CN1778731B - 模造玻璃模仁及其制造方法 - Google Patents

模造玻璃模仁及其制造方法 Download PDF

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CN1778731B
CN1778731B CN200410052544.9A CN200410052544A CN1778731B CN 1778731 B CN1778731 B CN 1778731B CN 200410052544 A CN200410052544 A CN 200410052544A CN 1778731 B CN1778731 B CN 1778731B
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vacuum sputtering
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produced glass
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CN1778731A (zh
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陈杰良
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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Abstract

本发明是关于一种模造玻璃模仁,包括一基材及多个复合层,该复合层包括一贵金属层、一绝缘金属氧化物层及一类金刚石薄膜层,其中该绝缘金属氧化物层处于贵金属层及类金刚石薄膜层之间。一种模造玻璃模仁的制造设备,其为一真空溅射机,包括真空溅射腔、靶材结构及基材结构,其中该靶材结构及基材结构设置于真空溅射腔内,该靶材结构上设有多个靶材体,每一靶材体上安装有永磁体,该基材结构上设有自转及公转结构。

Description

模造玻璃模仁及其制造方法
【技术领域】
本发明是关于一种模造玻璃模仁,尤其是关于模造玻璃模仁的结构、制造设备及其制造方法。 
【背景技术】
随着多媒体技术的发展,数码相机、摄影机越来越为广大消费者青睐,在人们对数码相机、摄影机追求小型化的同时,对其拍摄出物体的影像质量亦提出更高的要求,即希望拍摄物体的影像画面清晰,而物体的成像质量于很大程度上取决于数码相机内各光学元件的优劣。 
非球面镜片即为数码相机中不可或缺的光学元件,现有的数码相机非球面镜片是通过模造法制成。由于模造玻璃需要在高温(大约600℃)及高压(2000-10000N)下进行,所以模造法制备非球面镜片需要具备严格设计生产的模仁,模造玻璃模仁一般为基材与保护膜的组合结构,而基材材质一般是碳化钨、碳化硅等,而保护膜的材质一般为类金刚石薄膜(Diamond Like Film,DLC)、贵金属镀膜或贵金属合金镀膜,贵金属镀膜如铱(Iridium,Ir)、铂(Platinum,Pt)、钌(Ruthenium,Ru)等,贵金属合金镀膜如铱-钌合金(Ir-Ru)、铱-铼合金(Ir-Re)等。类金刚石薄膜(DLC)很难达到令人满意的模仁寿命,贵金属或贵金属合金都具有很强的化学稳定性,但是由于贵金属保护膜与基材之间附着性较差,使得模仁在模造的高温环境下很难有较高的模造循环次数,间接提高了模造玻璃的成本。 
现有的模造玻璃模仁是通过真空溅射方式于基材上溅射而制成,而现有的模造玻璃模仁制造设备为真空溅射机,一般是于真空溅射腔内设置溅射靶材及基材,亦可于真空溅射腔内设置永磁体形成磁控溅射机,如中国专利第90226142.8号,该专利介绍了一种磁控溅射机,该磁控溅射机包括真空室及设置于真空室内的磁控溅射靶、加热器等。该磁控溅射机可溅射不同材质及不同结构的多层膜或合金膜,然而由于该磁控溅射机每次仅能溅射一种单质膜,当溅射多层膜时,需重复打开真空溅射腔更换靶材,故此会造成各膜层因为破真空而被氧化,而磁控溅射机溅射多层膜时容易造成资源的浪费,同时增加了溅射产品的成本。 
有鉴于此,提供一种具有较长模造循环次数且模造温度较高的模造玻璃模仁、其制造方法及制造设备实为必要。 
【发明内容】
本发明的目的在于提供一种具有较长模造循环次数且模造温度较高的模造玻璃模仁。 
本发明的另一目的在于提供一种上述模造玻璃模仁的制造设备。 
本发明的再一目的在于提供一种上述模造玻璃模仁的制造方法。 
为了实现本发明的目的,本发明提供一种模造玻璃模仁,包括一基材及多个复合层,该复合层包括一贵金属层、一绝缘金属氧化物层及一类金刚石薄膜层,其中该绝缘金属氧化物层处于贵金属层及类金刚石薄膜层之间。 
为了实现本发明的另一目的,本发明提供一种模造玻璃模仁的制造设备,该设备为真空溅射机,包括真空溅射腔、靶材结构及基材结构,其中该靶材结构及基材结构设置于真空溅射腔内,该靶材结构上设有多个靶材体,每一靶材体上安装有永磁体,该基材结构上设有自转及公转结构。 
为了实现本发明的再一目的,本发明提供一种模造玻璃模仁的制造方法,包括以下步骤: 
将模仁基材安装于真空溅射机的基材结构上; 
将贵金属靶材、绝缘金属氧化物靶材及石墨靶材安装于真空溅射机的多个靶材体上; 
将真空溅射机内抽真空; 
依次溅射贵金属层、绝缘金属氧化物层及类金刚石薄膜层于基材上形成复合层,其中绝缘金属氧化物层处于贵金属层及类金刚石薄膜层之间; 
继续溅射直至达到规定的多个复合层; 
最后取出即得到模造玻璃模仁。 
本发明的真空溅射机靶材体上还可设置多个永磁体,永磁体形成的磁场可增加溅射速率,形成真空磁控溅射,可使溅射基材与靶材的粒子结合紧密,形成牢固的溅射层。 
相较现有技术,本发明的模造玻璃模仁具有多层复合层,可承受模造玻璃时的高温、高压环境,且复合层与基材结合紧密,所以本发明的模造玻璃模仁具有较高的模造循环次数。本发明的真空溅射机内可安装多个靶材,且该多个靶材可采用不同材质,故可于一次溅射过程中溅射出多层不同材质的镀膜,而且各膜层之间不会因为破真空而被氧化,节省了溅射成本,同时又由于本发明的真空溅射机的基材结构可于溅射时自转与公转,可使溅射的薄膜厚度均匀保持一致。 
【附图说明】
图1是本发明模造玻璃模仁的结构示意图; 
图2是本发明真空溅射机的剖示图; 
图3是本发明真空溅射机的靶材结构的磁铁设计图; 
图4是本发明真空溅射机内的射频电源线路设计图。 
【具体实施方式】
本发明适用于模造玻璃模仁及其制造领域。 
参照图1所示,本发明的模造玻璃模仁1包括一基材10及多个复合层12,该复合层12包括一贵金属层120、一绝缘金属氧化物层122及一类金刚石薄膜层124,其中该绝缘金属氧化物层122处于贵金属层120及类金刚石薄膜层124之间。 
为达到较好的模造循环寿命,复合层12的层数可为1-30层,最好应为5-10层。贵金属层120的贵金属可为铱、铂、钌或其合金,该贵金属层120的厚度为3-10埃(Angstrom)。绝缘金属氧化物层122的绝缘金属氧化物是ZrO2-xY2O3,其中重量百分比含量x为3-15%,最好应为5-8%,绝缘金属氧化物层122的绝缘金属氧化物还可为ZrO2-xY2O3-yAl2O3,重量百分比x为3-15%,最好应为5-8%,重量百分比y为3-5%,另,绝缘金属氧化物层122还可为Al2O3。该绝缘金属氧化物层122的厚度为20-50埃,而类金刚石薄膜层124的厚度为40-80埃。另外,类金刚石薄膜层124还可用与其具有相同效果的Si3N4、BN、WC或BCN等材料取代。 
参照图2所示,本发明模造玻璃制造设备是一真空溅射机2,该真空溅射机2包括真空溅射腔、靶材结构22及基材结构(图未示)。其中靶材结构22及基材结构安装于真空溅射腔内,靶材结构22设置于真空溅射腔的一端,其上设置有第一靶材体221、第二靶材体222及第三靶材体223。第一靶材体221可安装直径约为1-2英寸(2.45-4.9厘米)的靶材,第二靶材体222及第三靶材体223可安装直径为4-8英寸(9.8-19.6厘米)的靶材,三靶材体周围设有多个进气口27,该进气口27可将氩气等惰性气体均匀通入真空溅射腔内,以形成稳定的溅射环境。其中第一靶材体221上连接有直流电源或交流电源,第二靶材体222上连接有射频电源或交流电源,第三靶材体223上设有直流电源或射频电源。其中,射频电源的频率是13.56MHz,其电源供应图如图4 所示,射频电源供应器28产生的射频电源通过共享激发器(commonexciter)281、电容282、电感283、电压表284后80-98%供应给靶材,而其它的2-20%以负偏压射频电源供应给基材。交流电源的频率为150-500KHz,最佳应为325-450KHz,直流电源的功率应为200-1000W,最佳功率应为200-500W。 
请参照图3所示,为增强溅射速率,各靶材体上还安装有永磁体26,形成与电场垂直的磁场,用以加速溅射粒子的速率以形成磁控溅射,该永磁体的材料为钕铁硼(NdFeB),还可为锶钡铁氧体、镍铬钴合金(NiCrCo)、稀土钴合金等磁性材料。同时,为防止电磁辐射干扰,各靶材体外须设置接地屏蔽罩25。为降低溅射靶材的温度,应于各靶材体后设置冷却水管(图未示),基材结构位于真空溅射腔内与靶材结构相反的一端,该基材结构上设有多个基材位,同时基材结构上还设有自转及公转结构(图未示)控制基材结构自转及公转。 
请同时参照图1及图2所示,本发明模造玻璃模仁的制造方法即利用上述的真空溅射机2制造模造玻璃模仁1,包括以下步骤: 
将模仁基材10安装于真空溅射机2的基材结构上; 
将贵金属靶材、绝缘金属氧化物靶材及石墨靶材安装于真空溅射机; 
将真空溅射机内抽真空; 
依次溅射贵金属层120、绝缘金属氧化物层122及类金刚石薄膜层124于基材10上形成复合层12,其中绝缘金属氧化物层122处于贵金属层120及类金刚石薄膜层124之间; 
继续溅射直至达到规定的多个复合层12; 
最后取出即可得到模造玻璃模仁1。 
真空溅射前,将铂(Pt)、铱(Ir)、铼(Re)等贵金属或其合金材料的靶材安装入第一靶材体221,将选自ZrO2-xY2O3、ZrO2-xY2O3-yAl2O3或Al2O3等绝缘金属氧化物材料的靶材安装入第二靶材体222,将选自石墨、Si3N4、WC、BN及BCN等材料的靶材安装入第三靶材体223,将待镀基材10安装于基材结构的基材位上,然后将真空溅射腔内抽真空。当需要溅射贵金属材料膜层时,向真空溅射腔内通入惰性气体至0.1-1Pa,然后开启第一靶材体221上的直流(DC)电源或射频(RF)电源,同时开启基材结构上的自转及公转结构使基材10旋转进行溅射。当需要溅射绝缘材料膜时,向真空溅射腔内通入惰性气体(如氩气)与氧气的混合气至0.1-1Pa,接着开启第二靶材体222上的射频(RF) 电源或交流(AC)电源,同时开启基材结构上的自转及公转结构使基材10旋转进行溅射。当需要溅射类金刚石膜、Si3N4、WC、BN等膜层时,向真空溅射腔内通入惰性气体或惰性气体与氮气的混合气至0.1-1Pa,然后开启第三靶材体223上的交流(AC)电源或直流(DC)电源,同时开启基材结构上的自转及公转结构使基材10旋转进行溅射。 
本发明的模造玻璃模仁具有多层复合层,可承受模造玻璃时的高温、高压环境,且复合层与基材结合紧密,所以本发明的模造玻璃模仁具有较高的模造循环次数。本发明的真空溅射机内可安装多个靶材,且该多个靶材可采用不同材质,故可于一次溅射过程中溅射出多层不同材质的镀膜,而且各膜层之间不会因为破真空而被氧化,节省了溅射成本,同时又由于本发明的真空溅射机的基材结构可于溅射时自转与公转,可使溅射的薄膜厚度均匀保持一致。 

Claims (8)

1.一种模造玻璃模仁,其特征在于:其包括一基材及多个复合层,该复合层包括一贵金属层、一绝缘金属氧化物层及一类金刚石薄膜层,其中该绝缘金属氧化物层处于贵金属层及类金刚石薄膜层之间。
2.如权利要求1所述的模造玻璃模仁,其特征在于:该复合层的层数为5-10层。
3.如权利要求1或2所述的模造玻璃模仁,其特征在于:该贵金属层的材料为铱或铂或钌或铱合金或铂合金或钌合金,其厚度为3-10埃。
4.如权利要求1或2所述的模造玻璃模仁,其特征在于:该绝缘金属氧化物层的材料为ZrO2-xY2O3、ZrO2-xY2O3-yAl2O3及Al2O3中的任一种,其中重量含量x为3-15%,重量含量y为3-5%,该绝缘金属氧化物层的厚度为40-80埃。
5.如权利要求1或2所述的模造玻璃模仁,其特征在于:该类金刚石薄膜层的厚度为40-80埃。
6.如权利要求5所述的模造玻璃模仁,其特征在于:该类金刚石薄膜层用Si3N4、BN、WC或BCN取代。
7.一种模造玻璃模仁的制造方法,其特征在于:该方法使用的设备为一真空溅射机,包括真空溅射腔、靶材结构及基材结构,该靶材结构及基材结构设置于真空溅射腔内,该靶材结构上设有第一靶材体、第二靶材体及第三靶材体,该基材结构上设有自转及公转结构;
该方法包括以下步骤:
将模仁基材安装于真空溅射机的基材结构上;
将贵金属靶材、绝缘金属氧化物靶材及石墨靶材安装于真空溅射机的多个靶材体上;
将真空溅射机内抽真空;
依次溅射贵金属层、绝缘金属氧化物层及类金刚石薄膜层于基材上形成复合层,其中绝缘金属氧化物层处于贵金属层及类金刚石薄膜层之间;
继续溅射直至达到规定的多个复合层;
最后取出即得到模造玻璃模仁。
8.如权利要求7所述的模造玻璃模仁的制造方法,其特征在于:该贵金属靶材的材料为铱或铂或钌或铱合金或铂合金或钌合金,其安装于真空溅射机的第一靶材体,绝缘金属氧化物靶材的材料为ZrO2-xY2O3、ZrO2-xY2O3-yAl2O3及Al2O3中的任一种,其安装于真空溅射机的第二靶材体。
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI314920B (en) * 2004-04-30 2009-09-21 Hon Hai Prec Ind Co Ltd Core insert for molding glass system and method of manufacture it
TWI561479B (en) * 2011-12-01 2016-12-11 Hon Hai Prec Ind Co Ltd Mold core and method for making the same
CN103132062B (zh) * 2011-12-02 2016-10-26 鸿富锦精密工业(深圳)有限公司 模仁及其制造方法
US20140224958A1 (en) * 2013-02-11 2014-08-14 Corning Incorporated Coatings for glass-shaping molds and glass-shaping molds comprising the same
CN104960130B (zh) * 2015-07-23 2017-03-22 长沙理工大学 一种小口径非球面玻璃透镜的精密热压成型模具
TW201739704A (zh) * 2016-01-20 2017-11-16 康寧公司 塑形玻璃基材料之具高溫用途之塗層之模具
US10388533B2 (en) * 2017-06-16 2019-08-20 Applied Materials, Inc. Process integration method to tune resistivity of nickel silicide
CN108977787B (zh) * 2018-09-17 2019-10-18 重庆大学 一种磁控溅射镀膜阴极结构
CN110129743A (zh) * 2019-01-04 2019-08-16 东莞市鸿瀚电子材料有限公司 一种手机摄像头镜片镀ar膜工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096825A (zh) * 1993-06-22 1994-12-28 电子科技大学 对称磁体磁控溅射源

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4168961A (en) * 1975-09-02 1979-09-25 Eastman Kodak Company Method of molding glass elements
JPS61136928A (ja) * 1984-12-10 1986-06-24 Matsushita Electric Ind Co Ltd 光学ガラス素子のプレス成形用型
US5171348A (en) * 1989-06-20 1992-12-15 Matsushita Electric Industrial Co., Ltd. Die for press-molding optical element
US5078847A (en) * 1990-08-29 1992-01-07 Jerry Grosman Ion plating method and apparatus
JP3343620B2 (ja) * 1992-04-09 2002-11-11 アネルバ株式会社 マグネトロンスパッタリングによる薄膜形成方法および装置
DE19535994C2 (de) * 1994-10-14 1998-07-16 Sharp Kk Magnetooptisches Aufzeichnungsmedium und Herstellverfahren für dieses
JP3457826B2 (ja) * 1997-01-31 2003-10-20 株式会社リコー 薄膜式抵抗体及びその製造方法、流量センサ、湿度センサ、ガスセンサ、温度センサ
US6506289B2 (en) * 2000-08-07 2003-01-14 Symmorphix, Inc. Planar optical devices and methods for their manufacture
US6653027B2 (en) * 2001-02-26 2003-11-25 International Business Machines Corporation Attenuated embedded phase shift photomask blanks
JP4066044B2 (ja) * 2002-11-08 2008-03-26 信行 高橋 成膜方法及びスパッタ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096825A (zh) * 1993-06-22 1994-12-28 电子科技大学 对称磁体磁控溅射源

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-255568A 2002.09.11

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