CN1813335A - Endeffectors for handling semiconductor wafers - Google Patents
Endeffectors for handling semiconductor wafers Download PDFInfo
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- CN1813335A CN1813335A CN 200480018174 CN200480018174A CN1813335A CN 1813335 A CN1813335 A CN 1813335A CN 200480018174 CN200480018174 CN 200480018174 CN 200480018174 A CN200480018174 A CN 200480018174A CN 1813335 A CN1813335 A CN 1813335A
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Abstract
Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
Description
Priority request
That the application requires to enjoy in is that on June 27th, 2003 submitted to, exercise question is the priority of the U.S. Provisional Patent Application No.60/463425 of " ENDEFFECTORS FOR HANDLING SEMICONDUCTOR WAFERS ", and all is incorporated into the present invention by reference.
Technical field
Background technology
Usually, integrated circuit refers to a kind of circuit that is contained on the monolithic chip, and it includes active and passive circuit element.Integrated circuit forms with predetermined pattern diffusion and the continuous layer of deposit by utilize various materials on substrate.Described material can comprise such as the such semiconduction material of silicon, such as the such conductive material of metal and such as the such low-dielectric material of silica.The semiconduction material that is included in the integrated circuit (IC) chip is used to form similar all circuit common elements, such as resistor, capacitor, diode and transistor.
In general, be used to the to be shaped substrate of integrated circuit (IC) chip is made by thin silicon section or silicon wafer.In the manufacture process of integrated circuit (IC) chip, semiconductor wafer generally is maintained in the carrier that is known as " casket (cassette) ".Wafer is spaced from each other with stack manner in described casket.These wafers utilize the wafer handling facilities, also are known as end effector usually, individually send into the casket neutralization and take out from casket.End effector can be attached on the manipulator, moves this end effector by described manipulator on one, two or three directions.
End effector is designed to enter in the described casket between a pair of adjacent chip, and picks up out a wafer, for example is used to send in the process chamber.In this process chamber, semiconductor wafer stands a kind of in the kinds of processes.For example, in this process chamber, can carry out chemical vapor deposition method, etch process, annealing process and/or epitaxial growth technology.
In the transportation of wafer, must can not suffer damage or pollute to guarantee wafer by extreme care.Thus, many effort have been carried out, so that design the end effector and the manipulator that can carefully transport wafer in a kind of point-device mode in the industry.Although carried out multiple improvement in wafer loading and unloading field,, still require further improvement.For example, many wafer handling instruments are huge relatively and heavy, so that adapt to many apparatuses that are connected at present on this instrument, come more accurately to transport wafer.But, the size restrictions of end effector this end effector in transportation with the speed when quickening.Also have, huge relatively end effector requires process chamber to comprise relatively large opening, so that receive this end effector and carrying wafer thereon.
In view of aforementioned content, currently need the design of end effector and manipulator be further improved.Also have, need a kind of elongated relatively product design, not only can guarantee the control of accurate wafer, and can an integrated wafer detection system and a wafer pushing mechanism, wherein said wafer pushing mechanism can be used to grasp wafer in transportation.Also need a kind of elongated relatively end effector design, use in the time of can and loading and unloading thermal bimorph when the cold wafer of loading and unloading.
Summary of the invention
The present invention has recognized various defectives and the deficiency in the existing end effector design.Therefore, in general, the present invention relates to multiple the have many obvious advantages that can't obtain before this and the end effector of benefit.
For example, in one embodiment, the present invention relates to a kind of end effector that is used to load and unload semiconductor wafer.This end effector comprises a base component with near-end and far-end.For example, in one embodiment, described base component can comprise one with bifurcated mode and the isolated first point fork of the second point fork (tine).The first and second sharp forks can end at the far-end of described base component.On described base component, a plurality of supporting members can be set, be used to contact and support a wafer that places on this end effector.According to special-purpose, described supporting member can take various forms and shape.In one embodiment, described supporting member edge and this wafer that can only be formed at wafer comes in contact.Here, " edge of wafer " refers to the wafer boundary zone between wafer top surface and basal surface.For example, in the past, many end effectors play this wafer along the perimeter support of wafer, and described periphery is the part of this bottom wafer surface.
According to one embodiment of the present of invention, described end effector has a kind of elongated relatively profile.For example, described end effector can have the largest contours height less than 12 millimeters, such as less than 10 millimeters.
In one embodiment, described end effector can also comprise a thrust unit, is used for positions wafer on described base component.This thrust unit can comprise the piston that can bounce back, and this piston that can bounce back is configured to come in contact with the edge of semiconductor wafer.Described piston can move between an extended position and an advanced position.
Can be arranged to a biasing member related with described pistons work.This biasing member for example can be a spring, can be towards the described piston of its advanced position bias voltage.
In order to make described piston extension so that come in contact with wafer, described end effector can also comprise a pneumatic actuator.This pneumatic actuator can be configured to receive gases at high pressure, and these gases at high pressure are used to overcome by described biasing member and are applied to power on the described piston, and make described piston move to extended position from advanced position.In one embodiment, described pneumatic actuator can be connected on a pair of gas line.These gas lines can be configured to gases at high pressure are infeeded in the described pneumatic actuator.The power of described gas can be used to a drive member moved in the described pneumatic actuator and from described pneumatic actuator and shift out.Described drive member can be connected on the described piston thus, is used to make described piston extension and bounce back to a desired location.
When including thrust unit, described end effector can also comprise a getter device with the adjacent setting of described pneumatic actuator.Described getter device can be configured to produce a suction, is used for catching the particle that any process that moves at described piston discharges.For example, in one embodiment, described getter device can be communicated with a gas line fluid on being connected in described pneumatic actuator.A check-valves can be set between described gas line and getter device.When applying a suction to described gas line, described check-valves can be opened, and comes at suction of the inner generation of described getter device.By this way, described getter device can be used in when wafer is not clamped by described thrust unit.
End effector among the present invention can also comprise a wafer detection system, is used for surveying whether have wafer on this end effector.For example, in one embodiment, this wafer detection system can comprise one be communicated with photoconductive tube send optical channel, wherein this send optical channel to comprise a light source and an angle type optics.Can go out a light beam by described light emitted, this light beam conducts to described angle type optics by photoconductive tube.Described angle type optics can be constructed such that described light beam is transverse in the wafer receiving area that is limited by supporting member on the described base component.
Relative with the described optical channel that send, can be provided with one across described wafer receiving area and be subjected to optical channel, be used to receive the light beam that send optical channel to launch by described.This can be communicated with an optical sensor by optical channel.Described optical sensor can be used to indicate when the light beam that crosses described wafer receiving area is blocked and have wafer.
Be contained in and describedly send the angle type optics in the optical channel can comprise a reflection device that is used in combination with convex lens, such as mirror, wherein said convex lens make light beam focus on and narrow down.The described optical channel that send can also comprise a unthreaded hole between described photoconductive tube and angle type optics.The diameter of this unthreaded hole is less than the diameter of described photoconductive tube.For example, the diameter of described unthreaded hole can be from about 0.2 millimeter to about 1 millimeter, and the diameter of described photoconductive tube can be from about 2 millimeters to about 6 millimeters.Described photoconductive tube for example can be made such as the such crystalline material of quartz by a kind of.
The described optical channel that is subjected to can also comprise an angle type optics that is communicated with unthreaded hole and photoconductive tube.Described be subjected to optical channel can also comprise one facing to described send optical channel be subjected to the light opening.This is subjected to the light opening can be used to make the described visual field of optical channel that is subjected to narrow down.
According to the instruction among the present invention, can construct and use the end effector of number of different types as required.For example, in one embodiment, can make a kind of end effector that temperature is lower than 250 ℃ cold wafer that is specially adapted to load and unload.In another embodiment, can design a kind of end effector that is configured to maintain thermal bimorph, be higher than 250 ℃ wafer, for example up to 750 ℃ such as temperature.For example, in a kind of wafer processing process, this system can comprise a cold wafer end effector and a thermal bimorph end effector, is used for transporting wafer between process chamber and casket.
The end effector that is used to load and unload cold wafer can comprise a base component, and this base component is made such as the such metal of stainless steel by a kind of.The supporting member that is contained on the described base component can be made by a kind of low friction plastic property material, such as polyethers-ether ketone or polyformaldehyde-acetal polymer.In one embodiment, described supporting member can have one and is used for the inclined surface that comes in contact with Waffer edge.This inclined surface can have a kind of evagination and eccentric shape.For example, in one embodiment, described end effector can comprise four supporting members, and wherein two supporting members are positioned at the place, end that described first and second points are pitched.Be positioned at the surface that the supporting member at described sharp fork end place can have evagination and eccentric shape.
On the other hand, the end effector that is used to load and unload thermal bimorph can be made by a kind of heat proof material, such as fire polishing quartz or sapphire.In the present embodiment, described supporting member can form with described base component is whole.For example, described supporting member can be a kind of arcuate in shape, and this arcuate in shape is complementary with the radius of semiconductor wafer substantially.Each supporting member all can have a wafer contact surface, and this wafer contact surface diminishes to the least radius adjacent with described base component gradually from a maximum radius.Difference between maximum radius and the least radius can be at least about 0.75 millimeter, for example is at least about 1 millimeter.
In one embodiment, described end effector can also comprise the emergent pin that is positioned on the described base component in the central area between near-end and the far-end.These emergent pins can be contained on the end effector that is used to load and unload cold wafer or be contained in the end effector that is used to load and unload thermal bimorph.The common height of these emergent pins is less than the height of described supporting member.For example, these emergent pins can have less than about 1 millimeter height.
Described emergent pin is not to be designed under normal circumstances come in contact with semiconductor wafer.But if deflection (bowing) has taken place a wafer that is included on the described end effector, so described emergent pin will support this wafer, and prevent that other parts on this wafer and the end effector from coming in contact.If described wafer has taken place to contact with other parts on the end effector, this wafer might be contaminated or be produced temperature gradient so.
Further feature of the present invention, aspect and advantage are discussed in the back in more detail.
Description of drawings
With reference to the accompanying drawings a plurality of embodiment of the present invention are described:
Fig. 1 is the perspective view of a wafer processing process embodiment who makes according to the present invention;
Figure 1A is the perspective view of two manipulators, and each manipulator all is attached on the end effector of making according to the present invention;
Fig. 2 is the perspective view of an end effector embodiment who makes according to the present invention;
Fig. 3 is the plane graph of end effector shown in Fig. 2;
Fig. 4 is the end view of end effector shown in Fig. 2;
Fig. 5 is the enlarged perspective of end effector shown in Fig. 2, and some part is cut;
Fig. 6 A and 6B are the perspective views of the end effector that includes a thrust unit made according to the present invention, and some part is cut;
Fig. 7,7A and 7B are a plurality of views of an end effector that comprises the wafer detection system of making according to the present invention;
Fig. 8 is the perspective view of another one according to end effector embodiment of the present invention;
Fig. 9 A, 9B, 10A and 10B are the end views of different end effector embodiment, show the various supporting members of making according to the present invention;
Figure 11 is the perspective view of end effector shown in Fig. 8, and some part is cut; And
Figure 12 also is the perspective view of end effector shown in Fig. 8, and some part is cut.
Reusable Reference numeral is used for feature or the element of representing that the present invention is identical or similar in this specification and accompanying drawing.
Embodiment
Below with reference to embodiments of the invention, provided one or more example below.Each example all is used to explain the present invention, and the present invention is limited.In fact, for those skilled persons of present technique field, under the condition that does not depart from the scope and spirit of the present invention, can carry out multiple improvement and modification in the present invention.For example, the feature that is illustrated or is described as the parts among the embodiment can be used in another embodiment, obtain another embodiment.Therefore, wish that the present invention covers improvement and the modification within these scopes that fall into claims and their equivalent scope.Those skilled in the art will be appreciated that present discussion all is the descriptions to exemplary embodiment, and is not to be used for wideer aspect of the present invention is limited, and wherein said wideer aspect is implemented with representative configuration.
On the whole, the present invention relates to a kind of processing of wafers and handling system.According to the present invention, designed multiple end effector, compare with many existing structures, many improvement and advantage are provided.For example, in one embodiment, the present invention relates to a kind of low-temperature chip that is designed to load and unload, be lower than 250 ℃ wafer such as temperature, end effector.Alternatively, the invention still further relates to and be designed to load and unload thermal bimorph, be higher than 250 ℃ wafer such as temperature, the structure of end effector.But, should be appreciated that any feature that is associated with the end effector that is used to load and unload low-temperature chip also can be used in the end effector that is used to load and unload the relatively-high temperature wafer.
The end effector of making according to the present invention can comprise custom-designed supporting member, is used at this end effector upper support wafer.These supporting members only are designed to come in contact at edge and this wafer of wafer.
Except described supporting member, end effector can also comprise a wafer detection system.Also have, described end effector can comprise a thrust unit, and this thrust unit is used for positions wafer on described end effector.Described thrust unit can also be used for wafer holder at this end effector in the rapid movement process of described end effector.
With reference to Fig. 1, show a wafer processing process embodiment who makes according to the present invention.As shown in the figure, this system comprises a plurality of wafer cassette 10,12 and 14.These wafer cassette are designed to maintain wafer in mode spaced apart but that pile up.One or more manipulator 16 is adjacent with these caskets.As shown in the figure, these manipulators all are attached on the end effector, and wherein said end effector is designed to take out semiconductor wafer and they are inserted in the processing of wafers chamber 18 from casket 10,12 and 14.
In the embodiment shown in fig. 1, system comprises one first semiconductor wafer processing chamber 18 and one second semiconductor wafer processing chamber 20 (not shown).Semiconductor wafer processing chamber 18 comprises a door 22, and this door 22 opens and closes with in order wafer to be put into process chamber and to be taken out wafer from process chamber.Described processing of wafers chamber can be formed at and implement kinds of processes on the semiconductor wafer.For example, these process chambers can be designed to implement chemical vapor deposition, annealing, epitaxial diposition, etching or the like.In the embodiment shown in fig. 1, process chamber 18 comprises a rapid thermal treatment chamber.In the embodiment shown in fig. 1, the lid 24 of process chamber 18 is shown in an open position.This covers and keeps closing in processing procedure, but for example can be opened for process chamber is safeguarded.
Rapid thermal treatment chamber 18 can be connected on the air chamber 26, and this air chamber 26 maintains the multiple gas that uses in wafer processing procedure.For example, for a plurality of dissimilar layers of deposit on a semiconductor wafer, can infeed multiple gases to described process chamber.Described gas also can be the inert gas that is used for preventing to take place on semiconductor wafer in heat treatment process any undesirable reaction.
With reference to Figure 1A, show a pair of antithesis manipulator 28 and 30, all be connected on the end effector 32 and 34 of a correspondence.In the present embodiment, end effector 32 is used to load and unload the semiconductor wafer that is in relatively lower temp, and end effector 34 is used to load and unload the semiconductor wafer that is in higher temperature.Owing to have two manipulators 28 and 30 and two end effectors 32 and 34, so the system among the present invention can load and unload two semiconductor wafers simultaneously.For example, end effector 34 can take out a semiconductor wafer from process chamber 24, and simultaneously end effector 32 takes out a semiconductor wafer from casket, is used for replacing that of process chamber.
As shown in Figure 1A, manipulator 28 comprises a first 36 and a second portion 38, and manipulator 30 comprises a first 40 and a second portion 42.By using these parts, manipulator can freely move described end effector on both direction (X and Y direction).By comprise suitable mechanism in manipulator, described end effector can also upper and lowerly move (Z direction).For example, as shown in Figure 1A, described manipulator can be connected on the lifting device 43, promotes this manipulator when needed.Refer again to Fig. 1, described manipulator can also be installed on the linear track, makes this manipulator move along described casket and process chamber.
Need should be appreciated that the manipulator shown in Figure 1A has only been represented a kind of mechanism for implementing example that is used for mobile end effector 32 and 34.Thus, any suitable manipulator all can be connected on the described end effector.For example, in other embodiments, described end effector can be connected on the manipulator that comprises linear slide block, is used for moving on one, two or three directions.
With reference to Fig. 2-7B, will be described the end effector shown in Figure 1A 32 in more detail below.As shown in Fig. 2 and 3, end effector 32 comprises a base component 44.This base component 44 comprises a back 46 that limits the near-end of end effector.This base component also comprises 48 and one second point forks 50 of one first point fork, and they all end at the far-end of end effector.When being used to load and unload the wafer with relatively lower temp, base component 44 can be made such as the such metal of stainless steel by a kind of.Alternatively, can use any other suitable material.
For at described end effector upper support wafer, described end effector comprises the supporting member that is positioned in a large number on the base component.In the embodiment shown in Fig. 2 and 3, described end effector comprises four supporting members 52,54,56 and 58.As shown in Figure 3, these supporting members all are positioned on the described end effector, so that edge such and semiconductor wafer 60 shown in dotted line comes in contact.Supporting member 52,54,56 and 58 can be made by any suitable material with low-friction coefficient.For example, these supporting members can be made by a kind of plastic material, such as polyethers-ether ketone (PEEK) or polyformaldehyde-acetal polymer (POM).Alternatively, described supporting member can be made by a kind of crystalline material, such as quartz or sapphire.
For edge and this semiconductor wafer 60 at semiconductor wafer 60 only comes in contact, each supporting member all can have an inclined surface.
For example, with reference to Fig. 5, show a supporting member embodiment 56 who makes according to the present invention.In the present embodiment, supporting member 56 comprises a surface with off-centre and convex shape.The inventor has been found that predetermined surface shape shown in Figure 5 is used for making this wafer to feel relieved better on supporting member when a wafer is loaded on the end effector.As shown in Figure 5, because the evagination and the eccentric shape of supporting member, this wafer is promoted along line 62 in the centering process of wafer.As the back will more describe in detail, this given shape also will with a thrust unit collaborative work better.
In one embodiment, supporting member 56 and 58 all has a kind of evagination and eccentric shape.But supporting member 52 and 54 can have a kind of convex shape but be not eccentric.In other embodiments, supporting member 52 and 54 can comprise any suitable inclined surface that can cooperate with Waffer edge.In other embodiment, supporting member 52 and 54 can be formed at cooperating with wafer Anywhere of intra-zone except that Waffer edge.
As shown in Figure 3, each supporting member 52,54,56 and 58 is all propped up this wafer 60 around the marginal branch of wafer 60.These supporting members limit a wafer receiving area between them.For wafer being remained in the wafer receiving area, described end effector also comprises the circumferential supporting pin 64 that is positioned at this end effector proximal end and 66 and the stop dog component 68,70,72 and 74 that is positioned at this end effector far-end.On the whole, the height of described circumferential supporting pin and stop dog component is greater than described supporting member.For example, described circumferential supporting pin and stop dog component can exceed 0.2 millimeter than described supporting member at least, such as exceeding 0.5 millimeter than described supporting member at least.Circumferentially supporting pin 64 and 66 and stop dog component 68,70,72 and 74 be used for endways that the acceleration and the moderating process of actuator 32 remain on wafer 60 within the described wafer receiving area.
As shown in Figure 3, be provided with a pair of stop dog component at the place, end of each point fork around corresponding supporting member.For example, because semiconductor wafer 60 can comprise that is used for a breach of this wafer being felt relieved in various technologies in certain embodiments, so used a pair of stop dog component.But,,, still can come in contact with this wafer even the breach that is contained on the wafer aligns with a stop dog component by utilizing two stop dog components.Certainly, in certain embodiments, will only need a stop dog component.Alternatively, the width of described stop dog component can be greater than the width that is contained in the breach on the wafer.
According to the present invention, as illustrating especially in Fig. 2 and 3, end effector 32 also comprises a pair of emergent pin 76 and 78. Emergent pin 76 and 78 points that are positioned on the described end effector are stuck, and are designed to generally not come in contact with this semiconductor wafer 60 when semiconductor wafer 60 is supported on the described supporting member.Thus, the overall height of emergent pin 76 and 78 is lower than the height of described supporting member.For example, the height of emergent pin 76 and 78 can be at least than low 0.2 millimeter of described supporting member, such as low 0.5 millimeter.For example, in one embodiment, low 0.7 millimeter of the described supporting member of aspect ratio of emergent pin 76 and 78.
Now, semiconductor wafer is manufactured with bigger size and thin as much as possible.Thus, wafer bending or deflection may appear, if when particularly wafer has higher temperature.Therefore, emergent pin 76 and 78 provides the support to the deflection wafer under the condition that wafer is damaged by substance can.
Usually, emergent pin 76 and 78, circumferentially supporting pin 64 and 66 and stop dog component 68,70,72 and 74 can make by a kind of plastics or crystalline material.Usually, described emergent pin, circumferentially supporting pin and stop dog component can be made by any material that is used to produce described supporting member.
Aforementionedly be used to support and keep the passive device of semiconductor wafer except various, end effector 32 comprises that also is marked as a thrust unit of 80 generally.This thrust unit 80 is comprised in the base component 44 of end effector 32.The mechanism of this thrust unit is shown in Fig. 6 A and the 6B.In Fig. 6 A and 6B, end effector 32 is shown, and point fork 48 and 50 is not connected on the back 46.
As shown in Figure 6A and 6B, thrust unit 80 comprises a piston 82 that is connected on the contact 84.As shown in Fig. 6 B, contact 84 is designed to come in contact with the edge of semiconductor wafer 60.This contact can have a flat surface or a raised type surface.For most of applications, desirable is that described contact only contacts with this wafer point-like in the edge of wafer.
In order to make steam-cylinder piston 95 retractions, interrupt flow is crossed the gas of first gas line 92, and supplies with gases at high pressure via second gas openings 90 by second gas line 94.For example, can send, so that force steam-cylinder piston 95 to return in the pneumatic actuator 86 by second gas line, 94 gas supplied.For example, in one embodiment, steam-cylinder piston 95 can comprise a plunger (not shown), this plunger a side with come in contact by first gas line, 92 gas supplied, an other side with come in contact by second gas line, 94 gas supplied.By this way, steam-cylinder piston 95 can move into and shift out pneumatic actuator 86.Thus, when making that steam-cylinder piston 95 stretches, by gas line 92 supply gas, and the gas in the discharge gas line 94.On the contrary, when making steam-cylinder piston 95 retractions, by gas line 94 supply gas, and the gas in the discharge gas line 92.Also have, when for example as Fig. 6 B as shown in, wafer being remained on clip position, at gas line 92 inner maintenance gases at high pressure.
By moving drive member 96 via steam-cylinder piston 95, piston 82 moves between an advanced position and an extended position.Advanced position is shown in Fig. 6 A, and the extended position of piston 82 illustrates at Fig. 6 B.
In the motion process of piston 82, for most of applications, desirable is not allow any particle land that produce or stain the semiconductor wafer that is included on the end effector 32 by any way in the component movement process.Thus, in the present embodiment, piston 82 is maintained in the double-row bearing 100 of contiguous contact 84.Also have, all moving-members in the thrust unit 80 all are maintained within the housing that is limited by the base component 44 of end effector 32.
In one embodiment, end effector 32 can also comprise a getter device 101, and this getter device 101 is designed to catch the particle within any housing that may be present in the described base component.For example, as shown in Figure 6A and 6B, a getter device 101 is adjacent with pneumatic actuator 86, and is communicated with second gas line 94 and second gas openings, 90 fluids.Getter device 101 can for example be connected on second gas line 94 via a check-valves.By this way, when a vacuum source is connected on the gas openings 90, can impel described check-valves to open at suction of gas line 94 inner generations.In case described check-valves is opened, getter device 101 can produce a suction in described enclosure interior so, is used to catch any particle and prevents outside these particle effusion contacts 84.Getter device 101 for example can be worked as when need not gases at high pressure in second gas line, 94 inside and starting pneumatic actuator 86 and started.But, in an alternate embodiment, need should be appreciated that, can on getter device 101, connect an independently gas line, be used for producing a suction in the enclosure interior of described end effector always.
Except on the actuator endways wafer being positioned, thrust unit 80 is applicable to that also assistance takes out the base sheet rack of wafer from casket or from process chamber, so that this wafer is placed on the described end effector.For example, along with end effector moves in the casket, manipulator can be subjected to program control, thereby makes the contact 84 of wafer percussion piston 82.In case wafer has taken place to contact with contact 84, so described piston utilizes pneumatic actuator 86 to be stretched, and is used for this wafer clamp is leaned against described stop dog component.In case clamp, described end effector and wafer can be transmitted at a high speed, needn't worry that but wafer is shifted.Also have, in processing procedure, only the edge at wafer grasps this wafer, has also alleviated the damage to wafer.
As previously mentioned, piston 82 in the thrust unit 80 and contact 84 are designed such that described piston is stretching when pneumatic actuator 86 is supplied with gases at high pressure.In the past, end effector is designed to have a spring, and this spring is towards a kind of extended configuration bias voltage push rod.In these existing structures, use a vacuum power that described piston is remained on advanced position subsequently.But the inventor has been found that by pneumatic actuator 86 for example as previously mentioned, can reduce the profile height of end effector.The height that reduces end effector provides multiple advantage and benefit.For example, elongated end effector is easier to control.End effector can enter casket and processing of wafers chamber with less clearance.By utilizing an elongated end effector, casket can be designed to carry more wafer.
Similarly, process chamber can be made with a more narrow opening that supplies end effector to enter.By having a more narrow opening, when the end effector in utilizing the present invention inserts wafer in the process chamber, less generation pollution and variations in temperature.Also have, if process chamber includes pernicious gas, the size of the opening by reducing to receive described end effector so, any this gas is overflowed not too easily.
Thus, with reference to Fig. 4, show an end view of end effector 32.Even when including a thrust unit as previously mentioned, end effector 32 also can have and is lower than about 12 millimeters largest contours height, such as being lower than about 10 millimeters.In fact, in one embodiment, believe that can produce the largest contours height according to the present invention is lower than about 8.5 millimeters end effector.
Except having thrust unit, can also equip a wafer detection system according to the end effector that the present invention produces.With reference to Fig. 7,7A and 7B, show a wafer detection system embodiment who produces according to the present invention.In the present embodiment, shown wafer detection system is incorporated in the end effector 32, and wherein end effector 32 is designed to load and unload the wafer that is in relatively lower temp.But, must understand the time, this wafer detection system equally also is fit to use with the end effector that is used to load and unload the wafer that is in higher temperature.
In Fig. 7,7A and 7B, show end effector 32 once more, its Tipping Center fork 48 and 50 is not connected on the back 46 of base component 44.Also have, shown wafer detection system is positioned at the proximal end of end effector.But, should be appreciated that this wafer detection system can be placed in any other correct position of the inside, wafer receiving area on the end effector 32.
Usually, described wafer detection system comprises a light source, and this light emitted goes out a light beam that crosses the wafer receiving area on the end effector.A receiver is configured to receive described light beam, and for example can comprise an optical sensor.If described light beam is blocked, so described wafer detection system will be indicated endways and be had a wafer on the actuator.
With reference to Fig. 7 A, described wafer detection system comprise one be communicated with photoconductive tube 102 send the optical channel (not shown).Photoconductive tube 102 is preferably made by a kind of material that can stand high temperature.For example, in one embodiment, photoconductive tube 102 comprises one by the fiber of making such as the such crystalline material of quartz.Described photoconductive tube can have any suitable diameter, such as from 2 millimeters to 5 millimeters.For example, in one embodiment, photoconductive tube 102 can have the diameter of 3 millimeter.As shown in Figure 7A, photoconductive tube 102 extends along the periphery of end effector.
With reference to Fig. 7 B, show the described end of sending optical channel in more detail.As shown in the figure, photoconductive tube 102 ends at a unthreaded hole 104.As shown in the figure, the diameter of this unthreaded hole is less than the diameter of described photoconductive tube.For example, the diameter of this unthreaded hole can be from about 0.1 millimeter to about 1.5 millimeters, such as the diameter with 0.5 millimeter.On the whole, unthreaded hole 104 has dwindled the diameter of described light beam, and has the trend that makes that light beam is strengthened.
From unthreaded hole 104, described light beam enters an angle type optics 106.This angle type optics for example can comprise a reflection device 108 that is combined with lens 110.Reflection device 108 for example can comprise a minute surface that changes beam direction, thereby makes described light beam cross the wafer receiving area on the end effector.But, should be appreciated that to replace reflection device 108 that described angle type optics can comprise any appropriate device that can change described beam direction.
The lens 110 that accompany with reflection device 108 for example can be convex lens.Lens 110 are designed such that described light beam focusing and narrow down.For example, the diameter that leaves the light beam of lens 110 can be less than about 1.5 millimeters, such as less than about 1.0 millimeters.For example, in one embodiment, pass the diameter that can have about 0.5 millimeter of the light beam of lens 110.
After passing lens 110, described light beam passes the aperture or the optical channel opening 112 that cross end effector.Aperture 112 can not produce any influence to light beam itself usually.
Relative with lens 110, as shown in Figure 7A, described end effector comprises that also is subjected to an optical channel.In one embodiment, this is subjected to optical channel can have a kind of described structure that send optical channel that is very similar to.For example, this is subjected to optical channel can comprise an angle type optics 116, a unthreaded hole 118 and a photoconductive tube 120.Photoconductive tube 120 can be communicated with an optical sensor, and wherein said optical sensor is designed to sensing by the described amount that is subjected to the light of optical channel reception.If the amount of light reduces, so described optical sensor can be configured to indication and have a wafer on described end effector.
Describedly be subjected to optical channel also to comprise an aperture or be subjected to light opening 122.As shown in Figure 7, have divergent trend by the described light beam that send optical channel to launch, and along with light beam is advanced by optical channel to be cone shape towards described.By advancing with a kind of circular cone pattern, described light can reflect from adjacently situated surfaces.Light through reflection can be back to detector, and false readings is provided.
But aperture 122 can be avoided this problem by making the visual field that receives light narrow down.On the whole, aperture 122 has formed one and has been used for the described shadow shield that is subjected to optical channel.Thus, aperture 122 has prevented that incident ray is communicated with optical sensor via the described optical channel that is subjected to.
Can change according to special-purpose by the diameter of light aperture 122.For example, in one embodiment, described aperture can have from about 1 millimeter to about 5 millimeters diameter, such as have from about 2 millimeters to about 4 millimeters diameter.
In the aforementioned parameters scope, the light beam that crosses the end effector generation focusing among the present invention can have from about 2 millimeters to 4 millimeters diameter.For example, in one embodiment, described light beam can have the wafer of 3 millimeter and survey diameter.In other words, in the present embodiment, described optical detection system can be surveyed wafer in the Z zone of 3 millimeter.For most of applications, in order to reduce undesirable light reflection, the diameter of described light beam must be no more than about 3 millimeters.
Below with reference to Fig. 8-12, show an end effector 34 that is used to load and unload the wafer that is in higher temperature.Especially, this end effector is highly suitable for loading and unloading the wafer that temperature is higher than 250 ℃, such as being higher than 500 ℃.End effector 34 comprises a base component 124, and this base component 124 comprises a back 126 that is connected on the first point fork, the 128 and second point fork 130.In order to load and unload the wafer that is in higher temperature, point fork 128 and 130 can be made by a kind of heat proof material, such as quartz or sapphire.Preferably, point fork 128 and 130 is polished a smooth surface.For example, in one embodiment, described surface can be handled through fire polishing.
As shown in the figure, end effector 34 also comprises a plurality of supporting members 132,134,136 and 138.These supporting members are can be with described end effector integrally formed or can be made by material components independently.Supporting member 132,134,136 and 138 can be made by previous materials, such as quartz and sapphire.
With reference to Figure 11, show the decomposition view of supporting member 136, and in Figure 12, show the zoomed-in view of supporting member 132.As shown in the figure, supporting member 132 and 136 all is arcuate in shape.This arcuate in shape is become with the radius that is about to remain on the semiconductor wafer on the end effector to be complementary by master-plan.Supporting member 136 also comprises an inclined surface 140, and supporting member 132 comprises an inclined surface 142 simultaneously.Inclined surface 140 and 142 only is designed to come in contact with the edge of semiconductor wafer.All these supporting members limit a wafer capture region that is used for location on the actuator endways and keeps wafer jointly.
In wafer heating process, be known that the diameter of semiconductor wafer may increase 1 millimeter.Thus, also be designed to load and unload these wafers with inclined surface that each supporting member is associated when the relative heat of wafer or when colder relatively.Thus, the inclined surface on each supporting member limits one first or maximum radius at the place, top of these supporting members, and limits one second or least radius towards the supporting member bottom adjacent with the base component of end effector.According to the present invention, the maximum gauge of described supporting member and the difference between the minimum diameter be greater than about 0.5 millimeter, such as greater than about 1 millimeter.
By this way, all supporting member co-operation are loaded and unloaded and are had wafers having different sizes.For example, with reference to Fig. 9 A and 9B, show an end view of end effector 34.Especially, Fig. 9 A and 9B show supporting member 132 and the supporting member 138 that is keeping a semiconductor wafer 144.In Fig. 9 A, semiconductor wafer 144 has higher temperature, and has the diameter greater than wafer 144 shown in Fig. 9 B thus.But according to the present invention, supporting member 132 and 138 can support the wafer that is in heat expands state or cold contraction state.Also have, described supporting member can be only maintains this wafer in the edge of wafer.
As shown in Figure 9A and 9B, the inclined surface on the supporting member 132 and 138 all is concave shape.But according to special-purpose, the inclined surface on these supporting members can have other multiple shape.For example, replace the indent formula, described surface also can be convex shape.With reference to Figure 10 A and 10B, in the present embodiment, the inclined surface on the supporting member 132 and 138 has a beveled surface.Especially, the surface of described supporting member is linearly in the present embodiment.Be similar in the mode shown in Fig. 9 A and the 9B, shown wafer 144 is maintained by described stayed surface.
Referring again to Fig. 8, end effector 34 also comprises a pair of emergent pin 146 and 148 of emergent pin 76 and 78 as shown in Figure 2 that is similar to.Emergent pin 146 and 148 be used for wafer on remaining in end effector no longer align or bend or during deflection and this wafer come in contact.In fact, being in wafer under the higher temperature is easier to take place deflection and comes in contact with emergent pin 146 and 148.Usually, emergent pin 146 and 148 can be made by any heat proof material, such as quartz or sapphire.These pins can separate with described end effector to be produced separately or can be integrally formed with described end effector.As shown in Figure 2, the height of described emergent pin is lower than the height of described supporting member, and is designed to except that amorphous sheet bending or deflection take place really, does not come in contact with wafer.
Compare with many existing structures, provide multiple advantage and benefit with foregoing end effector 32 and 34 as shown in FIG..For example, as previously mentioned, these end effectors have a kind of elongated profile and are easy to control.These end effectors also comprise the supporting member of unique shape, unique wafer detection system and/or thrust unit, and wherein said thrust unit can be used to assist loaded with wafers and with wafer holder endways on the actuator.In fact, by aforesaid elements combination, believe that the end effector among the present invention can obtain wafer more efficiently than many end effectors of producing in the past.
For example, being present in supporting member on the described end effector can grasp these wafers on one's own initiative and these wafers are felt relieved when wafer is placed on this end effector.Thus, after described end effector has obtained wafer and begun to move, need not to start and utilize described thrust unit to clamp described wafer.Need not to clamp immediately the productivity ratio that described wafer can improve wafer processing process greatly.
For example, in one embodiment, the end effector among the present invention is moved into the wafer station that is provided with wafer.Described end effector moves below wafer.In case be lower than wafer, described end effector is raise on the Z direction, so that described wafer is placed on this end effector.Although described wafer is in not clamping or on-fixed position, the wafer detection system determines endways whether have wafer on the actuator subsequently.If have wafer on described end effector, this end effector shifts out described wafer station immediately so, and can be such as utilizing thrust unit that described wafer is felt relieved when moving.
As previously mentioned, when being loaded into a wafer on the end effector, the thrust unit that is in advanced position also can be used to this wafer is pushed to the point of described end effector and stick.
Compare with aforementioned technology, many existing end effectors need make end effector feel relieved and clamping to wafer this wafer station before wafer station retraction.Because their structure, the end effector among the present invention has overcome this shortcoming.
Under the condition that does not break away from the spirit and scope of the invention, those those of ordinary skill can be implemented these and other improvement and modification of the present invention in the art, and the spirit and scope of the invention are stated in claims especially.In addition, should be appreciated that the part among each embodiment can exchange in whole or in part.Also have, those skilled persons will understand is that in the art, and the description of front does not wish to be confined to so the present invention of description only as example in these claims.
Claims (100)
1, a kind of end effector that is used to load and unload semiconductor wafer comprises:
Base component with near-end and far-end, this base component has the top surface that is configured to receive semiconductor wafer;
Supporting member on a plurality of top surfaces that are positioned at described base component, the wafer that these supporting members are configured to and are received on the described top surface comes in contact;
Thrust unit is used on described base component wafer being positioned, and this thrust unit comprises and be configured to the bounced back piston that the edge with semiconductor wafer comes in contact that this piston can move between extended position and advanced position;
With the biasing member that described piston is associated, this biasing member is towards the described piston of its advanced position bias voltage; And
With pneumatic actuator related on the described piston action, this pneumatic actuator is configured to receive gases at high pressure, is used to overcome by described biasing member be applied to power on the described piston, and makes described piston move to extended position from advanced position.
2, end effector as claimed in claim 1 also comprises the contact element that is positioned on described piston one end, is used for the contact semiconductor wafer, and this contact element has flat surfaces.
3, end effector as claimed in claim 1 also comprises the contact element that is positioned on described piston one end, is used for the contact semiconductor wafer, and this contact element has the spirogyrate surface.
4, end effector as claimed in claim 1, wherein, described piston is maintained at the bearing assembly that is arranged in described pneumatic actuator downstream, and this bearing assembly prevents that particle that produces and the semiconductor wafer that remains on the described base component from coming in contact in described piston motion process.
5, end effector as claimed in claim 1, wherein, described biasing member comprises spring.
6, end effector as claimed in claim 1, wherein, the power that is applied on the described piston by described biasing member increases along with described piston extension.
7, end effector as claimed in claim 1, wherein, described pneumatic actuator is connected on first gas line and second gas line, this actuator comprises drive member, described first gas line is configured to gas is infeeded in this pneumatic actuator, be used to make described drive member to shift out this pneumatic actuator, and described second gas line is configured to gas is infeeded in this pneumatic actuator, the described drive member that is used to bounce back, described drive member is connected on the described piston.
8, end effector as claimed in claim 1 comprises also and the getter device of the adjacent setting of described pneumatic actuator that this getter device is configured to produce suction, is used for being captured in any particle that described piston motion process discharges.
9, end effector as claimed in claim 1 comprises that also at least one is used for the position transducer of the described position of piston of sensing.
10, end effector as claimed in claim 1, wherein, described thrust unit is positioned at the proximal end of described base component.
11, end effector as claimed in claim 1, wherein, the largest contours height of described end effector is lower than about 12 millimeters.
12, end effector as claimed in claim 1, wherein, the largest contours height of described end effector is lower than about 10 millimeters.
13, end effector as claimed in claim 1, also comprise at least one be positioned on the described base component and roughly with the opposed stop dog component of described thrust unit, the height of wherein said stop dog component is enough to wafer be remained between this stop dog component and the piston when small part stretches at described piston.
14, end effector as claimed in claim 13, wherein, described base component comprises and the isolated first point fork of the second point fork that the first and second point forks all end at the far-end of described base component, each point fork includes at least one stop dog component.
15, end effector as claimed in claim 1, wherein, described biasing member and pneumatic actuator all are contained in the housing that is limited by described base component.
16, end effector as claimed in claim 1, wherein, some supporting member comprises and only is configured to the surface that the edge with semiconductor wafer comes in contact at least, this surface is evagination and eccentric shape.
17, end effector as claimed in claim 1, also comprise the wafer detection system, this wafer detection system comprises and strides across described base component and be subjected to the opposed optical channel that send of optical channel, this send optical channel to be configured to be subjected to optical channel emission light beam towards described, and this wafer detection system is formed at the existence that detects wafer when described light beam is blocked by wafer.
18, end effector as claimed in claim 1, wherein, described a plurality of supporting member limits the wafer receiving area, and this end effector also comprises a pair of emergent pin, this sells substantially in the near-end of described base component and the central area, wafer receiving area between the far-end emergent, in positioned opposite separately, the height of these emergent pins are lower than the height of described supporting member, are used to prevent that semiconductor wafer and described base component from coming in contact on described base component.
19, end effector as claimed in claim 14 wherein, is provided with a pair of stop dog component at the place, end of each point fork, and all around the supporting member of correspondence, each stop dog component all has the height greater than corresponding supporting member to stop dog component for each.
20, end effector as claimed in claim 1, wherein, described a plurality of supporting member limits the wafer receiving area, and this end effector also comprises at least one circumferentially emergent pin, should circumferentially emergently sell the base component proximal end that is positioned at outside the described wafer receiving area, and height is greater than the height that is used for semiconductor wafer is remained on the supporting member within the described wafer receiving area.
21, a kind of end effector that is used to load and unload semiconductor wafer comprises:
Base component with near-end and far-end;
A plurality of supporting members that are positioned on the described base component are used to contact and support the semiconductor wafer that places on this end effector, and these supporting members limit the wafer receiving area between them;
Send optical channel, comprise the light source and the angle type optics that are communicated with photoconductive tube, wherein the light beam that is sent by described light source conducts to described angle type optics by photoconductive tube, and described angle type optics is constructed such that described light beam changes direction and passes described wafer receiving area;
Be subjected to optical channel, stride across described wafer receiving area and the described optical channel that send is opposed, be used to receive the light beam that send optical channel to send by described; And
With the described optical sensor that be communicated with by optical channel, this optical sensor is configured to indicate the existence of wafer when the light beam that crosses described wafer receiving area is blocked.
22, end effector as claimed in claim 21, wherein, the described optical channel that send also comprises unthreaded hole between described photoconductive tube and angle type optics.
23, end effector as claimed in claim 22, wherein, the diameter of described unthreaded hole is less than the diameter of described photoconductive tube.
24, end effector as claimed in claim 23, wherein, described photoconductive tube have from about 2 millimeters to about 6 millimeters diameter, and described unthreaded hole have from about 0.2 millimeter to about 1 millimeter diameter.
25, end effector as claimed in claim 21, wherein, described angle type optics comprises and the isolated reflection device of convex lens that described convex lens are constructed such that light beam focusing and narrow down.
26, end effector as claimed in claim 21, wherein, described proximal end and the described optical channel that is subjected to that send optical channel to be provided in described base component is opposed.
27, end effector as claimed in claim 21, wherein, described photoconductive tube comprises crystal fibre.
28, end effector as claimed in claim 21, wherein, described photoconductive tube comprises quartz fibre.
29, end effector as claimed in claim 21 wherein, is describedly also comprised with described by optical channel to send optical channel the opposed light opening that is subjected to.
30, end effector as claimed in claim 21, wherein, the described angle type optics that also comprised by optical channel to be communicated with photoconductive tube, described photoconductive tube is communicated with described optical sensor.
31, end effector as claimed in claim 21, wherein, described send optical channel be constructed such that light beam cross average diameter be about 2 millimeters to about 4 millimeters wafer receiving area.
32, end effector as claimed in claim 31, wherein, described light beam is slight cone shape.
33, a kind of end effector that is used to load and unload semiconductor wafer comprises:
Base component with near-end and far-end;
A plurality of supporting members that are positioned on the described base component are used to contact and support the wafer that places on this end effector; And
Described end effector has the largest contours height less than about 12mm.
34, end effector as claimed in claim 33, wherein, the largest contours height of this end effector is lower than about 10 millimeters.
35, end effector as claimed in claim 33, the thrust unit that also comprises the proximal end that is positioned at described base component, this thrust unit comprises the piston that can bounce back, this piston is configured to come in contact with the edge of semiconductor wafer, is used on described base component described wafer being positioned.
36, end effector as claimed in claim 35, wherein, the largest contours height of this end effector is lower than 10 millimeters.
37, end effector as claimed in claim 33, wherein, described a plurality of supporting members are processed to can be only come in contact around edge and this semiconductor wafer of semiconductor wafer.
38, end effector as claimed in claim 33, wherein, some supporting member comprises and only is configured to the surface that the edge with semiconductor wafer comes in contact at least, this surface is evagination and eccentric shape.
39, end effector as claimed in claim 38, wherein, described base component comprises with form of spokes and the separated first point fork of the second point fork, the first and second point forks all end at the far-end of described base component, and the described supporting member with evagination and eccentric surface is positioned at the far-end of each point fork.
40, end effector as claimed in claim 39, the far-end that also is included in described base component is around the stop dog component that is positioned at the supporting member that the first point fork and second point stick, and the height of these stop dog components is greater than described supporting member.
41, end effector as claimed in claim 33, wherein, described supporting member limits the wafer receiving area, and this end effector also comprises a pair of emergent pin, this sells substantially in the central area of the near-end of described base component and the wafer receiving area between the far-end emergent, in positioned opposite separately, the height of these emergent pins are lower than the height of described supporting member, are used to prevent that semiconductor wafer and described base component from coming in contact on described base component.
42, end effector as claimed in claim 35, wherein, related in the piston of described thrust unit and the pneumatic actuator effect, this pneumatic actuator is configured to receive gases at high pressure, is used for described piston is moved to extended position from advanced position.
43, end effector as claimed in claim 42 also comprises a getter device with the adjacent setting of described pneumatic actuator, and this getter device is configured to produce suction, is used for being captured in any particle that described piston motion process discharges.
44, end effector as claimed in claim 33, also comprise the wafer detection system, this wafer detection system comprises and strides across described base component and be subjected to the opposed optical channel that send of optical channel, this send optical channel to be configured to be subjected to optical channel emission light beam towards described, and this wafer detection system is formed at the existence that detects wafer when described light beam is blocked by wafer.
45, end effector as claimed in claim 33, wherein, described supporting member is made by the material that comprises polyethers-ether ketone or polyformaldehyde-acetal polymer.
46, end effector as claimed in claim 45, wherein, described base component is made by the material that comprises metal.
47, a kind of end effector that is used to load and unload semiconductor wafer comprises:
Base component with near-end and far-end;
A plurality of supporting members that are positioned on the described pedestal, be used to contact and support the wafer that places on this end effector, described base component comprises at least four supporting members, between them, limit the wafer receiving area, wherein at least one described supporting member comprises the inclined surface that is off-centre and convex shape, and this inclined surface only is configured to along the edge of semiconductor wafer therewith that semiconductor wafer comes in contact.
48, end effector as claimed in claim 47, wherein, described base component comprises and the isolated first point fork of the second point fork, each point fork includes the end of the far-end that limits described base component, supporting member is positioned at the described end of each point fork, and each supporting member includes the inclined surface that is off-centre and convex shape.
49, end effector as claimed in claim 48 also comprises around the stop dog component of each supporting member that is positioned at each sharp fork end place.
50, end effector as claimed in claim 47, the thrust unit that also comprises the proximal end that is positioned at described base component, this thrust unit comprises the piston that can bounce back, this piston is configured to come in contact with the edge of semiconductor wafer, is used on described base component described wafer being positioned.
51, end effector as claimed in claim 50, wherein, the largest contours height of this end effector is lower than about 12 millimeters.
52, end effector as claimed in claim 50, wherein, the largest contours height of this end effector is lower than about 10 millimeters.
53, end effector as claimed in claim 47, wherein, described a plurality of supporting members are shaped as the edge and this semiconductor wafer that only center on semiconductor wafer and come in contact.
54, end effector as claimed in claim 47, wherein, described a plurality of supporting member limits a wafer receiving area, and this end effector also comprises a pair of emergent pin, this is provided with on opposite separately in the near-end of described base component and the central area, wafer receiving area between the far-end, on described base component substantially to emergent pin, the height of these emergent pins is lower than the height of described supporting member, is used to prevent that semiconductor wafer and described base component from coming in contact.
55, end effector as claimed in claim 50, wherein, the piston in the described thrust unit is used with pneumatic actuator and is associated, and this pneumatic actuator is configured to receive gases at high pressure, is used for described piston is moved to extended position from advanced position.
56, end effector as claimed in claim 55 comprises also and the getter device of the adjacent setting of described pneumatic actuator that this getter device is configured to produce suction, is used for being captured in any particle that described piston motion process discharges.
57, end effector as claimed in claim 47, also comprise the wafer detection system, this wafer detection system comprises and strides across described base component and be subjected to the opposed optical channel that send of optical channel, this send optical channel to be configured to be subjected to optical channel emission light beam towards described, and this wafer detection system is formed at the existence that detects wafer when described light beam is blocked by wafer.
58, end effector as claimed in claim 47, wherein, described supporting member is made by the material that comprises polyethers-ether ketone or polyformaldehyde-acetal polymer like this.
59, end effector as claimed in claim 58, wherein, described base component is made by the material that comprises metal.
60, a kind of end effector that is used to load and unload semiconductor wafer comprises:
Base component with near-end and far-end;
A plurality of supporting members that are positioned on the described base component are used to contact and support the semiconductor wafer that places on this end effector, and these supporting members limit the wafer receiving area between them; And
A plurality of emergent pins, these emergent pins in the near-end and the central area between the far-end of described base component, be positioned on the described base component, the height of each emergent pin all is lower than the height that is limited by described supporting member, these emergent pins are positioned on the described base component, so that prevent to be supported in semiconductor wafer on the described supporting member and the other parts of described base component come in contact.
61, end effector as claimed in claim 60, wherein, described emergent pin has such height and is arranged at such position, make these emergent pins only during the semiconductor wafer generation deflection on remaining in described supporting member and this semiconductor wafer come in contact.
62, end effector as claimed in claim 60, wherein, the height of described emergent pin is less than about 1 millimeter.
63, end effector as claimed in claim 60, wherein, this end effector is comprising the emergent pin that strides across an interval setting in two central areas on described base component within the described wafer receiving area.
64, as the described end effector of claim 63, wherein, described base component comprises and isolated first point of the second point fork is pitched, and each point fork includes an end that limits the far-end of described base component, and the point that each emergent pin is positioned at correspondence is stuck.
65, end effector as claimed in claim 60, wherein, described base component is made by the material that comprises metal.
66, end effector as claimed in claim 60, wherein, described base component is made by the material that comprises quartz.
67, as the described end effector of claim 65, wherein, described supporting member and emergent pin are made by crystalline material.
68, as the described end effector of claim 67, wherein, described crystalline material comprises quartz.
69, end effector as claimed in claim 60, wherein, at least one described supporting member limits an inclined surface that is evagination and eccentric shape, and this inclined surface only is configured to come in contact with the edge of semiconductor wafer.
70, end effector as claimed in claim 60, wherein, described supporting member only is configured to come in contact with the edge of semiconductor wafer.
71, end effector as claimed in claim 60, the thrust unit that also comprises the proximal end that is positioned at described base component, this thrust unit comprises the piston that can bounce back, the edge that described piston is configured to semiconductor wafer comes in contact, and is used on described base component described wafer being positioned.
72, end effector as claimed in claim 60, wherein, the largest contours height of this end effector is lower than about 12 millimeters.
73, end effector as claimed in claim 60, wherein, the largest contours height of this end effector is lower than about 10 millimeters.
74, as the described end effector of claim 71, wherein, the piston in the described thrust unit is used with pneumatic actuator and is associated, and this pneumatic actuator is configured to receive gases at high pressure, is used for described piston is moved to extended position from advanced position.
75, as the described end effector of claim 74, comprise also and the getter device of the adjacent setting of described pneumatic actuator that this getter device is configured to produce suction, be used for being captured in any particle that described piston motion process discharges.
76, end effector as claimed in claim 60, wherein, also comprise the wafer detection system, this wafer detection system comprises and strides across described base component and be subjected to the opposed optical channel that send of optical channel, this send optical channel to be configured to be subjected to optical channel emission light beam towards described, and this wafer detection system is formed at the existence that detects wafer when described light beam is blocked by wafer.
77, end effector as claimed in claim 60, wherein, described supporting member has arcuate in shape, this arcuate in shape substantially with the radius of semiconductor wafer coupling, each supporting member has such wafer contact surface, this wafer contact surface diminishes to the least radius adjacent with described base component gradually from a maximum radius, difference between maximum radius and the least radius is at least about 0.75 millimeter, and described supporting member only comes in contact along edge and this semiconductor wafer of semiconductor wafer.
78, as the described end effector of claim 77, wherein, described supporting member is made by the material that can stand up at least 750 ℃ of temperature.
79,, wherein, comprise that the base component of described supporting member and emergent pin is made by crystalline material as the described end effector of claim 77.
80, as the described end effector of claim 79, wherein, described supporting member and emergent pin are integrally formed with described base component.
81, as the described end effector of claim 79, wherein, described crystalline material comprises quartz.
82,, wherein, described quartzy through the fire polishing processing as the described end effector of claim 80.
83, as the described end effector of claim 77, wherein, the wafer contact surface on the described supporting member is convex shape.
84, as the described end effector of claim 77, wherein, the wafer contact surface on the described supporting member is concave shape.
85, as the described end effector of claim 77, wherein, the wafer contact surface chamfering on the described supporting member.
86, a kind of end effector that is used to load and unload semiconductor wafer comprises:
Base component with near-end and far-end;
A plurality of supporting members that are positioned on the described base component, be used to contact and support the semiconductor wafer that places on this end effector, these supporting members only are configured to come in contact with the edge of semiconductor wafer, described supporting member limits a wafer receiving area between them, these supporting members have a kind of arcuate in shape, this arcuate in shape substantially with the radius of semiconductor wafer coupling, each supporting member has a wafer contact surface, this wafer contact surface diminishes to the least radius adjacent with described base component gradually from a maximum radius, and the difference between maximum radius and the least radius is at least about 0.75 millimeter.
87, as the described end effector of claim 86, wherein, described supporting member is made up to the material of about 750 ℃ of temperature at least by can standing.
88,, wherein, comprise that the base component of described supporting member and emergent pin is made by crystalline material as the described end effector of claim 86.
89, as the described end effector of claim 88, wherein, described supporting member and emergent pin are integrally formed with described base component.
90, as the described end effector of claim 88, wherein, described crystalline material comprises quartz.
91,, wherein, described quartzy through the fire polishing processing as the described end effector of claim 90.
92, as the described end effector of claim 86, wherein, the wafer contact surface on the described supporting member is convex shape.
93, as the described end effector of claim 86, wherein, the wafer contact surface on the described supporting member is concave shape.
94, as the described end effector of claim 86, wherein, the wafer contact surface chamfering on the described supporting member.
95, as the described end effector of claim 86, wherein, the largest contours height of this end effector is lower than about 12 millimeters.
96, as the described end effector of claim 86, wherein, the largest contours height of this end effector is lower than about 10 millimeters.
97, as the described end effector of claim 86, wherein, described base component comprises and the isolated first point fork of the second point fork that each point fork includes an end that limits the far-end of described base component, and supporting member is positioned at the place, described end of each point fork.
98, as the described end effector of claim 97, wherein, this end effector comprises at least four supporting members.
99, as the described end effector of claim 98, wherein, this end effector comprises at least two supporting members that are positioned at the proximal end of described base component.
100, as the described end effector of claim 86, wherein, described supporting member limits a wafer receiving area, and this end effector also comprises a pair of emergent pin, this is provided with on opposite separately in the central area of the near-end of described base component and the wafer receiving area between the far-end, on described base component substantially to emergent pin, the height of these emergent pins is lower than the height of described supporting member, is used to prevent that semiconductor wafer and described base component from coming in contact.
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| CN2010102296736A Division CN101908498A (en) | 2003-06-27 | 2004-03-23 | Be used to load and unload the end effector of semiconductor wafer |
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| CN1813335A true CN1813335A (en) | 2006-08-02 |
| CN100440421C CN100440421C (en) | 2008-12-03 |
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| CN2008101664837A Expired - Fee Related CN101383318B (en) | 2003-06-27 | 2004-03-23 | Endeffectors for handling semiconductor wafers |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101667530A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| CN102903661A (en) * | 2012-10-25 | 2013-01-30 | 上海宏力半导体制造有限公司 | Wafer tail end executor |
| CN103227129A (en) * | 2012-01-26 | 2013-07-31 | 株式会社安川电机 | Robot hand and robot |
| CN103358318A (en) * | 2012-03-26 | 2013-10-23 | 株式会社迪思科 | Robot hand |
| CN103579071A (en) * | 2013-11-04 | 2014-02-12 | 株洲南车时代电气股份有限公司 | Device used for picking and placing IGBT lining plate |
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| CN109129451A (en) * | 2018-09-14 | 2019-01-04 | 华中科技大学 | Shoulder locking and wrist capture device and its application of the self-positioning mechanical arm in space |
| CN117219560A (en) * | 2023-11-08 | 2023-12-12 | 泓浒(苏州)半导体科技有限公司 | Terminal adsorption device for wafer conveying under ultra-clean environment |
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| CN108666258A (en) * | 2017-03-31 | 2018-10-16 | 奇景光电股份有限公司 | Wafer jig and the method that wafer is clamped |
| CN112140138B (en) * | 2020-09-08 | 2022-04-01 | 上海工程技术大学 | Soft clamp holder |
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| US5022695A (en) * | 1989-01-30 | 1991-06-11 | Texas Instruments Incorporated | Semiconductor slice holder |
| CH680275A5 (en) * | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
| KR0152324B1 (en) * | 1994-12-06 | 1998-12-01 | 양승택 | Semiconductor wafer carrier apparatus |
| IL143467A (en) * | 1998-12-02 | 2005-05-17 | Newport Corp | Specimen holding robotic arm and effector |
| US6322312B1 (en) * | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
| JP2001007177A (en) * | 1999-06-17 | 2001-01-12 | Sony Corp | Transfer device for semiconductor substrate |
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2004
- 2004-03-23 CN CNB2004800181745A patent/CN100440421C/en not_active Expired - Fee Related
- 2004-03-23 CN CN2008101664837A patent/CN101383318B/en not_active Expired - Fee Related
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| US8672602B2 (en) | 2008-09-05 | 2014-03-18 | Tokyo Electron Limited | Vertical thermal processing apparatus |
| CN101667530A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| CN101667530B (en) * | 2008-09-05 | 2013-09-04 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| CN103227129A (en) * | 2012-01-26 | 2013-07-31 | 株式会社安川电机 | Robot hand and robot |
| CN103227129B (en) * | 2012-01-26 | 2015-10-14 | 株式会社安川电机 | Robot and robot |
| CN103358318A (en) * | 2012-03-26 | 2013-10-23 | 株式会社迪思科 | Robot hand |
| CN103358318B (en) * | 2012-03-26 | 2016-12-28 | 株式会社迪思科 | Robot arm |
| CN103449172B (en) * | 2012-05-29 | 2017-05-10 | 株式会社荏原制作所 | Workpiece conveying device, stop dog device and adjusting method |
| CN102903661A (en) * | 2012-10-25 | 2013-01-30 | 上海宏力半导体制造有限公司 | Wafer tail end executor |
| CN103579071A (en) * | 2013-11-04 | 2014-02-12 | 株洲南车时代电气股份有限公司 | Device used for picking and placing IGBT lining plate |
| CN106469671A (en) * | 2015-08-19 | 2017-03-01 | 英属开曼群岛商精曜有限公司 | Mechanical bearing arm and the method for carrying of wafer |
| CN109129451A (en) * | 2018-09-14 | 2019-01-04 | 华中科技大学 | Shoulder locking and wrist capture device and its application of the self-positioning mechanical arm in space |
| CN117219560A (en) * | 2023-11-08 | 2023-12-12 | 泓浒(苏州)半导体科技有限公司 | Terminal adsorption device for wafer conveying under ultra-clean environment |
| CN117219560B (en) * | 2023-11-08 | 2024-01-26 | 泓浒(苏州)半导体科技有限公司 | Terminal adsorption device for wafer conveying under ultra-clean environment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100440421C (en) | 2008-12-03 |
| CN101383318A (en) | 2009-03-11 |
| CN101383318B (en) | 2010-09-08 |
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