CN1778990A - Surface treatment for improving metal welding performance and work pieces therefrom - Google Patents
Surface treatment for improving metal welding performance and work pieces therefrom Download PDFInfo
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- CN1778990A CN1778990A CN 200510105565 CN200510105565A CN1778990A CN 1778990 A CN1778990 A CN 1778990A CN 200510105565 CN200510105565 CN 200510105565 CN 200510105565 A CN200510105565 A CN 200510105565A CN 1778990 A CN1778990 A CN 1778990A
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- protective membrane
- surface treatment
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- 238000004381 surface treatment Methods 0.000 title claims abstract description 19
- 238000004021 metal welding Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 238000002844 melting Methods 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 239000012528 membrane Substances 0.000 claims description 41
- 238000003466 welding Methods 0.000 claims description 28
- 230000003647 oxidation Effects 0.000 claims description 21
- 238000007254 oxidation reaction Methods 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010931 gold Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000010849 ion bombardment Methods 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 2
- 238000005238 degreasing Methods 0.000 claims description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 2
- 229910000975 Carbon steel Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 229910001069 Ti alloy Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000010962 carbon steel Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 230000008018 melting Effects 0.000 abstract description 5
- 239000011888 foil Substances 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- 230000008020 evaporation Effects 0.000 description 20
- 238000001704 evaporation Methods 0.000 description 20
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 12
- 239000007789 gas Substances 0.000 description 10
- 229910052786 argon Inorganic materials 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003657 drainage water Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
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Abstract
A surface treatment method used for enhancing jointing capability of metal. The process includes such steps as bombarding workpiece surface by high energy ion in vacuum condition to wipe off the oxide film; depositing a metal or alloy protective foil which is inoxidizable or can be removed easily on workpiece surface by jointing; depositing a matallic film with low melting point on protective foil. Problems caused by oxide film in metal jointing can be solved by this method.
Description
Technical field
The present invention relates to a kind of surface treatment method of metallic substance and the workpiece of handling with this method, more specifically, relate to a kind of surface treatment method that can improve the material surface welding property, the metallic surface that is specially adapted to easy oxidation is handled.
Background technology
Metal is easily oxidation and form oxide film in air, and for example aluminium alloy can form one deck aluminum oxide on its surface.The fusing point of the oxide film that generates is often high a lot of than corresponding metal material, and surface tension is well below corresponding metal.For example the fusing point of aluminum oxide is higher than 2000 ℃, and the fusing point of aluminium has only 660 ℃; The surface tension of aluminum oxide is 0.56N/m, and the surface tension of aluminium is 1.91N/m.Often connect by covalent linkage between the atom of metal oxide film, plasticity is low, and such structure and general metal construction differ greatly, so oxide film is difficult to form good the combination with other metals.The capillary reduction that has the mother metal of oxide film has in addition also influenced liquid metal sprawling on mother metal.These all can greatly reduce the welding property of mother metal, and the high temperature in the time of welding can increase the formation speed of oxide film.Therefore the oxide film of removing effectively on the metal mother metal is the key that obtains the superior weldability energy.
In the mother metal commonly used, aluminium alloy is one of material that is difficult to weld most.This is because of aluminum oxide fusing point height, chemical stability height, very difficult the removal.And aluminum oxide can be at a large amount of moisture of welding time absorption, makes to form a large amount of pores in the commissure.These characteristics of aluminum oxide have all seriously influenced the welding quality of aluminium alloy.Patent CN1014909B provides a kind of method of utilizing metal activation detergent clean metal, and a kind of method of utilizing the decontaminating cleaning agents clean metal also is provided among the patent CN1219603A, can both remove the oxide film that generates on the workpiece surface to a certain extent.In addition, utilize the method for plating or electroless plating on workpiece surface, to plate one deck or multiwalled " blocking layer ", also can prevent the oxidation of mother metal effectively.Yet, even general metal is exposed on the time very short in the atmosphere and also can forms layer oxide film thereon, for example, aluminium and iron are exposed in the atmosphere one minute just can form the oxide film that thickness is 20 dusts, even under same condition, also can form the oxide film that thickness is 10 dusts for stainless steel.In patent CN1026670C, propose after removing oxide film, to utilize a kind of organic solvent further to handle with ordinary method, feasible with fresh metallic surface and atmospheric isolation to prevent to generate oxide film.Yet employed organic solvent can decompose under the high temperature of welding or volatilization, makes it can not prevent that still oxide film from finishing preceding formation in welding.
Therefore, the oxide film of removal metallic surface can obtain reasonable effect under vacuum.Patent US5833758 and CN1124643A provide a kind of technology of cleaning semiconductor device surface under vacuum condition, but all do not have the follow-up film formed technology of oxidation that prevents, make it still can not be advantageously applied to welding field.A kind of method at the good material of vacuum condition deposit one deck solder wettability is provided among the patent CN1465738A, has been used to provide the reliable connection of component.Yet do not remove the technology of oxide film in this method; therefore be difficult to form good bonding strength between sedimentary material and the workpiece; if not for the certain protection of sedimentary material, also can face because of under atmosphere or on the surface at sedimentary material under the high temperature of welding, generating the Welding Problems that oxide film brings.
Summary of the invention
In order to address the above problem; the invention provides a kind of based on the surface treatment method under the vacuum environment; this surface treatment method can be removed the oxide film of metallic surface effectively; and on the metallic surface deposit multilayer film; this multilayer film comprises layer protecting film and outermost low-melting-point metal film at least, and described protective membrane is to be difficult for the metallic membrane of oxidation or easily oxidation but metallic membrane that its oxide film is removed in the time of welding easily.This surface treatment method can solve the Welding Problems of bringing because of oxide film effectively, has improved welding strength thus.
In order to achieve the above object, comprise the steps: that according to surface treatment method of the present invention (1) is with the workpiece vacuum chamber of packing into, toast vacuum chamber then, simultaneously vacuum chamber is evacuated to back of the body end vacuum, the surface of bombarding workpiece by high-energy heavy ion is to remove oxide film subsequently, and the gas with reductibility in this process or this process after feeds vacuum chamber to help the oxide film on the removal workpiece surface; (2) deposit layer protecting film on the surface of workpiece, described protective membrane is to be difficult for the metallic membrane of oxidation or easily oxidation but metallic membrane that its oxide film is removed in the time of welding easily; (3) the low-melting metallic membrane of deposition one deck on protective membrane, this metallic membrane is the outermost tunic of sedimentary multilayer film.
In step (1) before, can adopt the operation of degreasing, dehydration and removal oxide film, can guarantee the lip-deep clean level of workpiece like this, and reduce the thickness of the oxide film that workpiece formed on its surface as much as possible before entering vacuum chamber.Also can reduce effectively in addition on the workpiece surface may be residual such as the influence to vacuum tightness after entering vacuum chamber of impurity such as grease, moisture.
In step (1), after workpiece entered vacuum chamber, the baking vacuum chamber is assorted gas such as drainage water steam better.Produce high-energy heavy ion by ion source, described ion source can adopt point-like or linear hall ion source or Kaufman ion source.Perhaps, also can by will radio frequency or microwave introduce in the vacuum chamber and produce high-energy heavy ion, ICP ion source for example.In addition, also can according to circumstances on work rest, apply negative bias, thereby strengthen the effect of bombardment workpiece with speeding-up ion.Can use argon gas as the gas that produces high-energy heavy ion.Can use hydrogen as reducing gas.
In step (2), described protective membrane can use the precious metal that is difficult for oxidation, such as platinum (Pt), palladium (Pd) and gold (Au) and their alloy etc.Because above-mentioned metal is relatively expensive, so in addition, described protective membrane can also use easy oxidation but metal that its oxide film is removed easily when welding, such as the alloy of copper (Cu), silver (Ag) and copper base or money base.Described protective membrane can prevent the oxidation of workpiece well.When if described protective membrane and workpiece material are difficult for combining, step (2) can also be included in the middle of their deposition one deck with they all than being easier to the bonded material as transition layer.
In step (3), the low-melting metallic membrane of deposition one deck is as the outermost layer of workpiece on the surface of protective membrane.The composition of this metallic membrane should be identical with solder compositions or close as much as possible.Outermost low-melting film of workpiece and scolder can both be in molten state in the time of welding like this, make to form more abundant and uniform diffusion between two liquid phases, and identical or close on low-melting-point metal film and the solder compositions can form better combination on its interface.This lip-deep low-melting metallic membrane that covers workpiece fully can also further play the effect that prevents the workpiece oxidation.These characteristics all help improving welding strength.Low-melting metallic membrane comprises tin and such as tin-based alloys such as tin zinc, tin lead, tin silver.In addition, the film formed oxide film of these low-melting metals, for example the oxide film of tin all is easy to be removed in the time of welding.
Description of drawings
Fig. 1 is the structural representation of the workpiece surface after embodiments of the invention 1 are handled;
Fig. 2 is the structural representation of the workpiece surface after embodiments of the invention 2 are handled.
Fig. 3 is the structural representation of the workpiece surface after embodiments of the invention 3 are handled.
Fig. 4 is the structural representation of the workpiece surface after embodiments of the invention 4 are handled.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described:
Embodiment 1:
On Al alloy parts 1 surface, deposit the multilayer film of forming by copper layer 2 and tin layer 3 successively.Wherein the oxide compound of copper is removed when welding easily, and tin is low melting point metal.
Concrete operation method is as follows: by workpiece was carried out oil removing in 5-30 minute with the acetone ultrasonic cleaning, through being that the sulfuric acid of 0.5-2.0% soaks workpiece to remove the oxide film on the workpiece surface again with concentration after the rinsing, again after the tap water rinsing with ethanol ultrasonic cleaning dehydration.With the vacuum chamber of packing into after the workpiece oven dry, vacuum chamber is pumped to back of the body end vacuum, and vacuum chamber is heated to 200 ℃.
Then, open ion source, argon gas is fed vacuum chamber, by 5-30 minute next oxide film of partly removing on the workpiece of high-energy ion bombardment workpiece.Close argon flow amount subsequently, hydrogen is fed vacuum chamber, continue by high-energy ion bombardment workpiece 5-30 minute to remove the oxide film on the workpiece.
Next, close ion source and hydrogen flowing quantity, argon gas is fed vacuum chamber, and will carry on the back end vacuum and be adjusted to operating pressure.Then, open the evaporation source of copper, copper layer is to desired thickness.
At last, close the evaporation source of copper, open the evaporation source of tin, the deposit tin layer is to desired thickness.
Embodiment 2:
On Al alloy parts 4 surfaces, deposit the multilayer film of forming by gold layer 5 and tin layer 6 successively.Wherein gold is difficult for oxidation, and tin is low melting point metal.
Concrete operation method is as follows: remove oxide film according to method described in the embodiment 1.Then, argon gas is fed vacuum chamber, and will carry on the back end vacuum and be adjusted to operating pressure, open the evaporation source of gold, the deposited gold layer is to desired thickness.
At last, close the evaporation source of gold, open the evaporation source of tin, the deposit tin layer is to desired thickness.
Embodiment 3:
On Al alloy parts 7 surfaces, deposit the multilayer film that copper layer 9 and tin layer 10 are formed successively by nickel dam 8.Wherein nickel dam is a transition layer, and the oxide compound of copper is removed when welding easily, and tin is low melting point metal.
Concrete operation method is as follows: remove oxide film according to method described in the embodiment 1.Then, argon gas is fed vacuum chamber, and will carry on the back end vacuum and be adjusted to operating pressure, then, open the evaporation source of nickel, deposited nickel layer is to desired thickness.
Next, close the evaporation source of nickel, open the evaporation source of copper, copper layer is to desired thickness.
At last, close the evaporation source of copper, open the evaporation source of tin, the deposit tin layer is to desired thickness.
Embodiment 4:
On Al alloy parts 11 surfaces, deposit copper layer 13, nickel dam 14, the multilayer film that gold layer 15 and tin layer 16 are formed successively by nickel dam 12.Wherein nickel dam is a transition layer, and the oxide compound of copper is removed when welding easily, and gold is difficult for generating oxide compound, and tin is low melting point metal.
Concrete operation method is as follows: remove oxide film according to method described in the embodiment 1.Then, argon gas is fed vacuum chamber, and will carry on the back end vacuum and be adjusted to operating pressure, then, open the evaporation source of nickel, deposited nickel layer is to desired thickness.
Next, close the evaporation source of nickel, open the evaporation source of copper, copper layer is to desired thickness.
Next, close the evaporation source of copper, open the evaporation source of nickel, deposited nickel layer is to desired thickness.
Next, close the evaporation source of nickel, open the evaporation source of gold, the deposited gold layer is to desired thickness.
At last, close the evaporation source of gold, open the evaporation source of tin, the deposit tin layer is to desired thickness.
Surface treatment method provided by the invention can solve the problem that the oxide film of metal works brings effectively in welding process, thereby reaches the purpose that improves welding strength.
Claims (10)
1, a kind of surface treatment method that improves the Metal Material Welding performance may further comprise the steps:
(1) under vacuum condition, the surface of adopting the high-energy ion bombardment workpiece is to remove the oxide film on it;
(2) deposit layer protecting film at least on the surface of workpiece, wherein, described protective membrane is to be difficult for the metallic membrane of oxidation or easily oxidation but its oxide film easy removed metallic membrane in the time of welding;
(3) the low-melting metallic membrane of deposition one deck on protective membrane.
2, surface treatment method according to claim 1 also is included in step (1) and carries out operations such as degreasing, dehydration and removal oxide film before on the surface of workpiece.
3, surface treatment method according to claim 1, wherein, described workpiece is made up of a kind of material that is selected from aluminium, aluminium alloy, titanium, titanium alloy, carbon steel.
4, surface treatment method according to claim 1, wherein, described energetic ion provides by ion source, radio frequency or microwave.
5, surface treatment method according to claim 1, wherein, described protective membrane comprises a kind of material that is difficult for oxidation that is selected from gold, platinum and palladium and alloy thereof.
6, surface treatment method according to claim 1, wherein, described protective membrane comprises a kind of easy oxidation of the alloy that is selected from copper, silver and copper base or money base but material that oxide film is easy to remove.
7, surface treatment method according to claim 1, wherein, described low-melting metallic membrane comprises the tin-based alloy of tin and tin zinc, tin lead, tin silver etc.
8, surface treatment method according to claim 1 also is included between described workpiece and the described protective membrane, between the perhaps described protective membrane and the described low-melting-point metal film that will form deposition one deck with they all than being easier to the bonded material as transition layer.
9, a kind of surface treatment method that improves the material welding property may further comprise the steps:
(1) under vacuum condition, the surface of adopting the high-energy ion bombardment workpiece is to remove the oxide film on it;
(2) deposit one deck first protective membrane at least on the surface of workpiece, wherein, described first protective membrane is easy oxidation but its an oxide film easy removed metallic membrane in the time of welding;
(3) deposit one deck second protective membrane at least on the surface of workpiece, wherein, described second protective membrane is the metallic membrane that is difficult for oxidation;
(4) the low-melting metallic membrane of deposition one deck on protective membrane.
10, a kind of workpiece, comprising:
Sedimentary protective membrane on the surface of workpiece, wherein, described protective membrane is to be difficult for the metallic membrane of oxidation or easily oxidation but its oxide film easy removed metallic membrane in the time of welding;
Sedimentary low-melting-point metal film on described protective membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101055657A CN100451171C (en) | 2005-09-27 | 2005-09-27 | Surface treatment for improving metal welding performance and work pieces therefrom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101055657A CN100451171C (en) | 2005-09-27 | 2005-09-27 | Surface treatment for improving metal welding performance and work pieces therefrom |
Publications (2)
| Publication Number | Publication Date |
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| CN1778990A true CN1778990A (en) | 2006-05-31 |
| CN100451171C CN100451171C (en) | 2009-01-14 |
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| CNB2005101055657A Expired - Fee Related CN100451171C (en) | 2005-09-27 | 2005-09-27 | Surface treatment for improving metal welding performance and work pieces therefrom |
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| CN (1) | CN100451171C (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101700592B (en) * | 2009-11-27 | 2011-08-03 | 哈尔滨工业大学 | Method for soldering specific metal difficult to solder by ion injection deposition pretreatment |
| CN105164596A (en) * | 2013-03-15 | 2015-12-16 | 伊利诺斯工具制品有限公司 | Welding resource performance comparison system and method |
| US9684303B2 (en) | 2013-03-15 | 2017-06-20 | Illinois Tool Works Inc. | Welding resource tracking and analysis system and method |
| US9704140B2 (en) | 2013-07-03 | 2017-07-11 | Illinois Tool Works Inc. | Welding system parameter comparison system and method |
| US9862051B2 (en) | 2011-09-27 | 2018-01-09 | Illinois Tool Works Inc. | Welding system and method utilizing cloud computing and data storage |
| CN105164596B (en) * | 2013-03-15 | 2018-06-01 | 伊利诺斯工具制品有限公司 | Welding resource performance compares system and method |
| CN108183072A (en) * | 2017-12-19 | 2018-06-19 | 中国电子科技集团公司第四十七研究所 | Evaporate process of tin in chip surface layer |
| US10012962B2 (en) | 2013-03-15 | 2018-07-03 | Illinois Tool Works Inc. | Welding resource performance goal system and method |
| US10558953B2 (en) | 2013-07-03 | 2020-02-11 | Illinois Tool Works Inc. | Welding system parameter comparison system and method |
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| JPS6230887A (en) * | 1985-07-31 | 1987-02-09 | Mitsubishi Cable Ind Ltd | Composite aluminum material |
| WO2005074026A2 (en) * | 2004-01-21 | 2005-08-11 | Enthone Inc. | Tin-based coating of electronic component |
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- 2005-09-27 CN CNB2005101055657A patent/CN100451171C/en not_active Expired - Fee Related
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| CN101700592B (en) * | 2009-11-27 | 2011-08-03 | 哈尔滨工业大学 | Method for soldering specific metal difficult to solder by ion injection deposition pretreatment |
| US11865649B2 (en) | 2011-09-27 | 2024-01-09 | Illinois Tool Works Inc. | Welding systems and methods utilizing cloud computing and data storage |
| US9862051B2 (en) | 2011-09-27 | 2018-01-09 | Illinois Tool Works Inc. | Welding system and method utilizing cloud computing and data storage |
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| US9665093B2 (en) | 2013-03-15 | 2017-05-30 | Illinois Tool Works Inc. | Welding resource performance comparison system and method |
| US9684303B2 (en) | 2013-03-15 | 2017-06-20 | Illinois Tool Works Inc. | Welding resource tracking and analysis system and method |
| CN105164596B (en) * | 2013-03-15 | 2018-06-01 | 伊利诺斯工具制品有限公司 | Welding resource performance compares system and method |
| US10012962B2 (en) | 2013-03-15 | 2018-07-03 | Illinois Tool Works Inc. | Welding resource performance goal system and method |
| US10282693B2 (en) | 2013-03-15 | 2019-05-07 | Illinois Tool Works, Inc. | Welding resource performance comparison system and method |
| US10558953B2 (en) | 2013-07-03 | 2020-02-11 | Illinois Tool Works Inc. | Welding system parameter comparison system and method |
| US10558952B2 (en) | 2013-07-03 | 2020-02-11 | Illinois Tool Works Inc. | Welding system parameter comparison system and method |
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| US11103948B2 (en) | 2014-08-18 | 2021-08-31 | Illinois Tool Works Inc. | Systems and methods for a personally allocated interface for use in a welding system |
| US11131978B2 (en) | 2015-12-28 | 2021-09-28 | Illinois Tool Works Inc. | Systems and methods for analyzing manufacturing parameters |
| CN108183072A (en) * | 2017-12-19 | 2018-06-19 | 中国电子科技集团公司第四十七研究所 | Evaporate process of tin in chip surface layer |
| CN112323022A (en) * | 2021-01-04 | 2021-02-05 | 度亘激光技术（苏州）有限公司 | Vapor deposition method for semiconductor device |
| CN112323022B (en) * | 2021-01-04 | 2021-03-19 | 度亘激光技术（苏州）有限公司 | Vapor deposition method for semiconductor device |
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