CN1835135A

CN1835135A - Mfg. method of coating capacity

Info

Publication number: CN1835135A
Application number: CN 200510055547
Authority: CN
Inventors: 杨合卿
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-03-16
Filing date: 2005-03-16
Publication date: 2006-09-20

Abstract

The invention discloses a method for fabricating a kind of electric element including following steps: coating conductive resin between two welding spots on PCB; solidifying conductive resin; cutting out grooves in turning down type on the solidified surface of the conductive resin by laser; coating delectric material on the conductive resin cut, and solidifying the material; testing and correcting capacity and carrying out second times of test; coating insulating protective layer on the delectric material.

Description

The manufacture method of coating capacity

Technical field

The invention belongs to the manufacture method of electric component manufacture method, particularly a kind of coating capacity.

Background technology

As shown in Figure 1 and Figure 2, the manufacture of existing ceramic condenser is mainly in the surface coated electric conductor 11 ((Electrode) of several pieces ceramic sheets 1 (Ceramic Green Sheet), and an end that makes electric conductor 11 is close proximity to the transverse sides of ceramic sheet 1, the other end of electric conductor 11 is then apart from the suitable spacing of another transverse sides, after again several pieces ceramic sheets 1 being piled up pressing mutually with the relative direction of electric conductor 11, establish respectively with welding ends 12 in 1 liang of cross side of the ceramic sheet that piles up, so just constitute electric capacity 100.There is following shortcoming in the existing manufacture method of this kind:

1, processing procedure is complicated, not only increases manufacturing cost, and is easy to generate defective products.

2, the electric conductor 11 that is coated with is predetermined capacity, behind whole capacitor 100 manufactured finishing, if there is the capacity error, then can't revise.

3, the equipment of Zhi Zaoing is huge, not only takes up space, and because of the investment of plant equipment causes and can't reduce cost, lacks competitiveness.

Summary of the invention

The purpose of this invention is to provide and a kind ofly simplify processing procedure, be beneficial to the capacity correction, reduce the manufacture method of the coating capacity of manufacturing cost.

The present invention comprises following steps:

The coating electroconductive resin is coated electroconductive resin between two solder joints of PCB; Solidify, electroconductive resin is solidified; Laser cutting, the electroconductive resin surface after solidifying goes out revolution folding shape groove with laser cutting; The coating dielectric material also solidifies, and the electroconductive resin coating dielectric material after cutting is solidified again; Test capacity is revised and second test; Be coated with layer of cloth, in dielectric materials layer coating insulating protective layer.

Wherein:

Curing schedule is heated to be solidified for the electroconductive resin that will coat PCB.

In coating dielectric material and the curing schedule, when the trench gap that forms in the laser cutting step is too small, after needing that dielectric resin extracted bubble in vacuum environment and being heated, be coated with in the infiltration mode.

Behind the coating dielectric material and curing schedule that is coated with in the infiltration mode after the heating, be coated with the electroconductive resin of the second layer again, to constitute double-deck electric capacity.

Because the present invention comprises following steps: the coating electroconductive resin, electroconductive resin is coated between two solder joints of PCB; Solidify, electroconductive resin is solidified; Laser cutting, the electroconductive resin surface after solidifying goes out revolution folding shape groove with laser cutting; The coating dielectric material also solidifies, and the electroconductive resin coating dielectric material after cutting is solidified again; Test capacity is revised and second test; Be coated with layer of cloth, in dielectric materials layer coating insulating protective layer.The present invention is except making the single electric capacity between PCB two solder joints, also electric capacity directly can be made on any insulating substrate with sufficient mechanical strength, and do not need as traditional capacitance, to weld, be that the present invention cooperates laser cutting with electroconductive resin, make electric capacity be fixed in PCB with coating method, remove that processing procedure is simple, consumptive material is few, do not need bulky equipment reducing outside the manufacturing cost, and be beneficial to the correction of capacity.Not only simplify processing procedure, be beneficial to the capacity correction, and reduce manufacturing cost, thereby reach purpose of the present invention.

Description of drawings

Fig. 1, be existing ceramic condenser decomposition texture schematic isometric.

Fig. 2, be existing ceramic condenser broken section structural representation stereogram.

Fig. 3, for manufacturing flow chart of the present invention.

Fig. 4, be coated with electroconductive resin step schematic diagram for the present invention.

Fig. 5, be coated with electroconductive resin step cutaway view for the present invention.

Fig. 6, cut electroconductive resin step schematic diagram one for the present invention.

Fig. 7, cut electroconductive resin step schematic diagram two for the present invention.

Embodiment

As shown in Figure 3, the present invention comprises following steps:

A, coating electroconductive resin:

As Fig. 4, shown in Figure 5, electroconductive resin 2 is coated between two

solder joints

31,32 of PCB 3.

B, curing:

The electroconductive resin 2 of coating PCB 3 is given heating cure.

C, laser cutting:

As Fig. 6, shown in Figure 7, electroconductive resin 2 surfaces after solidifying go out revolution folding shape groove 21 at interval with laser cutting.

D, coating dielectric material also solidify:

Electroconductive resin 2 coating dielectric materials after cutting, dielectric material is the high resin of insulativity.If when groove 21 gaps that form in the laser cutting step are too small, need dielectric resin 2 is extracted bubble in vacuum environment, obtaining more stable capacity, and if the gap is too small, dielectric material needs be coated with in the infiltration mode after heating.The dielectric material of coating is solidified.

E, test, correction and test again:

Test capacity; Suitably mend cutting with the change capacity, revise; Second test.

F, be coated with layer of cloth:

In dielectric materials layer coating insulating protective layer, increasing resistance to impact and temperature tolerance, and improve bond strength as resin, to remedy the relatively poor deficiency of conjugation of resin and PCB solder joint.

G, finish the electric capacity on the PCB solder joint.

The present invention is except making the single electric capacity between 3 liang of solder joints of

PCB

31,32, electric capacity can directly be made on any insulating substrate with sufficient mechanical strength, and do not need as traditional capacitance, to weld, and can be behind cutting of ground floor electroconductive resin and coating dielectric material, be coated with the electroconductive resin of the second layer again, to constitute double-decker, capacity is enlarged, improve range of application.

In sum, the present invention cooperates laser cutting with electroconductive resin, makes electric capacity be fixed in PCB with coating method, removes that processing procedure is simple, consumptive material is few, does not need bulky equipment reducing outside the manufacturing cost, and is beneficial to the correction of capacity.

Claims

1, a kind of manufacture method of coating capacity, its feature comprises following steps at it:

A, coating electroconductive resin are coated electroconductive resin between two solder joints of PCB;

Electroconductive resin is solidified in B, curing;

C, laser cutting, the electroconductive resin surface after solidifying goes out revolution folding shape groove with laser cutting;

D, coating dielectric material also solidify, and the electroconductive resin coating dielectric material after cutting is solidified again;

E, test capacity are revised and second test;

F, be coated with layer of cloth, in dielectric materials layer coating insulating protective layer.

2, the manufacture method of coating capacity according to claim 1 is characterized in that described curing schedule is that the electroconductive resin that will coat PCB is heated to be solidified.

3, the manufacture method of coating capacity according to claim 1, it is characterized in that in described coating dielectric material and the curing schedule, when the trench gap that forms in the laser cutting step is too small, after needing that dielectric resin extracted bubble in vacuum environment and being heated, be coated with in the infiltration mode.

4, the manufacture method of coating capacity according to claim 3, it is characterized in that coating dielectric material and curing schedule that described heating back is coated with in the infiltration mode after, be coated with the electroconductive resin of the second layer again, to constitute double-deck electric capacity.