CN1739912A - Molding process - Google Patents
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- CN1739912A CN1739912A CN 200410068554 CN200410068554A CN1739912A CN 1739912 A CN1739912 A CN 1739912A CN 200410068554 CN200410068554 CN 200410068554 CN 200410068554 A CN200410068554 A CN 200410068554A CN 1739912 A CN1739912 A CN 1739912A
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Abstract
The present invention relates to molding technology, and the molding process includes the following steps: micro electromechanical machining to making pre-mold kernel in high machining precision, making mold kernel, making mold, and molding workpiece in preset shape.
Description
Technical field
The relevant a kind of molding process of the present invention, the particularly a kind of a kind of molding process that can produce high processing precise degree workpiece.
Background technology
Existing molding process, be used to widely and make some workpiece, make it be applied to needed place, its principle is nothing more than being to produce a die earlier, the shape of the workpiece that the shape of this die is just finished with the desire moulding is opposite fully, with this die workpiece is carried out punching press again, can cause after the demoulding desire the workpiece of the shape of moulding.
A kind of molding process of prior art as shown in Figure 1, at first, in order to produce a die, prepare a unprocessed die material 10 earlier, next utilize general machining process, 10 processing of unprocessed die material formed a die 11, its machining process comprise conventional art brill, mill, methods such as car, mill, purpose produce one with the antipodal die 11 of shape of desiring the workpiece that moulding finishes so that follow-up punching press is used; Next, with die 11 fluid-tight engagement on a die holder 12, to form a mould 1; Next, utilize this mould 1 to carry out punching press at a workpiece 2, through mould 1 move back mold process after, promptly can form one desire the workpiece 2 of moulding.
The molding process of above-mentioned prior art, quick Fabrication is arranged, easy mass-produced advantage, but, some mechanisms or device are arranged now, needed assembly small-sized, die manufacturing process in the molding process of prior art, owing to be the brill that utilizes prior art, mill, car, processing methods such as mill, and use its corresponding facility as drilling machine, milling machine, lathe and grinding machine etc., generally have the restriction of precision, generally speaking, the brill of prior art, mill, the precision of methods such as car has the brill of some precisions roughly more than 1 millimeter, mill, car, perhaps, the instrument of mill can improve the processing precise degree more again, but but can't improve too much, cause the molding process of prior art can't produce the workpiece that meets high processing precise degree demand; As seen, in order to adapt to demand now, a kind of molding process that can improve the processing precise degree presses for very much.
Summary of the invention
The invention provides a kind of molding process, in order to process the workpiece of a precision, to meet the demand of producing small size workpiece.
Molding process of the present invention, its step comprises: a base material is provided; On this base material, form a pre-die layer, and, pre-die layer processing is formed a pre-die with a micro electronmechanical processing method; Next, a die material is formed on the pre-die, making the die forming materials is a die; Again die and a die holder being combined closely and made becomes a mould, or die and base material combined closely with a die holder in the lump and becomes a mould; Workpiece at last, carries out a molded program at a workpiece, so that can be formed to a default shape with this mould.
According to above-mentioned conception, above-mentioned micro electronmechanical processing method is to be the flat stamping developing method, and wherein the step of method comprises: a photomask is provided, photomask is placed on the pre-die layer; One light is provided, shines on photomask, this photomask can make part light pass, and then exposes on the pre-die layer; Carry out development step, part that light shone in the pre-die layer or the part of not shone by light are removed; Wherein, the pre-die layer that forms on the base material be for a sensing optical activity material made.
According to above-mentioned conception, above-mentioned micro electronmechanical processing method also can be accurate discharge-treating method, laser processing or rapid prototyping technology processing method.
According to above-mentioned conception, above-mentioned rapid prototyping technology processing method is to be selected from: the stereosopic printing method of forming (Stereo Lithography Apparatus), the laser sintered method of selection type (Selected LaserSintering), laser direct forming method (Laser Engineering Net Shaping), 3-D spraying gluing method (Three Dimensional Printing), melting deposition molding (FusedDeposition Molding), laminated entity autofrettage (Laminated Object Manufacturing) and ink-jet molding (Inkjet Method).
According to above-mentioned conception, above-mentioned die material is to utilize little electroforming mode or the powder metallurgy forming mode is formed on the pre-die.
According to above-mentioned conception, above-mentioned molded program is to be selected from following manner: punching press, extruding, die casting, forging, sheet metal and ejection formation etc.
According to above-mentioned conception, the material of above-mentioned die can be selected from following material: binary or the above Ni-based or chromium-base alloys of binary such as nickel cobalt, nickel phosphorus, nickel cobalt phosphorus, nickel tungsten, nickel rhenium, nickel palladium, nickel chromium triangle, nickel carborundum phosphorus, nickel graphite, nickel manganese.
According to above-mentioned conception, the hardness of above-mentioned die is more than the 450HV (Vickers hardness); Its processing precise degree is below 1 millimeter.
According to above-mentioned conception, in the molding process of the present invention, after forming die, can at mould or die carry out a subsequent treatment again, to strengthen its durability; Wherein said subsequent treatment is to be selected from: heat treatment, surface coating processing, gas cooled processing and liquid cools processing etc.
According to above-mentioned conception, it is to plate layer protecting film at this die surface that above-mentioned surface coating is handled, and its thickness is 1 to 8 micron, and the material of this diaphragm can be selected from: aluminium nitride, TiAlN, chromium nitride, aluminium carbide and class are bored carbon (DLC) etc.
According to above-mentioned conception, above-mentioned workpiece material can be selected from: copper metal, copper alloy, aluminum metal, aluminium alloy and nonmetal.
Description of drawings
Fig. 1 is the schematic flow sheet of the molding process of prior art.
Fig. 2 is the schematic flow sheet of molding process of the present invention.
Fig. 3 is the schematic flow sheet of the flat stamping developing method described in the molding process of the present invention.
Fig. 4 is the schematic flow sheet of the molding process of another embodiment of the present invention.
The specific embodiment
Embodiments of the invention please refer to shown in Figure 2, in the step of molding process of the present invention, at first need to provide a base material 35, this base material 35 is the bases that make a pre-die 36 as with micro electronmechanical processing method, the preferably, micro electronmechanical processing method of the present invention can be flat stamping developing method, accurate discharge-treating method or laser processing etc., in order to explain orally conveniently, present embodiment with the flat stamping developing method as the micro electronmechanical processing method among the utility model embodiment.
Please refer to Fig. 3,, need on base material 35, form a pre-die layer 34 earlier in order to produce a pre-die 36, the preferably, the mode that forms pre-die layer 34 can be the sedimentation in the semiconductor approach etc., but not as limit; Wherein, pre-die layer 34 need be constituted by the sensing optical activity material; One photomask 37 is provided, and photomask 37 is placed pre-die layer 34 top, the pattern of its photomask 37 is that the pattern of the pre-die 36 that forms with the institute desire is identical; Next, one light 38 is provided, be radiated on the photomask 37, because the pattern on the photomask 37 can make light portion pass, and then is radiated on the pre-die layer 34 preferably, the part that photomask 37 can make light pass, just the pattern of the pre-die 36 that forms with the institute desire is identical, if vice versa fully, as long as the employed developer of development step after the cooperation; Next carry out a development step, this development step is with a developer part of being shone by light 38 on the pre-die layer 34 (or the part of not shone by light 38 also can) to be removed, and so, it is a pre-die 36 that pre-die layer 34 will be made into.
Above-mentioned flat stamping developing method, can produce the pre-die 36 of a high processing precise degree, generally speaking, because the flat stamping developing method belongs to semiconductor applications technology commonly used, so such flat stamping developing method can be produced the processing precise degree easily at the pre-die 36 below 1 millimeter; In addition, also can adopt as accurate discharge-treating method, laser processing or rapid prototyping technology processing method etc., wherein accurate discharge-treating method is that a pre-die workpiece (not shown) is placed on the accurate discharging processing machine tool, after the program by discharge processing, can cause a processing precise degree equally at the pre-die 36 below 1, but the material of pre-die workpiece (not shown) wherein must be a metal; And laser processing is that a pre-die workpiece is placed on the Laser Processing facility, use high-octane laser light to process pre-die workpiece (not shown), the method not only can cause a processing precise degree at the pre-die 36 below 1 millimeter, and simultaneously pre-die workpiece (not shown) does not need to limit its material composition basically; And include the stereosopic printing method of forming (StereoLithography Apparatus) in the rapid prototyping technology processing method, the laser sintered method of selection type (Selected Laser Sintering), laser direct forming method (Laser Engineering Net Shaping), 3-D spraying gluing method (ThreeDimensional Printing), melting deposition molding (Fused Deposition Molding), laminated entity autofrettage (Laminated Object Manufacturing) and ink-jet molding (InkjetMethod) etc. can be produced the processing precise degree at the pre-die 36 below 1 millimeter.
Next, referring again to Fig. 2, after pre-die 36 completes, one die material (not shown) can be formed on the pre-die 36, and making die material (not shown) be shaped to a die 31, this can application examples such as little electroforming mode, and base material 35 and pre-die 36 are placed little electroforming facility, utilize little electroforming principle that die material (not shown) is little by little inserted on the pre-die 36, make to be shaped to a die 31; Or application examples such as powder metallurgy forming mode, base material 35 and pre-die 36 are placed on the Powder metallurgic forming machines tool, insert the powder of die material (not shown), after the program of overcompression, sintering, can also be shaped to a die 31.
Next, again die 31 and a die holder 32 are combined closely and become a mould 1, carry out a molded program with this mould 1 at a workpiece 4 again, the preferably, molded program can be a punching press program, just mould 1 is fixed on the punching press facility, make mould 1 directly for workpiece 4 punching presses, can make workpiece 4 form default shape, but molded program is not as limit, similar molded programs such as for example extruding, die casting, forging, sheet metal and ejection formation all can obtain identical result; Wherein, the material of above-mentioned die 31 can be above Ni-based of binary such as nickel cobalt, nickel phosphorus, nickel cobalt phosphorus, nickel tungsten, nickel rhenium, nickel palladium, nickel chromium triangle, nickel carborundum phosphorus, nickel graphite, nickel manganese or binary or chromium-base alloy is made, its hardness makes to produce comparatively durable die 31 more than 450HV (Vickers hardness); In addition, after die 31 forms, can also carry out a subsequent treatment, for example: heat treatment, surface coating processing, gas cooled processing and liquid cools processing etc. at die 31 or entire die 1, the structure of die 31 is more strengthened, more helped the carrying out of molded program; Wherein, it is on the mould 1 or the surface of die 31 that above-mentioned surface coating is handled, plate layer protecting film, the material of its diaphragm can be that aluminium nitride, TiAlN, chromium nitride, aluminium carbide and class are bored carbon (DLC) etc., its thickness can make the surface texture of die 31 more strengthen between 1 to 8 micron (μ m); As seen above-mentioned subsequent treatment is extremely important in molded program for mould 1, particularly at the processing precise degree at workpiece 4 below 1 millimeter, because its size is very small, if the structural strength of the die 31 in the mould 1 is not enough, die 31 very possible therefore damages when carrying out molded program; The preferably, the material of workpiece 4 can be copper metal, copper alloy, aluminum metal, aluminium alloy and nonmetal, cooperates molding process of the present invention, its effect is more remarkable, but the material of workpiece 4 also should be as limit.
Another embodiment of the present invention please refer to shown in Figure 4, present embodiment and above-mentioned roughly not change of embodiment, but when making die 31, the ledge that can only produce die 31 gets final product, utilize again base material 35 originally just with die 31 interconnective characteristics, in the lump die 31 and base material 35 and die holder 32 are combined closely and become a mould 1, carry out a molded program with this mould 1 at a workpiece 4 again, so not only can reach the effect identical with above-mentioned embodiment, when die material (not shown) is made into die 31, process and the raw material made have been saved simultaneously.
According to above-mentioned explanation as can be known, the present invention is in order to improve the precision of die, make the workpiece that to produce a high processing precise degree, with the compact demand of product now, design especially and utilize micro electronmechanical processing method to produce a pre-die in advance, because micro electronmechanical processing method can provide the characteristic of high processing precise degree, and then produce the die of high processing precise degree, make the purpose of reaching the workpiece of producing a high processing precise degree, as seen, the present invention has the value of its industry really.
The above only is preferred embodiment of the present invention, and the foregoing description only is to be used for explanation but not in order to limiting claim of the present invention, and category of the present invention is that the claim scope by following the application is defined.The change or the replacement of every equivalence of being done according to the present patent application Patent right requirement scope all should belong to covering scope of the present invention.
Claims (12)
1. molding process, its step comprises:
One base material is provided;
On this base material, form a pre-die layer, and with a micro electronmechanical processing method, should pre-die layer process and form a pre-die;
One die material is formed on this pre-die, and making this die forming materials is a die;
With this die making becoming mould;
Carry out a molded program with this mould at a workpiece, in order to do making this workpiece form default shape.
2. molding process as claimed in claim 1 is characterized in that described micro electronmechanical processing method is to be the flat stamping developing method, and the step of this method comprises:
The pre-die layer of this that forms on this base material is to be a sensing optical activity material;
One photomask is provided, is positioned on this pre-die layer;
One light is provided, shines on this photomask, this photomask passes part light, exposes on this pre-die layer;
Carry out development step, with in this pre-die layer by part that this light shone or do not removed by the part that this light shone, make this pre-die layer form a pre-die.
3. molding process as claimed in claim 1 is characterized in that, this die material is to utilize little electroforming mode or powder metallurgy forming mode to be formed on this pre-die.
4. molding process as claimed in claim 1 is characterized in that described die is to combine closely with a die holder and become a mould, and wherein this die can separately and this die holder be combined closely or combined closely with this die holder in the lump with this base material.
5. molding process as claimed in claim 1 is characterized in that described molded program is to be selected from following manner: punching press, extruding, die casting, forging, sheet metal and ejection formation.
6. molding process as claimed in claim 1 is characterized in that the material of described die can be selected from following material: binary or the above Ni-based or chromium-base alloys of binary such as nickel cobalt, nickel phosphorus, nickel cobalt phosphorus, nickel tungsten, nickel rhenium, nickel palladium, nickel chromium triangle, nickel carborundum phosphorus, nickel graphite, nickel manganese.
7. molding process as claimed in claim 6, the hardness that it is characterized in that described die is more than the 450HV; The processing precise degree of this die is below 1 millimeter.
8. molding process as claimed in claim 1 is characterized in that, this die can carry out a subsequent treatment after formation, to strengthen its durability; Wherein said subsequent treatment is to be selected from following manner: heat treatment, surface coating are handled, gas cooled is handled and liquid cools is handled; It is to plate layer protecting film at this die surface that wherein said surface coating is handled, and its thickness is 1 to 8 micron, and the material of this diaphragm can be selected from following material: aluminium nitride, TiAlN, chromium nitride, aluminium carbide and class are bored carbon.
9. molding process as claimed in claim 1 is characterized in that described workpiece material can be selected from following group: copper metal, copper alloy, aluminum metal, aluminium alloy and nonmetal.
10. molding process as claimed in claim 1, it is characterized in that described micro electronmechanical processing method is to be accurate discharge-treating method, be that a pre-die workpiece is placed on the accurate discharging processing machine tool, after the program by discharge processing, make this pre-die workpiece form this pre-die.
11. molding process as claimed in claim 1, it is characterized in that described micro electronmechanical processing method is to be laser processing, be that a pre-die workpiece is placed on the Laser Processing facility, use a high-octane laser light to process this pre-die workpiece, make this pre-die workpiece form this pre-die.
12. molding process as claimed in claim 1, it is characterized in that described micro electronmechanical processing method is to be the rapid prototyping technology processing method, this method is to be selected from: the stereosopic printing method of forming, the laser sintered method of selection type, laser direct forming method, 3-D spraying gluing method, melting deposition molding, laminated entity autofrettage and ink-jet molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100685541A CN100450703C (en) | 2004-08-26 | 2004-08-26 | Molding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100685541A CN100450703C (en) | 2004-08-26 | 2004-08-26 | Molding process |
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| Publication Number | Publication Date |
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| CN1739912A true CN1739912A (en) | 2006-03-01 |
| CN100450703C CN100450703C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100685541A Expired - Fee Related CN100450703C (en) | 2004-08-26 | 2004-08-26 | Molding process |
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| CN (1) | CN100450703C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102782577A (en) * | 2009-09-09 | 2012-11-14 | Lg电子株式会社 | Method for manufacturing stamper for injection molding |
| CN104249242A (en) * | 2013-06-26 | 2014-12-31 | 起亚自动车株式会社 | Method of manufacturing press mold for mass-producing hot stamping cold trim and press mold for mass-producing hot stamping cold trim manufactured using same |
| CN105695834A (en) * | 2016-02-20 | 2016-06-22 | 杨鑫 | Female forming die |
| CN106696173A (en) * | 2017-01-11 | 2017-05-24 | 东莞市津舜康五金制品有限公司 | Injection mold male mold core and production method of injection mold male mold core |
| CN107877097A (en) * | 2017-11-03 | 2018-04-06 | 瑞声光电科技(常州)有限公司 | The processing method and process equipment of lens mould |
| CN108274083A (en) * | 2017-12-27 | 2018-07-13 | 中国科学院宁波材料技术与工程研究所 | A kind of method of the micro- texture in Electrolyzed Processing surface |
| FR3092103A1 (en) * | 2019-01-29 | 2020-07-31 | Netri | Manufacturing process of 3D microfluidic devices |
| CN115213633A (en) * | 2022-05-31 | 2022-10-21 | 东莞正广精密科技有限公司 | Preparation method of AG effect texture |
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| US3498158A (en) * | 1968-06-07 | 1970-03-03 | Gti Corp | Steel embossing die and methods of making the same |
| JPH07109668B2 (en) * | 1986-10-24 | 1995-11-22 | キヤノン株式会社 | Method for manufacturing duplicate mold for precision molding |
| US5079974A (en) * | 1991-05-24 | 1992-01-14 | Carnegie-Mellon University | Sprayed metal dies |
| CN1124187C (en) * | 2000-02-28 | 2003-10-15 | 邓大仁 | Method for producing plastic optic full reflector mould |
| US6570119B2 (en) * | 2001-08-30 | 2003-05-27 | Corning Incorporated | Method of making extrusion die with varying pin size |
| AU2003201247A1 (en) * | 2002-01-17 | 2003-07-30 | Elmicron Ag | Embossing die for fabricating high density interconnects and method for its fabrication |
| JP2003279381A (en) * | 2002-01-21 | 2003-10-02 | Mitsubishi Electric Corp | Encoder, code disk, method of manufacturing metallic mold used for producing the code disk, and method of manufacturing the code disk |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8771928B2 (en) | 2009-09-09 | 2014-07-08 | Lg Electronics Inc. | Method for manufacturing stamper for injection molding |
| CN102782577A (en) * | 2009-09-09 | 2012-11-14 | Lg电子株式会社 | Method for manufacturing stamper for injection molding |
| CN104249242B (en) * | 2013-06-26 | 2019-04-05 | 起亚自动车株式会社 | For producing the pressing mold and its manufacturing method of hot padding cold-trim(ming) in batches |
| CN104249242A (en) * | 2013-06-26 | 2014-12-31 | 起亚自动车株式会社 | Method of manufacturing press mold for mass-producing hot stamping cold trim and press mold for mass-producing hot stamping cold trim manufactured using same |
| CN105695834A (en) * | 2016-02-20 | 2016-06-22 | 杨鑫 | Female forming die |
| CN106696173A (en) * | 2017-01-11 | 2017-05-24 | 东莞市津舜康五金制品有限公司 | Injection mold male mold core and production method of injection mold male mold core |
| CN107877097A (en) * | 2017-11-03 | 2018-04-06 | 瑞声光电科技(常州)有限公司 | The processing method and process equipment of lens mould |
| CN108274083A (en) * | 2017-12-27 | 2018-07-13 | 中国科学院宁波材料技术与工程研究所 | A kind of method of the micro- texture in Electrolyzed Processing surface |
| CN108274083B (en) * | 2017-12-27 | 2019-06-07 | 中国科学院宁波材料技术与工程研究所 | A kind of method of the micro- texture in Electrolyzed Processing surface |
| FR3092103A1 (en) * | 2019-01-29 | 2020-07-31 | Netri | Manufacturing process of 3D microfluidic devices |
| WO2020157412A1 (en) * | 2019-01-29 | 2020-08-06 | Netri | Method for producing 3d microfluidic devices |
| CN113646252A (en) * | 2019-01-29 | 2021-11-12 | 内特里公司 | Method for manufacturing 3D microfluidic devices |
| CN115213633A (en) * | 2022-05-31 | 2022-10-21 | 东莞正广精密科技有限公司 | Preparation method of AG effect texture |
| CN115213633B (en) * | 2022-05-31 | 2024-01-30 | 东莞正广精密科技有限公司 | AG effect texture preparation method |
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| CN100450703C (en) | 2009-01-14 |
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