CN1758098A - Display modular and its sealing method - Google Patents
Display modular and its sealing method Download PDFInfo
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- CN1758098A CN1758098A CN 200410080945 CN200410080945A CN1758098A CN 1758098 A CN1758098 A CN 1758098A CN 200410080945 CN200410080945 CN 200410080945 CN 200410080945 A CN200410080945 A CN 200410080945A CN 1758098 A CN1758098 A CN 1758098A
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Abstract
This invention relates to a display module and its sealing method, among which, a display module includes a silicon liquid crystal panel and a circuit baseboard, a silicon baseboard of the panel has many first connecting points around it and an upper baseboard is set on the silicon baseboard to expose the first connecting points, which are the second connecting points coupling multiple welding lines to the circuit baseboard. This method includes: forming a buffer material on the side of the upper baseboard then forming a packaged colloid on the silicon and the circuit baseboards, in which, the colloid covers the first and second connecting points and wraps the weld lines, the Xiao hardness of the colloid is greater than that of the buffer material, then the colloid is cured.
Description
Technical field
The present invention relates to a kind of display module and processing procedure thereof, particularly relate to a kind of liquid crystal on silicon (liquidcrystal on silicon, LCOS) display module and glue sealing method thereof.
Background technology
In recent years, LCD is gradually towards full-colorization, large scale, high-res and trend development cheaply, wherein because the direct viewing type display still has many restrictions on large scale demonstration and cost, therefore the microreflection formula display panel that has high-res by silica-based liquid crystal panel etc., and collocation light engine (optical engine) comes into one's own gradually with liquid crystal projector and the back projection TV that reaches large scale and show.
Silica-based liquid crystal panel is the reflection type liquid crystal panel of a kind of framework on silicon substrate, it is to form golden oxygen partly to lead thin film transistor (TFT) (the thin film transistor that transistor (MOS transistor) replaces traditional display panels on silicon substrate, TFT), to control the liquid crystal layer of each pixel electrode (pixelelectrode) top.In addition,, therefore can reflect the light of extraneous incident because the pixel electrode of silica-based liquid crystal panel is a metal material, and the colored optical filtering substrates outgoing that makes light pass liquid crystal layer and its top, to reach the purpose of demonstration.In addition because silica-based liquid crystal panel be framework on silicon substrate, so have that volume is little, high-res etc. is better than the advantage of traditional direct viewing type display panel, and very meet the demand of large-sized Projection Display.
See also shown in Figure 1ly, be an existing known silica-based liquid crystal panel and the partial schematic diagram after a flexible circuit board engages.As shown in Figure 1, silica-based liquid crystal panel 110 normally by a silicon substrate 112, a glass substrate 114 and be disposed at silicon substrate 112 and glass substrate 114 between a liquid crystal layer 116 formed, wherein have a plurality of contacts 118 on the surface that silicon substrate 112 is not covered by glass substrate 114, and these contacts 118 are to be coupled to contact 122 on the flexible circuit board 120 by many bonding wires 130, that is routing joint (wire bonding), receive outside image signal to see through flexible circuit board 120.
Please consult shown in Figure 1ly again, known finishing after routing engages can form a packing colloid 140 usually on silicon substrate 112 and flexible circuit board 120, so that packing colloid 140 covers contacts 118 and contacts 122, and coat bonding wire 130.Afterwards, (ultraviolet, UV) irradiation packing colloid 140 is to solidify (curing) packing colloid 140 by ultraviolet ray again.Generally speaking, the fundamental purpose that forms this packing colloid 140 is being protected bonding wire 130, and bonding wire 130, contact 118 and contact 122 are isolated from the outside, and enters in silicon substrate 112 or the flexible circuit board 120 via contact 118 or contact 122 to avoid moisture.
Yet, known when cure package colloid 140, understand because of temperature variation usually, and in packing colloid 140, produce residual thermal stress.In addition, because the side of glass substrate 114 is directly to contact with packing colloid 140, therefore when being subjected to this residual thermal stress, glass substrate 114 does the time spent, the uneven thickness that can cause the liquid crystal layer 116 of stress area, and when showing, producing the lathe work of Newton ring (Newton ' sring), this will have a strong impact on the display quality of silica-based liquid crystal panel 110.
This shows that above-mentioned existing display module (module is module, below all be called module) and glue sealing method thereof obviously still have inconvenience and defective, and demand urgently further being improved in structure, method and use.In order to solve the existing problem of display module and glue sealing method thereof, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing display module and glue sealing method thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of display module and the glue sealing method thereof of founding a kind of new structure, can improve general existing display module and glue sealing method thereof, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing display module and glue sealing method thereof exist, and provide a kind of new display module and glue sealing method thereof, technical matters to be solved is to make it that a kind of display module is provided, in order to of the effect of reduction packing colloid to the issuable thermal stress of silica-based liquid crystal panel, and then the display quality of raising silica-based liquid crystal panel.
A further object of the present invention provides a kind of glue sealing method, in order to of the effect of reduction packing colloid to the issuable thermal stress of silica-based liquid crystal panel, and then the display quality of raising silica-based liquid crystal panel, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of display module according to the present invention's proposition, it comprises: a liquid crystal on silicon (liquid crystal onsilicon, LCOS) panel, have a viewing area and a perimeter circuit district, this silica-based liquid crystal panel comprises: a silicon substrate, have most first contacts, it is to be positioned at this perimeter circuit district; One upper substrate is disposed at the top of this silicon substrate, and makes those first contacts expose; One liquid crystal layer is disposed between this silicon substrate and this upper substrate; One circuit base plate is disposed at by this silica-based liquid crystal panel, and this circuit base plate has most second contacts; Most bar bonding wires are coupled between those first contacts and those second contacts; One packing colloid is disposed on this silicon substrate and this circuit base plate, and this packing colloid is to cover those first contacts and those second contacts, and coats those bonding wires; And a fender, be disposed between this upper substrate and this packing colloid, and the shore hardness value (Shorehardness) of this fender is the shore hardness value less than this packing colloid.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid display module, the shore hardness value of wherein said fender is less than 90.
Aforesaid display module, the shore hardness value of wherein said packing colloid is greater than 90.
Aforesaid display module, the material of wherein said fender comprises siliceous colloid.
Aforesaid display module, the material of wherein said packing colloid comprises epoxy resin.
Aforesaid display module, wherein said circuit base plate comprises printed circuit board (PCB) or flexible circuit board.
Aforesaid display module, wherein said upper substrate is a transparency carrier.
Aforesaid display module, the material of wherein said upper substrate comprises glass.
Aforesaid display module, wherein said silica-based liquid crystal panel more comprise a frame glue, and it is to be disposed between this upper substrate and this silicon substrate around this liquid crystal layer.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of display module that the present invention proposes, it comprises: a liquid crystal panel; One circuit base plate couples this liquid crystal panel; One packing colloid is in order to cover this liquid crystal panel and this circuit base plate one couples the place; And a fender, be disposed between this liquid crystal panel and this packing colloid.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid display module, the shore hardness value of wherein said fender are the shore hardness values less than this packing colloid.
Aforesaid display module, wherein said liquid crystal panel are to be silica-based liquid crystal panel.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of display that the present invention proposes, it comprises as the 10th described display module of claim.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of glue sealing method according to the present invention's proposition, be applicable to the connection process of a silica-based liquid crystal panel and a circuit base plate, wherein the periphery of a silicon substrate of this silica-based liquid crystal panel has most first contacts, and this silicon substrate top is to dispose a upper substrate, it is to make those first contacts expose, and those first contacts are to be coupled to most second contacts on this circuit base plate by most bar bonding wires, and it comprises: form the side of a fender in this upper substrate; Form a packing colloid on this silicon substrate and this circuit base plate, wherein this packing colloid is to cover those first contacts and those second contacts, and coats those bonding wires, and the shore hardness value of this packing colloid is the shore hardness value greater than this fender; And solidify this packing colloid.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid glue sealing method, wherein after forming this fender, and before forming this packing colloid, it more comprises this fender is toasted.
Aforesaid glue sealing method, the mode of solidifying this packing colloid comprises ultraviolet curing.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of glue sealing method that the present invention proposes, be applicable to the connection process of a liquid crystal panel and a circuit base plate, it comprises: form the side of a fender in this liquid crystal panel; Form a packing colloid and couple the place in one of this liquid crystal panel and this circuit base plate, wherein this fender is between this liquid crystal panel and this packing colloid; And solidify this packing colloid.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid glue sealing method, it more comprises this fender is toasted.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid glue sealing method, the mode of solidifying this packing colloid is with ultraviolet curing.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present invention thes contents are as follows:
The present invention proposes a kind of display module, and it is made of a silica-based liquid crystal panel, a circuit base plate, many bonding wires, a fender and packing colloids.Silica-based liquid crystal panel for example has a viewing area and a perimeter circuit district, and silica-based liquid crystal panel comprise a silicon substrate, a upper substrate and be disposed at silicon substrate and upper substrate between a liquid crystal layer, wherein silicon substrate for example has a plurality of first contacts, it is to be positioned at the perimeter circuit district, and upper substrate is to be disposed in the viewing area of silicon substrate top, and the contact of winning is exposed.In addition, circuit base plate is to be disposed at by the display panel, and circuit base plate has a plurality of second contacts, and bonding wire is to be coupled between first contact and second contact.In addition, packing colloid is to be disposed on silicon substrate and the circuit base plate, and packing colloid is to cover first contact and second contact, and coating bonding wire, and fender is to be disposed between upper substrate and the packing colloid, and the shore hardness value of fender (Shore hardness) is the shore hardness value less than packing colloid.
The present invention more proposes a kind of display module, and it is made of a liquid crystal panel, a circuit base plate, a fender and a packing colloid.Wherein, packing colloid is in order to covering this liquid crystal panel and this circuit base plate one couples the place, and fender is disposed between this liquid crystal panel and this packing colloid.
The present invention more proposes a kind of display, and it is to comprise above-mentioned display module.
In a preferred embodiment of the present invention, the shore hardness value of above-mentioned fender for example is less than 90, and the shore hardness value of packing colloid for example is greater than 90.In addition, the material of fender for example is the colloid of siliceous (silicon), and the material of packing colloid for example is epoxy resin (epoxy resin).
In a preferred embodiment of the present invention, above-mentioned circuit base plate for example is printed circuit board (PCB) or flexible circuit board.In addition, upper substrate for example is a transparency carrier, and its material for example is a glass.In addition, above-mentioned silica-based liquid crystal panel for example more comprises a frame glue (sealant), and it is to be disposed between upper substrate and the silicon substrate around liquid crystal layer.
The present invention more proposes a kind of glue sealing method, it is applicable to the connection process of a silica-based liquid crystal panel and a circuit base plate, wherein the periphery of a silicon substrate of silica-based liquid crystal panel for example has a plurality of first contacts, and the silicon substrate top is to dispose a upper substrate, it is that the contact of winning is exposed, and first contact is to be coupled to a plurality of second contacts on the circuit base plate by many bonding wires.At first, form the side of a fender in upper substrate.Then, form a packing colloid on silicon substrate and circuit base plate, wherein packing colloid is to cover first contact and second contact, and coats bonding wire, and the shore hardness value of packing colloid is the shore hardness value greater than fender.Afterwards, cure package colloid.
The present invention more proposes a kind of glue sealing method, and it is applicable to the connection process of a liquid crystal panel and a circuit base plate.Form the side of a fender in liquid crystal panel.Form a packing colloid and couple the place in one of this liquid crystal panel and this circuit base plate, wherein this fender is between this liquid crystal panel and this packing colloid.And, solidify this packing colloid.
In a preferred embodiment of the present invention, above-mentioned glue sealing method and before forming packing colloid, for example more comprises fender is toasted after forming fender.In addition, the mode of above-mentioned cure package colloid for example is ultraviolet curing.
Based on above-mentioned, display module of the present invention and glue sealing method thereof are configuration one fenders between the upper substrate of packing colloid and silica-based liquid crystal panel, and the shore hardness value of fender is the shore hardness value less than packing colloid, and the effect of buffering is provided with the thermal stress that packing colloid inside is produced.Thus, can effectively reduce the thermal stress effect that upper substrate may be subjected to, and reduce the corresponding Newton ring that produces on the silica-based liquid crystal panel, and then improve display quality and process rate.
Via as can be known above-mentioned, the invention relates to a kind of display module and glue sealing method thereof, wherein a display module comprises a silica-based liquid crystal panel and a circuit base plate, the periphery of one silicon substrate of silica-based liquid crystal panel has a plurality of first contacts, and the silicon substrate top is to dispose a upper substrate, it is that the contact of winning is exposed, and first contact is to be coupled to a plurality of second contacts on the circuit base plate by many bonding wires.This glue sealing method at first forms the side of a fender in upper substrate, then form a packing colloid on silicon substrate and circuit base plate, wherein packing colloid is to cover first contact and second contact, and coats bonding wire, and the shore hardness value of packing colloid is the shore hardness value greater than fender.Afterwards, cure package colloid.This display module and glue sealing method thereof help to reduce the effect of packing colloid to the issuable thermal stress of silica-based liquid crystal panel.
By technique scheme, display module of the present invention and glue sealing method thereof have following advantage at least: the present invention is before forming packing colloid, form a fender in the side of the upper substrate of silica-based liquid crystal panel in advance, wherein the shore hardness value of this fender is the shore hardness value less than packing colloid.Be different from the existing known packing colloid that only uses single material, fender of the present invention can provide the effect of buffering to the thermal stress that packing colloid inside produces, and can reduce the thermal stress effect that upper substrate may be subjected to.Therefore, issuable Newton ring in the time of can effectively reducing silica-based liquid crystal panel and show by display module of the present invention and glue sealing method thereof, and then can improve the process rate of the display quality and the display module of silica-based liquid crystal panel.
In sum, display module of the present invention and glue sealing method thereof provide a kind of display module, can reduce the effect of packing colloid to the issuable thermal stress of silica-based liquid crystal panel, and then can improve the display quality of silica-based liquid crystal panel.The present invention simultaneously also provides a kind of glue sealing method, can reduce the effect of packing colloid to the issuable thermal stress of silica-based liquid crystal panel, and then can improve the display quality of silica-based liquid crystal panel.It has above-mentioned many advantages and practical value, and in like product and method, do not see have similar structural design and method to publish or use and really genus innovation, no matter it all has bigger improvement on product structure, method or function, have large improvement technically, and produced handy and practical effect, and more existing display module and glue sealing method thereof have the multinomial effect of enhancement, thereby are suitable for practicality more, really are a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by a preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the partial schematic diagram after having a known silica-based liquid crystal panel now and a flexible circuit board engaging.
Fig. 2 is the preceding synoptic diagram of joint of a kind of display module of the present invention.
Fig. 3 A is the synoptic diagram after the display module of Fig. 2 engages.
Fig. 3 B is the part sectioned view of the display module of Fig. 3 A along the A section.
Fig. 4 is the process flow diagram of a kind of glue sealing method of preferred embodiment of the present invention.
110: silica-based liquid crystal panel 112: silicon substrate
114: glass substrate 116: liquid crystal layer
118,122: contact 120: flexible circuit board
130: bonding wire 140: packing colloid
200: display module 210: silica-based liquid crystal panel
210a: viewing area 210b: perimeter circuit district
211: frame glue 212: silicon substrate
214: upper substrate 214a: the upper substrate side
216: liquid crystal layer 218,222: contact
220: circuit base plate 220a: opening
230: bonding wire 240: packing colloid
250: fender
Step 402: the side at the upper substrate of silica-based liquid crystal panel forms fender
Step 404: fender is toasted
Step 406: on silicon substrate and circuit base plate, form packing colloid
Step 408: cure package colloid
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to display module and its embodiment of glue sealing method, structure, method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Seeing also shown in Figure 2ly, is the synoptic diagram before the joint of a kind of display module of the present invention.As shown in Figure 2, display module 200 is made of a silica-based liquid crystal panel 210 and a circuit base plate 220, and wherein circuit base plate 220 for example is a flexible circuit board, and for example has an opening 220a on the circuit base plate 220.Certainly, in other embodiments, above-mentioned circuit base plate 220 can also be printed circuit board (PCB) (printed circuit board, PCB) or the carrier of other types.In addition, the perimeter circuit district 210b that silica-based liquid crystal panel 210 for example has a viewing area 210a and is positioned at 210a periphery, viewing area, wherein be to dispose a plurality of contacts 218 in the perimeter circuit district 210b, and the other also correspondence of the opening 220a of circuit base plate 220 have a plurality of contacts 222.
See also shown in Fig. 3 A and the 3B, wherein Fig. 3 A is the synoptic diagram after the display module 200 of Fig. 2 engages, and Fig. 3 B is the part sectioned view of the display module 200 of Fig. 3 A along the A section.Silica-based liquid crystal panel 210 is made of a silicon substrate 212, a upper substrate 214 and a liquid crystal layer 216, wherein above-mentioned contact 218 is to be positioned on the silicon substrate 212, and silicon substrate 212 is to be bonded with each other by a frame glue 211 with upper substrate 214, and liquid crystal layer 216 is to be filled in the space that silicon substrate 212, upper substrate 214 and frame glue 211 surrounded.In addition, for example be formed with a plurality of dot structure (not shown) on the silicon substrate 212, in order to the liquid crystal molecule in the liquid crystal layer 216 that drives the top.In addition, upper substrate 214 for example is a transparent substrates, and its material for example is a glass, in order to allowing that external light source enters in the silica-based liquid crystal panel 210, and external light source reflects on silicon substrate 212, and by after the liquid crystal layer 216, will be again by upper substrate 214 outgoing, to reach the purpose of show image.
Please consult shown in Fig. 3 A and the 3B again, silica-based liquid crystal panel 210 is to be disposed in the opening 220a (as shown in Figure 2) of circuit base plate 220, and the contact on the silica-based liquid crystal panel 210 218 is to be coupled to contact 222 on the circuit base plate 220 by many bonding wires 230, and the method that wherein disposes these bonding wires 230 for example is that routing engages.In addition, be to dispose a packing colloid 240 on silicon substrate 212 and the circuit base plate 220, it is to cover the contact 218 of silicon substrate 212 and the contact 222 of circuit base plate 220, and coats bonding wire 230, and the material of this packing colloid 240 for example is an epoxy resin.Wherein, the major function of packing colloid 240 is at protection bonding wire 230; and bonding wire 230, contact 218 and contact 222 are isolated from the outside; avoiding extraneous moisture to enter in silicon substrate 212 or the circuit base plate 220, and cause the internal wiring of silicon substrate 212 or circuit base plate 220 lost efficacy (defect) via contact 218 or contact 222.
Please consult shown in Fig. 3 A and the 3B again, the present invention reduces the effect of the thermal stress of packing colloid 240 generations to the upper substrate 214 of silica-based liquid crystal panel 210, be upper substrate 214 corresponding to the side 214a of bonding wire 230 and packing colloid 240 between configuration one fender 250, its material for example is siliceous colloid, and the shore hardness value of this fender 250 is the shore hardness values less than packing colloid 240.In a preferred embodiment, the shore hardness value of fender 250 for example is less than 90, and the shore hardness value of packing colloid 240 for example is greater than 90.Because the material of fender 250 is softer, therefore the effect of buffering can be provided the thermal stress that packing colloid 240 is produced by this fender 250, produce the phenomenon of Newton ring when avoiding silica-based liquid crystal panel 210 to show in a side of contiguous packing colloid 240.
For clearer announcement feature of the present invention, hereinafter the general is illustrated at a kind of glue sealing method of above-mentioned display module again.See also shown in Figure 4ly, be the process flow diagram of a kind of glue sealing method of preferred embodiment of the present invention, wherein silica-based liquid crystal panel is coupled to circuit base plate by the routing joining technique.
Glue sealing method of the present invention at first is to form fender (step 402) in the side of the upper substrate of silica-based liquid crystal panel, and wherein this fender is to select the material of shore hardness value less than packing colloid for use.Then, fender is toasted (step 404), wherein Hong Kao time for example is two hours, and baking temperature for example is 60 ℃, so that the fender moulding, wherein, this step also can be omitted, but required standing time can be long.Then, form packing colloid (step 406) on silicon substrate and circuit base plate, wherein packing colloid is the contact that covers on upper substrate and the circuit base plate, and coats bonding wire, and the material of packing colloid for example is an epoxy resin.Afterwards, cure package colloid (step 408), and finish manufacture procedure of adhesive of the present invention.In one embodiment, the method for solidifying this packing colloid for example is with ultraviolet ray irradiation packing colloid.Certainly, in other embodiments, the method for cure package colloid also comprises that high-temperature baking or other have the knack of the known technology of this operator.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (19)
1, a kind of display module is characterized in that it comprises:
One liquid crystal on silicon (liquid crystal on silicon, LCOS) panel have a viewing area and a perimeter circuit district, and this silica-based liquid crystal panel comprises:
One silicon substrate has most first contacts, and it is to be positioned at this perimeter circuit district;
One upper substrate is disposed at the top of this silicon substrate, and makes those first contacts expose;
One liquid crystal layer is disposed between this silicon substrate and this upper substrate;
One circuit base plate is disposed at by this silica-based liquid crystal panel, and this circuit base plate has most second contacts;
Most bar bonding wires are coupled between those first contacts and those second contacts;
One packing colloid is disposed on this silicon substrate and this circuit base plate, and this packing colloid is to cover those first contacts and those second contacts, and coats those bonding wires; And
One fender is disposed between this upper substrate and this packing colloid, and the shore hardness value of this fender (Shore hardness) is the shore hardness value less than this packing colloid.
2, display module according to claim 1 is characterized in that the shore hardness value of wherein said fender is less than 90.
3, display module according to claim 1 is characterized in that the shore hardness value of wherein said packing colloid is greater than 90.
4, display module according to claim 1 is characterized in that the material of wherein said fender comprises siliceous colloid.
5, display module according to claim 1 is characterized in that the material of wherein said packing colloid comprises epoxy resin.
6, display module according to claim 1 is characterized in that wherein said circuit base plate comprises printed circuit board (PCB) or flexible circuit board.
7, display module according to claim 1 is characterized in that wherein said upper substrate is a transparency carrier.
8, display module according to claim 1 is characterized in that the material of wherein said upper substrate comprises glass.
9, display module according to claim 1 is characterized in that wherein said silica-based liquid crystal panel more comprises a frame glue, and it is to be disposed between this upper substrate and this silicon substrate around this liquid crystal layer.
10, a kind of display module is characterized in that it comprises:
One liquid crystal panel;
One circuit base plate couples this liquid crystal panel;
One packing colloid is in order to cover this liquid crystal panel and this circuit base plate one couples the place; And
One fender is disposed between this liquid crystal panel and this packing colloid.
11, display module according to claim 10, the shore hardness value that it is characterized in that wherein said fender are the shore hardness values less than this packing colloid.
12, display module according to claim 10 is characterized in that wherein said liquid crystal panel is to be silica-based liquid crystal panel.
13, a kind of display is characterized in that it comprises as the 10th described display module of claim.
14, a kind of glue sealing method, be applicable to the connection process of a silica-based liquid crystal panel and a circuit base plate, wherein the periphery of a silicon substrate of this silica-based liquid crystal panel has most first contacts, and this silicon substrate top is to dispose a upper substrate, it is to make those first contacts expose, and those first contacts are to be coupled to most second contacts on this circuit base plate by most bar bonding wires, it is characterized in that it comprises:
Form the side of a fender in this upper substrate;
Form a packing colloid on this silicon substrate and this circuit base plate, wherein this packing colloid is to cover those first contacts and those second contacts, and coats those bonding wires, and the shore hardness value of this packing colloid is the shore hardness value greater than this fender; And
Solidify this packing colloid.
15, glue sealing method according to claim 14 wherein after forming this fender, and before forming this packing colloid, is characterized in that it more comprises this fender is toasted.
16, glue sealing method according to claim 14 is characterized in that the mode of solidifying this packing colloid comprises ultraviolet curing.
17, a kind of glue sealing method is applicable to the connection process of a liquid crystal panel and a circuit base plate to it is characterized in that it comprises;
Form the side of a fender in this liquid crystal panel;
Form a packing colloid and couple the place in one of this liquid crystal panel and this circuit base plate, wherein this fender is between this liquid crystal panel and this packing colloid; And
Solidify this packing colloid.
18, glue sealing method according to claim 17 is characterized in that it more comprises this fender is toasted.
19, glue sealing method according to claim 17, the mode that it is characterized in that solidifying this packing colloid is with ultraviolet curing.
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| CNB2004100809455A CN100378524C (en) | 2004-10-10 | 2004-10-10 | Display modular and its sealing method |
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| CNB2004100809455A CN100378524C (en) | 2004-10-10 | 2004-10-10 | Display modular and its sealing method |
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| CN101930700A (en) * | 2009-06-18 | 2010-12-29 | 立景光电股份有限公司 | Display module |
| WO2015010387A1 (en) * | 2013-07-26 | 2015-01-29 | 北京京东方光电科技有限公司 | Substrate and manufacturing method therefor, and display device |
| CN104809960A (en) * | 2009-10-16 | 2015-07-29 | 迪睿合电子材料有限公司 | Display device and manufacturing method thereof, as well as transparent resin filler |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930700A (en) * | 2009-06-18 | 2010-12-29 | 立景光电股份有限公司 | Display module |
| CN104809960A (en) * | 2009-10-16 | 2015-07-29 | 迪睿合电子材料有限公司 | Display device and manufacturing method thereof, as well as transparent resin filler |
| WO2015010387A1 (en) * | 2013-07-26 | 2015-01-29 | 北京京东方光电科技有限公司 | Substrate and manufacturing method therefor, and display device |
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| Publication number | Publication date |
|---|---|
| CN100378524C (en) | 2008-04-02 |
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