CN1805132A - 用于芯片冷却的采用液态金属热界面的方法和装置 - Google Patents
用于芯片冷却的采用液态金属热界面的方法和装置 Download PDFInfo
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- CN1805132A CN1805132A CN 200510112867 CN200510112867A CN1805132A CN 1805132 A CN1805132 A CN 1805132A CN 200510112867 CN200510112867 CN 200510112867 CN 200510112867 A CN200510112867 A CN 200510112867A CN 1805132 A CN1805132 A CN 1805132A
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US63710004P | 2004-12-17 | 2004-12-17 | |
US60/637,100 | 2004-12-17 | ||
US11/220,878 | 2005-09-06 |
Publications (2)
Publication Number | Publication Date |
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CN1805132A true CN1805132A (zh) | 2006-07-19 |
CN100440492C CN100440492C (zh) | 2008-12-03 |
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Application Number | Title | Priority Date | Filing Date |
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CNB2005101128677A Expired - Fee Related CN100440492C (zh) | 2004-12-17 | 2005-10-14 | 用于将液态金属粘接到界面表面的方法和粘接条 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984510A (zh) * | 2010-08-20 | 2011-03-09 | 符建 | 基于液态金属基底的软性连接的led装置 |
CN104966704A (zh) * | 2015-07-23 | 2015-10-07 | 国网智能电网研究院 | 一种低热阻的压接式功率器件封装 |
CN105374806A (zh) * | 2015-11-27 | 2016-03-02 | 国网智能电网研究院 | 一种圆形分组布局的压接式功率器件封装 |
CN107343378A (zh) * | 2017-08-11 | 2017-11-10 | 昆明品启科技有限公司 | 一种液态金属与硅脂结合的散热方法 |
CN109413938A (zh) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | 一种复合材料轻质高效冷却方法及装置 |
CN116435274A (zh) * | 2023-06-15 | 2023-07-14 | 广东技术师范大学 | 一种集成硅通孔和微流道的三维集成电路结构及制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003332505A (ja) * | 2002-05-15 | 2003-11-21 | Fujitsu Ltd | 冷却構造体および伝熱部材 |
CN1223919C (zh) * | 2002-10-10 | 2005-10-19 | 中国科学院理化技术研究所 | 以液体金属镓或其合金作流动工质的芯片散热用散热装置 |
WO2004075291A1 (ja) * | 2003-02-24 | 2004-09-02 | Fujitsu Limited | 電子部品と放熱部材および、それらを使用した半導体装置の製造方法 |
-
2005
- 2005-10-14 CN CNB2005101128677A patent/CN100440492C/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984510A (zh) * | 2010-08-20 | 2011-03-09 | 符建 | 基于液态金属基底的软性连接的led装置 |
CN104966704A (zh) * | 2015-07-23 | 2015-10-07 | 国网智能电网研究院 | 一种低热阻的压接式功率器件封装 |
CN104966704B (zh) * | 2015-07-23 | 2019-01-25 | 国网智能电网研究院 | 一种低热阻的压接式功率器件封装 |
CN105374806A (zh) * | 2015-11-27 | 2016-03-02 | 国网智能电网研究院 | 一种圆形分组布局的压接式功率器件封装 |
CN107343378A (zh) * | 2017-08-11 | 2017-11-10 | 昆明品启科技有限公司 | 一种液态金属与硅脂结合的散热方法 |
CN109413938A (zh) * | 2018-10-24 | 2019-03-01 | 航天材料及工艺研究所 | 一种复合材料轻质高效冷却方法及装置 |
CN116435274A (zh) * | 2023-06-15 | 2023-07-14 | 广东技术师范大学 | 一种集成硅通孔和微流道的三维集成电路结构及制备方法 |
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Publication number | Publication date |
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CN100440492C (zh) | 2008-12-03 |
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Effective date of registration: 20171106 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171106 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20081203 Termination date: 20211014 |