JPH05251876A - Electronic parts fitting device and its method - Google Patents

Abstract

PURPOSE:To easily mount electronic parts such as LEDs, transistors, resistors, etc., on a printed board at a proper height and simply solder lead terminals on the copper foil of the printed board without shifting, tilting or removing the lead terminals from the printed board. CONSTITUTION:The title device is provided with a socket 18 penetrated by the lead terminals 14 and 14' of an electronic parts 12, and the socket 18 holds the terminals 14 and 14' of the parts 12 elastically by means of a pair of resilient receiving pieces 30 and 30', and furthermore the socket 18 is held elastically against a printed board 16 by a cylindrical part having a slit 28a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of an electronic component mounting device and method for mechanically and electrically mounting electronic components such as LEDs, transistors, resistors, diodes and capacitors on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, various mounting methods have been tried for mechanically and electrically mounting electronic parts on a printed circuit board. The first mounting method is a method of directly penetrating a lead terminal of an electronic component into a printed circuit board and soldering the lead terminal to a copper foil of the printed circuit board for mechanical and electrical mounting. In this method, the mounting height of the electronic component is adjusted by forming a bent portion that engages with the printed board in the middle of the lead terminal. The electronic component is attached such that the component body is laid sideways or vertically with respect to the printed circuit board. This first mounting method is generally used mainly for mounting resistors, capacitors, diodes and the like.

In the second mounting method, the lead terminals of the electronic component are penetrated through the printed board through the spacers, the lead terminals are soldered to the copper foil of the printed circuit board to electrically mount the electronic component, and this soldering is also performed. This is a method of mechanically attaching the electronic component and the spacer to the printed circuit board by attachment. This second mounting method is mainly used for mounting LEDs. The spacer has a plurality of lead terminal through holes through which the lead terminals pass, or is formed in a pipe shape through which the plurality of lead terminals collectively pass.

[0004]

An electronic component, such as an LED, which is to be mounted at a predetermined position and height with respect to the surface of the device, has a mounting position and height according to the specifications of the device to be used. Is set. Therefore, the electronic component is required to be able to adjust the mounting height with respect to the printed circuit board. Furthermore, a versatile mounting device and mounting method for electronic components are required for a plurality of devices.

According to the first mounting method of the prior art, the mounting height to the printed circuit board is adjusted by forming the bent portion on the lead terminal, so that the step of bending the lead terminal is required and the workability is low. was there.

In addition, the second mounting method of the prior art does not require a bending step of the lead terminals, but various heights and shapes can be used in accordance with various mounting heights of electronic parts and specifications of the device to be used. Since it is necessary to prepare spacers, the same number of spacer molding dies as the types of spacers are required, which is extremely uneconomical.

Further, in both the first and second mounting methods of the prior art, even if the lead terminals penetrate the printed circuit board, they are not mechanically held by the printed circuit board. Since it can not be the top surface, the soldering work is troublesome, and during the soldering work, the electronic components and the spacer may be displaced with respect to the printed circuit board, fall down, or come off from the printed circuit board. After the soldering, there is a drawback that the trouble must be corrected and the mounting work becomes complicated.

Further, for example, when a lead terminal is formed by press molding and has a rectangular cross section, such as an LED lead terminal, it is attempted to be mounted at a predetermined mounting height by the first mounting method of the prior art. However, it is difficult to bend the lead terminal, and therefore it is not possible to form a bent portion in the middle of the lead terminal to adjust the mounting height. Therefore, this first mounting method can be applied to the electronic equipment. There was a drawback that the types of parts were limited.

An object of the present invention is to easily adjust the mounting height of an electronic component, and to securely hold the lead terminals on the printed circuit board for easy and reliable soldering. An object is to provide a mounting device for an electronic component that can be used.

Another object of the present invention is to easily set the mounting height of the electronic component and to easily hold the lead terminal of the electronic component on the printed circuit board so that the electronic component can be easily mounted on the printed circuit board. Another object of the present invention is to provide a method of attaching an electronic component that can be reliably inserted.

[0011]

One object of the present invention is to provide an electronic component mounting apparatus for mechanically and electrically mounting a plurality of lead terminals of an electronic component on the printed circuit board by penetrating the lead terminals. A socket for mechanically holding a lead terminal of an electronic component on a printed circuit board, the socket comprising an insulating holder having a plurality of contact members through which the plurality of lead terminals pass, and each contact member is a printed circuit board. The board elastic holding portion elastically held on the wall surface of the mounting hole of, and a terminal elastic holding portion for elastically holding the lead terminal by locking to a corresponding lead terminal of the electronic component, the lead terminal, Provided is a mounting device for an electronic component, characterized in that it is soldered and electrically connected across a tip extending from a board elastic holding portion and a copper foil of a printed circuit board. It is intended.

Another object of the present invention is to provide a method for mounting an electronic component in which a plurality of lead terminals of the electronic component are penetrated through the printed circuit board to be mechanically and electrically attached to the printed circuit board. A socket that mechanically holds the printed circuit board is used.The socket is composed of an insulating holder having a plurality of contact members through which a plurality of lead terminals should pass, and each contact member is elastic on the wall surface of the mounting hole of the printed circuit board. Board elastic holding part that is elastically held and a terminal elastic holding part that elastically holds the lead terminal by locking it to the corresponding lead terminal of the electronic component. After being inserted into the hole and elastically holding the board elastic holding part on the wall of the mounting hole of the printed circuit board, the electronic component is mounted on the printed circuit board at the specified mounting height. Insert the lead terminal of the electronic component into the socket as shown in the figure, and then solder it across the tip of the lead terminal drawn from the elastic board holding part of this socket and the copper foil of the printed board to solder the lead terminal to the printed board. Another object of the present invention is to provide a method for attaching an electronic component, which is characterized in that the electronic component is electrically connected to the copper foil.

Still another object of the present invention is to provide a method for mounting an electronic component, wherein a plurality of lead terminals of the electronic component are penetrated through the printed circuit board to be mechanically and electrically attached to the printed circuit board. Is mechanically held on the printed circuit board, the socket is composed of an insulating holder having a plurality of contact members through which a plurality of lead terminals should pass, and each contact member is attached to the wall of the mounting hole of the printed circuit board. The board elastic holding part that is elastically held and the terminal elastic holding part that holds the lead terminal elastically by locking to the corresponding lead terminal of the electronic component, and the electronic component is mounted from the bottom surface of the socket in a predetermined manner. Insert the lead terminal of the electronic component into the socket so that it is at the height, fix the lead terminal to the connector member, and then socket the electronic component. The elastic board holding part of is inserted into the mounting hole of the printed circuit board to elastically hold the board elastic holding part on the wall of the mounting hole of the printed circuit board, and finally the tip of the lead terminal that is pulled out from the elastic board holding part of the socket. It is an object of the present invention to provide a method for mounting an electronic component, characterized in that the lead terminal is electrically connected to the copper foil of the printed circuit board by soldering over the copper foil of the printed circuit board.

[0014]

As described above, when the holder that mechanically holds the electronic component on the printed circuit board is used, the socket elastically holds the lead terminal of the electronic component, and the socket is elastically held on the printed circuit board. Since the electronic component is securely held at the predetermined position on the printed circuit board, the lead terminals can be easily and satisfactorily soldered, and the lead terminals of the electronic component are appropriately attached to the terminal elastic holding portions of the socket. By holding the electronic component in the position, the mounting height of the electronic component can be easily adjusted. Further, the socket can be easily inserted into the printed circuit board and the electronic component can be easily inserted into the socket, which facilitates the mounting work of the electronic component.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 and FIG. 2 show an electronic component mounting apparatus and a mounting method 10 according to the present invention. Although 12 is shown to be an LED, the invention is equally applicable to other electronic components.

The electronic component mounting apparatus 10 of the present invention comprises a socket 18 for mechanically holding a plurality of lead terminals 14, 14 'of the electronic component 12 on a printed circuit board 16.
The socket 18 is composed of an insulating holder 22 having a plurality of contact members 20 through which a plurality of lead terminals 14 and 14 'are to pass.

As shown in FIGS. 1 to 8, each contact member 20 is integrally formed with a board elastic holding portion 24 elastically held on the wall surface of the mounting hole 16a of the printed board 16 and the board elastic holding portion. The terminal elastic holding portion 26 is formed and holds the corresponding lead terminal 14 or 14 ′ of the electronic component 12 to elastically hold the lead terminal 14 or 14 ′. In the illustrated embodiment, this substrate elastic holding portion 24
The terminal elastic holding portion 26 is integrally formed by a frame 25, and the terminal elastic holding portion 26 is formed by the frame 2
5 is formed by hanging from the upper edge. The contact member 20 is attached to the insulating holder 22 by being inserted into the mounting hole 23 of the insulating holder 22 and hooking the locking claw 32 in the locking hole 23 of the insulating holder 22. In addition, the upper ends of the mounting holes 23 are connected to the lead terminals 14 and 1 of the electronic component 12.
It is the entrance 18a when the 4'is inserted.

In the embodiment of FIGS. 1 and 2, the substrate elastic holding portion 24 is composed of a cylindrical portion 28 having a slit 28a as shown in FIG. 5, and the terminal elastic holding portion 26 is also shown in FIG. As shown, a pair of spring retaining tabs 30 that approach each other to retain the lead terminals 14 or 14 ',
Made of 30 '.

As can be seen from FIGS. 3 and 6, the socket 1
In order to allow 8 to be automatically inserted into the printed board 16 by an automatic inserter, the vicinity of the lower edge of the cylindrical portion 28 of the board elastic holding portion 24 is tapered as indicated by reference numeral 24a. Further, as can be seen from FIGS. 5 to 8, the contact member 20 can be formed by punching and bending a single conductive metal plate.

The lead terminals 14 and 14 'are shown in FIGS.
As shown in FIG. 3, the cylindrical portion 28 of the board elastic holding portion 24 protruding from the printed circuit board 16, the tips 14 a and 14 ′ a of the lead terminals 14 and 14 ′ derived from the cylindrical portion 28, and the copper foil of the printed circuit board 16 (see FIG. It is electrically connected to the copper foil of the printed circuit board 16 by a soldering portion 34 formed by soldering over (not shown).

Next, a method of mounting the electronic component 12 according to the present invention will be described. First, using an automatic inserter (not shown),
The board elastic holding portion 24 of the socket 18 shown in FIGS. 3 and 4.
1 is inserted into the mounting hole 16a of the printed circuit board 16 as shown in FIGS. After that, the lead terminal 1 of the electronic component 12 is formed by using another terminal automatic insertion machine not shown.
4, 14 'are automatically inserted from the inlet 18a of the socket 18 and held in the socket 18. In this case, in the automatic terminal insertion machine, the mounting height H12 of the electronic component is the sum of the height H of the socket 18 and the distance H'from the upper surface of the socket 18 to the lower edge 12a of the component body 12A by a stopper means (not shown). Is set in advance.

Finally, the cylindrical portion 28 of the board elastic holding portion 24 protruding from the printed board 12 and the cylindrical portion 28.
The lead terminals 14, 14 ′ derived from the tips 14 a, 1
The lead terminals 14 and 14 'are electrically connected to the copper foil of the printed circuit board 12 by soldering over the 4'a and the copper foil of the printed circuit board 12 to form the soldered portion 34.

As described above, the socket 18 serves as the electronic component 12.
When the lead terminals 14 and 14 ′ are elastically held by the terminal elastic holding portion 26 and the socket 18 is elastically held on the printed board 16 by the board elastic holding portion 24, the electronic component 12 becomes Is securely held in place. Therefore, even if the printed circuit board 16 holding the electronic component 12 is reversed, the electronic component 12 does not come off from the printed circuit board 16, and the lead terminals 14, 14 'of the electronic component 12 are reversed. It is possible to easily solder from above the soldering surface.
Also, during the soldering work, the electronic component 12 is mounted on the printed circuit board 1.
6 does not shift or fall down, and there is no need for inspection after soldering and re-soldering.

FIG. 9 shows another embodiment of the present invention. In this embodiment, the board elastic holding portion 24 is elastically locked not to the slit 28a but to the lower edge of the mounting hole 16a of the printed board 16. The embodiment is the same as the embodiment shown in FIGS. 1 and 2 except that it comprises a cylindrical portion 28 having an elastic locking piece 28b, and its function and mounting method are the same as the embodiment shown in FIGS. Is.

FIG. 10 shows still another embodiment of the present invention. In this embodiment, the terminal elastic holding portion 26 does not hang down from the upper edge of the frame 25, but the cylinder of the substrate elastic holding portion 24. Extension piece 2 extending upward from the portion 28
It is the same as the embodiment of FIGS. 1 and 2 except that it is integrally formed at the upper end of 9, and its function and mounting method are the same as those of the embodiments of FIGS.

FIG. 11 shows another mounting method of the present invention.
This mounting method uses the socket 18 having the same structure as shown in FIGS. 1 to 4, but the socket having the structure shown in FIGS. 9 and 10 may be used. In this mounting method, first,
The lead terminal 14 of the electronic component 12 so that the lower surface of the component body 12A of the electronic component 12 has a predetermined mounting height H12 from the lower surface of the socket 18 (the surface in contact with the printed board).
14 'is inserted into the contact member 20 from the inlet 18a of the socket 18 by an automatic insertion machine. In this case as well, the mounting height H12 is the sum of the height H of the socket 18 and the distance H'from the upper surface of the socket 18 to the lower surface of the component body 12A. The mounting height H12 is set by a stopper means (not shown). Is set.

Next, the lead terminals 14 of the electronic component 12,
14 'is a contact portion formed by welding the elastic substrate holding portion 24 of the corresponding connector member 20 of the socket 18 to the lead terminals 14 and 14' by welding through the slit 28a at the tapered portion 24a or by caulking the cylindrical portion 28 at the tapered portion 24a. It is fixed to the member 20.

Thus, in the socket 18 with the electronic component 12 attached, the elastic substrate holding portion 24 of the socket 18 is the same as that shown in FIG. 1 and FIG.
So as to be inserted into the mounting hole 16a of the printed circuit board 16 by using an automatic insertion machine to elastically hold the board elastic holding portion 24 on the wall surface of the mounting hole 16a of the printed circuit board 16.

Finally, the elastic substrate holding portion 2 of the socket 18
4 is connected to the lead terminals 14 and 14 ′ that are led out from the lead terminal 4 and the copper foil of the printed circuit board 16 by soldering, and the lead terminals 1
4, 14 'are electrically connected to the copper foil of the printed circuit board 16.

[0030]

According to the present invention, as described above, the socket for mechanically holding the electronic component on the printed circuit board is used,
Since the socket elastically holds the lead terminals of the electronic component and the socket elastically holds the printed circuit board, the electronic component is securely held at a predetermined position on the printed circuit board, and therefore the soldering of the lead terminals is performed. Can be carried out easily and satisfactorily, and the lead terminal of the electronic component can be held at the terminal elastic holding portion of the socket at an appropriate position, so that the mounting height of the electronic component can be easily made with one type of socket. It is economical because it can be adjusted. Furthermore,
A large number of sockets and electronic components can be mounted using an automatic insertion machine, so that the mounting work can be performed efficiently.

[Brief description of drawings]

FIG. 1 is a front view showing a cross section of one half of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a side view showing a cross section of one half of the electronic component mounting device of FIG.

FIG. 3 is a front view showing in cross section one half of a socket used in the mounting device for the electronic component of FIG.

FIG. 4 is a bottom view of the socket of FIG.

5 is a front view of a contact member used in the socket of FIG.

6 is a vertical cross-sectional view of the contact member of FIG.

FIG. 7 is a top view of the contact member of FIG.

FIG. 8 is a bottom view of the contact member of FIG.

FIG. 9 is a front view showing in cross section one half of an electronic component attaching device according to another embodiment of the present invention.

FIG. 10 is a front view showing in cross section one half of an electronic component attaching apparatus according to still another embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a state where an electronic component is assembled to a socket by a mounting method according to another embodiment of the present invention.

[Explanation of symbols]

 10 Electronic Component Mounting Device 12 Electronic Component 14, 14 'Lead Terminal 16 Printed Circuit Board 16a Mounting Hole 18 Socket 20 Contact Member 22 Insulating Holder 23 Mounting Hole 24 Board Elastic Holding Part 25 Frame 26 Terminal Elastic Holding Part 28 Cylindrical Part 28a Splitting 28b Elastic locking pieces 30, 30 'One pair of spring-holding pieces 34 Soldering parts

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[Procedure amendment]

[Submission date] May 20, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 2

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 3

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

Another object of the present invention is to provide a method for mounting an electronic component in which a plurality of lead terminals of the electronic component are penetrated through the printed circuit board to be mechanically and electrically attached to the printed circuit board. A socket for mechanically holding the printed circuit board is used, and the socket is composed of an insulating holder having a plurality of contact members through which a plurality of lead terminals should pass, and each contact member is attached to a wall surface of a mounting hole of the printed circuit board. The board elastic holding portion elastically held, and the terminal elastic holding portion for elastically holding the lead terminal by engaging with the corresponding lead terminal of the electronic component, the board elastic holding portion of the socket is the printed circuit board. So that the electronic component can be mounted at the specified mounting height after it is inserted into the mounting hole and elastically holds the substrate elastic holder on the wall of the mounting hole of the printed circuit board. Resiliently held by the terminal elastic holding portions the lead terminal of the electronic component is inserted into the socket, then extend over the copper foil of the tip and the printed circuit board of the lead terminals deriving from the elastic substrate holding portion of the socket Another object of the present invention is to provide an electronic component mounting method characterized in that the lead terminal is electrically connected to the copper foil of the printed circuit board by soldering.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

Still another object of the present invention is to provide a method for mounting an electronic component, wherein a plurality of lead terminals of the electronic component are penetrated through the printed circuit board to be mechanically and electrically attached to the printed circuit board. Is mechanically held on the printed circuit board, the socket is composed of an insulating holder having a plurality of contact members through which a plurality of lead terminals should pass, and each contact member is attached to the wall of the mounting hole of the printed circuit board. The bottom surface of the insulating holder of the socket, in which the electronic component is made up of a substrate elastic holding portion that is elastically held, and a terminal elastic holding portion that elastically holds the lead terminal by engaging with a corresponding lead terminal of the electronic component After inserting the lead terminal of the electronic component into the socket so as to have a predetermined mounting height from and fixing the lead terminal to the connector member,
With the electronic components attached, the board elastic holding part of the socket is inserted into the mounting hole of the printed board to elastically hold the board elastic holding part on the wall of the mounting hole of the printed board, and finally the elastic board of the socket. A method of mounting an electronic component is characterized in that the lead terminal electrically led out from the holding portion and soldered across the copper foil of the printed circuit board across the tip of the lead terminal to electrically connect the lead terminal to the copper foil of the printed circuit board. To provide.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

[0014]

As described above, when the socket for mechanically holding the electronic component on the printed circuit board is used, the socket elastically holds the lead terminal of the electronic component, and the socket is elastically held on the printed circuit board. Since the electronic component is securely held at the predetermined position on the printed circuit board, the lead terminals can be easily and satisfactorily soldered, and the lead terminals of the electronic component are appropriately attached to the terminal elastic holding portions of the socket. By holding the electronic component in the position, the mounting height of the electronic component can be easily adjusted. Further, the socket can be easily inserted into the printed circuit board and the electronic component can be easily inserted into the socket, which facilitates the mounting work of the electronic component.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction content]

As shown in FIGS. 1 to 8, each contact member 20 is integrally formed with a board elastic holding portion 24 elastically held on the wall surface of the mounting hole 16a of the printed board 16 and the board elastic holding portion. The terminal elastic holding portion 26 is formed and holds the corresponding lead terminal 14 or 14 ′ of the electronic component 12 to elastically hold the lead terminal 14 or 14 ′. In the illustrated embodiment, this substrate elastic holding portion 24
The terminal elastic holding portion 26 is integrally formed by a frame 25, and the terminal elastic holding portion 26 is formed by the frame 2
5 is formed by hanging from the upper edge. The contact member 20 is inserted into the mounting hole 23 of the insulative holder 22 and is attached to the insulative holder 22 by engaging the engaging claw 32 with the engaging hole 23 a of the insulative holder 22. In addition, the upper ends of the mounting holes 23 are connected to the lead terminals 14 and 1 of the electronic component 12.
It is the entrance 18a when the 4'is inserted.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Change

[Correction content]

Finally, the cylindrical portion 28 of the board elastic holding portion 24 protruding from the printed board 16 and the cylindrical portion 28.
The lead terminals 14, 14 ′ derived from the tips 14 a, 1
Electrically connecting the lead terminals 14, 14 'to the copper foil of the printed circuit board 16 by forming a 4'a, the soldering portions 34 are denoted by solder straddling the copper foil of the printed circuit board 16.

Claims (3)

[Claims] 1. An electronic component mounting apparatus for mechanically and electrically mounting a plurality of lead terminals of an electronic component on the printed circuit board by penetrating the printed circuit board, wherein the lead terminals of the electronic component are mechanically mounted on the printed circuit board. A socket for holding the socket, the socket comprising an insulative holder having a plurality of contact members through which the lead terminals penetrate, and each of the contact members is elastically attached to a wall surface of a mounting hole of the printed circuit board. A substrate elastic holding portion to be held;
A terminal elastic holding portion that elastically holds the lead terminal by being locked to a corresponding lead terminal of the electronic component,
The electronic device mounting apparatus, wherein the lead terminal is electrically connected by soldering across a tip extending from the board elastic holding portion and a copper foil of a printed circuit board. 2. A method of mounting an electronic component, wherein a plurality of lead terminals of the electronic component are penetrated through the printed circuit board to be mechanically and electrically attached to the printed circuit board, wherein the lead terminals of the electronic component are mechanically mounted on the printed circuit board. Using a socket to hold, the socket is composed of an insulating holder having a plurality of contact members through which the lead terminals should penetrate, each contact member is elastically attached to the wall surface of the mounting hole of the printed circuit board. A substrate elastic holding portion to be held;
A terminal elastic holding portion that elastically holds the lead terminal by being locked to a corresponding lead terminal of the electronic component,
After the board elastic holding portion of the socket is inserted into the mounting hole of the printed board to elastically hold the board elastic holding portion on the wall surface of the mounting hole of the printed board, the electronic component is mounted at a predetermined mounting height. The lead terminal of the electronic component is inserted into the socket so that it can be attached by soldering over the tip of the lead terminal and the copper foil of the printed board that are led out from the elastic board holding portion of the socket. An electronic component mounting method comprising electrically connecting the lead terminal to a copper foil of the printed circuit board. 3. A method of mounting an electronic component, wherein a plurality of lead terminals of the electronic component are penetrated through the printed circuit board to be mechanically and electrically attached to the printed circuit board, wherein the lead terminals of the electronic component are mechanically mounted on the printed circuit board. Using a socket to hold, the socket is composed of an insulating holder having a plurality of contact members through which the lead terminals should penetrate, each contact member is elastically attached to the wall surface of the mounting hole of the printed circuit board. A substrate elastic holding portion to be held;
A terminal elastic holding portion that elastically holds the lead terminal by being locked to a corresponding lead terminal of the electronic component,
A state in which the electronic component is mounted after inserting the lead terminal of the electronic component into the socket and fixing the lead terminal to the connector member so that the electronic component has a predetermined mounting height from the lower surface of the socket. The elastic board holding part of the socket is inserted into the mounting hole of the printed board to elastically hold the board elastic holding part on the wall surface of the mounting hole of the printed board, and finally from the elastic board holding part of the socket. A method for mounting an electronic component, characterized in that the lead terminal is led out and soldered over the copper foil of the printed circuit board to electrically connect the lead terminal to the copper foil of the printed circuit board.