CN1797002A - Device for debugging circuit board, and method for debugging circuit board - Google Patents
Device for debugging circuit board, and method for debugging circuit board Download PDFInfo
- Publication number
- CN1797002A CN1797002A CN 200410103547 CN200410103547A CN1797002A CN 1797002 A CN1797002 A CN 1797002A CN 200410103547 CN200410103547 CN 200410103547 CN 200410103547 A CN200410103547 A CN 200410103547A CN 1797002 A CN1797002 A CN 1797002A
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- contact pin
- circuit board
- socket
- debugging apparatus
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Abstract
The invention discloses a circuit board debugging device and method, comprising a fixed needle socket and an active needle socket, where the fixed pin socket is in the bottom layer and welded to a printed circuit board (PCB), and the active needle socket is plugged in the fixed needle socket and provided with extractable needles, and the jacks on the extractable needles are used for DIP integrated circuit (IC) chips to be inserted in. As measuring, the pins of the extractable needles are suspended and do no contact with the fixed needle socket so that the circuit is cut-off; therefore the invention has no destruction to IC chips and PCBs, thus improving the circuit board debugging effect. And it can accurately locate failures and besides, the suspended pins are easy for fixing the probes of oscillographs and logic analyzers, beneficial to measurement.
Description
Technical field
The present invention relates to a kind of circuit board debugging apparatus, relate in particular to a kind of debugging apparatus of the circuit board that uses the dip chip and carry out the circuit board adjustment method.
Background technology
At present, exist a lot of circuit boards in various electronic equipments and the device, finish various functions and task, and what play a decisive role on the circuit board is exactly various integrated circuit (IC) chip.Integrated circuit (IC) chip has multiple packing forms, for example, and dual-in-line package (DIP), the flat encapsulation of plastics square (PQFP), contact pin grid array packages (PGA), BGA Package (BGA) or the like.Wherein, most middle small scale integrated circuits (IC) all adopt dual-in-line package (DIP) form, as 8088 and RAM among the Intel series CPU, devices such as FIFO.
When carrying out the debugging of monoblock circuit board, can measure and analyze the pin of circuit trace on the circuit board and components and parts by oscillograph and logic analyser.If some the cabling level on the discovery printed circuit board (PCB) is incorrect, then is difficult to misjudgment and where appears at.Because each the relevant device of bundle of lines of walking on the printed circuit board (PCB) all links together, so driving element, cabling and receiving device all have identical level.Therefore wrong level may be produced by certain drive source, thereby causes all devices of its driving and cabling all to present wrong level; But also may be caused by certain receiving end device, it has dragged down or has drawn high the originally correct level that drive source output is arranged, and for example, the incorrect clamping circuit of receiving end will cause such consequence; Also having a kind of may be printed circuit board (PCB) cabling existing problems itself.For above-mentioned situation, engineers can only be cut off the cabling on the printed circuit board (PCB) with icking tool, then driving element and receiving device is separately measured, and confirms the position of making a mistake.Though such operation can be investigated fault, this method has very big defective and spinoff.At first after confirming wrong and fixing a breakdown,, still need to carry out the correct cabling that cuts off being coupled together by fly line if not the problem of PCB cabling.Secondly, no matter be secant or fly line operation, for the circuit trace densely distributed on the printed circuit board (PCB), that spacing is narrow, very difficulty operates all, and very easily cause undesirable, indiscoverable short circuit and open circuit, bring very important spinoff; Moreover for the multi-layer PCB board of internal layer cabling, the operation of secant and fly line can't be implemented at all.Also have, such operation can not repeatedly repeat.In addition, secant and fly line also increase the unreliability of printed circuit board (PCB) greatly, so still need making sheet again after the debugging.
Summary of the invention
The objective of the invention is to; Overcome the defective that prior art exists; In order to improve operational reliability, the accuracy of localization of fault and the integrality of printed circuit board (PCB) to the printed circuit board (PCB) debugging; Thereby provide a kind of and be applicable to the circuit board debugging apparatus dip chip, simple in structure, and a kind of method of carrying out the circuit board debugging of dip chip easily and fast is provided.
In order to solve the problems of the technologies described above, the invention provides a kind of circuit board debugging apparatus, comprise the fixing plug pin socket, it is characterized in that, also comprise contact pin and movable contact pin socket; Described fixing plug pin socket is general dual-in-line socket, and described movable contact pin socket has the contact pin that can extract, and the jack that inserts for the integrated circuit (IC) chip of dip is arranged on the contact pin of described fixing plug pin socket.The fixing plug pin socket is positioned at the bottom of device during use, is welded on the printed circuit board (PCB); Movable contact pin socket is plugged on the fixing plug pin socket.
In such scheme, described movable contact pin socket is general dual-in-line socket, and its contact pin is extracted the formation jack, and single contact pin is standby; Perhaps utilize not with the dual-in-line socket and the combination of single contact pin of contact pin, single contact pin optionally is inserted on the common socket according to the debugging needs.
In such scheme, the number of pin of described fixing plug pin socket and movable contact pin socket, corresponding with the packing forms of the integrated circuit (IC) chip of the dip of being debugged.
In such scheme, described contact pin shape, corresponding with the pin shape of the chip of various dip.
In such scheme, contact pin is shaped as the cylinder contact pin.
In such scheme, contact pin is shaped as flat contact pin.
In such scheme, described contact pin is a metal material, and the supporting construction of described fixing plug pin socket and movable contact pin socket is that insulating material is made.
The present invention also provides a kind of use the circuit board debugging apparatus carry out the circuit board adjustment method, may further comprise the steps:
A) the debug circuit plate the time, the fixing plug pin socket of circuit board debugging apparatus is welded direct on the circuit board, do not use the movable contact pin socket of this device, the integrated circuit (IC) chip of dip is directly inserted the fixing plug pin socket, carries out the measurement and the debugging of circuit board;
B) when finding that the circuit trace relevant with the pin of this chip presents abnormal level, extract chip, the movable contact pin socket of circuit board debugging apparatus is inserted the fixing plug pin socket, and extract wherein contact pin corresponding to error level, after taking out the contact pin in the described movable contact pin socket, it is unsettled that the chip that inserts described circuit board debugging apparatus has correspondence to extract the pin of contact pin, and unsettled described pin does not contact with the fixing plug pin socket; At last the integrated circuit (IC) chip of dual-in-line is inserted the movable contact pin socket of circuit board debugging apparatus, separately measured then and analyze.
C) after problem is got rid of, extract movable contact pin socket once more, the integrated circuit (IC) chip of dual-in-line is directly inserted fixing plug pin socket of the present invention.
As from the foregoing, a kind of circuit board debugging apparatus of the present invention, adopt fixing plug pin socket and movable contact pin socket two-layer, movable contact pin socket has the contact pin that can extract, during measurement, the pin of the contact pin of extracting is unsettled, and do not contact with fixed socket, the circuit blocking-up, so use this device, be that integrated circuit (IC) chip or printed circuit board (PCB) are not all destroyed, thereby improved the debugging effect of circuit board, avoided because the destruction to chip or circuit board that debugging is introduced has been reduced the repeatedly expense of making sheet; And the accurate position that takes place of fault location; In addition, unsettled chip pin is easy to the probe of oscillograph and logic analyser and fixes, and is beneficial to measurement.
Description of drawings
Fig. 1 a is the fixing plug pin socket vertical view of circuit board debugging apparatus provided by the present invention;
Fig. 1 b is the fixing plug pin socket left view of circuit board debugging apparatus provided by the present invention;
Fig. 1 c is the fixing plug pin socket side view of circuit board debugging apparatus provided by the present invention;
Fig. 1 d is the fixing plug pin socket stereographic map of circuit board debugging apparatus provided by the present invention;
Fig. 2 a is the top layer socket vertical view of circuit board debugging apparatus provided by the present invention;
Fig. 2 b is the top layer socket left view of circuit board debugging apparatus provided by the present invention;
Fig. 2 c is the top layer socket side view of circuit board debugging apparatus provided by the present invention;
Fig. 2 d is the top layer socket stereographic map of circuit board debugging apparatus provided by the present invention, also has a movable contact pin to insert the signal of socket among the figure; Fig. 3 is the overall package figure of circuit board debugging apparatus provided by the present invention;
Fig. 4 extracts the synoptic diagram figure of certain contact pin when debugging for use circuit board debugging apparatus of the present invention;
Fig. 5 detects the step synoptic diagram for 3 of using circuit board debugging apparatus of the present invention that a certain circuit is carried out in the debug process.
The drawing explanation:
The movable contact pin socket of 1-; The movable contact pin of 10=, the movable contact pin of promptly movable contact pin socket;
2-fixing plug pin socket;
20-fixing plug pin, the i.e. fixing plug pin of fixing plug pin socket.
Embodiment
Below in conjunction with drawings and Examples the present invention is described in detail: with reference to figure 1-4, make the circuit board debugging apparatus that the circuit board of a pair of dip chip is debugged, comprise that one is the fixing plug pin socket 2 and the movable contact pin socket 1 of supporting construction with the insulating material, be the general dual-in-line socket of buying on the market, in the jack of movable contact pin socket 1 the movable contact pin 10 that can extract is arranged, fixing plug pin socket 2 is positioned at the bottom of device, metal fixing plug pin 20 is arranged, be welded on the printed circuit board (PCB); Movable contact pin socket 1 is plugged on the fixing plug pin socket 2, and the jack on the described contact pin inserts for the integrated circuit (IC) chip of dip.
The circuit board debugging apparatus that the present invention mentioned is to make based on common dip chip carrier socket.The method for making of the movable contact pin socket that the present invention mentioned has two kinds:
(1) adopt common dip chip carrier socket, but the contact pin on this socket fixes, stiff, so, optionally insert socket according to the needs of debugging and get final product as long as manual contact pin is extracted; Perhaps in the manufacturer production socket, make contact pin be activity, can freely extract and insert.
(2) also have a kind of way to be, the structure of socket itself is not carried out any change and destruction, as long as prepare abundant single contact pin, optionally be inserted in dip chip carrier socket (contact pin of some pin does not insert) according to the debugging needs, chip is inserted on the single contact pin of these activities, debugs to get final product.
Device of the present invention, corresponding with the integrated circuit (IC) chip of each dip.Because the difference of number of pin, dip has various ways, as DIP-8, and DIP-16, DIP-28 or the like, circuit board debugging apparatus of the present invention is corresponding with the packing forms of various dual-in-lines, and DIP-8 is also arranged, DIP-16, DIP-28 or the like.
The circuit board debugging apparatus of use present embodiment detects the method for debugging, may further comprise the steps:
A) the debug circuit plate the time, the fixing plug pin socket of circuit board debugging apparatus is welded direct on the circuit board, do not use the movable contact pin socket of this device, the integrated circuit (IC) chip of dip is directly inserted the fixing plug pin socket, carries out the measurement and the debugging of circuit board;
B) when finding that the circuit trace relevant with the pin of this chip presents abnormal level, extract chip, the movable contact pin socket of circuit board debugging apparatus is inserted the fixing plug pin socket, and extract wherein contact pin corresponding to error level, at last the integrated circuit (IC) chip of dual-in-line is inserted the movable contact pin socket of circuit board debugging apparatus, separately measured then and analyze.The pin of integrated circuit (IC) chip opens circuit with the cabling that goes wrong like this, has reached the effect of secant;
C) after problem is got rid of, extract movable contact pin socket once more, the integrated circuit (IC) chip of dual-in-line is directly inserted fixing plug pin socket of the present invention.
With reference to figure 5, electric circuit inspection process synoptic diagram (part of certain piece circuit board) shown in Fig. 5 a-c, the circuit board debugging apparatus of use present embodiment detects the concrete steps of the method for debugging: wherein debugged circuit board is the FIFO (pushup storage) of a dip: IDT7203.
(1) at first, this device directly is inserted on the fixing plug pin socket of device of the present invention and measures;
Suppose in debug process, find that the cabling level that is connected with the Q4 pin of FIFO in this circuit is unusual, at this time being difficult to judge is that FIFO itself has problem, or the problem of cabling, still receives the problem of the device of FIFO output.
(2) extract fifo chip, insert the top layer socket of device of the present invention, and extract the contact pin corresponding, insert fifo chip again with the Q4 pin; At this moment, the Q4 pin of FIFO is unsettled, with the cabling disconnection on the printed circuit board (PCB); At this moment measure, can locate the unusual root of cabling level.
(3) after fixing a breakdown, extract the top layer socket, the FIFO device is directly inserted the fixing plug pin socket.
Above operation can repeatedly repeat.
In sum, a kind of circuit board debugging apparatus employing fixing plug pin socket of the present invention and movable contact pin socket are two-layer, movable contact pin socket has the contact pin that can extract, during measurement, the pin of the contact pin of extracting is unsettled, and do not contact with fixed socket, the circuit blocking-up, so use this device, be that integrated circuit (IC) chip or printed circuit board (PCB) are not all destroyed, thereby improved the debugging effect of circuit board, avoided because the destruction to chip or circuit board that debugging is introduced has been reduced the repeatedly expense of making sheet; And the printed circuit board (PCB) to using the dip chip that can be convenient and reliable is debugged the position that fault location takes place; Guarantee the integrality and the reliability of printed circuit board (PCB) simultaneously.In addition, unsettled chip pin is easy to the probe of oscillograph and logic analyser and fixes, and is beneficial to measurement.
It should be noted that at last: above embodiment is the unrestricted technical scheme of the present invention in order to explanation only, although the present invention is had been described in detail with reference to the foregoing description, those of ordinary skill in the art is to be understood that: still can make amendment or be equal to replacement the present invention, and not breaking away from any modification or partial replacement of the spirit and scope of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (9)
1, a kind of circuit board debugging apparatus comprises the fixing plug pin socket, it is characterized in that, also comprises contact pin and movable contact pin socket; Described fixing plug pin socket is general dual-in-line socket, and described movable contact pin socket has the contact pin that can extract, and the jack that inserts for the integrated circuit (IC) chip of dip is arranged on the contact pin of described fixing plug pin socket.
2. circuit board debugging apparatus as claimed in claim 1 is characterized in that, described movable contact pin socket is general dual-in-line socket, and its contact pin is extracted the formation jack, and single contact pin is standby.
3. circuit board debugging apparatus as claimed in claim 1 is characterized in that, described movable contact pin socket optionally is inserted in single contact pin on the common socket according to the debugging needs for utilizing not with the dual-in-line socket and the combination of single contact pin of contact pin.
4, circuit board debugging apparatus as claimed in claim 1 is characterized in that, the number of pin of described fixing plug pin socket and movable contact pin socket is corresponding with the packing forms of the integrated circuit (IC) chip of each dip.
5, circuit board debugging apparatus as claimed in claim 1 is characterized in that, described fixing plug pin socket and movable contact pin socket the contact pin shape, corresponding with the pin shape of the chip of various dip.
6, circuit board debugging apparatus as claimed in claim 5 is characterized in that, contact pin is shaped as the cylinder contact pin.
7, circuit board debugging apparatus as claimed in claim 5 is characterized in that, contact pin is shaped as flat contact pin.
8, circuit board debugging apparatus as claimed in claim 1 is characterized in that, the contact pin of described circuit board debugging apparatus is a metal material, and the supporting construction of described circuit board debugging apparatus socket is an insulating material.
9, the described circuit board debugging apparatus of a kind of use claim 1 carries out the circuit board adjustment method, may further comprise the steps:
A) when the debug circuit plate, the fixing plug pin socket of circuit board debugging apparatus is welded direct on the circuit board, do not use the movable contact pin socket of this device, the integrated circuit (IC) chip of dip is directly inserted the fixing plug pin socket, carries out the measurement and the debugging of circuit board;
B) when finding that the circuit trace relevant with the pin of this chip presents abnormal level, extract chip, the movable contact pin socket of circuit board debugging apparatus is inserted the fixing plug pin socket, and extract wherein contact pin corresponding to error level, after taking out the contact pin in the described movable contact pin socket, it is unsettled that the chip that inserts described circuit board debugging apparatus has correspondence to extract the pin of contact pin, unsettled described pin does not contact with the fixing plug pin socket, at last the integrated circuit (IC) chip of dual-in-line is inserted the movable contact pin socket of circuit board debugging apparatus, separately measured then and analyze;
C) after problem is got rid of, extract movable contact pin socket once more, the integrated circuit (IC) chip of dual-in-line is directly inserted fixing plug pin socket of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101035470A CN100465648C (en) | 2004-12-29 | 2004-12-29 | Device for debugging circuit board, and method for debugging circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101035470A CN100465648C (en) | 2004-12-29 | 2004-12-29 | Device for debugging circuit board, and method for debugging circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1797002A true CN1797002A (en) | 2006-07-05 |
| CN100465648C CN100465648C (en) | 2009-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004101035470A Expired - Fee Related CN100465648C (en) | 2004-12-29 | 2004-12-29 | Device for debugging circuit board, and method for debugging circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100465648C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299463A (en) * | 2010-06-28 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | Broken pin replacement module of data interface and broken pin replacing method |
| CN101738976B (en) * | 2008-11-14 | 2013-03-20 | 北京谊安医疗系统股份有限公司 | System for programming PIC controller and device used in programming |
| CN105975371A (en) * | 2016-05-06 | 2016-09-28 | 张广山 | Electronic chip debugger |
| CN106199386A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of simple adjustment method of wiring board |
| CN109782161A (en) * | 2018-12-26 | 2019-05-21 | 中国科学院长春光学精密机械与物理研究所 | The debugging circuit board and its adjustment method of anti-fuse FPGA |
| CN110098726A (en) * | 2018-01-29 | 2019-08-06 | 株洲中车时代电气股份有限公司 | A kind of switching device buffer circuit plate |
| CN111129913A (en) * | 2019-12-30 | 2020-05-08 | 长春奥普光电技术股份有限公司 | Dismounting device for socket type contact pin packaging chip |
| CN111707408A (en) * | 2020-07-08 | 2020-09-25 | 宁波中车时代传感技术有限公司 | Sputtering film pressure transmitter |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676832A (en) * | 1970-12-28 | 1972-07-11 | Ibm | Connector |
| JPS63213278A (en) * | 1987-02-27 | 1988-09-06 | 日本テキサス・インスツルメンツ株式会社 | Socket |
| US4912401A (en) * | 1989-01-18 | 1990-03-27 | Tektronix, Inc. | Connection apparatus for interactively accessing an electronic device in a pin grid array socket |
| JPH1041038A (en) * | 1996-07-22 | 1998-02-13 | Yuucom:Kk | Conversion header |
| JPH11258290A (en) * | 1998-03-11 | 1999-09-24 | Ricoh Co Ltd | Power unit to substrate assembly under test |
| CN2760568Y (en) * | 2004-12-31 | 2006-02-22 | 中国科学院空间科学与应用研究中心 | Circuit board debugging device using dual in-line package chip |
-
2004
- 2004-12-29 CN CNB2004101035470A patent/CN100465648C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738976B (en) * | 2008-11-14 | 2013-03-20 | 北京谊安医疗系统股份有限公司 | System for programming PIC controller and device used in programming |
| CN102299463A (en) * | 2010-06-28 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | Broken pin replacement module of data interface and broken pin replacing method |
| CN105975371A (en) * | 2016-05-06 | 2016-09-28 | 张广山 | Electronic chip debugger |
| CN106199386A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of simple adjustment method of wiring board |
| CN110098726A (en) * | 2018-01-29 | 2019-08-06 | 株洲中车时代电气股份有限公司 | A kind of switching device buffer circuit plate |
| CN110098726B (en) * | 2018-01-29 | 2020-08-14 | 株洲中车时代电气股份有限公司 | Switch device buffer circuit board |
| CN109782161A (en) * | 2018-12-26 | 2019-05-21 | 中国科学院长春光学精密机械与物理研究所 | The debugging circuit board and its adjustment method of anti-fuse FPGA |
| CN111129913A (en) * | 2019-12-30 | 2020-05-08 | 长春奥普光电技术股份有限公司 | Dismounting device for socket type contact pin packaging chip |
| CN111707408A (en) * | 2020-07-08 | 2020-09-25 | 宁波中车时代传感技术有限公司 | Sputtering film pressure transmitter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100465648C (en) | 2009-03-04 |
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