CN1838027A - Computer heat radiation system and heat radiation method - Google Patents

Computer heat radiation system and heat radiation method Download PDF

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Publication number
CN1838027A
CN1838027A CN 200510055796 CN200510055796A CN1838027A CN 1838027 A CN1838027 A CN 1838027A CN 200510055796 CN200510055796 CN 200510055796 CN 200510055796 A CN200510055796 A CN 200510055796A CN 1838027 A CN1838027 A CN 1838027A
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fan
heat radiation
computer
mainboard
aerated area
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CN 200510055796
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CN100447708C (en
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辛伯勇
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Abstract

This invention relates to a computer heat radiation system and heat radiation method. Wherein, using a first fan to cool the CPU and the core zone of main board, arranging a first ventilation area opposite to the first fan on the free area arranged on the case front board far away the core zone by the cooling system storage element, and a second ventilation area arranged the case back board. This invention improves the air channel of computer system to let the air flow in CPU unheated by other parts and solve the cooling of memory, increases system cooling efficiency, and reduces system noise and the device cost.

Description

Computer heat radiation system and heat dissipating method
Technical field
The present invention relates to computer realm, particularly a kind of computer heat radiation system and heat dissipating method.
Background technology
Along with computer technology rapid development, the integrated level of CPU (central processing unit) and chipset is more and more higher, and power consumption and thermal value are increasing.For guaranteeing the operate as normal of computer system, need higher requirement be proposed to the heat radiation of computer system.And present most computer system still adopts air-cooled mode to dispel the heat, the Basic Ways that solves computer system heat radiation is the unit interval heat dissipation capacity of raising system and the radiating efficiency that improves system, just the heat that system produced is discharged as early as possible, allow system air quantity as much as possible take away heat.The maximum heat radiation elements of computer system is CPU, it also is the focus that system radiating solves, computer system in the past is not because heat radiation contradiction is very outstanding, the air flow of the air intake vent of the CPU radiating fin of computer system often passes through the heating of other components and parts, temperature is higher, so just increase demand, the cost of heat radiator and fan is improved CPU radiating fin and fan.Simultaneously, the heat that CPU radiating fin sheds can not be by the distinguished and admirable system that discharges smoothly, and distinguished and admirable have bigger impact with the inside computer system device, and noise increases, and radiating effect reduces.
Summary of the invention
The problem that the present invention solves provides a kind of computer heat radiation system, is the defective that core removes to adjust the heat dissipation wind channel of computer system to solve in the prior art not with the CPU heat radiation.
In order to address the above problem, the invention discloses a kind of computer heat radiation system, comprising: first fan and CPU radiating fin, described first fan are used for to CPU and the heat radiation of mainboard nucleus, and this system also comprises:
First aerated area, be arranged on the vacant zone of the front panel that faces toward with first fan, and the case front panel that the storage unit of the vacant zone of this front panel by described computer heat radiation system is installed on this computer heat radiation system forms away from mainboard nucleus one side;
Second aerated area is arranged on the rear panel of the described cabinet that faces toward with first fan.
Described cooling system also comprises second fan, and described second fan is used to hard disk or/and the heat radiation of PCI outer plug-in card.
Described first fan is bigger than the blast and the air quantity of second fan.
Between described first fan and described CPU radiating fin, also comprise a fan housing, be used to carry out distinguished and admirable concentrating.
Described first aerated area and second aerated area comprise a plurality of shapes air vent arbitrarily.
Described first aerated area, described first fan, described second aerated area and mainboard core heat dissipation region are point-blank.
Described second aerated area is positioned at I/O catch behind the mainboard.
Described storage unit comprises at least one hard disk.
Described storage area comprises computer floppy drive.
In addition, the invention discloses a kind of heat dissipating method of computer system, this method is: the storage unit of computer system is installed on the case front panel of this computer system away from mainboard nucleus one side, on the front panel of described cabinet, the vacant zone that faces toward with first fan of giving the heat radiation of CPU and mainboard nucleus is provided with first aerated area; And on the rear panel with described cabinet, the vacant zone that faces toward with described first fan is provided with second aerated area.
Compared with prior art, the present invention has the following advantages:
The present invention makes the air-flow that enters CPU radiating fin substantially without other parts heating by the air channel of improvement computer system.When solving the CPU heat radiation, well realize the heat radiation of internal memory, radiating efficiency raising, the system noise of computer system are reduced, and reduce the cost of radiating element.
Description of drawings
Fig. 1 is the first example structure figure of computer system of the present invention;
Fig. 2 is the cut-open view of Fig. 1 along the A-A direction;
Fig. 3 A is the rear panel view of first embodiment of computer system of the present invention;
Fig. 3 B is the front-panel view of first embodiment of computer system of the present invention;
Fig. 4 is the second example structure figure of computer system of the present invention;
Fig. 5 is the front-panel view of the 3rd embodiment of computer system of the present invention;
Fig. 6 is the front-panel view of the 4th embodiment of computer system of the present invention.
Embodiment
Principle of the present invention is exactly the layout of reasonably optimizing parts on the basis of active computer framework, the gas flow temperature of CPU radiating fin air intake vent is tried one's best without the heating of components and parts such as hard disk, reduce CPU radiating fin and radiator fan air intake vent temperature, simultaneously, increase louvre by vacant zone at mainboard I/O (I/O) catch, the distinguished and admirable part of system can flow out computer system along straight line substantially smoothly, thereby improves computer system heat radiation efficient, reduces system noise.
Embodiment below in conjunction with accompanying drawing illustrates ultimate principle of the present invention.
With the 5U computer system that meets the SSI standard is example, and in conjunction with Fig. 1, Fig. 3 A and Fig. 3 B the structure of present embodiment is described.The basic device that comprises existing computer system: power supply 101, the 3rd I/O catch 114 behind zone 102, internal memory 103, CPU radiating fin 104, first fan 105, button and pilot lamp 106, five cun equipment 107, four-way wind zone 108, second fan 110, hard disk 111, floppy drive 113 and the mainboards that ventilates, described floppy drive 113 and hard disk 111 may be summarized to be memory cell region; Also comprise improvement of the present invention: memory cell region is arranged on the left front below of cabinet, and physical location is installed in the side of case front panel away from the mainboard nucleus according to the mainboard set positions of computing machine; And increase by first aerated area 112 and second aerated area 109.
The heat radiation of this computer system is from the case front panel air draught by first fan 105 and second fan 110, finish heat radiation from the air-out of cabinet rear panel, wherein first fan 105 is CPU zones, is the main radiator fan of the electric current and voltage adjustment module of CPU power supply and internal memory 103 etc., is the most important radiator fan of computer system.PCI (peripheral interconnect equipment) outer plug-in card that second fan 110 is mainly on hard disk 111 and the mainboard dispels the heat.The big multi-air intake of computer system in the past is chosen in memory cell region, the wind that enters first fan 105 is heated by hard disk 111, make the radiating effect variation of CPU and internal memory 103, wherein, described memory cell region comprises: hard disk 111, floppy drive 113 or CD-ROM drive etc.
Present embodiment is by adjusting the position of hard disk 111, memory cell region is arranged on the left front below of cabinet, and increase by first aerated area 112, the air intake as much as possible of first fan 105 is directly entered by first aerated area 112, reduce the air intake vent temperature of CPU radiating fin 104 greatly, for example, can reduce by 3~5 ℃ through experimental results show that.Like this, square one just reduces the radiating requirements to CPU radiating fin 104 and fan down, reduces the heat radiation cost, and the heat radiation of the feed circuit of CPU is had a good guarantee.In addition, because the I/O catch only has mainboard I/O catch interface less than the area of half behind most at present mainboards, so can reserve second aerated area 109 in remaining zone, flow through like this air-flow behind the CPU radiating fin 104 particularly just can directly directly shed for the air-flow of other devices heat radiations on internal memory 103 and the mainboard along the mainboard surface smoothly by second air vent 109.If there is not second aerated area 109 on the mainboard I/O catch, flow through air-flow behind the CPU radiating fin 104, comprising along the mainboard surface just directly to discharge for the air-flow of other radiating element heat radiations on internal memory 103 and the mainboard, must discharge through the 3rd ventilation zone 102 and four-way wind zone 108, so not only whole computer system is ventilated not smooth, and behind the distinguished and admirable bump mainboard of the part of the system I/O catch bigger backflow phenomenon is arranged, reduce radiating effect, increase system noise.
Hard disk 111 heat radiations of native system are to pass through hard disk 111 air intakes by second fan 110, mainly discharge from four-way wind zone 108, and the heat radiation of external pci card is also mainly finished by second fan 110.Because the raising of radiating efficiency, fan among the present invention can be selected for use lower slightly than indexs such as the rotation speed of the fan that uses in the conventional computer system, blast, and because second fan 110 can be more lower slightly than the performance of first fan 105, for example: blast, air quantity etc., to save cost.In addition, in order to reach better radiating effect, can make described first aerated area, first fan 105, described second aerated area and mainboard core heat dissipation region point-blank.Aerated area of the present invention is made up of a plurality of air vents, the shape of air vent, size and put in order can be according to the vacant set positions on the panel.
In addition, Fig. 2 be Fig. 1 at A-A direction cut-open view, indicate that in the figure the direction of heat radiation process apoplexy is being pasted mainboard along streamlined flow.
The second embodiment of the present invention comprises power supply 501, internal memory 502, CPU radiating fin 503, first fan 504, floppy drive 505, second fan 507 as shown in Figure 4.In addition, improve on the basis, between first fan 504 and CPU radiating fin 503, increase wind scooper 506 at first embodiment.When the passive heat radiation mode is adopted in the heat radiation of CPU, carry out distinguished and admirable concentrating with a wind scooper 506 between the heat radiator 503 of first fan 504 and CPU, the upper surface along mainboard that to concentrate more through the air-flow behind the heat radiator blows out like this, and this moment, second aerated area 109 seemed more important.
When system need support more hard disk, for example 10, front panel layout cardinal rule was constant, allow exactly system the core heat dissipation region the air inlet gas flow temperature as much as possible not through other parts heating of system.As shown in Figure 4, make the hard disk quantity of the first half in hard disk district as far as possible few to increase the quantity of air vent.When memory cell region comprises the polylith hard disk, the structure of front panel as shown in Figure 6, comprise: button or pilot lamp 701, five cun equipment 702, hard disk 703 and first aerated areas 704, polylith hard disk 703 is fixed on the lower left as far as possible, makes first aerated area 704 be positioned at a side near mainboard.When memory cell region comprises polylith hard disk and floppy drive, the structure of front panel as shown in Figure 5, comprise: button or pilot lamp 601, five cun equipment 602, floppy drive 605, hard disk 603 and first aerated areas 604, floppy drive 605 is fixed on the lower left with hard disk 603 as far as possible, makes first aerated area 604 be positioned at a side of close mainboard.The area of first aerated area 604 can change according to the size of remaining space, but the center should be relative with first fan, preferably makes first aerated area 604, first fan and second aerated area on same straight line.
System provided by the present invention is because the design of system air inlet is more reasonable, and the air-flow that enters CPU radiating fin is substantially without other parts heating, so system reduces the performance requirement of heat radiator, the cost of every heat radiator can reduce; Use system provided by the present invention because the air channel is more reasonable, smooth and easy, windage is low, so system fan can be selected the fan that blast is lower and rotating speed is lower, to reduce noise.So under the square one, the high noisy of system can reduce by 3~5dB, the fan cost reduces simultaneously; Use system provided by the present invention since distinguished and admirable can be very concentrated along smooth and easy the flowing through in mainboard surface, so can effectively reduce the surface temperature of internal memory and CPU supply current Voltage Regulator Module, can reduce by 5~10 ℃ through experiment showed.
The present invention includes a kind of heat dissipating method of computer system in addition, be specially: the storage unit of computer system is installed on the case front panel of this computer system away from mainboard nucleus one side, on the front panel of described cabinet, the vacant zone that faces toward with first fan of giving the heat radiation of CPU and mainboard nucleus is provided with first aerated area; And on the rear panel of described cabinet, the vacant zone that faces toward with described first fan is provided with second aerated area.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (10)

1, a kind of computer heat radiation system comprises first fan and CPU radiating fin, and described first fan is used for it is characterized in that to CPU and the heat radiation of mainboard nucleus, also comprises:
First aerated area, be arranged on the vacant zone of the front panel that faces toward with first fan, and the case front panel that the storage unit of the vacant zone of this front panel by described computer heat radiation system is installed on this computer heat radiation system forms away from mainboard nucleus one side;
Second aerated area is arranged on the rear panel of the described cabinet that faces toward with first fan.
2, computer heat radiation system as claimed in claim 1 is characterized in that, described cooling system also comprises second fan, and described second fan is used to hard disk or/and the heat radiation of PCI outer plug-in card.
3, computer heat radiation system as claimed in claim 2 is characterized in that: described first fan is bigger than the blast and the air quantity of second fan.
4, computer heat radiation system as claimed in claim 1 is characterized in that, also comprises a fan housing between described first fan and described CPU radiating fin, is used to carry out distinguished and admirable concentrating.
5, computer heat radiation system as claimed in claim 1 is characterized in that: described first aerated area and second aerated area comprise a plurality of shapes air vent arbitrarily.
6, computer heat radiation system as claimed in claim 1 is characterized in that: described first aerated area, described first fan, described second aerated area and mainboard core heat dissipation region are point-blank.
7, computer heat radiation system as claimed in claim 1 is characterized in that: described second aerated area is positioned at I/O catch behind the mainboard.
8, computer heat radiation system as claimed in claim 1 is characterized in that: described storage unit comprises at least one hard disk.
9, computer heat radiation system as claimed in claim 1 is characterized in that: described storage area comprises computer floppy drive.
10, a kind of heat dissipating method of computer system, it is characterized in that, the storage unit of computer system is installed on the case front panel of this computer system away from mainboard nucleus one side, on the front panel of described cabinet, the vacant zone that faces toward with first fan of giving the heat radiation of CPU and mainboard nucleus is provided with first aerated area; And on the rear panel with described cabinet, the vacant zone that faces toward with described first fan is provided with second aerated area.
CNB2005100557961A 2005-03-21 2005-03-21 Computer heat radiation system and heat radiation method Active CN100447708C (en)

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Application Number Priority Date Filing Date Title
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CN1838027A true CN1838027A (en) 2006-09-27
CN100447708C CN100447708C (en) 2008-12-31

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7643284B2 (en) 2006-10-30 2010-01-05 Lenovo Singapore Pte. Ltd Housing temperature suppressing structure in electronic device and portable computer
CN101888512A (en) * 2010-06-28 2010-11-17 浙江大华技术股份有限公司 Hot-pluggable hard disk video recorder
CN102346525A (en) * 2011-04-18 2012-02-08 伍战中 Horizontal consolidated computer mainboard radiator
CN111090318A (en) * 2019-10-25 2020-05-01 苏州浪潮智能科技有限公司 Feedback heat dissipation method and device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5793608A (en) * 1996-06-11 1998-08-11 Sun Microsystems, Inc. Cooling system for enclosed electronic components
US6418018B1 (en) * 2000-12-21 2002-07-09 Foxconn Precision Components Co., Ltd. Heat removal system
US20040095723A1 (en) * 2002-11-15 2004-05-20 Enlight Corporation Internal heat sink construction for CPU cabinet

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7643284B2 (en) 2006-10-30 2010-01-05 Lenovo Singapore Pte. Ltd Housing temperature suppressing structure in electronic device and portable computer
CN101174172B (en) * 2006-10-30 2012-05-09 联想(新加坡)私人有限公司 Housing temperature suppressing structure in electronic device and portable computer
CN101888512A (en) * 2010-06-28 2010-11-17 浙江大华技术股份有限公司 Hot-pluggable hard disk video recorder
CN101888512B (en) * 2010-06-28 2012-09-05 浙江大华技术股份有限公司 Hot-pluggable hard disk video recorder
CN102346525A (en) * 2011-04-18 2012-02-08 伍战中 Horizontal consolidated computer mainboard radiator
CN111090318A (en) * 2019-10-25 2020-05-01 苏州浪潮智能科技有限公司 Feedback heat dissipation method and device
CN111090318B (en) * 2019-10-25 2021-12-24 苏州浪潮智能科技有限公司 Feedback heat dissipation method and device

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