CN1819759A - Method and apparatus for producing a wiring board, including film-peeling - Google Patents

Abstract

A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process S2 and a peeling process S3. In the taping process S2, two sheets of substrate are supported and adjoined under the condition that the edges thereof are placed close to each other, and a tape is affixed so that the protective film may be connected on the edge of the substrate. In the peeling process S3, the protective films connected to each other are continuously peeled by sequentially lifting them via the tapes so that an interlayer insulation material may remain on the substrate.

Description

The method and apparatus that comprises the production terminal block that film is peeled off

Technical field

The present invention relates to a kind of being used for by making the method for terminal block, and relate to a kind of thin film peel-off device of by on the substrate of the insulation material layer of diaphragm protection diaphragm being peeled off from having of being used for from having by the process of on the substrate of the insulation material layer of diaphragm protection this diaphragm being peeled off.

Background technology

Traditionally, the process of making terminal block is included in the process that forms insulation material layer on the surface of substrate.The example of this process is included in the step of insulating material film between laminated photosensitive resist film on the substrate surface, photosensitive or thermoset layer.The bearing film that the surface portion of insulation material layer is for example made by PET (PETG) covers.Each bearing film is laminated on the first type surface of each substrate.Therefore, must before the insulation material layer of handling combination, from the surface of insulation material layer, bearing film be peeled off.

In addition, there is a kind of process in another example as the process that forms insulation material layer on substrate surface, and this process forms insulation material layer by carrying out repeatedly liquid resist is applied to the process of substrate surface and makes it dry process.Even because the surface portion of insulation material layer also has viscosity to a certain degree drying after, thus must with the diaphragm covering of for example making by PET etc. it.Similar with bearing film, each diaphragm also is laminated on the first type surface of each substrate.Therefore, similar with the situation that will peel off bearing film, must from the surface of insulation material layer, diaphragm be peeled off so that insulation material layer is developed after its exposure in advance.

As the conventional method that is used to peel off this bearing film or diaphragm; for example in order on film, to form floating part; proposition is by making film move to film indentation (for example, referring to patent documentation 1) along the surface direction of film when knurling roller is rotated.In addition, the method that another proposed is: the film pressing element is moved to promote film along the surface direction of film, form floating part (for example, referring to patent documentation 2) thus thereon.

[patent documentation 1] Japanese patent application open (kokai) No.2000-86080 (Fig. 1 etc.)

[patent documentation 2] Japanese patent application open (kokai) No.H10-324454 (Fig. 2 etc.)

Summary of the invention

But, owing in the time will peeling off the film that is arranged on the substrate, need carry out the strip operation of identical with the substrate number (being the twice of this number) number of times when time on the both sides of film laminating at substrate, so can not improve the efficient of strip operation.In addition, because the quantity of institute's stripping film will be identical with the substrate number or more, the complexity so the collection of the film that separates will become.

Further, if when knurling roller or film pressing element are moved, applied excessive power, then because insulation material layer or substrate can will reduce output by vitiable high probability to film.Even further, even insulation material layer forms by being subjected to the also easy fragile material that damages of slight scraping.Therefore, the part of insulation material layer is broken easily and is become fragment, produces foreign particles thus.And, if these foreign particles attached on the insulation material layer, then the thickness of insulation material layer is inhomogeneous, this also is a factor that causes output to reduce.

The present invention considers these problems and finishes.First purpose of the present invention is to provide a kind of method that is used to make terminal block, and this method can realize operation is effectively peeled off and collected to diaphragm when preventing the output reduction.Second purpose of the present invention is to provide a kind of can prevent when output from reducing the thin film peel-off device of operation is effectively peeled off and collected to diaphragm.

The means that are used to overcome the above problems (means 1) comprise a kind of equipment of by on the substrate of the insulation material layer of diaphragm protection diaphragm being peeled off from having of being used for, wherein this thin film peel-off device comprises: stripping machine can partly form device, and this stripping machine can partly form device and form stripping machine meeting part so that peel off described diaphragm on the periphery of described diaphragm; Baseplate support device, this baseplate support device supports the substrate of a plurality of adjacency; Sticker, this sticker attach flexible band, make each described diaphragm can connected at the part place by the stripping machine on the described baseplate support device substrate supported; And mechanism for stripping, this mechanism for stripping can be peeled off these diaphragms continuously by utilizing described band to promote the described diaphragm that is connected by described band in proper order.

Therefore, in the thin film peel-off device of means 1, each diaphragm is connected by the band that depends on sticker.Mechanism for stripping promotes diaphragm in proper order by band then, thereby peels off diaphragm continuously.Therefore, owing to can carry out strip operation to a plurality of substrates, and can collective peel off diaphragm, therefore can effectively carry out the strip operation of diaphragm.In addition,, can collective remove a plurality of diaphragms owing to diaphragm is connected to each other by band, thus can be so that valid function.

In addition, in this equipment, owing to carry out strip operation after the band that will depend on sticker attaches, so the strip operation of diaphragm is not easy to damage insulation material layer or substrate, can prevent the output reduction thus.And, more little to the damage of insulation material layer, then because the issuable particle that breaks of the part of insulation material layer is few more.Therefore also can prevent owing to influence the output that particle the caused reduction of insulation material layer.

In addition, can be easy to partly to begin to peel off diaphragm from stripping machine, make diaphragm can connect at the part place at stripping machine because attach band by mechanism for stripping.

The suitable material that constitutes diaphragm is for having flexible resin, paper etc.Can consider damage minimum that they should cause insulation material layer, they cost rationally and they when forming thinly, have durability and wait and suitably select these materials.Some examples that are used for the resin material of diaphragm are PET resin (pet resin), EP resin (epoxy resin), PI resin (polyimide resin) etc.In addition, although the thickness of diaphragm is not particularly limited, can preference the thickness of 15 μ m to 50 μ m in this way.Therefore can peel off diaphragm easily.If the thickness of diaphragm is less than 15 μ m, then its part is retained on the insulation material layer easily, because diaphragm may be torn to shreds when peeling off.On the other hand, if the thickness of diaphragm greater than 50 μ m, its flexible may be impaired, may cause being difficult to remove diaphragm thus.And when diaphragm was coiled on the core main body, the core main body increased easily at the external diameter of coiling diaphragm part, may need frequently to change the core main body like this.

In addition, the stripping machine that forms in the periphery of diaphragm can partly preferably run through a plurality of through holes of diaphragm.In this case, owing to can around these through holes, form air pocket, so adhesion can not act between the part and substrate that is formed with air pocket.Therefore can peel off diaphragm from cavitation inception by mechanism for stripping easily.

In addition, although the internal diameter of through hole is not particularly limited, its internal diameter preference is as in the scope of 0.1mm to 1.5mm, more preferably from 0.5mm to 1.0mm.If the diameter of through hole is 0.1mm or littler, may be not enough to peel off diaphragm, because only to form very little air pocket from cavitation inception.When the diameter of through hole is 1.5mm or when bigger, may crackle appear in the edge of through hole when forming through hole.

In addition, these through holes preferably are arranged to straight line along the edge at direct of travel side place of diaphragm, and are arranged to a row vertical with the direct of travel of substrate.If have into a plurality of through holes of two or more rows perpendicular to the direct of travel of substrate, the part that then constitutes terminal block in insulation material layer may be damaged, because owing to form insulation material layer that through hole damaged and the zone of substrate may be extended.

It may be noted that the distance 1.0mm to 10mm preferably between the center of adjacent through-holes, be more preferably 2.5mm to 7.5mm.If the distance between these centers then may be only to peel off the part that is formed with air pocket less than 2.5mm, remainder may be retained on the insulation material layer.If the distance between these centers greater than 7.5mm, may be difficult to band is attached on the entire portion that is formed with air pocket in taping process.

Substrate can be the substrate that mainly is made of resin material or ceramic material.Some examples of this substrate comprise EP resin (epoxy resin) substrate, PI resin (polyimide resin) substrate, BT resin (bismaleimide-triazine resin) substrate, PPE resin (polyphenylene oxide resin) substrate etc.In addition, the substrate that can adopt the composite material by these resins and organic fiber to constitute, described organic fiber for example is glass fibre (glass cloth or non-woven glass cloth) and Fypro.Perhaps, can constitute substrate by resin-resin composite materials, this resin-resin composite materials form make thermosetting resin for example epoxy resin impregnated for example continuous poriferous PTFE of three-dimensional netted fluorocarbon resin base material.And mainly the example of the substrate that is made of ceramic material is by the ceramic material substrate that constitutes of aluminium oxide, aluminium nitride, boron nitride, carborundum and silicon nitride for example.

In addition, substrate has the shape that is roughly rectangle, and four sides preferably have 60cm or littler length.If length is greater than 60cm, the total amount of the diaphragm of removing from substrate can become too big, thereby rolling and collecting of diaphragm may be not easy.And, although diaphragm connects by band, may be difficult to they are peeled off continuously.

Baseplate support device can comprise for example member of roller, is used for the locational while conveying substrate of base plate supports in the cardinal principle level.In baseplate support device, preferred only in a plurality of substrate adjacency (just only in the substrate of location) prepare to be used for the support unit of supporting substrate.The object lesson that is used for the mechanism of supporting substrate is an actuator etc., and wherein in the substrate of location, support unit upwards promotes, thus contact substrate, and in the delocalization substrate, support unit moves down, thus separate with substrate.In this manner, because support unit supporting substrate when the location, therefore can be so that accurately locate substrate.And when the delocalization substrate (for example, when substrate is sent to back-end process), support unit can not interfered substrate by contact.Therefore, can transmit these substrates reposefully.

Be used to suitable material comprise resin, paper etc.These materials can be considered that its flexibility waits and select.Do not have flexible material if adopt, then may cause being difficult to correctly roll and collecting the diaphragm that is connected by these bands.In addition, can consider cost and the durability etc. of material when forming thinly.Be used to some examples of resin material of base material comprise PET resin (pet resin), polyvinyl chloride resin (polyvinyl chloride resin), EP resin (epoxy resin), PI resin (polyimide resin) etc.In addition, if the base material of band is by forming with the diaphragm identical materials, can be so that the separation of material and utilization again.

And the band that attaches in taping process can have or not have viscous layer at the reverse side of base material.But preferred band has viscous layer.By this way, owing to when attaching, do not need to have the adhesive material of the reverse side that is applied to band, therefore can effectively carry out taping process.And, when attaching band, not needing heat treatment, therefore can not take place because the adverse effect to insulation material layer that heating causes can be avoided the reduction of output thus.

Some examples with band (adhesive tape) of viscous layer comprise glass paper tape, vinyl tape, aluminium strip etc.Specifically, the glass paper tape may cause the damage of substrate hardly, and it is relatively cheap, and can have durability when forming thinly.On the other hand, the example that does not have a band of viscous layer can be a paper tape etc.

In addition, in sticker, band not only can be attached to the periphery of diaphragm, and can attach so that band can arrive the mode of the core of diaphragm.But band preferably only is pasted to the periphery of diaphragm.By this way, owing to do not need the long connection diaphragm that brings, therefore can reduce employed band amount.And, in sticker, preferably band is pasted to the part part that forms stripping machine meeting part, specifically form the part of air pocket around through hole.By this way, can never can exist with the cavitation inception of the adhesion of substrate and peel off diaphragm, thus can be so that strip operation.

And sticker preferably includes: the band feeding mechanism, and this band feeding mechanism is emitted band; Band shearing device, this band shearing device cut off the band that the band feeding mechanism is supplied; And the band pressue device, this band pressue device will be pressed on the edge of substrate with the band that feeding mechanism is supplied.

Band feeding mechanism in the periphery office of diaphragm can be emitted band along the direction vertical with the direct of travel of substrate or along the direct of travel of substrate.But, preferably emit band along the direct of travel of substrate.By this way, owing to do not need the long connection diaphragm that brings, therefore can reduce employed band amount.In addition, when emitting band, preferably band is pasted to two or more a plurality of position connecting diaphragm along the direct of travel of substrate.If bring the connection diaphragm by what only be pasted to a position, when promoting diaphragm by band, tension force may be concentrated on tape.This may cause with separation or break, increase the possibility that diaphragm separates thus.

Mechanism for stripping preferably includes: draw-gear, and this draw-gear is the traction protection film on the direction that promotes the diaphragm that is connected by band; Deflector roll, this deflector roll are oriented to contact the still unstripped diaphragm that is arranged on the substrate, and this deflector roll guides to the draw-gear side along the periphery of deflector roll with diaphragm; And the deflector roll detent mechanism, this deflector roll detent mechanism location deflector roll makes the rotation of deflector roll can be positioned adjacent to the center of substrate rather than the edge of substrate.

Because deflector roll is oriented to the contact protection film, therefore can when rising, diaphragm not be raised by protective substrate.It is hereby ensured that the substrate that will remove diaphragm is delivered to back-end process.And, if being located such that the rotation of deflector roll, deflector roll can be positioned at the outside of substrate edges rather than the edge of substrate, then the some parts of diaphragm may be retained on the substrate.On the other hand,, locate deflector roll, thereby the rotation of deflector roll can be located near the center of substrate rather than the edge of substrate by the deflector roll detent mechanism according to the present invention.In this case, can guarantee to peel off diaphragm from substrate.

In addition, thin film peel-off device preferably includes: substrate position detection apparatus is used for detecting the position at edge of the substrate of baseplate support device; And base positioner, this base positioner wherein is provided with the gap according to locating substrate from the testing result of described substrate position detection apparatus between the edge of substrate.This be because: when peripheral overlapping and edge substrate of diaphragm and substrate contacted with each other, diaphragm may be hidden under the base plate bottom, made that like this stripping process is difficult to carry out.In addition, by this way, because base positioner it is hereby ensured between the edge of substrate to be provided with the gap according to the position of adjusting substrate from the testing result of described substrate position detection apparatus.

In addition, thin film peel-off device preferably includes: the film rolling lifting device is used to roll and collect the diaphragm that mechanism for stripping is peeled off.If the diaphragm of having peeled off is fallen in the dustbin, collected diaphragm possibility volume is very big, may produce about the diaphragm disposal concerns thus.On the other hand, in film mechanism for stripping of the present invention, diaphragm can be rolled compactly collecting, thereby makes its easy disposal.

The film rolling lifting device preferably includes: the core main body, coil the diaphragm of peeling off by mechanism for stripping at this core main body place; The core subject support means, this core subject support means supports described core main body and described core main body can be rotated; Core main body drive unit, this core main body drive unit rotation drives described core main body; And clutch, this clutch is adjusted at the transfer amount of the rotary driving force between described core main body and the described core main body drive unit.By this way, diaphragm is coiled on the core main body, and if coiling have the external diameter of the core main body of diaphragm to become big, can reduce the rotary speed of core main body by the transfer amount that clutch reduces rotary driving force.Therefore, the circumferential speed of diaphragm can be remained on diaphragm and be stripped from the identical level of speed that mechanism peels off.Therefore, can prevent because the circumferential speed of the acceleration of diaphragm causes the disconnection of band.

In addition, the core main body preferably is supported for the core main body can be pulled down from the core subject support means.By this way, for example, be coiled on the core main body and when the core main body reaches restriction, can continue to collect diaphragm reposefully by changing the core main body at diaphragm.

The suitable material that is used for the core main body can be made of metal, resin, paper etc.Specifically, resin, paper etc. can be easy to abandon.In addition, if the core main body is by forming with the diaphragm identical materials, can be so that the separation of material and utilization again.Some examples that are used for the resin material of core main body comprise PET resin (pet resin), EP resin (epoxy resin), PI resin (polyimide resin) etc.

In addition, when all diaphragm being set on the both sides at substrate, preferably has switching mechanism, substrate overturn after arbitrary diaphragm of this switching mechanism in peeling off these diaphragms.In this case, if, can carry out strip operation to the diaphragm that is arranged on the substrate opposite side, thereby peel off two diaphragms by the overturn substrate of the diaphragm of peeling off a side of switching mechanism.And, the diaphragm on the both sides that are arranged on substrate be can peel off and station-keeping mode for example sticker and mechanism for stripping do not changed.In addition, thin film peel-off device preferably includes the substrate gigback, and this substrate gigback is back to sticker with the substrate that switching mechanism overturn.By this way, when needs are peeled off the diaphragm that is arranged on the substrate both sides, can only need a cover sticker, mechanism for stripping etc.

In addition, the means that are used to address the above problem (means 2) are a kind of methods that is used for making by the process of from the substrate with insulation material layer of being protected by diaphragm diaphragm being peeled off terminal block, wherein this method comprises: taping process, this taping process is supported on a plurality of substrates of the edge of substrate being arranged to adjacency under the condition close to each other, and an above position flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing each band to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

Therefore, according to taping process, connect diaphragm by band according to the method for means 2.In stripping process, promote diaphragm in proper order then, thereby peel off diaphragm continuously by band.Therefore, if a plurality of substrates are carried out strip operation so that diaphragm is peeled off by collective, then can effectively carry out strip operation.And, because band is connected to each other diaphragm, can collective remove a plurality of diaphragms, thus can be so that effective collection operation of diaphragm.

In addition, in the manufacture method of means 2, after attaching band, carry out strip operation according to taping process.Therefore the insulation material layer of substrate is not easy to be damaged because of the strip operation of diaphragm, can prevent to reduce output thus.And, more little to the damage of insulation material layer, then because the issuable particle that breaks of SI semi-insulation material layer is few more.Therefore can prevent also that the output that particle caused that influences insulation material layer from reducing.

In addition, the means that are used to address the above problem (means 3) are a kind of methods that is used for making by the process of from the substrate with insulation material layer of being protected by diaphragm diaphragm being peeled off terminal block, wherein this method comprises: stripping machine meeting part forming process, and this stripping machine can part forming process form stripping machine meeting part on the periphery of diaphragm; Taping process, this taping process are supported on stripping machine can part be arranged to a plurality of substrates of adjacency under the condition close to each other with the edge of substrate after the forming process, and attaches flexible band and make and can connect these diaphragms in the part place at stripping machine; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing band to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

In addition, the means that are used to address the above problem (means 4) are a kind of methods that is used for making by the process of from the substrate with insulation material layer of being protected by diaphragm diaphragm being peeled off terminal block, wherein this method comprises: forming process of through hole, and this forming process of through hole is by forming the through hole in the periphery that is arranged on diaphragm with for example needle-penetration; Taping process, this taping process are arranged to a plurality of substrates of adjacency under the condition close to each other with the edge of substrate after being supported on forming process of through hole, and attach flexible band, and the air pocket place that makes diaphragm form around through hole connects; And stripping process, this stripping process promotes diaphragm connected to one another in proper order by band and peels off these diaphragms continuously and insulation material layer is retained on the substrate after taping process.

Below, as the example that above-mentioned thin film peel-off device uses, the method for utilizing this thin film peel-off device to make terminal block is described.

For example, conveying has the substrate by the insulation material layer of diaphragm protection, can preferably carry out stripping machine meeting part forming process then, and this stripping machine can part forming process form stripping machine meeting part, as the chance of peeling off the diaphragm on its periphery.An example of stripping machine meeting part forming process is a forming process of through hole, and this forming process of through hole forms through hole by the periphery with the needle-penetration diaphragm.In this case, owing to can around these through holes, form air pocket, so adhesion can not act between the part and substrate that is formed with air pocket.Therefore can peel off diaphragm from cavitation inception by mechanism for stripping easily.

After forming process of through hole, carry out taping process.Specifically, at first, a plurality of substrates can be arranged in abutting connection with between the edge of substrate, providing the gap simultaneously.Attach flexible band then, thereby can connect diaphragm.In addition, taping process preferably includes band is released to band supply process on the diaphragm, cuts off the band cutting-off process of the band of being supplied and is being with band pressure process on the edge that the band of being supplied is pressed in after the supply process substrate after the band supply process.Specifically, can cut off the band cutting-off process of the band of being supplied after the supply process, can carry out then the band of being supplied is pressed in band pressure process on the edge of substrate at band.Therefore, thus attaching band connects diaphragm.In addition, band pressure process can be carried out after the band supply process, can be with cutting-off process afterwards.

In the band supply process, can emit band along the direction vertical or along the direct of travel of substrate with the direct of travel of substrate in the periphery office of diaphragm.But, preferably emit band along the direct of travel of substrate.By this way, owing to do not need the long connection diaphragm that brings, therefore can reduce employed band amount.In addition, when emitting band along the direct of travel of substrate, preferably will be with connecting the edge that two of diaphragm or more a plurality of position are pasted to substrate.If bring the connection diaphragm by what only be pasted to a position on the substrate edges, when promoting diaphragm by band, tension force may be concentrated on tape.This may cause with separation or break, may increase the possibility that diaphragm separates thus.

In addition, in taping process, band not only can be attached to the periphery of diaphragm, and can attach so that band can arrive the mode of the core of diaphragm.But band preferably only is pasted to the periphery of diaphragm.By this way, owing to do not need the long connection diaphragm that brings, therefore can reduce employed band amount.And, in taping process, preferably band is pasted to the part that forms air pocket around through hole.By this way, can never can exist with the cavitation inception of the adhesion of substrate and peel off diaphragm, thus can be so that strip operation.

In addition, in taping process, preferably the edge of substrate is arranged under the condition opposite each other with a plurality of base plate supports and in abutting connection with after attach band.Specifically, preferably supporting a plurality of substrates and band is being arranged to attach under the condition close to each other in the edge of these substrates.In addition, preferably between substrate edges, be provided with and attach band after the gap.If diaphragm and substrate is peripheral overlapping, this may cause the edge of substrate to contact with each other, and then diaphragm may be hidden under the substrate, makes that strip operation may be very complicated.

In addition, usually continuous conveying substrate.In this case, the gap size between the substrate is preferably from 0.7mm to 1.3mm.When the gap is 0.7mm or littler the time, the possibility that diaphragm may be hidden under the substrate may increase.On the other hand, when the gap is 1.3mm or bigger the time, may need the longer connection diaphragm that brings.Therefore, may increase cost because increasing the band amount of using.And, because portion's (only part of existence band) may be elongated a little less than when connecting diaphragm, therefore may easy tear-open strip.In addition, when substrate was not conveying continuously, the distance between the substrate preferably was set to be lower than (parallel with direct of travel) side edge length (for example 60cm) of substrate.

After taping process, can carry out stripping process so that on substrate, stay insulation material layer, this stripping process is peeled off diaphragm continuously by utilizing band to promote diaphragm connected to one another in proper order.In stripping process, deflector roll can be oriented to contact the still unstripped diaphragm that is provided with on substrate, and the rotation of deflector roll can be positioned adjacent to the center of substrate rather than the edge of substrate.Then, the diaphragm that can be connected by band along the periphery surface traction of deflector roll.By this way, can easily peel off diaphragm by mechanism for stripping.And, because stripping process does not need any heat treatment to diaphragm, therefore can prevent the sex change (for example thermmohardening) of insulation material layer in advance.

In stripping process; deflector roll is positioned to contact the still unstripped diaphragm that on substrate, is provided with and the rotation of deflector roll is positioned adjacent to the center of substrate rather than the edge of substrate in, the preferred diaphragm that is connected along the periphery surface traction belt of deflector roll.

By this way, can prevent that substrate floats when promoting diaphragm, because deflector roll is oriented to the contact protection film.Therefore, can guarantee that the substrate that will remove diaphragm is delivered to back-end process.And if the rotation of deflector roll is positioned in outside the edge of substrate, then diaphragm may not can be peeled off fully and may be retained on the substrate.On the other hand, according to the present invention, in stripping process, the rotation of deflector roll can be positioned adjacent to the center of substrate rather than the edge of substrate.In this case, can guarantee to peel off diaphragm from substrate.

In addition, preferably after stripping process, roll and collect the film turn-up process of the diaphragm of having peeled off.If the diaphragm of having peeled off is fallen in the dustbin, the diaphragm possibility volume of being lost is very big, may produce about the diaphragm disposal concerns thus.On the other hand, according to the present invention, diaphragm can be rolled compactly collecting, thereby can reduce the refuse amount.

In addition, can before forming process of through hole, carry out taping process.Just, after taping process, can carry out stripping process by being considered to attach the part of band and in forming process of through hole, forming through hole with for example needle-penetration.

According to this manufacture method, peel off diaphragm easily, therefore can effectively make terminal block.

In addition, terminal block can be to pile up Multi-layer Interconnection Board, has the accumulation horizon that is made of a plurality of interlayer insulating films and a plurality of conductive layer alternatively laminated, and wherein insulation material layer can be used to form these interlayer insulating films.

Description of drawings

Fig. 1 is a schematic diagram, demonstrates the thin film peel-off device according to an embodiment.

Fig. 2 is the top plane view of relevant portion, demonstrates the substrate that has by the interlayer dielectic of diaphragm protection.

Fig. 3 is a flow chart, demonstrates the summary of the manufacture process of terminal block.

Fig. 4 is the cutaway view of relevant portion, demonstrates the state after from diaphragm pin being pulled out.

Fig. 5 is the cutaway view of relevant portion, demonstrates at these substrates are adjacent when being provided with state.

Fig. 6 is the cutaway view of relevant portion, demonstrates the state when cutting off the band of being supplied by Tape cutter.

Fig. 7 is the cutaway view of relevant portion, demonstrates the state with band pressure roller pressure zone the time.

Fig. 8 is the cutaway view of relevant portion, demonstrates the state when diaphragm is peeled off.

Fig. 9 is the cutaway view of relevant portion, demonstrates the substrate after diaphragm is peeled off.

Figure 10 is a schematic diagram, demonstrates the clutch according to another embodiment.

Figure 11 is a schematic diagram, demonstrates the thin film peel-off device according to another embodiment.

The explanation of Reference numeral

The Reference numeral that is used for identifying the various architectural features of accompanying drawing comprises as follows:

The 1-thin film peel-off device

4-is as the film mechanism for stripping of mechanism for stripping

5-is as the labelling machine of sticker

7-is as the film roll-up mechanism of film rolling lifting device

The 12-diaphragm

14-is as the interlayer dielectic of insulation material layer

The 15-substrate

16-is as the through hole of stripping machine meeting part

The 17-air pocket

18, the edge of 19-substrate

The 20-gap

The 31-band

The 33-deflector roll

34-is as the paper tube of core main body

38-is as the carry-over pinch rolls of draw-gear

39-is as the motor that is used to drive paper tube of core main body drive unit

40-is as the paper tube back shaft of core subject support means

41-is as the base plate supports part of baseplate support device

57-can partly form the pin of device as stripping machine

61-is as the band organization of supply of band feeding mechanism

62-is as the Tape cutter of band shearing device

63-is as the band pressure roller of band pressue device

71,72-is as the substrate position detecting sensor of substrate position detection apparatus

The 81-clutch

S1-is as the forming process of through hole of stripping machine meeting part forming process

The S2-taping process

The S3-stripping process

S4-diaphragm collection process

Embodiment

Be elaborated about the thin film peel-off device that is used to make terminal block with reference to Fig. 1 to 10 below according to preferred embodiment.

Fig. 1 demonstrates the general thin peel-off device 1 according to preferred embodiment.This thin film peel-off device 1 comprises film puncturing mechanism 2, labelling machine 5 (sticker), film mechanism for stripping 4 (mechanism for stripping) and substrate output mechanism 3.Film puncturing mechanism 2 flows to labelling machine 5 with substrate 15 form through hole 16 in the diaphragm 12 of substrate 15 after, and substrate 15 has the interlayer dielectic 14 (insulation material layer) (referring to Fig. 4) by diaphragm 12 protections.Labelling machine 5 flexiblely makes the diaphragm 12 of these substrates 15 after can being connected to each other these substrates 15 be flowed to film mechanism for stripping 4 with 31 attaching.Thereby film mechanism for stripping 4 is with 31 substrate 15 to be flowed to substrate output mechanism 3 after peeling off diaphragm 12 continuously promoting by order by utilizing with 31 diaphragms that connect 12.Substrate output mechanism 3 will have been finished the substrate 15 of the stripping process of film mechanism for stripping 4 and discharge from thin film peel-off device 1.This thin film peel-off device 1 uses when multilayer is counted fat terminal block (terminal block) making according to the mode that forms accumulation horizon on substrate 15 to pile up.In addition, these accumulation horizons can be formed by the coarctate a plurality of interlayer insulating films of alternating layer and a plurality of conductive layer.

Fig. 2 and Fig. 4 demonstrate the substrate 15 as the operand of peel-off device 1.This substrate 15 for example has the substrate that is arranged on the conductive layer on its two sides for adopting for piling up the core substrate of multi-layer resinous terminal block.Interlayer dielectic 14 is set on the entire upper surface of substrate 15.This interlayer dielectic 14 for example is made of photonasty epoxy resin.In addition, the surface portion of interlayer dielectic 14 is subjected to 12 protections of the diaphragm made by for example PET (PETG).For some embodiment, the thickness of diaphragm 12 can be about 25 μ m.And, be formed on as a plurality of through holes 16 (stripping machine can part) of the chance of peeling off diaphragm 12 diaphragm 12 peripheral part on the lateral margin on the direct of travel of substrate.In certain embodiments, the diameter of through hole 16 can be about 1.0mm, and the distance between the center of adjacent through-holes 16 can be about 3mm.In addition, the distance between the lateral margin on the direct of travel at through hole 16 and substrate 15 can be about 6mm.In addition, each through hole 16 is arranged to straight line along the marginal portion on direct of travel 13 of diaphragm 12.And each through hole 16 is arranged to a row vertical with the direct of travel of substrate 15.These through holes 16 are corresponding with the position of pin 57 in film puncturing mechanism 2.

As shown in Figure 1, film puncturing mechanism 2 comprises a plurality of base plate supports rollers 8, pin 57 etc.Base plate supports roller 8 is from bottom support substrate 15, and rotates along with moving of substrate 15.Pin 57 (stripping machine can partly form device) is used to pierce through the peripheral part of diaphragm 12 to form through hole 16.When from diaphragm 12, pin 57 being pulled out, will around the through hole in being arranged on diaphragm 12 16, form air pocket 17 (referring to Fig. 4 to 8).

Shown in Fig. 1,2,6 and 7; in labelling machine 5; respectively will be with 31 two positions that are attached on the diaphragm 12 in a certain distance apart from one another, make diaphragm 12 be connected the edge 18 of substrate 15 and the edge 19 of another piece substrate 15 of being provided with along direct of travel between.That is to say that labelling machine 5 attaches is with 31, make and to be connected in diaphragm 12, being formed with the part of air pocket 17 and the peripheral part of the diaphragm 12 of another piece substrate 15 that is provided with along direct of travel.Some embodiment adopt the adhesive tape that has viscous layer at its reverse side with 31.

As shown in Figure 1, labelling machine 5 comprises band organization of supply 61 (band feeding mechanism).Band organization of supply 61 comprises band feed rolls 64, rubber rollers 65 and band deflector roll 66.Be with 31 by being used to emit along the direct of travel of substrate 15 with the band feed rolls 64 that the motor (not shown) of supply rotates.In addition, on the periphery surface of band feed rolls 64, prepare a plurality of uneven parts so that the reverse side of contact zones 31 (viscous layer side).Therefore, band feed rolls 64 and less with 31 contact surface, thus can prevent to be with 31 to be bonded on the band feed rolls 64.In addition, the surface of rubber rollers 65 contact zones 31 and along with rotating with 31 supply.In addition, be with 31 by rubber rollers 65 and the tightly clamping of band feed rolls 64.And, the reverse side of band deflector roll 66 contact zones 31 and along with rotating with 31 supply.Then, band deflector roll 66 will be given substrate 15 by 31 guiding of being with of band feed rolls 64 supplies.

In addition, comprise Tape cutter 62 (band shearing device) and band pressure roller 63 (band pressue device) at the labelling machine shown in Fig. 15.Tape cutter 62 is installed in the front end place of the bar that is positioned on the cylinder 67.This Tape cutter 62 moves up and down under the effect of cylinder 67, and cuts off 31 (referring to the Fig. 6) that are with by 64 supplies of band feed rolls.And band pressure roller 63 is installed in the front end place of the bar that is positioned on the cylinder 68, and moves up and down under the effect of cylinder 68.The contact of band pressure roller 63 by 64 supplies of band feed rolls with 31 surface in, band pressure roller 63 rotates and mobile (referring to Fig. 7) along the direct of travel of substrate 15 (direction of representing with arrow F1 and F2).Therefore, band pressure roller 63 will be pressed on the edge 18,19 of substrate 15 with 31.

As shown in Figure 1, the base plate supports part 41 (baseplate support device) that is used for supporting substrate 15 is formed between labelling machine 5 and the film mechanism for stripping 4.Base plate supports part 41 comprises substrate conveying roller 32, base plate supports roller 35 and support 45.The substrate conveying roller 32 that is rotated by the motor (not shown) that is used for transmitting substrate flows to film mechanism for stripping 4 with institute's substrate supported 15.Base plate supports roller 35 is from bottom support substrate 15, and rotates along with moving of substrate 15.Support 45 is from the edge 18 of following supporting substrate 15 with along the edge 19 of another piece substrate 15 of direct of travel.That is to say that the situation lower carriage 45 that is arranged close to each other at the edge 18,19 of substrate 15 supports two substrates 15.In other words, support 45 supports the substrate 15 of two adjacency, forms the gap simultaneously between the edge 18,19 of these substrates, and this gap is less than the length on the direct of travel of substrate 15 (length of side parallel with the direct of travel of substrate 15).Support 45 is installed in the front end place of the bar that is positioned on the cylinder 44, and moves up and down under the effect of cylinder 44.When substrate 15 was set, cylinder 44 moved up with the edge 18,19 of supporting substrate support 45.And when transmitting substrate 15, cylinder 44 moves down support 45.

In addition, substrate position detecting sensor 71,72 is arranged near the transport path (referring to Fig. 5) of substrate 15.Substrate position detecting sensor 71 comprises the luminous component 73 on the upside that is arranged on transport path and is arranged on light receiving part 74 on the bottom side of transport path whether the edge 18 at direct of travel side place that luminous component 73 and light receiving part 74 detect substrates 15 has moved and arrived the precalculated position.Substrate position detecting sensor 72 also comprises luminous component 75 and light receiving part 76, whether is positioned at the precalculated position so that detect the edge 19 of another piece substrate 15 that is arranged on direct of travel side place.In detail, substrate position detecting sensor 71,72 detect substrate edge 18,19 whether with gap 20 adjacency of nearly for example 1mm therebetween.

The motor that is used to transmit substrate makes substrate conveying roller 32 rotate so that the edge 18 of substrate 15 is moved according to the testing result of substrate position detecting sensor 71,72, thereby forms gap 20 between the edge 18 of these substrates and edge 19.Therefore, the motor that is used to transmit substrate has the function as base positioner.

As shown in Figure 1, film mechanism for stripping 4 is used for peeling off from cavitation inception diaphragm 12.Film mechanism for stripping 4 comprises a plurality of substrate control rolls 36 and a pair of distributing roller 46.Each substrate control roll 36 is arranged to the end face of contact substrate 15 respectively and bottom surface and by actuator (not shown) cylinder clamping substrate 15 tightly for example.Each substrate control roll 36 rotates along with moving of substrate 15.In addition, two distributing rollers 46 are clamping substrate 15 tightly from the end face of substrate 15 and bottom surface, and rotates along with moving of substrate 15.Two distributing rollers 46 are discharged to substrate transfer mechanism 3 sides with substrate 15.In addition, substrate transfer mechanism 3 mainly is made of a plurality of rubber rollers 6.These rubber rollers 6 are clamping substrate 15 and rotate along with moving of substrate 15 tightly from the end face of substrate 15 and bottom surface.

In addition, comprise deflector roll 33 and a pair of carry-over pinch rolls 38 (draw-gear) at the film mechanism for stripping 4 shown in Fig. 1.Located by the front end (along the edge of direct of travel) of film mechanism for stripping 4 substrate conveying 15, this deflector roll 33 is arranged to contact and is arranged on the diaphragm 12 of not being stripped from the substrate 15.Deflector roll 33 guides to carry-over pinch rolls 38 with diaphragm 12 along the periphery of deflector roll 33.Two carry-over pinch rolls 38 are clamping diaphragm 12 tightly from the end face of diaphragm 12 and bottom surface.And, promoting by traction protection film 12 on the direction of 31 diaphragms 12 that connect by being used for two carry-over pinch rolls 38 that the motor (not shown) of traction protection film drives.

As shown in Figure 1, thin film peel-off device 1 comprises film roll-up mechanism 7 (film rolling lifting device), and the diaphragm of being peeled off by film mechanism for stripping 4 12 is rolled and collected to this film roll-up mechanism 7.Film roll-up mechanism 7 comprises paper tube 34 (core main body) and paper tube back shaft 40 (core subject support means).Paper tube back shaft 40 supports dismountable paper tube 34.In detail, paper tube back shaft 40 can insert the center of paper tube 34 and remove from the center of paper tube 34.And the internal diameter of paper tube 34 is the external diameter of paper tube back shaft 40 no better than, thereby paper tube 34 and paper tube back shaft 40 cannot relatively rotate.Paper tube back shaft 40 is rotated by the motor 39 that is used to drive paper tube (core main body drive unit) as shown in fig. 10.Therefore, diaphragm 12 is coiled on the paper tube 34.

Next will describe adopting this thin film peel-off device 1 to make the method for piling up multi-layer resinous terminal block.

At first, adopt the punch process of drilling machine so that formation runs through the through hole (not shown) that this covers the copper laminate in the pre-position to covering the copper laminate.In addition, can come in covering the copper laminate, to form these through holes by the laser punch process that for example adopts YAG laser or carbon dioxide gas laser.Then, can be by for example carrying out according to for example the electroless plating copper and the electrolytic copper plating of the technology of conventional known form these through holes.In addition, can carry out etching to the both sides of covering the copper laminate that have Copper Foil on it forms so that by for example relief method first conductive layer is carried out pattern.Specifically, after carrying out electroless plating copper, can apply electrolytic copper plating to electroless plating copper layer as common electrode.In addition, can by expose and developing process according to predetermined pattern lamination and form dry film.In this state, can remove unnecessary electrolytic copper plating layer, electroless plating copper layer and Copper Foil by etching.Then, can be by peeling off the substrate 15 of dry film acquisition as double sided board.In addition, can form substrate 15 by semi-additive process.In detail, after electroless plating copper, can expose and developing process to form the anti-plate layer according to predetermined pattern.In this state, after the electroless plating copper layer as common electrode is applied electrolytic copper plating, can at first dissolve resist, and can remove any unnecessary electroless plating copper layer by etching.Therefore, can obtain substrate 15 as double sided board.

Then; after on the first type surface that film like interlayer dielectic 14 is formed on substrate 15, can diaphragm 12 laminations be had thereon on the first type surface of substrate 15 of described interlayer dielectic 14 by adopting the lamination process of the laminating machine of conventional known for example.In detail, at first make a plurality of substrate 15 level adjacency, and can cover the diaphragm 12 of the first type surface of whole base plate 15 by laminating machine (not shown) lamination.Then, the diaphragm 12 of institute's lamination can be cut into the size of every substrate 15.Afterwards, can carry out the exposure of interlayer dielectic 14.

Then, the substrate 15 with interlayer dielectic 14 of being protected by diaphragm 12 can be flowed to film puncturing mechanism 2.Then, can carry out at the forming process of through hole S1 shown in Fig. 3 (stripping machine meeting part forming process).In detail, can pierce through the peripheral part of diaphragm 12 in the lateral margin on direct of travel of peripheral part, to form through hole 16 with pin 57.Then, the through hole 16 that is being arranged on when therefrom pulling out pin 57 in the diaphragm 12 forms air pocket 17 (referring to Fig. 4) on every side.

After forming process of through hole S1, carry out taping process S2 (referring to Fig. 3).In detail, substrate 15 is flowed to film mechanism for stripping 4, and make a plurality of substrate 15 adjacency and location, between the edge 18,19 of these substrates 15, form gap 20 (referring to Fig. 5) simultaneously.Then, attach and to be with 31, make the part that can adopt labelling machine 5 to be connected to be formed with air pocket 17 in the diaphragm 12 and along the peripheral part (referring to Fig. 6 and 7) of the diaphragm 12 of another piece substrate 15 of direct of travel.Specifically, at first be with supply process S2-1 (referring to Fig. 3), band supply process S2-1 utilizes band feed rolls 64 will be with 31 to be released on the diaphragm 12.Can be with cutting-off process S2-2 then, band cutting-off process S2-2 cuts off 31 (referring to the Fig. 3 and 6) that are with that supplied by Tape cutter 62.After band cutting-off process S2-2, can be with pressure process S2-3, band pressure process S2-3 is with being with pressure roller 63 to be pressed on the edge 18 and 19 of substrate 15 (referring to Fig. 3 and 7) with 31.Therefore, this is with 31 these diaphragms 12 can be linked together, and finishes taping process S2 then.

In addition, can before band cutting-off process S2-2, be with pressure process S2-3.That is to say, can be with pressure process S2-3, and can during band cutting-off process S2-2, be with 31 afterwards by Tape cutter 62 cut-outs.

After taping process S2, carry out stripping process S3 (referring to Fig. 3), this stripping process S3 is with 31 orders to promote diaphragm 12 connected to one another by utilization and peels off diaphragm 12 continuously.In stripping process S3, deflector roll 33 is arranged to contact is arranged on the diaphragm 12 of also not being stripped from the substrate 15, and the rotation of deflector roll 33 is arranged near the center of substrate 15 rather than the edge 18 of substrate 15.Then, the periphery surface along deflector roll 33 draws and promotes by the diaphragms 12 (referring to Fig. 8) with 31 connections.In detail, by carry-over pinch rolls 38 elevator belts 31 time, the volume of air pocket 17 will expand gradually.At this moment, be arranged on air pocket 17 on the marginal portion 13 from extending out to the end of marginal portion 13 near these through holes 16.Therefore, air pocket 17 extends to the whole width of marginal portion 13, this marginal portion 13 can be separated with interlayer dielectic 14 thus.

After stripping process S3, can carry out diaphragm collection process S4, the diaphragm 12 that this diaphragm collection process S4 will peel off is rolled and is collected on the paper tube 34.Therefore, from substrate 15, diaphragm 12 is peeled off fully, and can be retained in (referring to Fig. 9) on the substrate 15 as the interlayer dielectic 14 of the interlayer insulating film of piling up multi-layer resinous terminal block.In addition, carry the substrate 15 of having peeled off diaphragm 12 by substrate output mechanism 3.

Then, the interlayer dielectic 14 on the substrate 15 that has transferred out is exposed.Therefore, can form interlayer insulating film with guide hole corresponding with the position that wherein will form the guide hole conductor.Then, can apply electroless plating copper to interlayer insulating film according to the technology (for example, semi-additive process) of for example conventional known, can expose then and developing process to form the anti-plate layer according to predetermined pattern.In this state, can apply electrolytic copper plating to electroless plating copper layer so that at the inner formation of these guide holes guide hole conductor, and on interlayer insulating film, form copper plate as common electrode.In addition, can come on interlayer insulating film, to form second conductor layer by for example dissolving the unnecessary electroless plating copper layer (conductor forming process) of resist and etching.

Then, can come alternately lamination interlayer insulating film and conductor layer by the process that repeats above-mentioned lamination-conductor formation.Therefore, accumulation horizon can be constituted like this, and the multi-layer resinous terminal block of predetermined accumulation can be finished.

Therefore, according to some embodiment, can obtain following effect.

(1) according to some embodiment, can be in labelling machine 5 during the taping process S2 by being with 31 to connect each diaphragm 12.Then, in stripping process S3, film mechanism for stripping 4 is with 31 orders to promote diaphragm 12 by utilization and is peeled off diaphragm 12 continuously.Therefore, when a plurality of substrates 15 are carried out stripping process S3, owing to a plurality of diaphragms 12 can collective be peeled off, so can help effective strip operation of diaphragm 12.In addition, because diaphragm 12 is by being with 31 to be connected to each other, thus a plurality of diaphragms 12 can be collected together, thus can help its effective collection.

In certain embodiments, stripping process S3 preferably carries out after the operation that the in-plane that makes knurling roller or film pressing element etc. along diaphragm 12 moves, rather than carries out after attaching with 31 taping process S2 by labelling machine 5.Therefore, interlayer dielectic 14 or substrate 15 are not easy owing to the strip operation of diaphragm 12 impaired, can prevent that thus output from reducing.In addition, more little to the damage of interlayer dielectic 14, then owing to the part of interlayer dielectic 14 break the particle that produces can be few more.Therefore, can prevent that the output that causes owing to the particle that influences interlayer dielectic 14 from reducing.

(2) in the stripping process S3 of some embodiment, deflector roll 33 is arranged to contact protection film 12, can prevent that thus substrate 15 is raised when diaphragm 12 rises.Therefore, the substrate 15 of having peeled off diaphragm 12 can be sent between the distributing roller 46 reliably, and successfully flows to substrate output mechanism 3.

(3) for example, if will by labelling machine 5 during taping process S2, attach be with 31 to be attached on the diaphragm 12 time need any heat treatment, then heat can influence interlayer dielectic 14 (for example, thermosetting etc.).But, since in the taping process S2 of some embodiment, attach with 31 for having the adhesive tape of viscous layer, so when applying without any need for heat.Therefore, heat etc. can not influence interlayer dielectic 14 easily, can prevent that thus the output that causes owing to heat from reducing.

(4) if before band cutting-off process S2-2, be with pressure process S2-3, though then in band pressure process S2-3 to being with 31 to pressurize, band pressure roller 63 also may be difficult to the specific part of contact zones 31.For this reason, entire belt 31 may be pressed on the substrate 15 insecurely.Therefore, when diaphragm 12 in stripping process S3 when being with 31 to promote, their may be because with 31 disengaging and separated from one another.In addition, even be with under the situation about being pressed in securely among the pressure process S2-3 on the substrate 15 in entire belt 31, diaphragm 12 and interlayer dielectic 14 also may be destroyed by Tape cutter 62 in band cutting-off process S2-2.

On the other hand, in certain embodiments, can before band pressure process S2-3, be with cutting-off process S2-2.Therefore, band pressure roller 63 can be in band pressure process S2-3 the whole top of contact zones 31, entire belt 31 can be pressed on the substrate 15 securely thus.Therefore, be with 31 can not peel off easily, thereby can avoid the separation of diaphragm 12.In addition, owing to will be with 31 to be pressed on the substrate 15 in being with pressure process S2-3 cut-out is with 31 after, so diaphragm 12 and interlayer dielectic 14 can be difficult to be destroyed by Tape cutter 62.

(5) in taping process S2, can under the situation of not cutting off a band 31, connect a plurality of diaphragms 12.But, in certain embodiments, can will be with 31 to be cut to short length and attaching, thereby connect the diaphragm 12 of adjacency.In this manner, owing to do not need long not to be with 31 to connect diaphragm 12, therefore can reduce employed with 31 consumption.Just, be with 31 owing to can utilize Tape cutter 62 to cut off, therefore can be so that minimum with 31 consumption.

In addition, can do following improvement to some embodiment.

In certain embodiments, film mechanism for stripping 4 can comprise the deflector roll detent mechanism, and this deflector roll detent mechanism location deflector roll 33 makes the rotation of deflector roll can be arranged near the center of substrate 15 rather than the edge 18 of substrate 15.For example, deflector roll 33 can be mounted to round the rotation of this rotation, and can comprise that this actuator makes rotation move along the direct of travel of substrate 15 by the actuator deflector roll detent mechanism that constitutes of cylinder for example.

By this way, even the rotation of deflector roll 33 is positioned at outside the substrate 15 rather than 18 places, edge of substrate 15,, also the rotation of deflector roll 33 can be moved near the center of substrate 15 rather than the edge 18 of substrate 15 by driving cylinder.Therefore can under the situation that need not accurately locate substrate 15, guarantee to peel off whole protecting film 12.

As shown in figure 10, film roll-up mechanism 7 can comprise clutch 81, and this clutch 81 is adjusted at paper tube 34 and is used for the transfer amount of the rotary driving force between the motor 39 that paper tube drives.For example, clutch 81 can be by the paper tube side plate 82 that is fixed to paper tube back shaft 40, be fixed to the motor side plate 84 of the rotating shaft 83 that is used for the motor 39 that paper tube drives and the spring (not shown) that paper tube side plate 82 and motor side plate 84 combine constituted.

In diaphragm collection process S4, because diaphragm 12 is coiled on the paper tube 34, therefore coiling has the external diameter of the part of diaphragm 12 can become big.Therefore, the amount of rolling in one of paper tube back shaft 40 and paper tube 34 changes of diaphragm 12 can become big.At this moment, if the adhesion of spring is died down so that paper tube side plate 82 and motor side plate 84 slide over each other, then the rotary speed of paper tube back shaft 40 and paper tube 34 can be slack-off, because the transfer amount of rotary driving force can diminish.Therefore, the circumferential speed of diaphragm 12 can be remained on diaphragm 12 and be pulled on the identical level of the speed of roller 38 traction.Therefore can prevent to cut off and be with 31 because of diaphragm 12 excessive circumferential speeds.

Although the thin film peel-off device of some embodiment 1 has been used to form the interlayer insulating film of piling up multi-layer resinous terminal block, thin film peel-off device 1 also can be used to form the insulating barrier of the terminal block except piling up multi-layer resinous terminal block.

The thin film peel-off device 1 of some embodiment has been used to peel off diaphragm 12 stacked on the substrate 15 that is provided with interlayer dielectic 14.But the thin film peel-off device of some embodiment 1 can be used for peeling off diaphragm 12 from the insulating material that forms solder resist and anti-plate layer.In addition; the thin film peel-off device 1 of embodiment of the present invention can be used for from peeling off bearing film as infrabasal plate; be pressed with resist film or interlayer dielectic film on this substrate upper strata, and the superficial layer of this substrate can also be coated with bearing film (diaphragm).

The thin film peel-off device 1 of some embodiment has been used to make terminal block, for example piles up multi-layer resinous terminal block.But this thin film peel-off device 1 not necessarily only is used to make terminal block, but also can be used for peeling off diaphragm 12 in the other products of making except terminal block.

Have the hypothesis of the diaphragm 12 that is laminated on the one side based on substrate 15, finished in film mechanism for stripping 4 under the situation of strip operation, the substrate output mechanism 3 of some embodiment is discharged substrate 15 from thin film peel-off device 1.

But substrate output mechanism 3 also can be to discharge the mechanism that all has the substrate 15 of diaphragm 12 on the both sides.Just, substrate output mechanism 3 also can be as the function of switching mechanism, after any diaphragm 12 that is provided with on substrate 15 is stripped from (with reference to Figure 11), and this switching mechanism substrate overturn 15.In this case,, just can peel off the diaphragm 12 on the opposite side, peel off two diaphragms 12 thus if come the substrate 15 that any one diaphragm 12 that is provided with on the substrate 15 has been stripped from is overturn by switching mechanism.In addition, need not to change arrangement mode for example labelling machine 5 and film mechanism for stripping 4, just can peel off the diaphragm 12 that is arranged on substrate 15 both sides.In addition, can be so that strip operation because come substrate overturn 15 by switching mechanism, can not need manual rotary movement thus.

In addition, in this case, thin film peel-off device 1 preferably includes substrate gigback 91 and substrate hoisting mechanism 92 (with reference to Figure 11).Substrate gigback 91 comprises a plurality of rollers 93, and these rollers 93 are used to transmit the substrate that is positioned under film mechanism for stripping 4 and the labelling machine 5.Be used to transmit each roller 93 of substrate by rotation, substrate gigback 91 is back to film puncturing mechanism 2 (substrate hoisting mechanism 92) with the substrate 15 that switching mechanism overturn.In addition, substrate hoisting mechanism 92 comprises the base plate supports roller 8 at the cylinder 94 and the front end place of the bar that is connected cylinder 94, and is moved up and down by cylinder 94.Substrate hoisting mechanism 92 promotes by 91 conveyings of substrate gigback and by base plate supports roller 8 substrate supported 15, and substrate 15 is delivered to film puncturing mechanism 2.By this way, when needs are peeled off two diaphragms 12 that are arranged on the substrate 15, only need a cover labelling machine 5, film mechanism for stripping 4 etc.

Below list the technological concept that obtains from above-mentioned embodiment.

(1) a kind of method that is used for making terminal block by the process of from substrate, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process is supported on a plurality of substrates of the edge of substrate being arranged to adjacency under the condition close to each other, and an above position flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing each band to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

(2) a kind of method that is used for making terminal block by the process of from substrate, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process is supported on a plurality of substrates of the edge of substrate being arranged to adjacency under the condition opposite each other, and an above position flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

(3) a kind of method that is used for making terminal block by the process of from substrate, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process is supported on gap between the edge that makes substrate than a plurality of substrates of adjacency under the short condition of the length of the direct of travel of substrate of substrate, and an above position flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

(4) a kind of method that is used for making terminal block by the process of from the substrate that is roughly rectangle, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process is supported on gap between the edge that makes substrate than a plurality of substrates of adjacency under the short condition of the length of side parallel with direct of travel substrate substrate, and an above position flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

(5) a kind of method that is used for making terminal block by the process of from substrate, flexible protective film being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process supports the substrate of a plurality of adjacency, and the flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

(6) a kind of method that is used for making terminal block by the process of from substrate, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, the length that this taping process supports the longest edge of the substrate of a plurality of adjacency and substrate is set to 60cm or littler, and the flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process, this stripping process is peeled off diaphragm continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process, make insulation material layer to be retained on the substrate.

(7) a kind of method that is used for making terminal block by the process of from substrate, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process is supported on a plurality of substrates of the edge of substrate being arranged to adjacency under the condition close to each other, and the flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process; this stripping process is peeled off these diaphragms continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process; make insulation material layer to be retained on the substrate, and wherein taping process comprise band is released to band supply process on the diaphragm, cuts off the band cutting-off process of the band of being supplied and is being with band pressure process on the edge that the band of being supplied is pressed in after the supply process substrate after the band supply process.

(8) a kind of method that is used for making terminal block by the process of from substrate, diaphragm being peeled off with insulation material layer of protecting by diaphragm, wherein this method comprises: taping process, this taping process is supported on a plurality of substrates of the edge of substrate being arranged to adjacency under the condition close to each other, and the flexibility band is attached on the edge of substrate so that connect these diaphragms; And stripping process; this stripping process is peeled off diaphragm continuously by utilizing these bands to promote diaphragm connected to one another in proper order after taping process; make insulation material layer to be retained on the substrate, and wherein taping process preferably include band is released to band supply process on the diaphragm, cuts off the band cutting-off process of the band of being supplied and is being with band pressure process on the edge that the band that is cut off is pressed in after the cutting-off process substrate after the band supply process.

(9) a kind of thin film peel-off device of by on the substrate of the insulation material layer of diaphragm protection diaphragm being peeled off from having of being used for, wherein this thin film peel-off device comprises: stripping machine can partly form device, and this stripping machine can partly form device and form stripping machine meeting part so that peel off diaphragm on the periphery of diaphragm; Baseplate support device, this baseplate support device supports a plurality of substrates that are adjacent to each other; Sticker, this sticker attach flexible band, make each diaphragm can connect at the part place at the stripping machine by described baseplate support device substrate supported; And mechanism for stripping, this mechanism for stripping is peeled off these diaphragms continuously by utilizing these bands to promote the diaphragm that is connected by these bands in proper order, and wherein sticker comprises: the band feeding mechanism, and this band feeding mechanism is emitted band on diaphragm; Band shearing device, this band shearing device cut off the band that the band feeding mechanism is supplied; And the band pressue device, this band pressue device will be pressed on the edge of substrate with the band that shearing device cut off.

In addition to those skilled in the art, obviously should make be included in of the present invention shown in and described details in various variations.These change in the spirit and scope that intention is included in claims here.

The Japanese patent application No.2005-179082 that the Japanese patent application No.2004-350570 that the application submitted to based on the Japanese patent application No.2004-350569 that submitted on December 3rd, 2004, on December 3rd, 2004, on June 20th, 2005 submit to, the full content of introducing these applications here as a reference.

Claims (18)

1. one kind is used for by going up the method that the process that described diaphragm (12) is peeled off is made terminal block from the substrate (15) with insulation material layer (14) of being protected by diaphragm (12), and this method comprises:

Taping process (S2), this taping process support is arranged to a plurality of substrates (15) close to each other, and flexibility band (31) is attached to the edge (18,19) of substrate (15) upward so that connect described diaphragm (12); And

Stripping process (S3); this stripping process is peeled off these diaphragms continuously by utilizing described band (31) order to promote described diaphragm connected to one another (12) after described taping process, make described insulation material layer (14) can be retained on the described substrate (15).

2. the method for a manufacturing terminal block as claimed in claim 1, wherein said taping process (S2) are arranged to attach under the condition close to each other described band (31) at the described edge (18,19) that described substrate (15) is located such that described substrate (15).

3. the method for a manufacturing terminal block as claimed in claim 1, wherein said taping process (S2) attaches described band (31) under the condition that leaves gap (20) between the described edge (18,19) that described substrate (15) is positioned in described substrate (15).

4. the method for a manufacturing terminal block as claimed in claim 1; wherein said stripping process (S3) is positioned to go up the still unstripped described diaphragm (12) that is provided with described substrate (15) with deflector roll (33) and contacts; and the rotation of described deflector roll is positioned adjacent to the center of described substrate rather than the edge (18 of described substrate; 19), when drawing described diaphragm (12), the periphery surface along described deflector roll (33) promotes the described diaphragm (12) that connects by described band (31) then.

5. the method for a manufacturing terminal block as claimed in claim 1 also comprises diaphragm collection process (S4), rolls and collect the described diaphragm of having peeled off (12) in this diaphragm collection process.

6. the method for a manufacturing terminal block as claimed in claim 1, wherein the described band (31) that attaches in described taping process (S2) is the adhesive tape with viscous layer.

7. the method for a manufacturing terminal block as claimed in claim 1, wherein said substrate (15) has the shape that is roughly rectangle, and four sides have 60cm or littler length.

8. one kind is used for by going up the method that the process that described diaphragm (12) is peeled off is made terminal block from the substrate (15) with insulation material layer (14) of being protected by diaphragm (12), and this method comprises:

Stripping machine meeting part forming process (S1), this stripping machine can part forming process form stripping machine partly (16) on the periphery of described diaphragm (12);

Taping process (S2), this taping process supports a plurality of substrates (15) of adjacency under the following conditions, described condition be described stripping machine can part forming process (S1) afterwards with the edge (18 of substrate, 19) be arranged to close to each otherly, and this taping process attaches flexible band (31) and makes described diaphragm (12) can part (16) locate to be connected to each other at described stripping machine; And

Stripping process (S3); this stripping process is peeled off these diaphragms by utilizing described band (31) order to promote described diaphragm connected to one another (12) afterwards continuously in described taping process (S2), makes described insulation material layer (14) can be retained on the described substrate (15).

9. one kind is used for by going up the method that the process that described diaphragm (12) is peeled off is made terminal block from the substrate (15) with insulation material layer (14) of being protected by diaphragm (12), and this method comprises:

Forming process of through hole (S1), this forming process of through hole forms a plurality of through holes (16) by the peripheral part that pierces through described diaphragm (12) with a plurality of pins (57);

Taping process (S2), this taping process supports a plurality of substrates (15) of adjacency under the following conditions, described condition is afterwards with the edge (18 of substrate at described forming process of through hole (S1), 19) be arranged to close to each other, and this taping process attaches flexible band (31), makes described diaphragm (12) to locate to be connected to each other at the air pocket (17) that described through hole (16) forms on every side; And

Stripping process (S3); this stripping process is peeled off these diaphragms by utilizing described band (31) order to promote described diaphragm connected to one another (12) afterwards continuously in described taping process (S2), makes described insulation material layer (14) can be retained on the described substrate (15).

10. one kind is used for going up the thin film peel-off device that described diaphragm (12) is peeled off from the substrate (15) with insulation material layer (14) of being protected by diaphragm (12), and this thin film peel-off device comprises:

Stripping machine can partly form device (57), and this stripping machine can partly form device and form stripping machine meeting part (16) so that peel off described diaphragm (12) on the periphery of described diaphragm (12);

Baseplate support device (41), this baseplate support device support the substrate (15) of a plurality of adjacency;

Sticker (5), this sticker attaches flexible band (31), makes described diaphragm (12) can part (16) locate to be connected to each other at the described stripping machine of the described substrate (15) that is supported by described baseplate support device (41); And

Mechanism for stripping (4), this mechanism for stripping is peeled off these diaphragms continuously by utilizing described band (31) order to promote the described diaphragm (12) that is connected by described band (31).

11. a thin film peel-off device as claimed in claim 10 also comprises:

Substrate position detection apparatus (71,72), described substrate position detection apparatus detect the position at the edge (18,19) of the described substrate (15) in the described baseplate support device (41); And

Base positioner, this base positioner is located described substrate (15) according to the testing result of described substrate position detection apparatus (71,72), wherein has gap (20) between the edge (18,19) of these substrates.

12. a thin film peel-off device as claimed in claim 10, wherein said film mechanism for stripping (4) comprising:

Draw-gear (38), this draw-gear promotes the described diaphragm (12) that is connected by described band (31);

Deflector roll (33), this deflector roll are oriented to contact the still unstripped described diaphragm (12) that is arranged on the described substrate (15), and wherein said deflector roll (33) guides to described draw-gear (38) along the periphery of deflector roll (33) with described diaphragm (12); And

The deflector roll detent mechanism, this deflector roll detent mechanism can be located described deflector roll (33), makes the rotation of described deflector roll (33) can be positioned adjacent to the center of described substrate rather than the edge of described substrate (18,19).

13. a thin film peel-off device as claimed in claim 10 also comprises film rolling lifting device (7), the described diaphragm of being peeled off by described film mechanism for stripping (4) (12) is rolled and collected to this film rolling lifting device.

14. a thin film peel-off device as claimed in claim 13, wherein said film rolling lifting device (7) comprising:

Core main body (34) is coiled the described diaphragm of being peeled off by mechanism for stripping (4) (12) at this core main body place;

Core subject support means (40), this core subject support means supports described core main body (34) and described core main body (34) can be rotated;

Core main body drive unit (39), this core main body drive unit rotation drives described core main body (34); And

Clutch (81), this clutch are adjusted at the transfer amount of the rotary driving force between described core main body (34) and the described core main body drive unit (39).

15. a thin film peel-off device as claimed in claim 14, wherein core main body (34) is supported for core main body (34) can be pulled down from described core subject support means (40).

16. a thin film peel-off device as claimed in claim 10, wherein said sticker (5) comprising:

Band feeding mechanism (61), this band feeding mechanism is emitted described band (31);

Band shearing device (62), this band shearing device cuts off the described band (31) by described band feeding mechanism (61) supply; And

Band pressue device (63), this band pressue device is pressed in the described band (31) of described band feeding mechanism (61) supply on the edge (18,19) of described substrate (15).

17. a thin film peel-off device as claimed in claim 10, wherein said band (31) is the adhesive tape with viscous layer.

18. a thin film peel-off device as claimed in claim 10, wherein said substrate (15) have the diaphragm (12) that is arranged on described substrate (15) both sides, and this thin film peel-off device comprises:

Switching mechanism, this switching mechanism described substrate (15) that peel off arbitrary diaphragm the described diaphragm (12) that is arranged on described substrate (15) both sides from described substrate (15) after, overturns.

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