CN1769021A - Carrier film, method for processing ceramic circuit substrate used the same and method for manufacturing electronic parts - Google Patents
Carrier film, method for processing ceramic circuit substrate used the same and method for manufacturing electronic parts Download PDFInfo
- Publication number
- CN1769021A CN1769021A CNA2005100528687A CN200510052868A CN1769021A CN 1769021 A CN1769021 A CN 1769021A CN A2005100528687 A CNA2005100528687 A CN A2005100528687A CN 200510052868 A CN200510052868 A CN 200510052868A CN 1769021 A CN1769021 A CN 1769021A
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- Prior art keywords
- carrier film
- ceramic circuit
- circuit board
- hole
- reach
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/14—Supports; Mounting means for wire or other non-rigid radiating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Producing Shaped Articles From Materials (AREA)
- Ceramic Capacitors (AREA)
- Coils Of Transformers For General Uses (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a carrier film for ceramic green sheet, a ceramic green sheet processing method using it and a manufacturing method of electronic part. To make a shape almost columnar while preventing a through-hole from piercing a carrier film when the through-hole is formed to the ceramic green sheet supported on the carrier film by irradiating the ceramic green sheet with a laser beam. The carrier film 10 for the ceramic green sheet, which has a carrier film body 12 comprising a resin film and the metal thin film layer 11 formed on one main surface of the carrier film body, is used to form the ceramic green sheet 20 on the other main surface of the carrier film body 12.
Description
Technical field
The ceramic circuit board (green sheet) that the present invention relates to electronic devices and components manufacturing usefulness such as multilayer coil is used carrier film.Have again, also relate to the processing method of the ceramic circuit board that utilizes ceramic circuit board to use carrier film and the manufacture method of electronic devices and components.
Background technology
Electronic devices and components such as multilayer coil and the compound components and parts of stacked LC are to form ceramic circuit board on the carrier film of formations such as PET, after the processing of ceramic circuit board being carried out regulations such as reach through hole processing and conductor printing, carry out ceramic circuit board stacked and compacting, carry out sintering then and make.
In the electronic devices and components of making like this, between the conductor that different lamination surface form, utilize filling electric conductivity paste in reach through hole and the via hole that forms is electrically connected.
Method as form reach through hole on ceramic circuit board generally adopts laser processing device to carry out (patent documentation 1)
When adopting patent documentation 1 described laser processing device to form reach through hole, a best break-through ceramic circuit board and not break-through carrier film illustrates as a whole that promptly formation is with the bottom outlet that has of carrier film as the bottom surface.This be because, also as described in " 0004 "～" 0007 " paragraph of patent documentation 1, if hole break-through carrier film, then the electric conductivity paste spills from the bottom surface in hole, platform is produced to be polluted, perhaps the generation of the conductor in the reach through hole is peeled off when peeling off carrier film and circuit substrate, perhaps causes the platform damage.
Therefore, when irradiating laser, irradiation energy be to adjust, certain break-through ceramic circuit board and not break-through carrier film made.
[patent documentation 1] spy opens 2002-347016 communique (particularly " 0004 "～" 0007 ")
But when shining laser with such irradiation energy, as shown in Figure 7, the opening diameter that the section configuration of the reach through hole 30 that forms on the ceramic circuit substrate 20 becomes the laser light incident side is large, the little trapezoidal shape of circular cone of opening diameter of carrier film 10 1 sides
This is that the highest at the central shaft energy level, along with radially departing from central shaft, then energy level reduces gradually because the energy of laser distributes shown in Fig. 8 (a). In addition, figure center line A represents for break-through ceramic circuit substrate 20 necessary energy levels. The part that surpasses line A at energy level can be with the hole break-through. In addition, surpass the part of line B at energy level and since the hole also break-through carrier film 10, therefore to adjust, so that the peak value of energy level is no more than line B.
In order to reduce the D.C. resistance of electronic devices and components, the sectional area of reach through hole will be the bigger the better, but because the reason in the designs such as the restriction of chip size, in most cases the opening diameter size for reach through hole has certain restriction. Under the condition that opening diameter is restricted, for increasing section is long-pending as far as possible, being that circular cone is trapezoidal with the cross sectional shape of reach through hole compares, preferably cylindrical.
For the cross sectional shape that makes reach through hole is approximately cylindrical, shown in Fig. 8 (b), as long as increase the inclination degree of the energy distribution of laser, the zone that the increase energy level surpasses line A, if but the inclination that energization distributes, then energy level will be above line B near central shaft, and the hole is also with break-through carrier film 10. When hole break-through carrier film 10, will there be problem as described above, can not meet the demands.
That is, in method in the past, be difficult to neither make hole break-through carrier film, make again cross sectional shape form nearly quasicylinder shape.
Summary of the invention
In order to address the above problem, the ceramic circuit board carrier film that the present invention is relevant, the metal film layer that has the carrier film body that is made of resin film and form at an interarea of described carrier film body is at the ceramic circuit board of formation on the other hand of described carrier film body.
By like this, even laser to the more intense output of ceramic circuit board irradiation, the feasible reach through hole that forms near cylindrical, but owing to utilize the metal film layer reflector laser, therefore reach through hole does not have the break-through carrier film yet, can solve the problem that forms the near cylindrical reach through hole simultaneously and not produce the problem of printing unfavorable conditions such as pollution.
In addition, use in the carrier film at the ceramic circuit board that the present invention is relevant, another interarea that is preferably in described carrier film body forms release layer, forms ceramic circuit board on this release layer.
By like this, between carrier film and circuit substrate, can access good release property.
Have, described metal film layer is that principal component constitutes with Cu, Fe, Al and at least a alloy that contains in them preferably again.
Metal film layer preferably has certain above reflectivity to laser, from preventing that the carrier film body that resin constitutes is heated and rotten viewpoint, wish the thermal conductivity height in addition, Cu, Fe and Al are owing to satisfy these conditions, and relatively cheaply, therefore be suitable as the material of metal film layer.
The processing method of the ceramic circuit board that the present invention is relevant, to the ceramic circuit that on ceramic circuit board of the present invention described another interarea of carrier film body, forms with carrier film, surface irradiation laser from the opposition side on the surface supported by described carrier film body forms reach through hole on described ceramic circuit board.
By like this, even laser to the more intense output of ceramic circuit board irradiation, the feasible reach through hole that forms near cylindrical, but owing to utilize the metal film layer reflector laser, therefore reach through hole does not have the break-through carrier film yet, can solve the problem that forms near cylindrical Chuan Dao hole simultaneously and not produce the problem of printing unfavorable conditions such as pollution.
The manufacture method of the electronic devices and components that the present invention is relevant, be included in ceramic circuit board of the present invention with another interarea of described carrier film body of carrier film form ceramic circuit board operation, from described ceramic circuit board form the operation of reach through hole with the surface irradiation laser of the opposition side surface of supporting by described carrier film body and at described ceramic circuit board, to the operation of described reach through hole filling electric conductivity paste and the operation that described ceramic circuit board is stacked.
By like this, even laser to the more intense output of ceramic circuit board irradiation, the feasible Chuan Dao hole that forms near cylindrical, but owing to utilize the metal film layer reflector laser, therefore carrier film is not worn in the Chuan Dao hole yet, can solve the problem that forms the near cylindrical perforation simultaneously and not produce the problem of printing unfavorable conditions such as pollution, can make the little electronic devices and components of D.C. resistance easily.
As mentioned above, according to the present invention, even laser to the more intense output of ceramic circuit board irradiation, make and form the columniform Chuan Dao of likeness in form hole, but owing to utilize the metal film layer reflector laser, therefore the film carrier body is not worn in the Chuan Dao hole yet, can solve the problem that forms near cylindrical Chuan Dao hole simultaneously and not produce the problem of printing unfavorable conditions such as pollution.
Description of drawings
Figure 1 shows that the cutaway view of ceramic circuit board of the present invention with carrier film.
Figure 2 shows that the schematic diagram of laser processing device.
Figure 3 shows that the cutaway view of ceramic circuit board of the present invention with carrier film.
Figure 4 shows that with being the multilayer coil component exploded perspective view of an example of electronic devices and components of the present invention.
Figure 5 shows that with being the multilayer coil component exploded perspective view of an example of electronic devices and components of the present invention.
Figure 6 shows that the cutaway view of ceramic circuit board of the present invention with carrier film and ceramic circuit board.
Figure 7 shows that in the past ceramic circuit board is with the cutaway view of carrier film and ceramic circuit board.
Figure 8 shows that the curve synoptic diagram that laser energy distributes.
[label declaration]
10 carrier film
11 metal film layers
12 carrier film bodies
13 release layers
20～24 ceramic circuit boards
25a, 25b via hole
26a, 26b tape conductor
27 conductor introductions
30 reach through holes
40 laser processing devices
50 laser
60 multilayer coils
61 sintered bodies
62 outer electrodes
The specific embodiment
The following optimal morphology of using with reference to description of drawings enforcement the present invention.
[embodiment 1]
Figure 1 shows that the cutaway view of the relevant ceramic circuit board of the present invention with carrier film.Carrier film 10 of the present invention is made of carrier film body 12 and metal film layer 11, and this carrier film body 12 is made of PET (PETG), PP (polypropylene), PE resins such as (polyethylene).As metal film layer 11, owing to preferably laser is had certain above reflectivity, and also from reducing the viewpoint of manufacturing cost, requirement is comparatively cheap metal, therefore preferably adopts Cu, Fe and Al etc.Here, adopt the metal film layer 11 that carrier film body 12 bondings that are made of PET are made of Cu and the carrier film of making.Employing 10 μ m～40 μ m that the thickness of metal film layer 11 is best.When metal film layer 11 to 10 μ m are thin, be difficult to the heat that laser produces is fully dispelled the heat, the danger that resinous carrier film body 10 is produced baneful influence is arranged.On the other hand, when the thickness of metal film layer 11 surpasses 40 μ m, the flexibility of metal film layer 11 is not enough, with carrier film 10 coiling tubulars the time, produce in " coiling gauffer ", the danger of the flatness of damage carrier film 10 is arranged, and under these circumstances, the thickness of the ceramic circuit board that forms on the carrier film 10 will produce difference.
On carrier film body 12, form ceramic circuit board 20 across release layer 13.Release layer 13 is for improving the fissility of carrier film 10 and ceramic circuit board 20, even also can access under the situation of good fissility not forming release layer 13, not necessarily must adopt release layer.Release layer 13 can utilize formation such as silicones, polyvinyl alcohol, polyolefin, chain alkyl polymer, cured class, fluoride, but is not limited to this.
Figure 2 shows that the formation of laser processing device.Laser processing device 40 has LASER Light Source 41, diffraction grating 42, galvanometer scanning ytterbium 43, galvanometer scanning mirror drive unit 44, condenser lens 45 and platform 46.The ceramic circuit board of being supported by carrier film 10 20 is placed on the platform 46.The laser 50 that is produced by LASER Light Source 41 vibrations utilizes diffraction grating 42 beam split, with 43 reflections of galvanometer scanning mirror, shines to ceramic circuit board 20 by condenser lens 45.The irradiation position of laser 50 utilizes galvanometer scanning mirror drive unit 44 to make galvanometer scanning mirror 43 be moved to predetermined angular adjustment, makes to reach desirable position.
By to ceramic circuit board 20 irradiating lasers 50, form reach through hole 30 as shown in Figure 3.In addition, be called the meaning that " reach through hole " is meant " hole of break-through ceramic circuit board " here, comprising is with carrier film body and the metallic film situation that bottom outlet is arranged as the bottom surface.Reach through hole 30 is break-through ceramic circuit board 20 and carrier film body 12, with metal film layer 11 as the bottom surface.In the present invention, because metal film layer 11 is set, even therefore shine the laser of more intense energy, also because of reach through hole 30 not break-through metal film layers 11, even so filling electric conductivity paste in the reach through hole 30, can not produce that the electric conductivity paste spills from the bottom surface and the situation of polluting platform yet, can not be created in perhaps that the conductors in the reach through hole 30 peel off or lead problems such as platform damage when peeling off carrier film 10 and peeling off with circuit substrate 20 yet.In addition owing to can shine the laser of strong energy, but so the shape subcylindrical of reach through hole 30, can effectively reduce the D.C. resistance when making electronic devices and components.
[embodiment 2]
The manufacture method of the electronic devices and components that the present invention is relevant is described as the 2nd embodiment of the present invention below.Figure 4 shows that the exploded perspective view as the multilayer coil of an example of electronic devices and components, Fig. 5 is the profile stereogram.
At first, prepare ceramic size that Ni-Cu-Zn based ferrite powder, binding agent, solvent, dispersant etc. are mixed.Then, with the ceramic circuit board that this ceramic size forms on carrier film, its thickness after dry is reached in the scope of 45～55 μ m.
At this moment, as carrier film, for the ceramic circuit board that will constitute ceramic circuit board 21 described later and 22, adopt the carrier film of the present invention that describes in detail among the embodiment 1, but for ceramic circuit board 23 and 24, owing to do not form reach through hole, therefore can adopt the well-known carrier film that does not have metal film layer, also can adopt carrier film of the present invention.
Ceramic circuit board to no decorative pattern utilizes embodiment 1 described method to form reach through hole, in order to this reach through hole of electric conductivity paste filling that Ag is main component, by such formation via hole 25a, makes ceramic circuit board 21.In addition, ceramic circuit board to no decorative pattern utilizes embodiment 1 described method to form reach through hole, is the electric conductivity paste printer belt shape conductor 26a and the conductor introduction 27 of main component in order to Ag, this reach through hole of filling simultaneously, form via hole 25b, make ceramic circuit board 22.In addition, the ceramic circuit board of no decorative pattern in order to the electric conductivity paste printer belt shape conductor 26b that Ag is main component, is made ceramic circuit board 23.In addition, also prepare the ceramic circuit board 24 of no decorative pattern former state.
This multilayer coil is that the coil-conductor that the direction vertical with respect to stacked direction that the both ends by the regulation tape conductor 26b that forms on the end of the regulation tape conductor 26a that forms on the ceramic circuit board 22 and the ceramic circuit board 23 utilize via hole 25a and 25b to be formed by connecting has axle is housed in sintered body.
Here, in order to verify effect of the present invention, prepared to adopt carrier film in the past and multilayer coil and the multilayer coil of the present invention made, relatively dc resistance.
Making 1.6mm * 0.8mm * 0.8mm size, the number of turn with above-mentioned method is 7.75 multilayer coil.At this moment, the energy level that changes laser distributes, and the reach through hole that forms different shape compares.The result is as shown in table 1.With reference to Fig. 6, the shape of the reach through hole 30 of ceramic circuit board 20 is represented with the opening diameter r0 of laser light incident side and the ratio r0/r1 of the opening diameter r1 of a side of being supported by carrier film 10.In table 1, so-called " D.C. resistance than " is the value that the dc resistance of each sample and the ratio of specimen coding # 4 are represented with %.
Table 1
| Specimen coding | r 0/r 1 | D.C. resistance (Ω) | D.C. resistance is than (%) | ||
| The present invention is example in the | # | 1 | 1.0 | 20 | 59 |
| #2 | 1.1 | 24 | 71 | ||
| #3 | 1.2 | 29 | 85 | ||
| #4 | 1.3 | 34 | 100 | ||
| #5 | 1.4 | 39 | 115 | ||
| #6 | 1.6 | 51 | 150 | ||
| #7 | 1.8 | 65 | 191 | ||
| #8 | 3.0 | 180 | 529 |
When the carrier film that adopts in the past, if the energy level of wanting to strengthen laser makes the shape subcylindrical of reach through hole, promptly want to make r0/r1 approach 1.0, then because reach through hole break-through ceramic circuit board not only, therefore also break-through carrier film can not make the value of r0/r1 less than 1.3.Different therewith is, when adopting carrier film of the present invention, owing to use the metal film layer reflector laser, so promptly makes the energy level of high laser, and reach through hole is not break-through carrier film also, can make the value of r0/r1 reach 1.0～1.2.Its result, the electronic devices and components of the present invention electronic devices and components made with adopting in the past carrier film are compared, and can reduce D.C. resistance.The multilayer coil of specimen coding # 1 is particularly compared with the specimen coding # 4 of example in the past, D.C. resistance can be reduced to approximate 59%.
Claims (5)
1, a kind of ceramic circuit board carrier film is characterized in that,
The metal film layer that has the carrier film body that constitutes by resin film and form at an interarea of described carrier film body,
Another interarea at described carrier film body forms ceramic circuit board.
2, ceramic circuit board carrier film as claimed in claim 1 is characterized in that,
Another interarea at described carrier film body forms release layer, forms ceramic circuit board on this release layer.
3, ceramic circuit board carrier film as claimed in claim 1 or 2 is characterized in that,
Described metal film layer is that principal component constitutes with Cu, Fe, Al and at least a alloy that contains in them.
4, a kind of processing method of ceramic circuit board is characterized in that,
To the ceramic circuit that on the described ceramic circuit board of claim 1 described another interarea of carrier film body, forms with carrier film, opposite sides surface irradiation laser from the surface supported by described carrier film body forms reach through hole on described ceramic circuit board.
5, a kind of manufacture method of electronic devices and components is characterized in that, comprises
In the operation of the described ceramic circuit board of claim 1 with another interarea formation ceramic circuit board of described carrier film body of carrier film,
From the surface irradiation laser of described ceramic circuit board and the opposition side surface of supporting by described carrier film body and described ceramic circuit board form reach through hole operation,
To the operation of described reach through hole filling electric conductivity paste and
The operation that described ceramic circuit board is stacked.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004320414A JP2006130724A (en) | 2004-11-04 | 2004-11-04 | Carrier film for ceramic green sheet, ceramic green sheet processing method using it and manufacturing method of electronic part |
| JP2004320414 | 2004-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1769021A true CN1769021A (en) | 2006-05-10 |
| CN100558219C CN100558219C (en) | 2009-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100528687A Active CN100558219C (en) | 2004-11-04 | 2005-02-24 | The manufacture method of electronic device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006130724A (en) |
| KR (1) | KR100721322B1 (en) |
| CN (1) | CN100558219C (en) |
| TW (1) | TWI257897B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492519A (en) * | 2017-08-07 | 2017-12-19 | 中国电子科技集团公司第二十九研究所 | A kind of preparation method of multilayer co-firing ceramic substrate high desnity metal through hole |
| CN111048295A (en) * | 2018-10-12 | 2020-04-21 | 三星电机株式会社 | Coil component |
| CN111430128A (en) * | 2015-06-24 | 2020-07-17 | 株式会社村田制作所 | Coil component |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5157350B2 (en) * | 2007-09-28 | 2013-03-06 | Ｔｄｋ株式会社 | Method for producing laminated film and laminated ceramic electronic component |
| KR20130051614A (en) * | 2011-11-10 | 2013-05-21 | 삼성전기주식회사 | Multilayered ceramic electronic component and manufacturing method thereof |
| JP6648690B2 (en) | 2016-12-28 | 2020-02-14 | 株式会社村田製作所 | Manufacturing method of multilayer electronic component and multilayer electronic component |
| JP6648689B2 (en) * | 2016-12-28 | 2020-02-14 | 株式会社村田製作所 | Manufacturing method of multilayer electronic component and multilayer electronic component |
| CN116583006A (en) * | 2017-12-27 | 2023-08-11 | 三井金属矿业株式会社 | Copper foil with carrier |
| JP7366551B2 (en) * | 2019-02-05 | 2023-10-23 | 新光電気工業株式会社 | Composite green sheet, ceramic member, method for manufacturing composite green sheet, and method for manufacturing ceramic member |
| KR20230152205A (en) | 2022-04-26 | 2023-11-03 | 주식회사 이엔플러스 | Manufacturing method of high heat dissipation carbon aerogel and cabon-ceramic composite sheet usint the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640535B2 (en) * | 1987-08-10 | 1994-05-25 | 株式会社村田製作所 | Method for manufacturing monolithic ceramic capacitor |
| JP2766173B2 (en) * | 1993-12-27 | 1998-06-18 | 太陽誘電株式会社 | Processing method of ceramic green sheet with film |
| US6736988B1 (en) * | 1999-11-04 | 2004-05-18 | Mitsubishi Gas Chemical Company, Inc. | Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board |
| JP3979027B2 (en) * | 2001-04-12 | 2007-09-19 | 株式会社村田製作所 | Manufacturing method of ceramic electronic component |
| JP2002347016A (en) * | 2001-05-22 | 2002-12-04 | Murata Mfg Co Ltd | Method and apparatus for working ceramic green sheet |
-
2004
- 2004-11-04 JP JP2004320414A patent/JP2006130724A/en active Pending
-
2005
- 2005-01-11 TW TW094100690A patent/TWI257897B/en active
- 2005-02-24 CN CNB2005100528687A patent/CN100558219C/en active Active
- 2005-02-28 KR KR1020050016761A patent/KR100721322B1/en active IP Right Grant
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111430128A (en) * | 2015-06-24 | 2020-07-17 | 株式会社村田制作所 | Coil component |
| CN107492519A (en) * | 2017-08-07 | 2017-12-19 | 中国电子科技集团公司第二十九研究所 | A kind of preparation method of multilayer co-firing ceramic substrate high desnity metal through hole |
| CN111048295A (en) * | 2018-10-12 | 2020-04-21 | 三星电机株式会社 | Coil component |
| CN111048295B (en) * | 2018-10-12 | 2023-07-25 | 三星电机株式会社 | Coil assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060043274A (en) | 2006-05-15 |
| TW200615135A (en) | 2006-05-16 |
| KR100721322B1 (en) | 2007-05-25 |
| JP2006130724A (en) | 2006-05-25 |
| CN100558219C (en) | 2009-11-04 |
| TWI257897B (en) | 2006-07-11 |
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