CN1805069B - 一种改进型高分子ptc热敏电阻器及其制造方法 - Google Patents
一种改进型高分子ptc热敏电阻器及其制造方法 Download PDFInfo
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- CN1805069B CN1805069B CN 200510133004 CN200510133004A CN1805069B CN 1805069 B CN1805069 B CN 1805069B CN 200510133004 CN200510133004 CN 200510133004 CN 200510133004 A CN200510133004 A CN 200510133004A CN 1805069 B CN1805069 B CN 1805069B
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- high molecular
- stuffing
- fiberfill
- macromolecule
- ptc thermistor
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 229920002521 macromolecule Polymers 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 7
- 239000012752 auxiliary agent Substances 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000006072 paste Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000011162 core material Substances 0.000 abstract 4
- 239000000835 fiber Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 238000007670 refining Methods 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004153 renaturation Methods 0.000 description 1
- 229920006126 semicrystalline polymer Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200510133004 CN1805069B (zh) | 2005-12-31 | 2005-12-31 | 一种改进型高分子ptc热敏电阻器及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200510133004 CN1805069B (zh) | 2005-12-31 | 2005-12-31 | 一种改进型高分子ptc热敏电阻器及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN1805069A CN1805069A (zh) | 2006-07-19 |
CN1805069B true CN1805069B (zh) | 2011-02-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200510133004 Active CN1805069B (zh) | 2005-12-31 | 2005-12-31 | 一种改进型高分子ptc热敏电阻器及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN1805069B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109494035A (zh) * | 2018-11-13 | 2019-03-19 | 昆山聚达电子有限公司 | 热敏电阻的制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1170734A (zh) * | 1997-06-24 | 1998-01-21 | 中山大学 | 正温度系数型导电高分子复合材料组成及其制造方法 |
CN1182942A (zh) * | 1997-05-07 | 1998-05-27 | 上海维安热电材料有限公司 | 制备正温度系数热敏电阻器的水解交联法 |
CN1256499A (zh) * | 1999-12-06 | 2000-06-14 | 上海维安热电材料有限公司 | 一种热敏电阻器及其制造方法 |
-
2005
- 2005-12-31 CN CN 200510133004 patent/CN1805069B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1182942A (zh) * | 1997-05-07 | 1998-05-27 | 上海维安热电材料有限公司 | 制备正温度系数热敏电阻器的水解交联法 |
CN1170734A (zh) * | 1997-06-24 | 1998-01-21 | 中山大学 | 正温度系数型导电高分子复合材料组成及其制造方法 |
CN1256499A (zh) * | 1999-12-06 | 2000-06-14 | 上海维安热电材料有限公司 | 一种热敏电阻器及其制造方法 |
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Publication number | Publication date |
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CN1805069A (zh) | 2006-07-19 |
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Owner name: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., L Free format text: FORMER NAME: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTION CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee after: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. Address before: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Addressee: Dong Mei Document name: Notification of Passing Examination on Formalities |
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Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Patentee after: Shanghai Wei'an Electronic Co.,Ltd. Address before: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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CP03 | Change of name, title or address | ||
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Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee before: Shanghai Wei'an Electronic Co.,Ltd. |