CN1786743A - Method for mfg. core of light conducting plate - Google Patents
Method for mfg. core of light conducting plate Download PDFInfo
- Publication number
- CN1786743A CN1786743A CN 200410077414 CN200410077414A CN1786743A CN 1786743 A CN1786743 A CN 1786743A CN 200410077414 CN200410077414 CN 200410077414 CN 200410077414 A CN200410077414 A CN 200410077414A CN 1786743 A CN1786743 A CN 1786743A
- Authority
- CN
- China
- Prior art keywords
- light guiding
- substrate
- mould core
- manufacture method
- guiding board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to light guiding plate mold core manufacturing method. It includes the following steps: offering basal plate with reservation pattern; depositing nickel thin layer; forming nickel layer by no pole electro forming; putting into organic solvent to dissolve the basal plate and gain the nickel metallic body with reservation pattern; combining the nickel metallic body with mold core basal plate to form light guiding plate mold core.
Description
[technical field]
The present invention relates to a kind of manufacturing method for insert, relate in particular to a kind of light guiding board mould core manufacture method.
[background technology]
In recent years, along with the colorize and the maximization of LCD, its application is more extensive, as notebook computer, various desk-top computer, LCD TV etc.Because of LCD is a kind of passive component, itself can not be luminous, thereby need utilize the light source of a light-source system as LCD, as module backlight (Backlight Module), wherein, light guide plate is a significant components in the module backlight, is used to guide the transmission direction of sending light beam from light source, converts line source or pointolite to the area source outgoing.
For improving the homogeneity of beam projecting, generally a plurality of sites are set on the light guide plate surface, be used for the total reflection condition of broken beam, and make the homogeneity of its scattering, and then promote the overall performance of module backlight with raising light guide plate outgoing beam in the light guide plate internal transmission.
At present, the manufacture method of light guide plate mesh point is broadly divided into two kinds of printing-type and non-printing-types, and wherein the printing-type processing procedure is because press quality is wayward, and it has the trend that is replaced by non-printing-type processing procedure gradually.Non-printing-type processing procedure is that the leaded light pattern (surface configuration of light guide plate) that will design is produced on the die, adopts straight forming or impression to produce the light guide plate with equal light pattern.
Seeing also Fig. 1, is a kind of site leaded light method of patterning that forms on the light guiding board mould core substrate in the prior art, and its step comprises: provide a substrate, coating one even photoresist layer (step 101) on this substrate; Utilize the rifle mould of a predetermined pattern this photoresist layer to be exposed development step (step 102); Adopt dry-etching method that one substrate is carried out etching (step 103); Remove residue photoresistance (step 104), form an ejection formation die on the planar substrates surface.
But this manufacture method need be carried out dry ecthing after development is finished, and removes the residue photoresistance, the processing procedure complexity, and because of adopting dry-etching method can improve the die cost.
[summary of the invention]
In order to overcome the manufacture method processing procedure complexity of the light guiding board mould core that has the leaded light pattern in the prior art, and the high problem of cost, the invention provides the simple and lower-cost manufacture method of a kind of processing procedure with light guiding board mould core of leaded light pattern.
Light guiding board mould core manufacture method provided by the invention may further comprise the steps: a substrate with predetermined pattern is provided; Has deposition one nickel thin layer on the substrate of predetermined pattern at this; Form a nickel dam by electrodeless electroforming step on this nickel thin layer surface; Said structure is put into organic solvent, dissolve this substrate, thereby obtain having the nickel metallic object of predetermined pattern; This nickel metallic object with predetermined pattern is combined with the die substrate, form a light guiding board mould core.
Compared with prior art, metal film layer of the present invention and metal level are same metals and need not to carry out etching step that processing procedure is simple, low cost.
[description of drawings]
Fig. 1 is a kind of prior art light guiding board mould core manufacture method process flow diagram.
Fig. 2 is the light guiding board mould core manufacture method first embodiment process flow diagram of the present invention.
Fig. 3 is the substrate synoptic diagram of the wire mark moulding of light guiding board mould core manufacture method first embodiment of the present invention.
Fig. 4 is the deposited nickel layer synoptic diagram of light guiding board mould core manufacture method first embodiment of the present invention.
Fig. 5 is the electroforming synoptic diagram of light guiding board mould core manufacture method first embodiment of the present invention.
Fig. 6 is that the dissolving PMMA substrate of light guiding board mould core manufacture method first embodiment of the present invention forms the nickel dam synoptic diagram.
Fig. 7 is the light guiding board mould core synoptic diagram of the light guiding board mould core manufacture method first embodiment gained of the present invention.
[embodiment]
Seeing also Fig. 2, is the process flow diagram of method for manufacturing light guide plate first embodiment of the present invention.Light guiding board mould core manufacture method of the present invention may further comprise the steps: a substrate (step 201) with predetermined pattern is provided; Has deposition one nickel thin layer (step 202) on the substrate of predetermined pattern at this; The nickel dam (step 203) that has predetermined pattern by electrodeless electroforming step in this nickel thin layer surface formation one; Said structure is put into organic solvent, dissolve the substrate that this has predetermined pattern, thereby obtain having the nickel metallic object (step 204) of predetermined pattern; This nickel metallic object with predetermined pattern is combined with the die substrate, form a light guiding board mould core (step 205).
Seeing also Fig. 3 to Fig. 7, is the light guiding board mould core manufacture method first embodiment flow process of the present invention, and it may further comprise the steps:
Step 201 as shown in Figure 3, provides a substrate 30, and it comprises main body 31 and optical texture 33, wherein, the material of this main body 31 and optical texture 33 be polymethylmethacrylate (Poly Methyl Meth Acrylate, PMMA).This optical texture 33 is to utilize the light shield of a predetermined pattern to carry out net-point printing to make, and it is the semi-round ball structure.
Step 202, as shown in Figure 4, substrate 30 is put into sputter machine (figure does not show) cavity, set working pressure 0.05torr, substrate 30 is heated to 150 ℃, feeds plasma reaction gas, the control sedimentation time, at optical texture 33 surface depositions one layer thickness is the nickel thin layer 32 of 200～500 , and formation one has the substrate 40 of nickel thin layer 32.
Step 203 as shown in Figure 5, is put into electroforming solution with substrate 40, carries out electrodeless electroforming step to form a nickel dam 44 with predetermined pattern.Electrodeless electrocasting also can be described as autocatalysis casting (Auto catalytic Plating), form metal covering on the working substance surface earlier with catalytic capability, or utilize the catalytic action in working substance surface own, with chemical reduction method, make metallic ion become metallic state to separate out, and do not need the electric power casting on base material (substrate).Wherein, electroforming solution provides the potpourri of solution, hypophosphites and the promoter etc. of nickel ion.The solution that nickel ion is provided is nickel sulfate solution, also can be nickel chloride solution; Promoter is alkali halide.In addition, electroforming solution can also comprise that PH correctives, wetting agent, polishing material wait and strengthens the electroforming effect.This electroforming solution is an acid solution, and wherein this solution pH value is 4.2～4.8, also can be alkaline solution.The time that substrate 40 places electroforming solution is provided with according to required nickel dam 44 thickness.By electrodeless electroforming, the nickel dam 44 with predetermined pattern is formed on the substrate 40, thereby forms the substrate 50 of tool nickel dam 44.
Step 204 as shown in Figure 6, is put into the acetone organic solvent with substrate 50 and is dissolved substrate 30, obtains having the nickel metallic object 60 of predetermined pattern, and it is made of nickel thin layer 32 and nickel dam 44.
Step 205 as shown in Figure 7, provides a die substrate 70, after with itself and this nickel metallic object 60 pressing under heating condition, obtain the spatial structure model integrated by nickel metal layer 60 and die substrate 70, this model is die 80.
But light guiding board mould core manufacture method of the present invention is not limited to first embodiment, and wherein, this substrate 30 also can be polycarbonate (PC) substrate; This main body 31 and optical texture 33 also can be one-body molded by injection molding manufacture procedure; This optical texture 33 also is not limited to the semi-round ball structure, can be other structure, as cylindric; This nickel thin layer 32 also can be obtained by other deposition processs such as evaporations; This electrodeless electroforming step also can be flat with these optical texture 33 surface platings by the nickel metal; This substrate 30 is fallen by organic solvent dissolution in the back, and forms a mask recess patterns, and another side is the nickel metallic object 60 on plane; The one side on the one-tenth plane of this nickel metallic object 60 directly is attached to this die substrate 70, and forms die 80.
Claims (10)
1. a light guiding board mould core manufacture method may further comprise the steps: a substrate with predetermined pattern is provided; Deposition one nickel thin layer on the predetermined pattern of this substrate; Form a nickel dam by electrodeless electroforming step on this nickel thin layer surface; Said structure is put into organic solvent, dissolve this substrate, thereby obtain having the nickel metallic object of predetermined pattern; The nickel metallic object of this tool pattern is combined with the die substrate, form a light guiding board mould core.
2. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the material of this substrate is polymethylmethacrylate or polycarbonate.
3. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the predetermined pattern of this substrate is to utilize the light shield of a predetermined pattern to carry out net-point printing to make.
4. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the predetermined pattern of this substrate is and this substrate one ejection formation.
5. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the pattern of this substrate is that semicircle is spherical or cylindric.
6. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: this nickel thin layer is to adopt evaporation coating method to make.
7. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: this nickel thin layer is to adopt method for sputtering to make.
8. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the electroplate liquid that electrodeless electroforming step adopts is an acid solution.
9. light guiding board mould core manufacture method as claimed in claim 8 is characterized in that: the pH value of this acid solution is 4.2～4.8.
10. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: this organic solvent is an acetone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100774140A CN100356199C (en) | 2004-12-08 | 2004-12-08 | Method for mfg. core of light conducting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100774140A CN100356199C (en) | 2004-12-08 | 2004-12-08 | Method for mfg. core of light conducting plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1786743A true CN1786743A (en) | 2006-06-14 |
| CN100356199C CN100356199C (en) | 2007-12-19 |
Family
ID=36784277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100774140A Expired - Fee Related CN100356199C (en) | 2004-12-08 | 2004-12-08 | Method for mfg. core of light conducting plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100356199C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104698528A (en) * | 2015-01-26 | 2015-06-10 | 深圳市天诺通光电科技有限公司 | Method for preparing micron and nanometer structures on PS (polystyrene) light guide plate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05131457A (en) * | 1991-11-08 | 1993-05-28 | Olympus Optical Co Ltd | Manufacture of stamper |
| TW503170B (en) * | 2001-03-05 | 2002-09-21 | Setra Co Ltd | Method for producing injection molded mold with reflective light guide |
| CN1187639C (en) * | 2001-07-13 | 2005-02-02 | 兴隆发电子股份有限公司 | Optical guide plate and method for making its module core |
| JP2003245925A (en) * | 2002-02-26 | 2003-09-02 | Towa Corp | Processing method for mold for molding light guide plate, die and light-guide plate |
| CN1465751A (en) * | 2002-07-03 | 2004-01-07 | 胜华科技股份有限公司 | Method for raising surface hardness of electrocasting mould |
| CN1503010A (en) * | 2002-11-23 | 2004-06-09 | 鸿富锦精密工业（深圳）有限公司 | Method for making light guiding board |
-
2004
- 2004-12-08 CN CNB2004100774140A patent/CN100356199C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104698528A (en) * | 2015-01-26 | 2015-06-10 | 深圳市天诺通光电科技有限公司 | Method for preparing micron and nanometer structures on PS (polystyrene) light guide plate |
| CN104698528B (en) * | 2015-01-26 | 2018-05-04 | 深圳市天诺通光电科技有限公司 | A kind of method that micro-nano structure is prepared on PS light guide plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100356199C (en) | 2007-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103589995A (en) | Production method for mask plate | |
| KR20090117634A (en) | Method of manufacturing printed circuit board | |
| CN102208352A (en) | Manufacturing method and structure of ceramic copper-plated base plate | |
| CN1786746A (en) | Producing method of stamper for light guide plate | |
| CN1778505A (en) | Production of extremely profiled fine electrode for processing electric spark | |
| CN100356199C (en) | Method for mfg. core of light conducting plate | |
| TWI344551B (en) | Method for manufacturing a light guide plate of a backlight unit | |
| CN1453610A (en) | Manufacture of light-conducting board mold | |
| CN101169589A (en) | Method for manufacturing light guide plate cavity | |
| CN100529962C (en) | Light guide board module core manufacturing method | |
| CN100376953C (en) | Method for manufacturing light guiding plate core | |
| CN1372161A (en) | Light guiding board mould core and making method thereof | |
| CN1967340A (en) | Manufacturing method of light conducting board and light conducting board stamper and manufacturing processing of light conducting board | |
| TW200520925A (en) | A manufacturing method of a light guide plate | |
| CN201072452Y (en) | Mold insert structure of light conducting plate and light conducting plate structure formed by the same | |
| US6819494B2 (en) | Lens-implanted optical sheet and method for manufacturing the same | |
| US20080070129A1 (en) | Method for manufacturing a mold of a light guide plate | |
| CN1140818C (en) | Process for preparing plate-shaped optical element | |
| CN100383627C (en) | Manufacturing method of light board | |
| CN1779492A (en) | Light-conducting panel and production thereof | |
| CN1503010A (en) | Method for making light guiding board | |
| TWI263096B (en) | Method for manufacturing a cavity of a light guide plate | |
| CN112904664B (en) | Micro-nano die and manufacturing method thereof | |
| CN101686599B (en) | Circuit structure of circuit board and manufacture method thereof | |
| CN1704812A (en) | Method for manufacturing light guide plates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071219 Termination date: 20151208 |
|
| EXPY | Termination of patent right or utility model |