14; Reference light detects with imaging apparatus 15, is used to accept the branched optical cable vertically downward from semi-transparent semi-reflecting lens 13; And control part 16 is used for driving above-mentioned piezoelectric element 12 based on the output that detects with imaging apparatus 15 from this reference light, and the control assembly identification shooting timing of imaging apparatus 14.
Above-mentioned control part 16 is controlled by apparatus for mounting component main body control portion 17, and the captured image data of being taken with imaging apparatus 14 by component identification is sent to apparatus for mounting component main body control portion 17.
Apparatus for mounting component main body control portion 17 utilizes the speculum 11 that is changed the angle of inclination by the driving of piezoelectric element 12, shooting 3 taken view data of light shaft offset 1/2 pixel are synthesized, thereby generate the view data of the high resolution of the true resolution that had originally with imaging apparatus 14 than component identification.
Fig. 9 (a) and (b), (c) are key diagrams, are used to illustrate utilize the space pixel-shift to generate the principle of the view data of the resolution higher than the true resolution of imaging apparatus.In addition, in Fig. 9 (a) and (b), for convenience of explanation, component identification is replaced into according to the imaging pixels number with imaging apparatus 14 is 4 of perpendicular 4 horizontal strokes small-sized image pickup element 18 of 16 formations altogether.
If utilize this imaging apparatus 18 to take a left side part of having removed the literal " A " shown in Fig. 9 (a) and the lower right-most portion after the top part, then obtain the view data shown in Fig. 9 (b) with common resolution.
Fixed the literal " A " of this reference object, and the position 18-2 after imaging apparatus 18 is moved 1/2 pixel from the reference position shown in this Fig. 9 (b) towards upward (Y) direction shown in Fig. 9 (a), moving 1/2 pixel towards right (X) direction takes.
In addition, in fact, in above-mentioned example shown in Figure 8, by the position of imaging apparatus 18 not being moved 1/2 pixel and optical system is moved driving, thereby make the light path of the imaging surface that images in imaging apparatus 18 relatively move 1/2 pixel.
So,, then can access the high meticulous view data shown in Fig. 9 (c) if synthesize to the position 18-1 place acquired image data shown in the view data shown in Fig. 9 (b), Fig. 9 (a) and in position 18-2 place acquired image data.
This view data is the high meticulous view data for the resolution of 2 times of true resolutions, as if imaging apparatus 18 is to amount to imaging apparatus that 64 pixels constitute etc. by 8 of perpendicular 8 horizontal strokes.
(patent documentation 1) Japanese patent laid-open 11-186794 communique (summary, Fig. 1)
(patent documentation 2) Japan Patent spy opens the 2001-111879 communique and (makes a summary, Fig. 1)
So, the focal position of above-mentioned space pixel offset method in the past by making optical system or CCD mechanically move, make to take light path and relative generation 1/2 pixel-shift of location of pixels of the sensitive surface of CCD, thus obtain than true resolution high for example be the high meticulous view data of its 2 resolution.
But, as shown in Figure 8, the component identification of using by apparatus for mounting component with digital camera (comprising camera, video camera) in, carry out the space pixel-shift in order to realize high-resolution, therefore, in camera head, must unify the mechanism that side newly is provided for the mobile optical axis of 1/2 pixel-shift in CCD side or optical system.So the appending of mechanism of inevitable this mobile optical axis and the price of the apparatus for mounting component that causes rises has problem unsatisfactory.
Summary of the invention
Problem of the present invention is made in view of above-mentioned actual conditions in the past, purpose is the apparatus for mounting component that a kind of image-data generating method is provided and uses this method, this method is not appended in camera head the optical axis travel mechanism that is used for pixel-shift is installed, but the function of only using the device that all the time exists realizes the method for pixel-shift, thereby the high-resolution of obtaining.
Below, the structure that narration has been used image-data generating method of the present invention and used the apparatus for mounting component of this method.
At first, the 1st inventive images data creation method is: utilize fixed configurations to discern with cameral CCD (Charge Couple Device: charge coupled device) take the desired position of adsorbing the electronic unit on the adsorption nozzle that remains in installation head, thereby generate the view data of using for the image recognition of electronic unit in the electronic unit of apparatus for mounting component main body one side; It constitutes: when installation head is positioned on the reference position of electronic unit shooting, take above-mentioned electronic unit, generate the view data of benchmark, be positioned at from the said reference position towards directions X and Y direction when having moved on the position of preset distance in installation head, take above-mentioned electronic unit, generate captured image data, the view data and the above-mentioned captured image data of said reference synthesized, thereby obtain the view data of the high resolution of the resolution that has than above-mentioned CCD.
Predetermined displacement towards above-mentioned directions X or Y direction for example constitutes and makes the focal position of the shooting light path of above-mentioned electronic unit to move the corresponding displacement of 1/2 pixel at the sensitive surface of above-mentioned CCD.
Next, the 2nd inventive images data creation method is: utilize the substrate identification that remains on the installation head to take the desired position of substrate with cameral CCD (Charge Couple Device), thereby generate the image recognition view data for substrate; It constitutes: when installation head is positioned on the reference position of substrate imaging, take aforesaid substrate, generate the view data of benchmark, be positioned at from the said reference position towards directions X and Y direction when having moved the position of preset distance in installation head, take aforesaid substrate, generate captured image data, the view data and the above-mentioned captured image data of said reference synthesized, thereby obtain the view data of the high resolution of the resolution that has than above-mentioned CCD.
The predetermined displacement that moves towards above-mentioned directions X or Y direction for example constitutes and makes the focal position of the shooting light path of aforesaid substrate to move the corresponding displacement of 1/2 pixel at the sensitive surface of above-mentioned CCD.
In addition, the apparatus for mounting component of the 3rd invention constitutes: utilize the above-mentioned the 1st and/or the 2nd inventive images data creation method to generate the view data of electronic unit identification usefulness and/or substrate identification usefulness.
The effect of invention
According to the present invention, owing in the camera head inside of the electronic unit shooting usefulness of apparatus for mounting component main body one side pixel-shift mechanism is not set in fixed configurations, and the distance that installation head one of the minute movement on directions X and Y direction that makes the electronic unit that keeps captured makes the focal position of electronic unit shooting light path be offset 1/2 pixel is carried out shooting, obtain high-resolution view data thus, therefore, have the following advantages: avoided having equipped the caused cost rising of the travel mechanism that is used for pixel-shift, and the method for use pixel-shift obtains the image of high-resolution electronic unit owing to appending in camera head inside.
And, with camera head inside pixel-shift mechanism is not set in the substrate identification that is disposed at the first side of installation, but the distance that installation head one of the minute movement on directions X and Y direction that makes the camera head that maintenance takes substrate makes the focal position of substrate shooting light path be offset 1/2 pixel is carried out shooting, obtain high-resolution view data thus, therefore, have the following advantages: avoid having equipped the caused cost rising of the travel mechanism that is used for pixel-shift, and the method for use pixel-shift obtains the image of high-resolution substrate owing to appending in camera head inside.
Description of drawings
Fig. 1 (a) shows the outward appearance oblique view of example of the apparatus for mounting component of an embodiment who uses image-data generating method of the present invention;
Fig. 1 (b) be pattern show use removed should about the oblique view of internal structure behind the over cap.
Fig. 2 shows the oblique view of structure of the operation head of this routine apparatus for mounting component.
Fig. 3 is the system block diagram of this routine apparatus for mounting component.
Fig. 4 be pattern show the figure of state of the parts feed system of this routine apparatus for mounting component.
Fig. 5 (a) be pattern show in order to be adsorbed in installation head that parts on the adsorption nozzle move to carries out image recognition in the way on the substrate and the figure of the state that temporarily stops on the reference position on the camera in component identification.
Fig. 5 (b) be pattern show the figure of this shooting principle.
Fig. 6 (a) is the installation head seen from the side parallel with X-axis and the component identification figure with the position relation of the reference position of camera;
Fig. 6 (b) is that its E is to view (figure that sees from the side parallel with Y-axis);
Fig. 6 (c), 6 (d) are respectively the figure that sees that from above Fig. 6 (a), Fig. 6 (b) are seen.
Fig. 7 (a) is used to illustrate the flow chart that is obtained the performed processing operation of the CPU of photographing process of the high view data of resolution by execution;
Fig. 7 (b) shows the figure of installation head and the position relation that component identification is used camera of this moment.
Fig. 8 is used to illustrate that utilization space pixel-shift in the past generates the figure of component identification method of the view data of the resolution of wanting than the true resolution height of imaging apparatus.
Fig. 9 (a), 9 (b), 9 (c) are used to illustrate utilize the space pixel-shift to generate the figure of principle of the view data of the resolution of wanting than the true resolution height of imaging apparatus.
Embodiment
Below, with reference to the accompanying drawings embodiments of the present invention are described.
(embodiment 1)
Fig. 1 (a) is the outward appearance oblique view of example of the apparatus for mounting component of the expression embodiment that uses image-data generating method of the present invention; Fig. 1 (b) is that its up and down oblique view of the internal structure behind the over cap has been represented to remove in pattern ground.
Shown in Fig. 1 (a), apparatus for mounting component 20 has: monitoring arrangement 22, by the CRT that is in the front and back on the top cover respectively (Cathode ray tube: cathode ray tube) constitute; And, alarm lamp 23, be on this top cover about, be used to report each operating condition.And; on the face of the front and rear of top over cap 24; disposed operation input display unit 25; it is made of LCD and touch-type input device, can be by means of import various indications (operation at the rear portion of the right diagonal upward direction of Fig. 1 input be in the shade with display unit 25 and cannot see) from the operation of outside.
On the base station 26 of bottom,, disposed the fixing substrate guide rail 27 parallel with movable 1 couple along the direction of transfer of the substrate 28 shown in Fig. 1 (b) (among X-direction, the figure from oblique lower right towards oblique upper left side) horizontal-extending in central authorities.Join with the bottom of these substrate guide rails 27, disposed the conveyer belt (transport tape) of invisible ring (loop) shape among the figure movably.
Transport tape exposes with ribbing of each several mm wides below substrate guide rail 27 in the board transport path, drive by not shown band drive motor, on the board transport direction, move, one side is from the both sides at following support substrate 28 back sides, substrate 28 before on one side parts being installed is in upstream side feeder main body, and the substrate 28 that parts are installed passes out to line downstream one side in turn.In this apparatus for mounting component 20, send into 2 substrates 28 usually, determine its position, before finishing, the installation of electronic unit is being fixed.
In the front and back of base station 26, be formed with each parts supply with platform 29 (in Fig. 1 (a), the right oblique upper of figure to the parts at rear portion supply with platform 29 and be in the shade and cannot see.And, in Fig. 1 (b), omitted the parts at rear portion and supplied with platform 29 diagrams).
Supply with in the platform 29 at parts, disposed tape assembly feedwaies 31 (generally abbreviating tape feed, tape drum etc. as) a plurality of, 50-70.In belt feedway 31, portion in its back-end, dismounting is equipped with freely and is used for the roll coil of strip dish 32 that scrolling has been accommodated the band of parts.
And, above base station 26, disposed separate be fixed in body frame about (X-direction) 2 Y-axis tracks 33 and at be supported on these two Y-axis tracks 33 2 (in device integral body, being total up to 4) X-axis tracks 34 with being free to slide respectively.
Above-mentioned operation 35 via be in crooked state freely, be used to protect many not shown signal soft lines in the banded serobila 37 that is contained in interior void, link to each other with central control part on Sub-assembly Dept's motherboard of base station 26 inside that are disposed at apparatus main body 20.Operation 35 receives and provides electric power and control signal via these signal soft lines from central control part, and the location that sends substrate to central control part with mark, represent the view data of the information of parts installation site.
And, supply with between the platform 29 at substrate guide rail 27 and parts, corresponding with 4 operations 35, be provided with component identification respectively 4 positions with camera 38, be used for the parts that are adsorbed on the installation head 36 are carried out image recognition, and judge the posture that whether good it and be adsorbed, in Fig. 1 (b), omitted diagram, but, also disposed nozzle exchanger in its vicinity, be used to hold the multiple adsorption nozzle that can freely load with installation head 36 with exchanging.
And, in the inside of base station 26, although do not illustrate especially,, outside above-mentioned central control part, also possess base positioner and substrate be fixed on 2 substrate fixed mechanisms between the substrate guide rail 27 etc.
Fig. 2 is the oblique view of above-mentioned operation 35.As shown in the drawing, operation 35 is connected with the central control part of agent set via the banded serobila 37 of free bend as described above, it have 2 installation head 36 supporting by support sector 39 and 36 and substrate identification with camera 41.
2 installation head 36 can be respectively along Z-direction (above-below direction) lifting, and can rotate along θ direction of principal axis (360 ° of directions).At the front end of installation head 36, diffusing panel lighting device 42 has been installed respectively, also adsorption nozzle 44 has been installed in addition at its front end.Adsorption nozzle 44 is formed by light diffusing board 44-1 and nozzle 44-2.
Above-mentioned operation 35 is by means of above-mentioned Y-axis guide rail 33 and X-axis guide rail 34 and move freely all around.Thus, adsorption nozzle 44 is by means of operation 35 and installation head 36, in each operating area forwards, backwards with about move freely, free lifting and on 360 ° of directions, rotating freely up and down.
This apparatus for mounting component is as mentioned above by means of the adsorption nozzle that can freely exchange 44 of installation head 36 front ends that move freely in the three-dimensional working space of X, Y, Z, from the assembly supply device adsorption element, utilize component identification these parts that adsorbing to be carried out image recognition with camera, afterwards, the substrate position of the parts after utilizing substrate identification with this image recognition of the corresponding installation of camera carries out image recognition, afterwards, position on the substrate of this image recognition is carried out position correction, is installed automatically on one side the parts of above-mentioned image recognition on one side, thereby produces substrate.
Fig. 3 is the system block diagram of the apparatus for mounting component of structure as mentioned above.As shown in the drawing, this routine apparatus for mounting component 20 has: CPU 45; By be connected to the control part that i/o (input and output) control unit 47 on this CPU 45 and graphics processing unit 48 constitute by bus 46.
And, on CPU 45, connected memory 49.Although not special diagram has program area and data field in memory 49.
And, on i/o control unit 47, be connected with substrate lighting device 51 and LED luminaire 53 via lighting control unit 54, described substrate lighting device 51 is used for being thrown light in the parts installation site of substrate 28 (referring to Fig. 1 (b)), described LED luminaire 53 is used for the parts 52 on the adsorption nozzle 44 (referring to Fig. 2) that is adsorbed in installation head 36 are thrown light on, and equips with camera 38 one with component identification.
In addition, on i/o control unit 47, be connected with X-axis motor 55, Y-axis motor 56, Z axle motor 57 and θ axle motor 58 via amplifier (AMP) respectively.
Not special diagram on above-mentioned each amplifier, but also set encoder (エ Application コ-ダ) respectively, utilize these encoders, will be input to CPU 45 via i/o control unit 47 with the corresponding encoded radio of rotation of each motor (X-axis motor 55, Y-axis motor 56, Z axle motor 57 and θ axle motor 58).Thus, CPU 45 can discern all around of each installation head 36, current location up and down and the anglec of rotation.
In addition, be connected with vacuum unit 59 on the above-mentioned i/o control unit 47.Air is connected on the adsorption nozzle 44 of installation head 36 vacuum unit 59 via vacuum tube 61.
On this vacuum tube 61, be equipped with pneumatics transducer 62.Vacuum unit 59 utilizes vacuum that parts 52 are adsorbed onto on the adsorption nozzle 44, perhaps, and by removing vacuum, air blast and cutting off vacuum (destruction vacuum) and remove absorption.
At this moment, the barometric information in the vacuum tube 61 outputs to CPU 45 from pneumatics transducer 62 via i/o control unit 47 as the signal of telecommunication.Thus, CPU 45 has understood the atmospheric pressure state in the vacuum tube 61, whether can prepare to utilize adsorption nozzle 44 to come adsorption element 52 thereby can discern, and, whether can discern adsorbed parts 52 by normal sorption.
In addition, on above-mentioned i/o control unit 47, connected positioner, band drive motor, substrate sensor, reached abnormal show lamp etc. via each driver.Positioner is configured in the below of substrate guide rail 27 of the base station inside of apparatus for mounting component 20, is used to be directed into the location of the substrate 28 in the device.
The circulation of band drive motor drives the conveyer belt that sets with guide rail 27 one.Substrate sensor detects sending into and sending of substrate 28.The abnormal show lamp enters in the operating area etc. at the operation exception of apparatus for mounting component 20 or foreign matter and carries out light on and off when unusual, with report to the field operation person taken place unusual.
And, on CPU 45, be connected with communication i/o interface 63, display operation input unit 64 and tape deck 65.Communication i/o interface 63 utilizes wired or wireless mode to be connected with these processing unit, thereby can communicate with CPU 45 for example being to utilize under the situation that other processing unit such as personal computer carry out that teaching is handled etc.
But tape deck 65 is loading hard disk, MO (Magneto Optical disk), FD (floppydisk: soft (registered trade mark) coils), CD-ROM (compact disc read only memory)/RW (read﹠amp for example; Write), various recording mediums such as flash memory device, it be used to write down install with the parts of holding member erecting device 20 handle, its parts of in advance carrying out install teaching handle the data of supervisor, part library (library), change products (section is got り) shows data, from the various data such as NC (numerical control, Numerical Control) data of CAD (computer aided design).
Said procedure is downloaded to the program area of memory 49 by CPU 45, is used for the control and treatment of each one.Above-mentioned data also are read out the data field of memory 49, to carry out predetermined processing.
Treated, data updated is stored in the predetermined data field that is saved in the predetermined recording medium.And the data field of memory 49 has by a plurality of registers district of refinement, has preserved various count values in this register district temporarily.
Display operation input unit 64 is when implementing the parts installation exercise, and the image of the substrate 28 that the substrate identification that graphics processing unit 48 is utilized operation 36 1 side photographs with camera 41 and the component identification that this graphics processing unit 48 utilizes agent set one side are shown in the display unit with the image of the taken parts 52 of camera 38.
And, when implementing teaching and handle, show the teaching picture, produce when switching changing, the substrate before the demonstration report will be switched is with the difference of changing the result that the product data compare of changing the product table of changing that changing of product table produce that data and the substrate of producing in view of the above use etc.
Fig. 4 be pattern show this routine apparatus for mounting component 20 parts supply with the figure of the state of platform.Figure 4 illustrates: 2 substrate guide rails 27, the substrate 26 that is admitted to, parts are supplied with platform 29, be equipped on the tape assembly feedway 31 on this parts supply platform 29, and pellet type assembly supply device 66, move the operation 35 of execution unit installation exercise about before and after on the substrate 26 (XY direction), spent the installation head 36 that rotates freely by (Z direction) lifting and 360 about this operation 35 maintenance, and the component identification of the parts 52 of the front end that is adsorbed in this installation head 36 being carried out image recognition is with camera 38.
So, installation head 36 promotes adsorbed parts 52 (52a or 52b) shown in arrow a among the figure, carry out image recognition as the component identification of utilizing that moves on the arrow substrate that b is shown in 26 with 38 pairs of parts of camera 52 midway, executing location is proofreaied and correct, shown in arrow c, move to the parts installation site on the substrate 26, afterwards, shown in arrow d, descend, and these parts 52 are installed on the substrate 26.
Fig. 5 (a) be pattern show above-mentioned installation head 36 in order to carry out image recognition with 38 pairs of parts of camera 52 and the figure of the state that on the shooting reference position, stops being adsorbed in the component identification of utilizing that parts 52 on this adsorption nozzle 44 move on the substrate 26 midway temporarily, Fig. 5 (b) be pattern show the figure of this shooting principle.
But, in Fig. 5 (b), in order to schematically illustrate easily the structure of operation 35 1 side, and in operation 35, omitted diagram with understanding, and only shown installation head 36 (adsorption nozzle 44) and be adsorbed in parts 52 on this adsorption nozzle 44.
The reference position that temporarily stops of the installation head 36 shown in Fig. 5 (a) is the camera sites under the situation that the parts of common size are taken, installation head 36 is being fixed under the state that concerns with the position shown in Fig. 5 (a) of camera with component identification, parts 52 is carried out once taken.
In this photography, the light image 72 of parts 52 images on the imaging surface of imaging apparatus 74 after seeing through lens 73.
The view data that obtains thus for example is the view data of the resolution that meets imaging apparatus 74 shown in Fig. 9 (b) for example.
And with in the camera 38, if the size of 1 pixel of imaging apparatus 74 is set to 7 μ m * 7 μ m, the coverage that then images in the parts 52 on this 1 pixel is 50 μ m * 50 μ m in this routine component identification shown in Fig. 5 (b).
Therefore, if making installation head 36 is that parts 52 move 50 μ m * 1/2=25 μ m towards X-axis or Y direction, then the imaging on the imaging apparatus 74 is only moved 1 pixel * 1/2 to X-axis or Y direction.
Fig. 6 (a) sees installation head 36 shown in Fig. 5 (b) and the component identification figure with the position relation of the reference position of camera 38 from the side that is parallel to X-axis, Fig. 6 (b) be this E to view (figure that sees from the side that is parallel to Y-axis), Fig. 6 (c), 6 (d) are respectively the figure that sees Fig. 6 (a), 6 (b) from above.
This routine apparatus for mounting component is under the situation that the micro-element that needs is carried out the high-resolution photography is taken, except the shooting under the relation of above-mentioned position, also take installation head 36 and close with respect to above-mentioned position and tie up to the imaging that directions X and Y direction move on 25 μ m, the imaging apparatus 74 respectively and be offset 1/2 locations of pixels.
What cause owing to installation head 36 in addition, is the function of the minute movement that originally has of installation head 36 to 25 μ m of directions X or Y direction mobile.
In this example, synthesize,, therefore can carry out the image processing of micro-element owing to obtained high-resolution view data to taking 2 view data that obtain as mentioned above.And, travel mechanism that pixel-shift uses etc. is not set especially, and the minute movement function of utilizing installation head 36 originally to have is carried out pixel-shift in camera head.
Fig. 7 (a) is used to illustrate the flow chart that is obtained the performed processing operation of the CPU 45 of photographing process of this high-resolution view data by execution, and Fig. 7 (b) shows the installation head 36 of this moment and the component identification figure with the position relation of camera 38.
In addition, Fig. 7 (b) is the figure from the position relation of installation head 36 shown in Fig. 6 (c) and component identification usefulness camera 38.
In Fig. 7 (a), CPU 45 at first judges and utilizes object parts that component identification takes with camera 38 under the standard resolution that capturing element 74 is had whether good (S1).
In this was handled, component sizes was logined in advance at these parts and is installed in the parts data of the employed master unit of handling procedure, and whether the size of judging these object parts is less than pre-sizing.
Like this, judged result be under standard resolution for good, when promptly the size of object parts is more than or equal to pre-sizing (being YES among the S1), then on the reference position shown in Fig. 5 and Fig. 6 (a)-(d), the object parts are taken (S2).
The view data of the object parts that photograph in this baseline configuration is carried out after the image processing,, then carry out correction (S3), afterwards, finish photographing process for the installation site of the part of this offset if identify offset.
On the other hand, in the judgement of above-mentioned treatment S 1, not good under standard resolution, be that the size of object parts is during less than pre-sizing (S1 is NO), at first, identical with above-mentioned situation, on the reference position, take (S4), next, CPU 45 makes installation head 36 move 1/2 resolution, move 1/2 resolution (S5) to the Y direction from the reference position towards directions X.
In this was handled, moving 1/2 resolution was 1/2 pixel of imaging apparatus 74, promptly as mentioned above, was under the situation of 7 μ m * 7 μ m in the size of 1 pixel of imaging apparatus 74, made installation head 36 (being parts 52) move 25 μ m to X-axis, to the moving 25 μ m of y-axis shift.
Fig. 7 (b) shows as mentioned above installation head 36 has been moved apart from F (25 μ m), moved state apart from F (25 μ m) to Y direction to X-direction.Thus, the imaging of imaging apparatus 74 has been moved 1/2 pixel than the X-direction that is imaged on the reference position, has moved 1/2 pixel in Y direction, has promptly moved 1/2 resolution.
In addition, in fact, if installation head 36 moves towards the X-axis positive direction, then the imaging on the imaging apparatus 74 is moved towards the X-axis negative direction.The situation of Y-axis too.
Here, CPU 45 is offset 1/2 resolution and the imaging execution view dataization after Y direction is offset 1/2 resolution to this to X-direction, promptly image is taken (S6).
Like this, 45 couples of CPU said reference position photographs to view data, with move 1/2 resolution in X-direction, the view data of (skew back) is synthesized (S7) after Y direction moves 1/2 resolution.
Thus, obtained high meticulous view data shown in Fig. 9 (c).Like this, 45 pairs of above-mentioned high meticulous view data that obtain of CPU are carried out view data, if identify offset, then carry out the correction (S8) for the installation site of the part of this offset, afterwards, finish photographing process.
So, according to image-data generating method of the present invention, because supplementing devices such as pixel-shift travel mechanism are not set in the mechanism of component identification with camera inside, but the function of applying flexibly the minute movement that installation head itself has makes pixel-shift, used the pixel-shift method that the imaging on the imaging apparatus is moved 1/2 pixel, therefore, the cost that can not cause the apparatus for mounting component main body rises, and maintains the statusquo and just can generate high meticulous view data.
In addition, in the above-described embodiment, although the shooting to parts is illustrated, but, for substrate, also can in small location confirmation, utilize pixel-shift method same as described above, the supplementing devices such as travel mechanism of pixel-shift are not set in the mechanism of the affirmation of the substrate on being equipped on the operation head with camera, and apply flexibly the function of the minute movement that installation head has originally, move 1/2 pixel by the relative position that substrate and substrate are discerned with camera, thereby easily obtain the location drawing picture of the meticulous substrate of height.
Claims (5)
1. image-data generating method, utilize fixed configurations that the electronic unit identification cameral CCD of main body one side is installed in parts, the desired position that absorption is remained in the electronic unit on the adsorption nozzle of installation head is taken, and generate the view data of using for the image recognition of electronic unit, it is characterized in that
When installation head is in the reference position of electronic unit shooting, described electronic unit is taken, produce the view data of benchmark,
Be in from described reference position when directions X and Y square have moved on the position behind the preset distance in installation head, described electronic unit taken, produce captured image data,
The view data and the described captured image data of described benchmark are synthesized, thereby obtain being higher than the view data of the resolution of the resolution that described CCD has.
2. image-data generating method as claimed in claim 1, it is characterized in that, be that focal position with the shooting light path of described electronic unit moves the corresponding displacement of 1/2 pixel at the sensitive surface of described CCD to the predetermined displacement of described directions X or Y direction.
3. image-data generating method utilizes the substrate identification that remains on the installation head with cameral CCD the desired position of substrate to be taken, and generates the view data of using for the image recognition of substrate, it is characterized in that,
When installation head is in the reference position of substrate shooting, described substrate is taken, produce the view data of benchmark,
Be in from described reference position when directions X and Y direction have moved the position behind the preset distance in installation head, described substrate taken, produce captured image data,
View data and described captured image data to described benchmark synthesize, thereby obtain being higher than the view data of the resolution of the resolution that described CCD has.
4. image generating method as claimed in claim 1 is characterized in that, is that focal position with the shooting light path of described substrate moves the corresponding displacement of 1/2 pixel at the sensitive surface of described CCD to the predetermined displacement of described directions X or Y direction.
5. apparatus for mounting component is characterized in that, utilizes the described image-data generating method of claim 1 to 4 to generate the view data of electronic unit identification usefulness and/or substrate identification usefulness.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005089903A JP2006269992A (en) | 2005-03-25 | 2005-03-25 | Image data forming method and components mounting apparatus using it |
| JP089903/2005 | 2005-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1838730A true CN1838730A (en) | 2006-09-27 |
Family
ID=37015973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610005108 Pending CN1838730A (en) | 2005-03-25 | 2006-01-12 | Image data generation method and element installation apparatus using the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006269992A (en) |
| CN (1) | CN1838730A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902902A (en) * | 2009-05-29 | 2010-12-01 | Juki株式会社 | Electronic parts installation apparatus |
| CN101902567B (en) * | 2008-12-08 | 2013-03-13 | 索尼株式会社 | Imaging apparatus and imaging method |
| CN105993212A (en) * | 2013-12-02 | 2016-10-05 | 富士机械制造株式会社 | Assembly machine |
| CN107135335A (en) * | 2016-02-29 | 2017-09-05 | 致伸科技股份有限公司 | Obtain the method for image and the Extraction of Image device and electronic installation of application this method |
| CN108348143A (en) * | 2015-10-30 | 2018-07-31 | 索尼公司 | Information processing unit, information processing method and endoscopic system |
| CN112530821A (en) * | 2019-09-19 | 2021-03-19 | 捷进科技有限公司 | Chip mounting device and method for manufacturing semiconductor device |
-
2005
- 2005-03-25 JP JP2005089903A patent/JP2006269992A/en not_active Withdrawn
-
2006
- 2006-01-12 CN CN 200610005108 patent/CN1838730A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902567B (en) * | 2008-12-08 | 2013-03-13 | 索尼株式会社 | Imaging apparatus and imaging method |
| CN101902902A (en) * | 2009-05-29 | 2010-12-01 | Juki株式会社 | Electronic parts installation apparatus |
| CN101902902B (en) * | 2009-05-29 | 2015-04-01 | Juki株式会社 | Electronic parts installation apparatus |
| CN105993212A (en) * | 2013-12-02 | 2016-10-05 | 富士机械制造株式会社 | Assembly machine |
| CN105993212B (en) * | 2013-12-02 | 2018-11-02 | 株式会社富士 | Kludge |
| CN108348143A (en) * | 2015-10-30 | 2018-07-31 | 索尼公司 | Information processing unit, information processing method and endoscopic system |
| CN108348143B (en) * | 2015-10-30 | 2020-11-03 | 索尼公司 | Information processing apparatus, information processing method, and endoscope system |
| US11744440B2 (en) | 2015-10-30 | 2023-09-05 | Sony Corporation | Information processing apparatus, information processing method, and endoscope system for processing images based on surgical scenes |
| CN107135335A (en) * | 2016-02-29 | 2017-09-05 | 致伸科技股份有限公司 | Obtain the method for image and the Extraction of Image device and electronic installation of application this method |
| CN112530821A (en) * | 2019-09-19 | 2021-03-19 | 捷进科技有限公司 | Chip mounting device and method for manufacturing semiconductor device |
| CN112530821B (en) * | 2019-09-19 | 2024-01-23 | 捷进科技有限公司 | Chip mounting apparatus and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006269992A (en) | 2006-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1568262B1 (en) | Electronic parts mounting apparatus and method | |
| CN1838730A (en) | Image data generation method and element installation apparatus using the same | |
| CN1501770A (en) | Correcting method and apparatus for electronic components mounting apparatus | |
| JP4809799B2 (en) | Mounting machine, mounting method thereof, and moving method of board imaging means in mounting machine | |
| CN101067709A (en) | Image shake and correction apparatus and method | |
| CN1196873A (en) | Electronic part mounting apparatus | |
| CN1822644A (en) | Image acquiring method, image acquiring apparatus and device with image acquiring apparatus | |
| CN1780551A (en) | Shifting device, surface installation apparatus, error list generating method, program and memory medium | |
| CN1759644A (en) | Electronic component mounting device | |
| CN1849038A (en) | Manufacturing installation of substrate for element mounting | |
| CN1708218A (en) | Maintenance management apparatus for electronic parts assembling apparatus | |
| CN1402610A (en) | Electronic part installing method and device | |
| CN1723749A (en) | Electronic component placement machine and electronic component placement method | |
| CN1576931A (en) | Lens integral photographic device, producing method and apparatus thereof | |
| CN1756476A (en) | Element mounting method and apparatus | |
| CN1828462A (en) | Parts loading device and demonstration method for position adjustment | |
| CN1766738A (en) | Method and apparatus for recording images on deformed image-recordable object | |
| CN1384704A (en) | Parts installation device | |
| JP4704218B2 (en) | Component recognition method, apparatus and surface mounter | |
| CN1834836A (en) | Method for shorten base board identify time and part carrying device use this method | |
| JP4540837B2 (en) | Electrical component mounting system and method for obtaining relative positional relationship thereof | |
| JP3242528B2 (en) | Component recognition device for mounting machine | |
| JP2565263Y2 (en) | Imager for solder inspection | |
| JPH07307598A (en) | Electronic part mounting device and electronic part mounting method | |
| JP2003269929A (en) | Device for inspecting defect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |