CN1814374A - Combined shaping method for electronic product substrate - Google Patents
Combined shaping method for electronic product substrate Download PDFInfo
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- CN1814374A CN1814374A CN 200510005278 CN200510005278A CN1814374A CN 1814374 A CN1814374 A CN 1814374A CN 200510005278 CN200510005278 CN 200510005278 CN 200510005278 A CN200510005278 A CN 200510005278A CN 1814374 A CN1814374 A CN 1814374A
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- base material
- preform
- preform base
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Abstract
This invention relates to a complex forming method of electronic product base material, it is used for shell forming of electronic product. Holding forming base material is provided and preformed by normal technique as fluid pressure, mould or stamping, then it is filled in module, and metal pressure board is pressed on it. Mutual exclusion force with preformed base material is generated when electromagnetic coil on one side of the material switched on pulse current and close up the material, the force drives the material deformation and extend jointed to module.
Description
Technical field
The present invention relates to a kind of combined shaping method for electronic product substrate, relate in particular to the traditional forming technique of a kind of application, the innovative technology of collocation electromagnetic induction principle shaping electronic product casing.
Background technology
Because the electronic product seeking change and innovation also makes the life cycle of electronic product that very of short duration characteristic is arranged relatively now, therefore have the output time that requires to shorten the electronic product new product only, just can reach the purpose of quick output.
Known technology is when making the metal shell of electronic product, be to utilize known forming technique such as casting and punching press to make, the metal shell of known application forging type shaping electronic product, the comparatively electronic product metal shell of complicated shape though can be shaped, but it is low to be subject to casting technique stability also, causes the high shortcoming of defect rate.
Also have, when the mode of using punching press is shaped the metal shell of electronic product, when for the shape of shape requirement complexity or the electronic product metal shell of precise measure, there is crystallized ability not good, and more must be through repeatedly being shaped and meticulous finishing, just be enough to reach the size and the form tolerance requirement of the metal shell of electronic product, again, because the increase of operation number of times also increases many die costs.
In addition, still have, make the metal shell of electronic product,, still have forming speed slow though can satisfy the electronic product metal shell of manufacturing complicated shape with known hydroforming technology, and to the shortcomings such as crystallized ability deficiency of the exquisite lines or the pattern of housing.
Learn that by above-mentioned known technology the speed of production electronic product and qualification rate improve just to become influences the key of competitiveness of manufacturer own.
Summary of the invention
Problem in view of above known technology, the present invention's purpose is to provide a kind of manufacturing process of electronic product substrate, make the high shortcoming of defect rate of electronic product substrate housing in order to solve known single technology, and reduce known Sheet Metal Forming Technology, make the shortcoming of the too high and accurate grain pattern that can't be shaped of the die cost of electronic product substrate housing.
For realizing above-mentioned purpose, the present invention relates to a kind of combined shaping method for electronic product substrate, be applied to the housing molding of electronic product, this method provides base material step to be formed earlier, base material to be formed is provided, carry out the hydraulic pressure pwc forming step again, should be to be formed base material make the simple profile of this base material earlier with Hydroform process, and become the preform base material, press down preform base material step again, this preform base material is arranged at the depression top of mould, again metal platen is pressed down with this preform base material of pressure holding, then, with the electromagnetic induction forming step of extending, the solenoid group is placed this preform base material one side, and with this solenoid group connection power supply unit, to provide the electromagnetic induction shaping required electric power, when this solenoid group when this preform base material, this solenoid group because this pulse current is flowed through, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extends and fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
Another purpose of the present invention, provide another kind of combined shaping method for electronic product substrate, be applied to the housing molding of electronic product, this method provides base material step to be formed earlier, base material to be formed is provided, cast the preform step again, should make the simple profile of this base material and become the preform base material with casting technique earlier by base material to be formed, press down preform base material step again, this preform base material is arranged at the depression top of mould, again metal platen is pressed down with this preform base material of pressure holding, then, with the electromagnetic induction forming step of extending, the solenoid group is placed this preform base material one side, and with this solenoid group connection power supply unit, to provide the electromagnetic induction shaping required electric power, when this solenoid group when this preform base material, this solenoid group because this pulse current is flowed through, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
Another object of the present invention, provide a kind of combined shaping method for electronic product substrate, be applied to the housing molding of electronic product, this method provides base material step to be formed earlier, base material to be formed is provided, carry out punching press preform step again, should make the simple profile of this base material and become the preform base material with Sheet Metal Forming Technology earlier by base material to be formed, press down preform base material step again, this preform base material is arranged at the depression top of mould, again metal platen is pressed down with this preform base material of pressure holding, then, with the electromagnetic induction forming step of extending, the solenoid group is placed this preform base material one side, and with this solenoid group connection power supply unit, to provide the electromagnetic induction shaping required electric power, when this solenoid group when this preform base material, this solenoid group because this pulse current is flowed through, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
The metal shell of formed thereby of the present invention comprises the housing appearance of digital camera, mobile phone, MP3 player or notebook, and in addition, this housing appearance material comprises metal materials such as stainless steel, aluminium, magnesium material, titanium material or its alloy.
Hold within relevant the present invention in detail and concrete feasible embodiment, be described as follows with reference to the accompanying drawings:
The specific embodiment
The invention provides a kind of manufacturing process and device of electronic product casing, base material to be formed is gone ahead of the rest with traditional manufacturing process, as casting, punching press or hydraulic pressure pwc are shaped, again this preform base material is arranged in the mould, and utilize this preform base material of pressing plate pressure holding, again the solenoid group is passed to electric current and close this preform base material, produce repulsive interaction each other by both, this repulsive interaction orders about this preform base material toward fitted in this mould by force direction, finish the shaping of base material to be formed, electronic product substrate by the present invention's shaping can improve product qualified rate, and reaches the purpose that reduces known technology manufacturing base material profile shortcoming.
Below for the assembling mode and the implementation step of preferred embodiment of the present invention, conjunction with figs. elaborates now.
The present invention relates to a kind of combined shaping method of electronic product casing, see also shown in Figure 1A, wherein, the combined shaping method 1 of this electronic product casing, comprising provides base material step S10 to be formed, carry out hydraulic pressure pwc forming step S20, press down preform base material step S30, with the electromagnetic induction forming step S40 that extends.
See also shown in Figure 2ly, this electromagnetic forming device 60 comprises preform base material 61, solenoid group 62, metal platen 63, mould 64, wherein, the depression of this mould 64 has exquisite grain pattern design, in order to the exquisite grain pattern and the profile of shaping electronic product casing.
See also Figure 1 and Figure 2, the present invention relates to a kind of manufacturing process 1 of electronic product casing, this method provides base material step S10 to be formed earlier, base material to be formed (not expressing among the figure) is provided earlier, carry out hydraulic pressure pwc forming step S20 again, should make the simple profile of this base material and become preform base material 61 with Hydroform process earlier by base material to be formed, press down preform base material step S30 again, this preform base material 61 is arranged at the depression top of this mould 64, again this metal platen 63 is pressed down with this preform base material 61 of pressure holding, again with the electromagnetic induction forming step S40 that extends, this solenoid group 62 is placed this preform base material 61 1 sides, and with these solenoid group 62 connection power supply units, to provide the electromagnetic induction shaping required electric power, when this solenoid group 62 during near this preform base material 61, this solenoid group 62 because this pulse current is flowed through, make this solenoid group 62 and this preform base material 61 produce repulsive interaction mutually, this repulsive interaction orders about this preform base material 61 toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this shaping dies 64, and then this preform base material 61 designed shape of depression of being configured as this shaping dies 64.
The present invention relates to the combined shaping method of another kind of electronic product casing, see also shown in Figure 1B, wherein, the manufacturing process 1 ' of this electronic product casing, comprising provides base material step S10 ' to be formed, cast preform step S20 ', press down preform base material step S30 ', with the electromagnetic induction forming step S40 ' that extends.
See also Figure 1B and shown in Figure 2, the present invention relates to the manufacturing process 1 ' of another kind of electronic product casing, this method provides base material step S10 ' to be formed earlier, base material to be formed (not expressing among the figure) is provided earlier, cast preform step S20 ' again, should make the simple profile of this base material and become preform base material 61 with casting technique earlier by base material to be formed, press down preform base material step S30 ' again, this preform base material 61 is arranged at the depression top of this mould 64, again this metal platen 63 is pressed down with this preform base material 61 of pressure holding, again with the electromagnetic induction forming step S40 ' that extends, this solenoid group 62 is placed this preform base material 61 1 sides, and with these solenoid group 62 connection power supply units, to provide the electromagnetic induction shaping required electric power, when this solenoid group 62 during near this preform base material 61, this solenoid group 62 because this pulse current is flowed through, make this solenoid group 62 and this preform base material 61 produce repulsive interaction mutually, this repulsive interaction orders about this preform base material 61 toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this shaping dies 64, and then this preform base material 61 designed shape of depression of being configured as this shaping dies 64.
The present invention relates to the combined shaping method of another electronic product casing, see also shown in Fig. 1 C, wherein, the combined shaping method 1 of this electronic product casing "; comprising provides base material step S100 to be formed; carry out punching press preform step S200, press down preform base material step S300, with the electromagnetic induction forming step S400 that extends.
See also Fig. 1 C and shown in Figure 2, the present invention relates to the combined shaping method 1 of another kind of electronic product casing "; this method provides base material step S100 to be formed earlier; base material to be formed (not expressing among the figure) is provided earlier; carry out punching press preform step S200 again; should be to be formed base material form preform base material 61 with the simple profile that process for stamping and forming is made this base material earlier; press down preform base material step S300 again, this preform base material 61 is arranged at the depression top of this mould 64, again this metal platen 63 is pressed down with this preform base material 61 of pressure holding, again with the electromagnetic induction forming step S400 that extends, this solenoid group 62 is placed this preform base material 61 1 sides, and with these solenoid group 62 connection power supply units, to provide the electromagnetic induction shaping required electric power, when this solenoid group 62 during near this preform base material 61, this solenoid group 62 because this pulse current is flowed through, make this solenoid group 62 and this preform base material 61 produce repulsive interaction mutually, this repulsive interaction orders about this preform base material 61 toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this shaping dies 64, and then this preform base material 61 designed shape of depression of being configured as this shaping dies 64.
The above-mentioned preferred embodiment of the combined shaping method of electronic product casing of the present invention discloses the method for once-forming global shape, but be not in order to place restrictions on the present invention, the present invention is according to the material character of difference and the requirement of difformity, elder generation's shaping global shape, slight part shape more further is shaped, promptly utilize the multiple working procedure forming mode, for repeating repeatedly to carry out the preform base material forming step of extending, and then finish the manufacturing of electronic product casing with electromagnetic induction.
The combined shaping method of a kind of electronic product casing of the present invention, the metal shell of formed thereby comprises the housing appearance of digital camera, mobile phone, MP3 player or notebook, this housing appearance material comprises metal materials such as stainless steel, aluminium, magnesium material, titanium material or its alloy, as shown in Figure 3, this figure is the finished product schematic diagram that the present invention utilizes the electro-magnetic forming electronic product casing.
Though the present invention is disclosed in preferred embodiment; right its is not in order to qualification the present invention, any person of ordinary skill in the field, without departing from the spirit and scope of the invention; when can doing a little change and improvement, so the present invention's protection domain is as the criterion when looking the claim person of defining.
Description of drawings
Figure 1A is a preferred embodiment of the present invention flow chart
Figure 1B is another preferred embodiment flow chart of the present invention
Fig. 1 C is the another preferred embodiment flow chart of the present invention
Fig. 2 is a preferred embodiment of the present invention schematic diagram
Fig. 3 is the finished product schematic diagram of electronic product casing of the present invention
The primary clustering description of symbols
1 (1 ') (1 "): the combined shaping method of electronic product casing
Step S10 (step S10 ') (step S100): base material to be formed is provided
Step S20: carry out hydraulic pressure pwc and be shaped
Step S20 ': cast preform
Step S200: carry out the punching press preform
Step S30 (step S30 ') (step S300): press down the preform base material
Step S40 (step S40 ') (step S400): with the electromagnetic induction shaping of extending
60: electromagnetic forming device
61: preform base material 62: the solenoid group
63: metal platen 64: shaping dies
Claims (14)
1. a combined shaping method for electronic product substrate is applied to the electronic product casing that is shaped,
It is characterized in that comprising:
Base material to be formed is provided;
Carry out hydraulic pressure pwc and be shaped, should make the simple profile of this base material with Hydroform process earlier by base material to be formed, and become the preform base material;
Press down this preform base material, this preform base material is arranged at above the depression of shaping dies, again metal platen is pressed down with this preform base material of pressure holding; And
With the electromagnetic induction shaping of extending, with close this preform base material of solenoid group, and this solenoid group passed to pulse current, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
2. the method according to claim 1 is characterized in that, should comprise and repeats repeatedly to be shaped with the electromagnetic induction forming step of extending.
3. the method according to claim 1 is characterized in that, this base material material to be formed comprises the magnetic metal of stainless steel, aluminium, magnesium material, titanium material or its alloy.
4. a combined shaping method for electronic product substrate is applied to the electronic product casing that is shaped, and it is characterized in that comprising:
Base material to be formed is provided;
Cast preform, should make the simple profile of this base material with casting forming process earlier by base material to be formed, and become the preform base material;
Press down this preform base material, this preform base material is arranged at above the depression of shaping dies, again metal platen is pressed down with this preform base material of pressure holding; And
With the electromagnetic induction shaping of extending, with close this preform base material of solenoid group, and this solenoid group passed to pulse current, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
5. the method according to claim 4 is characterized in that, should comprise and repeats repeatedly to be shaped with the electromagnetic induction forming step of extending.
6. the method according to claim 4 is characterized in that, this base material material to be formed comprises the magnetic metal of stainless steel, aluminium, magnesium material, titanium material or its alloy.
7. a combined shaping method for electronic product substrate is applied to the electronic product casing that is shaped, and it is characterized in that comprising:
Base material to be formed is provided;
Carry out the punching press preform, should make the simple profile of this base material with process for stamping and forming earlier by base material to be formed, and become the preform base material;
Press down this preform base material, this preform base material is arranged at above the depression of shaping dies, again metal platen is pressed down with this preform base material of pressure holding; And
With the electromagnetic induction shaping of extending, with close this preform base material of solenoid group, and this solenoid group passed to pulse current, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
8. the method according to claim 7 is characterized in that, should comprise and repeats repeatedly to be shaped with the electromagnetic induction forming step of extending.
9. the method according to claim 7 is characterized in that, this base material material to be formed comprises the magnetic metal of stainless steel, aluminium, magnesium material, titanium material or its alloy.
10. a combined shaping method for electronic product substrate is applied to the electronic product casing that is shaped,
It is characterized in that comprising:
Base material to be formed is provided;
Carry out preform, should make the simple profile of this base material with forming technology earlier by base material to be formed, and become the preform base material;
Press down this preform base material, this preform base material is arranged at above the depression of shaping dies, again metal platen is pressed down with this preform base material of pressure holding; And
With the electromagnetic induction shaping of extending, with close this preform base material of solenoid group, and this solenoid group passed to pulse current, make this solenoid group and this preform base material produce repulsive interaction mutually, this repulsive interaction orders about this preform base material toward being subjected to force direction to open distortion outward, and extend and to fit in the depression of this mould, and then this preform base material designed shape of depression of being configured as this mould, finish the shaping of preform base material.
11. an enforcement is according to the article of the manufacture method of claim 1.
12. an enforcement is according to the article of the manufacture method of claim 4.
13. an enforcement is according to the article of the manufacture method of claim 7.
14. an enforcement is according to the article of the manufacture method of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510005278 CN1814374A (en) | 2005-02-04 | 2005-02-04 | Combined shaping method for electronic product substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510005278 CN1814374A (en) | 2005-02-04 | 2005-02-04 | Combined shaping method for electronic product substrate |
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| Publication Number | Publication Date |
|---|---|
| CN1814374A true CN1814374A (en) | 2006-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200510005278 Pending CN1814374A (en) | 2005-02-04 | 2005-02-04 | Combined shaping method for electronic product substrate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101460027B (en) * | 2007-12-10 | 2011-06-15 | 财团法人金属工业研究发展中心 | Metal casing of electronic product and manufacturing method thereof |
| US8056381B2 (en) | 2008-12-12 | 2011-11-15 | Metal Industries Research & Development Centre | Device for producing patterns |
| CN101746200B (en) * | 2008-12-22 | 2011-12-28 | 财团法人金属工业研究发展中心 | Pattern producing device |
| CN102989857A (en) * | 2012-09-14 | 2013-03-27 | 黄启瑞 | Forming method of sheet metal |
| CN104070100A (en) * | 2013-03-29 | 2014-10-01 | 联想(北京)有限公司 | Manufacture method of workpiece |
| CN107081344A (en) * | 2017-05-04 | 2017-08-22 | 西南石油大学 | Electromagnetic bending prevention device for thin-wall extruded metal material |
| CN109482718A (en) * | 2018-09-21 | 2019-03-19 | 北京长城华冠汽车科技股份有限公司 | Boring method |
-
2005
- 2005-02-04 CN CN 200510005278 patent/CN1814374A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101460027B (en) * | 2007-12-10 | 2011-06-15 | 财团法人金属工业研究发展中心 | Metal casing of electronic product and manufacturing method thereof |
| US8056381B2 (en) | 2008-12-12 | 2011-11-15 | Metal Industries Research & Development Centre | Device for producing patterns |
| CN101746200B (en) * | 2008-12-22 | 2011-12-28 | 财团法人金属工业研究发展中心 | Pattern producing device |
| CN102989857A (en) * | 2012-09-14 | 2013-03-27 | 黄启瑞 | Forming method of sheet metal |
| CN104070100A (en) * | 2013-03-29 | 2014-10-01 | 联想(北京)有限公司 | Manufacture method of workpiece |
| CN104070100B (en) * | 2013-03-29 | 2016-12-28 | 联想(北京)有限公司 | A kind of preparation method of workpiece |
| CN107081344A (en) * | 2017-05-04 | 2017-08-22 | 西南石油大学 | Electromagnetic bending prevention device for thin-wall extruded metal material |
| CN109482718A (en) * | 2018-09-21 | 2019-03-19 | 北京长城华冠汽车科技股份有限公司 | Boring method |
| CN109482718B (en) * | 2018-09-21 | 2021-01-26 | 北京长城华冠汽车科技股份有限公司 | Hole opening method |
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