JPH1041038A - Conversion header - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a general purpose conversion header simple, convenient and low in cost and easy for manufacture by providing upper solder tail parts and lower tail parts on short-circuit pins provided on plastic frame at a pitch same as that of DIP socket. SOLUTION: Plural metallic short-circuit pins 8 are planted on a plastic frame 5 having its outside dimensions approximately equal to that of an existing DIP socket 11 and composed of an inside vacant part and circumferential fixed part. These short-circuit pins 8 are provided at a pitch same as that of the abovementioned DIP socket 11 and on the upper part projecting above the plastic frame 5, on-surface mountable shape upper solder tail part 9 are provided and on the lower parts, plate-like and slender lower tail parts 10 are provided. And also it is desirable to provide the upper solder tail part 9 having spring character in vertical direction and in a direction in which short-circuit pins 8 face to each other. Thus obtained conversion header is used after inserting the lower parts of short-circuit pins 8 in DIP socket 11 on a main board 12 from above and soldering upper solder tail parts 9 to the back surface of a small base board 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conversion header for commonly using a DIP socket widely used for an EPROM mounted on a main board of a computer or the like with other semiconductors. .

[0002]

2. Description of the Related Art Conventionally, as shown in FIG.
When mounted on a main board, the program and data in the EPROM have been used in a form that can be easily inserted and removed through a DIP socket for conversion soldered to the main board in order to easily rewrite programs and data. Recently E
Semiconductors such as flash memories and the like, which almost satisfy the functions of the PROM itself and are inexpensive, have come to be distributed and used as a substitute for the EPROM. At this time, in consideration of compatibility with the existing EPROM, there is a demand to share a DIP socket for the EPROM, and in order to satisfy this demand, several types of connectors are used in combination as shown in FIG. .

[0003]

As shown in FIG. 2, the conventional device is expensive in price and height of the product because several types of connectors are combined. In addition, surface mount type semiconductors such as flash memories are mainly used as replacement semiconductors, so they had to be surface mounted once on a small board.However, only dip type connectors for connecting this small board were available. Therefore, a time-consuming process of connecting the pins of the connector penetrating through holes formed in the small substrate to the small substrate by hand soldering is required.

[0004]

According to the present invention, a plate-like terminal is incorporated in a plastic frame having substantially the same outer shape as a DIP socket mounted on a main board, and a portion of the terminal protruding upward from plastic can be surface-mounted. And the lower side was shaped so that the DIP socket could accept it.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A conversion socket according to the present invention has a plastic frame having substantially the same outer shape as a DIP socket, and a shape in which an upper surface can be surface-mounted and a lower portion can be received by the DIP socket, that is, a shape processed into a long flat plate. Mainly composed of short-circuit pins, a small board on which a substitute semiconductor is mounted is soldered on the upper surface using a surface mounting process, etc., and a flat plate pin located at the bottom is mounted on the main board for DIP Used by inserting it into a socket.

The material of the plastic frame is made of a material having high heat resistance that can withstand surface mounting conditions, and a hollow portion for visually checking and inspecting a fixing portion for fixing a pin and a soldering portion. It is mainly composed of departments.

The pin fixed to the plastic frame has an upper side bent outward or inward along a mounting surface of a small substrate so that surface mounting is possible, and a lower side can be fitted with a DIP socket. It is provided as an elongated plate shape as described above. At this time, the number of pins may be different from the number of pins of the DIP socket.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The plastic frame (5) has substantially the same outer shape as the DIP socket (11) and is made of a plastic material that can withstand the surface mounting process.
The same number of fixing portions (7) are provided at the same pitch as the P socket (11), and the shorting pins (8) are fixed in the fixing portions (7). Further, the short-circuit pin (8) is provided with a hollow portion (6) to facilitate surface mounting. The shorting pin (8) is made of a plate-like material, and the upper solder tail (9) corresponding to the surface mounting on the upper side is bent toward the hollow part (6) inside the plastic frame (5). The lower tail portion (10), which is located on the lower side and used by being inserted into the DIP socket (11), is provided in a plate-like and elongated shape. In this product, the upper solder tail part (9) is mainly soldered to the back surface of the small board (2) on which the alternative semiconductor (1) is mounted in the surface mounting process, and is attached to the main board (12) in this state. DIP
It is inserted into the socket (11) for use from above. In this case, the number of shorting pins (8) may be different from that of the DIP socket (11), or the upper solder tail (9)
May be outward. Upper solder tail (1
A method may be adopted in which 2) is provided with a spring property, and the connection between the small substrate (2) and the short-circuit pin (8) is maintained by a mechanical method such as fastening with a screw to maintain the connection with the small substrate (2). Further, a method may be used in which the upper solder tail portion (12) has a spring property in a direction sandwiching the small substrate, that is, in a width direction, and a corresponding side on the small substrate (2) is plated for contact.

[0009]

The present invention is embodied in the form described above, and has the following effects.

Since the plastic material used has high heat resistance and the shape of the upper part of the short-circuit pin can be surface-mounted, the connection with the small substrate is performed in the same line as the surface mounting process of the memory on the small substrate. It is easier to manufacture than before.

Since it is composed of a plastic frame and a short-circuit pin having a simple structure, a simple and inexpensive product can be provided.

[Brief description of the drawings]

FIG. 1 EPR incorporated in a conventional DIP socket
It is an exploded perspective view of OM.

FIG. 2 is an exploded perspective view of a conversion connector combining a conventional connector.

FIG. 3 is a perspective view of a conversion header according to the embodiment.

FIG. 4 is an exploded perspective view showing an assembled state of the embodiment.

[Explanation of symbols]

 1 Substitute semiconductor 2 Small board 3 Pin header 4 Small board side DIP socket 5 Plastic frame 6 Hollow section 7 Fixing section 8 Short pin 9 Upper solder tail section 10 Lower tail section 11 DIP socket 12 Main board 13 EPROM

Claims (3)

[Claims] 1. A metal short-circuit pin (8) is regularly provided at the same pitch as a DIP socket (11) on a plastic frame (5) having substantially the same external dimensions as an existing DIP socket (11). 8) A conversion header in which an upper solder tail portion (9) having a surface mountable shape is provided at an upper portion and a plate-like and elongated lower tail portion (10) is provided at a lower portion. 2. The conversion header according to claim 1, wherein the upper solder tail has a spring property in a vertical direction of the short-circuit pin. 3. The plastic solder frame according to claim 1, wherein the upper solder tail has a spring property in a direction in which the short-circuit pins oppose each other, that is, in a short side direction of the plastic frame. Conversion header.