CN1755497A - Method and system for packaging a display - Google Patents

Abstract

A package structure 800 and method of packaging for an interferometric modulator 830 is described. A transparent substrate 810 having an interferometric modulator 830 formed thereon is shown. A backplane 820 is joined to the transparent substrate 810 with a seal 840 where the interferometric modulator is exposed to the surrounding environment through an opening 850 in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure 800.

Description

Be used to encapsulate the method and system of a display

Technical field

Technical field of the present invention relates to MEMS (micro electro mechanical system) (MEMS) and to the encapsulation of this kind system.More specifically, technical field of the present invention relates to the method that interferometric modulator reaches this kind of making modulator under environmental baseline.

Background technology

MEMS (micro electro mechanical system) (MEMS) comprises micromechanical component, driver and electronic component.Micromechanical component can adopt deposition, etching or other several portions that can etch away substrate and/or institute's deposited material layer maybe can add several layers and make with the micromachined technology that forms electricity and electromechanical assembly.One type MEMS device is called as interferometric modulator.Term interferometric modulator used herein or interferometric light modulator are meant that a kind of use principle of optical interference optionally absorbs and/or catoptrical device.In certain embodiments, interferometric modulator can comprise the pair of conductive plate, one of them or the two all can be transparent whole or in part and/or be reflectivity, and can relative motion when applying a suitable electric signal.In one embodiment, one of them plate can comprise a quiescent layer that is deposited on the substrate, and another plate can comprise a metal partion (metp) that separates by an air gap and this quiescent layer.Be described in more detail as this paper, one of them plate can change the optical interference that is incident in the light on the interferometric modulator with respect to the position of another plate.Said apparatus is with a wide range of applications, and in this technology, utilizes and/or revises the characteristic of these types of devices so that its performance can be used for improving existing product and makes still undeveloped at present new product will be rather useful.

Summary of the invention

System of the present invention, method and device all have many aspects, and arbitrary single aspect all can not determine its desired characteristic separately.Now, its main characteristic is carried out brief discussion, this not delimit the scope of the invention.Checking this explanation, especially reading title for after the part of " embodiment ", how people provides the advantage that is better than other display device if can understanding device of the present invention.

Embodiment described herein provides a kind of encapsulating structure and a kind of method of making an encapsulating structure under environmental baseline.One embodiment of the invention are methods of a kind of manufacturing one display device, and it comprises: the transparent substrates that is formed with an interferometric modulator above is provided; Reach by apply a seal between a backboard and described transparent substrates described backboard is engaged to described transparent substrates to form an encapsulation, wherein said interferometric modulator has at least one perforate by described package encapsulation envelope and described encapsulation.

Another embodiment of the present invention is a kind of display device of making by the following method: the transparent substrates that is formed with an interferometric modulator above is provided; Reach by apply a seal between a backboard and described transparent substrates described backboard is engaged to described transparent substrates to form an encapsulation, wherein said interferometric modulator has at least one perforate by described package encapsulation envelope and described encapsulation.

Another embodiment is a kind of device based on MEMS (micro electro mechanical system), and it comprises: the transmission member that is used for transmitted light; Be used for the modulation member that the light of described transmission member is modulated is passed in transmission; Be used to cover the covering member of described modulation member; And be used for described covering member is engaged to described transmission member forming the containment member of an encapsulation, and wherein said covering member or described containment member comprise the perforate once sealing.

An embodiment is a kind of device based on MEMS (micro electro mechanical system) again, and it comprises: the transparent substrates that is formed with a microelectromechanicdevices devices above; One backboard; And a seal, described seal is configured to described backboard is engaged to described transparent substrates described microelectromechanicdevices devices is encapsulated in the encapsulation, and wherein said backboard or seal have the perforate of a sealing.

Also an embodiment is a kind of method of manufacturing one display device, and it comprises: the transparent substrates that is formed with a microelectromechanicdevices devices above is provided; By use a seal between a backboard and described transparent substrates described backboard is engaged to described transparent substrates to form an encapsulation, wherein said microelectromechanicdevices devices has at least one perforate by described package encapsulation envelope and described encapsulation; And reduce moisture in the described encapsulation by in described encapsulation, introduce a gas through described at least one perforate.

Another embodiment is a kind of display device of making by the following method: the transparent substrates that is formed with a microelectromechanicdevices devices above is provided; By use a seal between a backboard and described transparent substrates described backboard is engaged to described transparent substrates to form an encapsulation, wherein said microelectromechanicdevices devices has at least one perforate by described package encapsulation envelope and described encapsulation; And reduce moisture in the described encapsulation by in described encapsulation, introduce a gas through described at least one perforate.

Another embodiment is a kind of display device, and it comprises: the transmission member that is used for transmitted light; Be used for the modulation member that the light of described transmission member is modulated is passed in transmission; Be used to cover the covering member of described modulation member; And be used for described backboard is engaged to described transparent substrates described microelectromechanicdevices devices is encapsulated in the containment member in the encapsulation, wherein said encapsulation has at least one end envelope, and wherein, described at least one end envelope is configured to allow the gas stream mistake before described at least one the end envelope of sealing for removing the moisture in the described encapsulation.

An embodiment is a kind of device based on MEMS (micro electro mechanical system) again, and it comprises: the transparent substrates that is formed with a microelectromechanicdevices devices above; One backboard; An and seal, described seal is engaged to described transparent substrates described microelectromechanicdevices devices is encapsulated in the encapsulation with described backboard, wherein said seal puts between described backboard and the described transparent substrates and described encapsulation has at least one end envelope, wherein, described at least one end envelope is configured to allow the gas stream mistake before described at least one the end envelope of sealing for removing the moisture in the described encapsulation.

Description of drawings

According to hereinafter explanation and accompanying drawing (not drawn on scale), will easily know these and other aspect of the present invention, these accompanying drawings are intended to illustration and non-limiting the present invention, in the accompanying drawing:

Fig. 1 is first-class axle figure, it shows the part of an embodiment of an interferometric modulator display, wherein one of one first interferometric modulator removable reflection horizon is in an off-position, and a removable reflection horizon of one second interferometric modulator is in an excited target position.

Fig. 2 is a system block diagram, and it shows that one comprises an embodiment of the electronic installation of one 3 * 3 interferometric modulator displays.

Fig. 3 is the removable mirror position of an exemplary embodiment of interferometric modulator shown in Figure 1 and the graph of a relation of the voltage that applies.

Fig. 4 is one group of synoptic diagram that can be used for driving the row and column voltage of interferometric modulator display.

Fig. 5 A is presented at an exemplary frame of display data in 3 * 3 interferometric modulator displays shown in Figure 2.

Fig. 5 B demonstration can be used for writing the capable signal of frame shown in Fig. 5 A and an exemplary sequential chart of column signal.

Fig. 6 A and 6B are the system block diagrams of an embodiment of demonstration one display device.

Fig. 7 A is the sectional view of a device shown in Figure 1.

Fig. 7 B is a sectional view of an alternate embodiment of an interferometric modulator.

Fig. 7 C is a sectional view of another alternate embodiment of an interferometric modulator.

Fig. 8 is the sectional view of a basic encapsulating structure.

Fig. 9 A is one according to a sectional view of encapsulating structure that has the embodiment of perforate in backboard.

Fig. 9 B is one according to a sectional view of encapsulating structure that has the embodiment of perforate in peripheral seal.

Fig. 9 C is the plan view from above of encapsulating structure shown in Fig. 9 B.

Fig. 9 D is a plan view from above according to the backboard with perforate of an embodiment.

Fig. 9 E one has the sectional view of the encapsulating structure of perforate in backboard.

Fig. 9 F is a plan view from above with perforate according to another embodiment.

Fig. 9 G is a plan view from above according to the backboard with perforate of another embodiment.

Figure 10 one has perforate and have the sectional view of encapsulating structure of the embodiment of drying agent in encapsulation according to one in backboard.

Figure 11 A-11B is for showing the synoptic diagram that removes the process of water vapour according to an embodiment in encapsulation.

Figure 11 C is the plan view from above of Figure 11 B illustrated embodiment.

Figure 12 is a demonstration removes the process of water vapour in encapsulation according to another embodiment a synoptic diagram.

Figure 13 is a demonstration removes the process of water vapour in encapsulation according to another embodiment a synoptic diagram.

Figure 14 is that a demonstration is according to the synoptic diagram that removes the process of water vapour during an embodiment encapsulates certainly again.

Figure 15 is a demonstration removes the process of water vapour in encapsulation according to another embodiment a synoptic diagram.

Figure 16 A-16C is a demonstration removes the process of water vapour in encapsulation according to another embodiment a synoptic diagram.

Figure 17 A one shows the synoptic diagram of the process that perforate is sealed according to an embodiment.

Figure 17 B is the plan view from above of Figure 17 A illustrated embodiment before perforate is sealed.

Figure 18 A and 18B are system block diagrams, and it shows that one comprises an embodiment of the visual display unit of a plurality of interferometric modulators.

Embodiment

Hereinafter explanation is at some embodiments of the invention.But, the present invention can implement by being permitted different ways.In this explanation, can be with reference to accompanying drawing, in the accompanying drawings, identical parts use identical number-mark from start to finish.Find out easily that according to following explanation the present invention can implement in arbitrary configuration is used for the device of display image (no matter no matter is dynamic image (for example video) or still image (for example rest image), be character image or picture also).More specifically, the present invention can implement in inferior numerous kinds of electronic installations or is associated with these electronic installations for example (but being not limited to): mobile phone, wireless device, personal digital assistant (PDA), handheld computer or portable computer, gps receiver/omniselector, camera, the MP3 player, video camera, game machine, wrist-watch, clock, counter, TV monitor, flat-panel monitor, computer monitor, automotive displays (for example mileometer display etc.), driving cabin control device and/or display, video camera scenery display (for example rear view camera display of vehicle), electronic photo, electronics billboard or label, projector, building structure, packing and aesthetic structures (for example image display of a jewelry).The MEMS device that has similar structures with MEMS device described herein also can be used for non-display application, for example is used for electronic switching device.

Show an interferometric modulator display embodiment who contains an interfere type MEMS display element among Fig. 1.In these devices, pixel is in bright state or dark state.Under bright (" on (opening) " or " open (opening) ") state, display element reflexes to the user with most of incident visible light.Be in dark (" closing (off) " or " closed (closing) ") state following time, display element reflects the incident visible light to the user hardly.Decide on different embodiment, can put upside down the light reflectance properties that " on " reaches " off " state.The MEMS pixel can be configured to mainly reflect under selected color, also can realize colored the demonstration except that black and white.

Fig. 1 is first-class axle figure, and it shows two adjacent pixels in a series of pixels of a visual displays, and wherein each pixel comprises a MEMS interferometric modulator.In certain embodiments, an interferometric modulator display comprises a row/column array that is made of these interferometric modulators.Each interferometric modulator comprises a pair of reflection horizon, and this is positioned to each other to have a variable-sized optical resonance cavity at a distance of a variable and controlled distance at least to form one to the reflection horizon.In one embodiment, one of them reflection horizon can be moved between the two positions.Be referred to herein as on the primary importance of relaxed state, the local reflex layer that the position of this displaceable layers distance one is fixed is far away relatively.On the second place, the position of this displaceable layers is more closely near this local reflex layer.Decide position according to removable reflection horizon, from the incident light of this two layers reflection can with mutually long or mutually the mode of disappearing interfere, thereby form the mass reflex or the non-reflective state of each pixel.

The pixel array portion that shows in Fig. 1 comprises two adjacent interferometric modulator 12a and 12b.In the interferometric modulator 12a in left side, demonstration one movably high reflection layer 14a is in a relaxation position, and this relaxation position is apart from fixing local reflex layer 16a one preset distance.In the interferometric modulator 12b on right side, demonstration one movably high reflection layer 14b is in an excited target position, and this excited target position is near fixing local reflex layer 16b.

Fixed bed 16a, 16b conduct electricity, the part is transparent and local is reflectivity, and can the layer of one or more respectively do for oneself chromium and tin indium oxides be made by for example depositing on a transparent substrates 20.Described each layer is patterned into parallel band, and can form the column electrode in the display device, as further specifying hereinafter.Displaceable layers 14a, 14b can form by one or more depositing metal layers that is deposited on pillar 18 tops (and column electrode 16a, 16b quadrature) and and be deposited on the series of parallel band that the middle expendable material between the pillar 18 constitutes.After expendable material was etched, these deformable metal level 14a, 14b and the metal level of fixing separated by an air gap 19 of stipulating.These deformable layer can use one to have high conductivity and reflexive material (for example aluminium), and those bands can form the row electrode in the display device.

When not applying voltage, cavity 19 remains between a layer 14a, the 16a, and deformable layer is in the mechanical relaxed state shown in pixel 12a among Fig. 1.Yet after a selected row and column applies potential difference (PD), the capacitor that forms at the respective pixel place of described row and column electrode intersection is recharged, and electrostatic force pulls to these electrodes together.If voltage is enough high, then displaceable layers generation deformation, and be forced on the fixed bed (can on fixed bed, deposit a dielectric material (not shown in this Figure), preventing short circuit, and the control separation distance), shown in the pixel 12b on right side among Fig. 1.Regardless of the potential difference (PD) polarity that is applied, the behavior is all identical.This shows, may command reflection and row/row of non-reflective pixel state encourage to traditional LCD and other display techniques in used row/row encourage similar in many aspects.

Fig. 2 to Fig. 5 B shows the example process and the system that use an interferometric modulator array in a display application.

Fig. 2 is a system block diagram, and this figure shows that one can embody an embodiment of the electronic installation of each side of the present invention.In this exemplary embodiment, described electronic installation comprises a processor 21-, and it can be any general purpose single-chip or multicore sheet microprocessor, for example ARM, Pentium , Pentium II , Pentium III , Pentium IV , Pentium  Pro, 8051, MIPS , Power PC , ALPHA , or any special microprocessor, for example digital signal processor, microcontroller or programmable gate array.According to convention in the industry, processor 21 can be configured to carry out one or more software modules.Except that carrying out an operating system, also this processor can be configured to carry out one or more software applications, comprise web browser, telephony application, e-mail program or any other software application.

In one embodiment, processor 21 also is configured to communicate with an array controller 22.In one embodiment, array control unit 22 comprises a horizontal drive circuit 24 and the column drive circuit 26 that signal is provided to an array of display or panel 30.Array sectional view shown in Fig. 1 illustrates with line 1-1 in Fig. 2.For the MEMS interferometric modulator, described row/row excitation protocol can utilize the hysteresis property of these devices shown in Figure 3.It for example may need, and one 10 volts potential difference (PD) makes a displaceable layers be deformed into actuated state from relaxed state.Yet, when described voltage when this value reduces, reduce when being back to below 10 volts at described voltage, described displaceable layers will keep its state.In the exemplary embodiment of Fig. 3, before voltage drop was low to moderate below 2 volts, displaceable layers is relaxation fully not.Therefore, in example shown in Figure 3, exist one to be approximately the voltage range that 3-7 lies prostrate, exist one to apply voltage window in this voltage range, described device is stabilized in relaxation or actuated state in this window.Be referred to as " lag windwo " or " stability window " in this article.For an array of display with hysteresis characteristic shown in Figure 3, OK/the row excitation protocol can be designed to be expert at during the gating, the pixel that is energized is applied about 10 a volts voltage difference to selected in current, and to d/d pixel being applied one near 0 volt voltage difference.After gating, it is poor to apply about 5 a volts steady state voltage to pixel, and gating makes its residing any state so that its maintenance is expert at.After being written into, in this example, each pixel is all born one and is in " stability window " interior potential difference (PD) that 3-7 lies prostrate.This characteristic makes pixel design shown in Figure 1 be stabilized in an existing foment or a relaxed state under identical the voltage conditions that applies.Because each pixel of interferometric modulator, no matter be in foment or relaxed state, in fact all be one by described fixed reflector and capacitor that mobile reflection horizon constituted, therefore, this steady state (SS) can be kept under the voltage in the lag windwo and consumed power hardly.If the current potential that is applied is constant, then there is not electric current to flow into pixel basically.

In the typical case uses, can be by determining that according to one group of desired actuated pixels in first row one group of row electrode forms a display frame.After this, a horizontal pulse is put on the electrode of the 1st row, thereby encourage the pixel corresponding with determined alignment.After this, determined one group of row electrode is become corresponding with desired one group of actuated pixels in second row.After this, with a pulse put on the 2nd the row electrode, thereby according to determined row electrode encourage the 2nd the row in respective pixel.The pixel of the 1st row is not subjected to the influence of the pulse of the 2nd row, thereby the state that keeps it to set at the impulse duration of the 1st row.The property mode repeats above-mentioned steps to the row of whole series in order, to form described frame.Usually, repeating this process continuously by the speed with a certain desired frame number/second to refresh and/or upgrade these frames with new video data.Also have a variety of row and the row electrodes that are used to drive pel array also to be known, and can use with the present invention by people with the agreement that forms display frame.

Fig. 4,5A and Fig. 5 B show a kind of possible excitation protocol that is used for forming a display frame on 3 * 3 arrays shown in Figure 2.Fig. 4 shows one group of possible row and column voltage level of can be used for having the pixel of hysteresis curve shown in Figure 3.In the embodiment of Fig. 4, encourage a pixel to comprise and be set to-V being listed as accordingly _Bias, and will go accordingly and be set to+Δ V, it can correspond respectively to-5 volts and+5 volts.Discharging pixel then is to be set to+V by being listed as accordingly _BiasAnd will go accordingly and be set to identical+Δ V, form one 0 volts potential difference (PD) at described pixel two ends thus and realize.In the row of 0 volt of those wherein capable voltages maintenance, pixel is stable at its initial residing state, and is in+V with these row _BiasStill-V _BiasIrrelevant.Also as shown in Figure 4, should be appreciated that, also can use the voltage that has opposite polarity with above-mentioned voltage, for example encourage a pixel to comprise and be set to+V being listed as accordingly _Bias, will go accordingly and be set to-Δ V.In the present embodiment, discharging pixel is to be set to-V by being listed as accordingly _BiasAnd will go accordingly and be set to identical-Δ V, realize with the potential difference (PD) that forms one 0 volts at the pixel two ends.

Fig. 5 B is the sequential chart of a series of row of demonstration and column signal, and these signals put on 3 * 3 arrays shown in Figure 2, and it will form the demonstration shown in Fig. 5 A and arrange that wherein actuated pixels is non-reflectivity.Before writing the frame shown in Fig. 5 A, pixel can be in any state, and in this example, all row all are in 0 volt, and all row all be in+5 volts.Under these institute's voltages that apply, all pixels are stable at its existing actuated state or relaxed state.

In the frame shown in Fig. 5 A, pixel (1,1), (1,2), (2,2), (3,2) and (3,3) are encouraged.For realizing this effect, the 1st row one " line time " and during, the 1st row and the 2nd row are set at-5 volts, be listed as the 3rd be set at+5 volts.This can not change the state of any pixel, because all pixels all remain in the stability window of 3-7 volt.After this, rise to 5 volts of pulses that are back to 0 volt that descend again then by one from 0 volt and come gating the 1st row.Actuate pixel (1,1) and (1,2) and make pixel (1,3) relaxation thus.Other pixel in the array is all unaffected.For the 2nd row is set at desired state, the 2nd row are set at-5 volts, the 1st row and the 3rd row are set to+5 volts.After this, apply identical strobe pulse with actuate pixel (2,2) and make pixel (2,1) and (2,3) relaxation to the 2nd row.Equally, other pixel in the array is all unaffected.Similarly, by the 2nd row and the 3rd row are set at-5 volts, and be listed as the 1st be set at+5 volts to the 3rd capable the setting.The strobe pulse of the 3rd row is set at the state shown in Fig. 5 A with the 3rd row pixel.After writing incoming frame, the row current potential is 0, and the row current potential can remain on+5 or-5 volts, and after this demonstration will be stable at the layout shown in Fig. 5 A.Should be appreciated that, can use identical programs the array that constitutes by tens of or hundreds of row and columns.The sequential, order and the level that should also be clear that the voltage that is used to implement the row and column excitation can alter a great deal in the above General Principle of summarizing, and above-mentioned example only is exemplary, and any actuation voltage method all can be used with system and method as herein described.

Fig. 6 A and 6B are the system block diagrams of an embodiment of demonstration one display device 40.Display device 40 for example can be cellular phone or mobile phone.Yet the same components of display device 40 and the form of doing slightly to change thereof also can be used as for example illustration of all kinds such as TV and portable electronic device display device.

Display device 40 comprises a shell 41, a display 30, an antenna 43, a loudspeaker 44, an input media 48 and a microphone 46.Shell 41 comprises injection moulding and vacuum forming usually by any the making in the known many kinds of manufacturing process of those skilled in the art.In addition, shell 41 can include but not limited to plastics, metal, glass, rubber and pottery by any the making in the many kinds of materials, or the one combination.In one embodiment, shell 41 comprises the moveable part (not shown) that can have different colours with other or comprise the moveable part exchange of unlike signal, picture or symbol.

The display 30 of exemplary display device 40 can be any in the numerous kinds of displays, comprises bi-stable display as herein described.In other embodiments, display 30 comprises flat-panel monitors such as plasma scope for example mentioned above, EL, OLED, STN LCD or TFT LCD or non-tablet display such as CRT or other tubular device for example, and these displays are known by the those skilled in the art.Yet for ease of the explanation present embodiment, display 30 comprises interferometric modulator display as herein described.

The assembly that in Fig. 6 B, schematically shows an embodiment of exemplary display device 40.Example illustrated display device 40 comprises a shell 41, and can comprise that other are closed in assembly wherein at least in part.For example, in one embodiment, exemplary display device 40 comprises a network interface 27, and this network interface 27 comprises that one is coupled to the antenna 43 of a transceiver 47.Transceiver 47 is connected to processor 21, and processor 21 is connected to again regulates hardware 52.Regulating hardware 52 can be configured to a signal is regulated (for example a signal being carried out filtering).Regulate hardware 52 and be connected to a loudspeaker 44 and a microphone 46.Processor 21 also is connected to an input media 48 and a driving governor 29.Driving governor 29 is coupled to one frame buffer 28 and is coupled to array driver 22, and array driver 22 is coupled to an array of display 30 again.One power supply 50 is all component power supply according to the designing requirement of particular exemplary display device 40.

Network interface 27 comprises antenna 43 and transceiver 47, so that exemplary display device 40 can communicate by network and one or more device.In one embodiment, network interface 27 also can have some processing capacity, to reduce the requirement to processor 21.Antenna 43 is used to transmit and receive the antenna of signal for known any of those skilled in the art.In one embodiment, this antenna is launched according to IEEE802.11 standard (comprising IEEE802.11 (a), (b), or (g)) and is received the RF signal.In another embodiment, this antenna is launched according to bluetooth (BLUETOOTH) standard and is received the RF signal.If be cellular phone, then this antenna is designed to receive CDMA, GSM, AMPS or other and is used for the known signal that communicates at the mobile phone network.47 pairs of signals that receive from antenna 43 of transceiver carry out pre-service, so that it can be received and further be handled by processor 21.Transceiver 47 is also handled the signal that self processor 21 receives, so that they can be by antenna 43 from exemplary display device 40 emissions.

In an alternate embodiment, can replace transceiver 47 by a receiver.In another alternate embodiment, network interface 27 can be stored or produce the image source of sending out the view data of delivering to processor 21 by one and substitute.For example, this image source can be one and contains the software module that the digital video disk (DVD) of view data or hard disk drive or produce view data.

The overall operation of processor 21 common control examples display device 40.Processor 21 automatic network interfaces 27 or an image source receive data (for example Ya Suo view data), and this data processing is become raw image data or is processed into a kind of form that is easy to be processed into raw image data.Then, the data after processor 21 will be handled are sent to driving governor 29 or are sent to frame buffer 28 and store.Raw data typically refers to the information that can discern the picture characteristics of each position in the image.For example, described picture characteristics can comprise color, saturation degree and gray level.

In one embodiment, processor 21 comprises a microcontroller, CPU or is used for the logical block of the operation of control examples display device 40.Regulating hardware 52 generally includes and is used for sending signals and from the amplifier and the wave filter of microphone 46 received signals to loudspeaker 44.Adjusting hardware 52 can be the discrete component in the exemplary client computer 40, perhaps can incorporate in processor 21 or other assemblies.

Driving governor 29 direct self processors 21 or receive the raw image data that produces by processor 21 from frame buffer 28, and suitably with the raw image data reformatting so as high-speed transfer to array driver 22.Particularly, driving governor 29 is reformated into a data stream with raster-like format with raw image data, so that it has a chronological order that is suitable for scanning array of display 30.Then, the information after driving governor 29 formats is sent to array driver 22.Although a driving governor 29 (a for example lcd controller) usually as one independently integrated circuit (IC) be associated with system processor 21, these controllers can make up by many kinds of modes.It can be used as hardware and is embedded in the processor 21, is embedded in the processor 21 or fully-integrated with example, in hardware and array driver 22 as software.

Usually, the self-driven controllers 29 of array driver 22 receive the information after the format and video data are reformated into one group of parallel waveform, and the parallel waveform per second of this group many times is applied to from hundreds of of the x-y picture element matrix of display, thousands of lead-in wires sometimes.

In one embodiment, driving governor 29, array driver 22, and array of display 30 be applicable to the display of arbitrary type as herein described.For example, in one embodiment, driving governor 29 is a traditional display controller or bistable display controllers (a for example interferometric modulator controller).In another embodiment, array driver 22 is a legacy drive or a bistable display driver (a for example interferometric modulator display).In one embodiment, a driving governor 29 integrates with array driver 22.This embodiment is very common in the integrated system of for example cellular phone, wrist-watch and other small-area display equal altitudes.In another embodiment, array of display 30 is a typical array of display or a bistable array of display (a for example display that comprises an interferometric modulator array).

Input media 48 makes the operation that the user can control examples display device 40.In one embodiment, input media 48 comprises a keypad (for example a qwerty keyboard or a telephone keypad), a button, a switch, a touch sensitive screen, a pressure-sensitive or thermosensitive film.In one embodiment, microphone 46 is input medias of exemplary display device 40.When using microphone 46, can provide voice command to come the operation of control examples display device 40 by the user to these device input data.

Power supply 50 can comprise many kinds of energy storing devices, and this is well-known in affiliated field.For example, in one embodiment, power supply 50 is a rechargeable accumulator, for example a nickel-cadmium accumulator or a lithium-ions battery.In another embodiment, power supply 50 is a regenerative resource, capacitor or solar cell, comprises a plastic solar cell and solar cell coating.In another embodiment, the socket that is configured to from the wall of power supply 50 receives electric power.

In certain embodiments, programmability is as indicated above is present in the driving governor in control, and this driving governor can be arranged on several positions of electronic display system.In some cases, the control programmability is present in the array driver 22.The those skilled in the art will know, can reach the above-mentioned optimization of enforcement in different configurations in number of hardware and/or the component software arbitrarily.

Detailed structure according to the interferometric modulator of above-mentioned principle operation can be ever-changing.For example, Fig. 7 A-7C shows three kinds of different embodiment of moving lens structure.Fig. 7 A is a sectional view embodiment illustrated in fig. 1, wherein deposition one strip of metal material 14 on the support member 18 that quadrature extends.In Fig. 7 B, movably reflecting material 14 only is on the tethers 32 at corner and is attached to support member.In Fig. 7 C, removable reflecting material 14 is suspended on the deformable layer 34.Because the structural design and the material therefor of reflecting material 14 can be optimized aspect optical characteristics, and the structural design of deformable layer 34 and material therefor can be optimized aspect the desired mechanical property, so this embodiment has some advantages.In many open files, comprise that for example No. 2004/0051929 U.S. discloses in the application case, the production of various dissimilar interference devices has been described.Can use the known technology of a variety of people to make said structure, this comprises a series of material depositions, patterning and etching step.

Hereinafter will illustrate in greater detail the encapsulation technology of interferometric modulator.Interferometric modulator generally includes moving-member, for example movably mirror 14a, 14b, shown in moving-member must have a protected space that can move therein.

Shown that in Fig. 8 one is used for a synoptic diagram of the basic encapsulating structure 700 of an interferometric modulator.As shown in FIG. 8, a basic encapsulating structure 700 comprises a transparent substrates 710 and backboard lid or " cap " 720.As shown in Figure 8, an interferometric modulator 730 is encapsulated in the encapsulating structure 700.Preferably, backboard 720 is sealed with transparent substrates 710, avoids the infringement of the harmful element in the environment with protection interferometric modulator 730.

Hereinafter will discuss a kind of in more detail according to the method that interferometric modulator is encapsulated embodiment illustrated in fig. 8.Encapsulation as herein described and method for packing can be used for arbitrary interferometric modulator is encapsulated, and include but not limited to interferometric modulator mentioned above.

As indicated above, interferometric modulator 730 is configured to reflect the light that passes transparent substrates, and comprises moving-member, for example movably mirror 14a, 14b.Therefore, can move, preferably between these moving-members and backboard 720, form a gap or cavity 770 for making these moving-members.Gap or cavity 770 can move the mechanical part (for example movably mirror 14a, 14b) of interferometric modulator 730.Should be appreciated that, in one embodiment, be to form gap or cavity 770 when a backboard 720 with sunk area is engaged to transparent substrates 710, as shown in Figure 8.

Transparent substrates 710 can be any transparency material that can form film, MEMS device in the above.These transparency materials include but not limited to glass, plastics and transparent polymer.Image is to show by the transparent substrates 710 as an imaging surface.

According to an embodiment, the preferable interferometric modulator 730 that on a transparent substrates 710, forms.Should be appreciated that, fixed mirror 16a, the 16b of interferometric modulator 730 adjoin transparent substrates 710, and movably mirror 14a, 14b are formed on fixed mirror 16a, the 16b, and the mode of formation makes movably that mirror 14a, 14b can move in the cavity 770 of encapsulating structure embodiment illustrated in fig. 8 700.

For forming interferometric modulator 730, in one embodiment transparent substrates 710 is covered with tin indium oxide (ITO).Described ITO can be preferably by comprising chemical gas deposition (CVD) and sputtering at the thickness that interior standard deposition technique is deposited into about 500 .The preferable skim chromium that on ITO, deposits.Then, etching ITO/ chromium is double-deck and be patterned into some row, to form row electrode 16a, 16b.Preferable listing at each ITO/ chromium forms layer of silicon dioxide (SiO ₂), to form fixed mirror 16a, the 16b of local reflex.Preferable on this structure deposition (and subsequently a discharge) silicon (Si) sacrifice layer, with at fixed mirror 16a, 16b and formation one optical resonator between mirror 14a, the 14b movably.In other embodiments, this sacrifice layer can be formed by molybdenum (Mo), tungsten (W) or titanium (Ti).

Another preferable mirror layer that is formed by aluminium of deposition on this sacrificial silicon layer is to form movably mirror 14a, the 14b of interferometric modulator 730.Deposit this mirror layer and be patterned into row some and row electrode 16a, 16b quadrature, to form row/column array mentioned above.In other embodiments, this mirror layer can comprise the high reflection metal, for example (for example) silver (Ag) or gold (Au).Perhaps, this mirror layer can be a metal stack that is configured to provide suitable optical property and engineering properties.

After forming movably mirror 14a, 14b, preferable use one gas etch technology removes sacrificial silicon layer, with at fixed mirror 16a, 16b and movably form optical cavities between mirror 14a, the 14b.In one embodiment, as hereinafter illustrating in greater detail, backboard is being engaged to transparent substrates after remove this sacrifice layer by the perforate in backboard or the peripheral seal.Can use standard etch techniques to remove sacrificial silicon layer.This specific release etch will be decided on the material of intending discharging.For example, can use xenon difluoride (XeF ₂) remove sacrificial silicon layer.In another embodiment, before being engaged to transparent substrates 710, backboard 720 removes sacrificial silicon layer between mirror 16a, 16b, 14a, the 14b.The those skilled in the art will know that preferable standard deposition technique and the standard photolithography techniques all used of each layer of interferometric modulator 730 deposits and patterning.

Be understood by those skilled in the art that 720 mechanical functions of backboard are avoided pollutant effects in the environment with protection interferometric modulator 730.Backboard 720 prevents that mechanical disturbance, moisture and dusty gas from entering and damages the interferometric modulator 730 that encapsulates in 700 potentially together with a transparent substrates 710 and a seal 740 (it will be described in more detail hereinafter).

No matter backboard 720 is transparent material or opaque material if can making one by any suitable material, no matter be conductive material or insulating material also.The material that is applicable to backboard 720 includes but not limited to glass (float glass for example, 1737, soda-lime), plastics, pottery, polymkeric substance, laminated product, and metal and metal forming (for example stainless steel (SS302, SS410), kovar (Kovar), coating kovar).

One containment member or a seal 740 are set usually makes transparent substrates 710 engage formation encapsulating structure 700 with backboard 720.Seal 740 can be one and half airtight sealing bodies, for example a traditional epoxy radicals sticker.In other embodiments, except that the seal of other types, seal 740 can be the seal of polyisobutylene (PIB), O shape circle, film metal weldering, liquid spin-coating glass, scolder, polymkeric substance or plastics and other types.In another embodiment, seal 740 can be an airtight sealing body.

After making backboard 720 and transparent substrates 710 engages, seal 740 is solidified and sclerosis.Be understood by those skilled in the art that, can be different from through the seal 740 of overcure between backboard 720 and the transparent substrates 710 can be after encapsulating structure 700 be divided into independent array applied seal.

Usually wish on single transparent substrates, to make several interferometric modulator arrays, use backboard, then described structure be divided into independent array.After with seal 740 sclerosis, can carry out machinery or laser scribing or otherwise prepare division described structure.Decide on seal 740 and other factors, may be to each independent encapsulating structure or arrayed applications one end envelope after division.

Fig. 9 A shows that one has the schematic side view of an embodiment of the encapsulating structure 800 in hole, an end Fengkai.End hole, Fengkai is generally the perforate that is arranged in the continuous peripheral seal (shown in Fig. 9 B) of a script or is perforate or the hole 850 that is arranged in backboard 820, shown in Fig. 9 A.Fig. 9 C is the plan view from above of Fig. 9 B illustrated embodiment.Shown in Fig. 9 B and 9C, peripheral seal scatters discontinuously, thereby stays a perforate 860 in seal 840.

Should be appreciated that, in backboard, may exist more than a perforate 850, shown in Fig. 9 D-9G.In Fig. 9 A illustrated embodiment, can seal perforate or hole 850, forming the perforate of end envelope or sealing, thereby make encapsulation 800 intactly have a metal for example or glass cap, metal forming, sticker, solder or through the polymkeric substance of UV or heat curing.

Should be appreciated that metal cap also has other purposes.For example, metal cap can use with a backboard that is formed by printed circuit board (PCB) (PCB) backboard that may comprise the electrical interface that is used for radio frequency (RF) signal.The PCB backboard not only can be used as being integrated in the protection of the circuit in the backboard, and can strengthen RF circuit needs.For example, metal cap can be set and carry out RF enhancing or protection.Also can in PCB backboard or interferometric modulator, incorporate antenna properties into, include but not limited to use a metal backing or a metal cap antenna as a cellular phone.

In encapsulation process, use these perforates or hole 850 to make it possible in environmental baseline, outside pressure controling chamber, encapsulate.Usually, environmental baseline is the testing laboratory's condition in the toilet of a no particulate, its normally temperature be about that 70, relative humidity are in about 40-60% scope and goodly be about 50%.Perforate or hole 850 can be overflowed the pressure in the encapsulation 800, thereby pressure can not cause transparent substrates 810 and backboard 820 to separate in joint or seal process, and this is because can not set up pressure in encapsulation 800.Make the pressure in the encapsulation realize constant compression force by perforate 850 effusion meetings in encapsulation 850, this also makes the seal width more even, even seal does not distribute with uniform thickness.

Perforate or hole 850 also can be configured to allow material to enter and discharge encapsulation 800.Particularly, perforate or hole 850 can be configured to allow to apply solvent to interferometric modulator 830 and remove wall or sacrifice layer, and this will be described in more detail hereinafter.Be understood by those skilled in the art that may seal by also nonessential use side, this will be described in more detail hereinafter.

Generally speaking, wish to make the water vapour that infiltrates through in the encapsulating structure 800 minimized, control the environment of encapsulating structure 800 inside thus.Encapsulating structure 800 can carry out airtight sealing, to guarantee that regardless of surrounding environment the environment in the encapsulating structure 800 all keeps constant.The example of one airtight sealing processing procedure is disclosed in United States Patent (USP) the 6th, 589, and in No. 625, this case is incorporated herein with way of reference in full.

Have among the embodiment of airtight sealing body one, seal 840 is an impermeability barrier layer, and it prevents that as an environment barrier layer any air and water vapour from flowing through seal 840 and entering encapsulating structure 800.The material that is applicable to the airtight sealing body includes but not limited to weld seam, solder, sieves the sticker that mixes mutually with for example zeolite equimolecular.Only sticking work agent component self can not be as a suitable environment barrier layer, because it will finally make moisture and other contaminant infiltration go in the encapsulating structure 800.For the critical environment in space, may wish to use the half airtight sealing body 840 that forms by one of above-mentioned material, this is because for other Sealing Technologies such as welding or soldering for example, seal 840 may be extremely thin and very cheap.Half airtight sealing body 840 can apply by simple streamline manufacturing process, the welding of airtight sealing body and soldering tech then need the technology of excessive temperature, and this may damage encapsulating structure 800, relatively costly and often occupy much bigger space because of welding or the seal of soldering are thicker.Should be appreciated that half airtight sealing body can comprise not the sticker that mixes mutually with any molecular sieve or drying agent.

In one embodiment, zeolite can comprise the mineral of aluminosilicate structure, for example sodium aluminosilicate.In another embodiment, zeolite can comprise the microporous silicate mineral.Should be appreciated that, also can use the effective ingredient that can be used as molecular level absorbability filtering material except that zeolite.In one embodiment, sticker can be low air release property sticker.In other embodiments, sticker can be the sticker with different air release properties.Used drying agent can be calcium dioxide, strontium oxide strontia (SRO), silica gel, montmorillonite clay (being preferably aluminium-magnesium silicate), molecular sieve (zeolite, for example Na in seal ₁₂AlO ₃SiO ₂₁₂XH ₂O) or calcium sulphate.

The quantity of material that it will be understood by one of ordinary skill in the art that seal 840 will depend on will need the moisture that removes or the estimator of dusty gas in encapsulating structure 800 in the lifetime of encapsulating structure 800.The quantity of material of seal 840 also not only depends on the moisture or the contamination gas scale of construction of encapsulating structure 800 inside when encapsulation forms, and depends on the permeability of seal 800 and the possible outgas of package assembling.

Zeolite can absorb hydrone under high relatively temperature.Zeolite can be with moisture and dusty gas trapping in its hole.Be understood by those skilled in the art that the zeolite that can select to have the different aperture size absorbs different pollutants as the material of seal 840.In one embodiment, zeolite is chosen to absorb contaminant molecule, for example critical diameter is the aromatic series branched-chain hydrocarbon of 10 dusts to the maximum.In another embodiment, can select the zeolite of pore-size between 2 dusts and 3 dusts to absorb the contaminant molecule of diameter less than 2 dusts, for example hydrogen and hydrone.In another embodiment, the zeolite that can use pore-size to be about 50 dusts (50 ) absorbs nitrogen and carbon dioxide molecule.The those skilled in the art will know that airtight sealing body 840 can be made of the potpourri of the zeolite with different aperture size.

Seal 840 is applied to transparent substrates 810 around interferometric modulator 830 along periphery usually.Be understood by those skilled in the art that, one wherein encapsulating structure 800 comprise among the embodiment more than an interferometric modulator 830, seal 840 is applied to transparent substrates 810 around the peripheries of described a plurality of interferometric modulators 830 usually.In certain embodiments, seal 840 preferable form thickness in about 1-20 micrometer range, better in about 12-18 micrometer range, especially be more preferred from 15 microns.Be understood by those skilled in the art that, the thickness of seal 840 will depend on various factors, the amount that comprise the material of life expectancy, the seal 840 of device, estimation can infiltrate through pollutant in the encapsulating structure 800 and moisture in lifetime, the humidity of surrounding environment, and whether comprise the flatness of drying agent and backboard 820 and transparent substrates 810 in encapsulating structure 800.Then backboard 820 is placed on the transparent substrates 810, and transparent substrates 810 is sealed in to form encapsulating structure 800 with backboard 820 by seal 840.

In certain embodiments, the periphery around seal 840 applies an external adherence agent pearl (not shown).External adherence agent pearl can comprise a low-permeability sticker, and it can be encapsulating structure 800 extra environmental protection is provided.External adherence agent pearl is applicable in the environment with a large amount of pollutants, in this environment, unless unpractical effective ingredient amount of packing into, only seal 840 self can't be used as effective airtight sealing body.For example, if seal 840 comprises the zeolite (for example zeolite more than 60%) by weight of high-load, then seal 840 can become in the microscopically porous and have high viscosity thereby be difficult to and apply.This seal 840 with high-load zeolite may provide healthy and strong mechanical support for encapsulating structure 800.And the outer ring also can provide extra mechanical support.

Shown in Fig. 9 A, can be formed with at least one perforate 850 in the backboard 820.Can introduce a release material to the inside of encapsulating structure 800 by this perforate, for example xenon difluoride (XeF ₂), remove sacrifice layer in the interferometric modulator 830 (fixed mirror 16a, 16b and movably the sacrifice layer between mirror 14a, the 14b).The quantity of these openings 850 and size depend on the required speed that removes of sacrifice layer.

For removing the sacrifice layer that forms by molybdenum (Mo), silicon (Si), tungsten (W) or titanium (Ti), can be by the one or more openings 850 in the backboard 820 with xenon difluoride (XeF ₂) inside of introducing encapsulating structure 800.Preferablely form these openings 850 in the backboard 820 by etching openings in backboard 820.Xenon difluoride (XeF ₂) react with sacrifice layer, thereby remove sacrifice layer.For the sacrifice layer that forms by spin-coating glass or oxide, preferablely transparent substrates 810 laggard promoting the circulation of qi body etchings have been engaged to or vapor phase etchant removes sacrifice layer at backboard 820.The those skilled in the art will know that removing technology will decide on the material of sacrifice layer.

After removing sacrifice layer, preferable opening in the backboard 820 850 is sealed.In one embodiment, use a heat curing or UV cured polymer to seal these perforates.This (a bit) perforate also can use metal or glass cap, metal forming, sticker, weld seam or solder to seal.The those skilled in the art will know, also can use other materials and be preferably to use to have full-bodied material.

In another embodiment, before after removing sacrifice layer, to this (a bit) perforate 850, sealing, can apply drying agent with the steam form in encapsulating structure 800 inside by (for example) this (a bit) perforate 850.In certain embodiments, a part of drying agent 860 can comprise to or be coated to the inside surface of backboard 820, as shown in figure 10.In addition, can apply the drying agent of more or other types by this (a bit) perforate 850 to the inside of encapsulation 800.The size of this (a bit) perforate 850 is preferable less, thereby high-absorbility drying agent or slow trapping rate drying agent all can before being engaged to transparent substrates 810, backboard 820 be incorporated in the backboard 820, because the air capacity that enters in the encapsulation 800 by this (a bit) perforate under the situation of no any vacuum or pressure-driven power will be enough little.In a preferred embodiment, the diameter of perforate 850 is in about 10-100 micrometer range.This (a bit) perforate 850 can be incorporated in the backboard 820 drying agent 860 before assembling, and made certain gas or etchant can pass through these (a bit) perforate 850 injections to activate drying agent 860 or to deposit other drying agent in encapsulation 800.

As indicated above, can use drying agent to control to retain in the moisture in the encapsulating structure 800.Yet,, needn't use drying agent to prevent that moisture from entering the inside of encapsulating structure 800 from atmosphere if seal 840 is entirely impermeability.

Owing to need not to use drying agent, thereby make the encapsulating structure 800 can be thinner, this be that people are desired.Yet, in certain embodiments, for example have among the embodiment of half airtight sealing body at those, but need to use drying agent.Usually, in the encapsulation that contains drying agent, the expected life of device may depend on the life-span of drying agent.When drying agent exhausts fully, thereby along with there being abundant moisture to enter encapsulating structure interferometric modulator is caused damage, interferometric modulator display will lose efficacy.The device theoretical maximum life depend on enter the encapsulation in the water vapour flux and the amount and the kind of drying agent.

Should be appreciated that to have among the encapsulating structure embodiment of airtight sealing body one, the life-span of device is not depended on the ability of drying agent or the physical dimension of seal.In this encapsulating structure, interferometric modulator will can not lose efficacy because of drying agent exhausts.

As indicated above, can use drying agent to reduce to retain in the moisture in the encapsulating structure 800.Drying agent can be used for having the encapsulation of impermeability or half airtight sealing body.In the encapsulation with half airtight sealing body, drying agent can be used for controlling the moisture in environment enters encapsulation.The those skilled in the art will know that for the encapsulation of airtight sealing, drying agent may be also nonessential, but it can desirably control the moisture that remains in the encapsulating structure 800.For encapsulation, can in encapsulation, provide drying agent to be absorbed in to enter in the manufacture process any moisture in the encapsulation with airtight sealing body.

Generally speaking, but any trapping moisture and can not disturb the material of the optical property of interferometric modulator 830 all to can be used as drying agent.Suitable desiccant material includes but not limited to zeolite, molecular sieve, surface adsorption agent, loose adsorbent and chemical reactor.The those skilled in the art will know that desiccant material should be selected according to many kinds of factors, and these factors comprise the estimator of dusty gas in the environment and the absorption rate and the desiccant material amount of desiccant material.

Drying agent can have different forms, shape and size.Except being the solid form, drying agent also can be powder type.These powder can directly be inserted in the encapsulation, and perhaps it can mix mutually with a sticker and applies.In an alternate embodiment, drying agent can form different shape, for example cylindrical or thin slice shape before putting on encapsulation inside.

In another embodiment, can after making transparent substrates 810 and backboard 820 engages, apply drying agent.According to this embodiment, shown in Fig. 9 A, in backboard 820, form a little hole or a perforate 850.The those skilled in the art will know, can form more than a hole or perforate 850 in backboard 820.In Fig. 9 A illustrated embodiment, preferable perforate or the hole 850 of before backboard 820 is engaged to transparent substrates 810, forming.Perforate or hole 850 allow to be injected into drying agent to each independent encapsulating structure 800 after backboard 820 and transparent substrates 810 have been sealed.In the present embodiment, also require perforate or hole 850 are sealed,, thereby make the inside of encapsulating structure 800 isolated with external environment on every side with the encapsulating structure 800 of formation sealing.The those skilled in the art will know that perforate or hole 850 also can be beneficial to realizes a complete perimeter seal process, eliminates the common hole, LCD type end Fengkai of using in peripheral seal 840 thus.Perforate in the backboard 820 or hole 850 are preferable to be sealed after in drying agent being injected into encapsulation 800.

The those skilled in the art also will know, in certain embodiments, apply a self aligned unimolecular layer or anti-static friction coating in encapsulation 800, so that the moving-member of interferometric modulator 830 (for example element 14a, 14b) can move like a cork.Described self aligned unimolecular layer can be coated to the inside of encapsulating structure 800 by this (a bit) perforate 850.Described unimolecular layer preferably comprises one and is configured to reduce the mantle friction on the moving-member and/or discharges the material of the water vapour in the moving-member.The Exemplary materials of self aligned unimolecular layer includes but not limited to: silicon fluoride, chlorine silicon fluoride, methoxy silane, trichlorosilane, perfluor carboxylic acid in the last of the ten Heavenly stems, octadecyl trichlorosilane (OTS), dichlorodimethylsilane or hydrophobicity or Abherent material, for example PTFE, teflon, poly-silica, polystyrene, polyurethane (standard and can by the two of ultraviolet curing), one comprise the segmented copolymer (for example polymethylmethacrylate) or the polysilazane (polysilazane that especially has polysiloxane) of a hydrophobic components.In certain embodiments, the Exemplary materials of self aligned unimolecular layer includes but not limited to inorganic material, one or more in for example following: graphite, diamond-like-carbon (DLC), silit (SiC), hydrogenation diamond coatings or fluoridize DLC.Between each moving-member, exist water vapour to increase and make described moving-member separate required power, thereby be disadvantageous.Therefore, reducing ability that mantle friction and/or water vapour gather on moving-member can correspondingly reduce and make each moving-member separate required power.Yet, should be appreciated that the water vapour that common ambient humidity value is provided is not enough to influence unfriendly the function of encapsulation 800 internal interference formula modulators 830.

Generally speaking, interferometric modulator has the humidity requirement tolerance limit (for example being up to about 10%) that is higher than Organic Light Emitting Diode (OLED) display.Carry out half airtight sealing or airtight sealing even encapsulate 800, water vapour also may infiltrate through in the encapsulation 800.Place among some embodiment of drying agent in the inside of encapsulation 800 therein, a certain amount of moisture of tolerable infiltrates, and this capacity on drying agent is decided.Yet if the amount of existing moisture or water vapour is higher than tolerance value, if perhaps infiltrate through the water of encapsulation in 800 more than desired amount, the life-span of interferometric modulator 830 may shorten or may not correctly work.In addition, in certain embodiments, produce and/or the moisture that infiltrates may not remove before the completing of encapsulation as yet rightly at assembly process.In addition, the rh value that encapsulation is inner especially under the situation of no drying agent, should keep less than tolerance value, so that interferometric modulator 830 is correctly worked during its expected life.

Shown in Fig. 9 B, encapsulating structure 800 is not to have a perforate in backboard 820, but can have a perforate 860 in peripheral seal 840, perhaps except that having in backboard 820 perforate, also can have a perforate 860 in peripheral seal 840.Perforate 860 in the seal 840 provides with above at the described identical advantage of the perforate in the backboard 820, comprises making it possible to encapsulate under environmental baseline, can introducing release material, drying agent and self aligned unimolecular layer.As be arranged in the perforate of backboard, in the present embodiment, transparent substrates 810 and backboard 820 are joined merge introduce drying agent, release material and self aligned unimolecular layer after, preferable with 860 sealings of the perforate in the seal 840 to form the perforate of a sealing.In a preferred embodiment, use preferable can perforate 860 sealing by the polymkeric substance of UV curing or heat curing.The preferable viscosity that makes polymkeric substance is lower than the viscosity of peripheral seal 840, so that the surface tension that increases helps polymkeric substance that perforate 860 is sealed fully.

Figure 11 A-11B shows the synoptic diagram that removes the process of water vapour according to an embodiment from described encapsulation.Encapsulation 900 among Figure 11 A comprises a drying agent 970, and the encapsulation 900 among Figure 11 B does not then comprise drying agent.Figure 11 C is the plan view from above of Figure 11 B illustrated embodiment.Shown in Figure 11 C, seal 940 is continuous distribution not, to form an inlet 960 and one outlet 980 in seal 940.To illustrate in greater detail a water vapour below and remove process.Used herein term " water vapour " can comprise the water of any pattern, includes but not limited to aqueous water, vaporous water (gas phase) or encapsulates inner lip-deep condensate water.

Shown in Figure 11 A-11B, in seal 940, define an inlet 960 and one outlet 980.In one embodiment, inlet 960 is configured to provide a gas to encapsulation 900 inside, and exports 980 and be configured to make water vapour can discharge encapsulation 900.In Figure 11 A-11B illustrated embodiment, in seal 940, define an inlet and an outlet.

In an alternate embodiment, in seal, define an inlet and a plurality of outlet.In one embodiment, at least one in inlet 960 and the outlet 980 is to use the stroke pin to form.In this embodiment, inlet 960 and to export 980 shape be circle substantially.In another embodiment, inlet 960 and export 980 and can have and be different from circular shape.The those skilled in the art will know, inlet 960 and/or export 980 and also can or use any other proper tools to form by the system of boring.

In certain embodiments, inlet 960 has essentially identical size with outlet 980.In other embodiments, inlet 960 can be of different sizes with outlet 980.For example, the size of inlet 960 can be greater than the size of outlet opening 980.Perhaps, can be by how can be effectively after removing water vapour or easily to entering the mouth 960 and export 980 and seal this criterion and determine inlet 960 and export 980 size.In other words, as long as can implement sealing effectively, inlet 960 and export 980 and can have arbitrary dimension.Inlet 960 and to export in 980 diameter of at least one preferable in about 10 μ m-2mm scopes more preferably in about 500 μ m-1.5mm scopes, especially is more preferably about 1mm.

Can in seal 940, define inlet 960 simultaneously and export 980.Perhaps, in seal 940, at first define inlet 960 and export in 980 one, and then define another.For example, can at first form inlet 960, and after in encapsulation 900, introducing gas by inlet 960, form outlet 980.In this embodiment, can raise encapsulation 900 gas inside pressure so that the enhancing water vapour removes process.

In one embodiment, the gas of introducing in the encapsulation 900 is dry inert gas, is preferably the nitrogen of molecular state, i.e. N ₂In another embodiment, described gas is argon gas.Should be appreciated that described gas can be any can or vacuumize the gas that (suction) removes the water vapour of encapsulation 900 inside effectively by for example pressure, drying, expeling (blowing).For example, described gas can be air, the air through heating, the gas through heating or dry gas.

Described gas can 960 be fed into encapsulation 900 inside continuously by entering the mouth, till removing all water vapours basically.In one embodiment, the humidity that can pass through monitoring outlet opening 980 places determines to measure the humidity of the gas of discharging outlet 980 whether water vapour is removed substantially.

In another embodiment, at least a portion water vapour can remove from encapsulating 900 inside by the perforate that encapsulates in 900 by for example vacuum pump.Except that water vapour, also removable other harmful materials of institute's gas supplied (for example dust, other harmful particle or fluent materials).In this embodiment, encapsulation 900 can be positioned in the Room (or vacuum chamber), and can be by the described chamber of finding time, it is filled again with a dry gas (for example nitrogen or argon gas) gas feed is gone in the encapsulation 900 then.In this embodiment, around encapsulation 900, be formed up to the small part vacuum, to encapsulate the 900 inner water vapours of extracting out certainly.Should be appreciated that, in this embodiment, in encapsulation 900, only need a perforate.Therefore, in this embodiment need be with an inlet 960 and one outlet 980.

In one embodiment, can during the manufacture process of encapsulation 900, remove water vapour.In this embodiment, can use one wherein at first etch away sacrifice layer in the interferometric modulator 930 " release off " and or remove technology, as indicated above.Then, can use the carrier gas of introducing in the encapsulation by the inlet 960 that is formed in the seal 940 (for example nitrogen or argon gas) to remove the water vapour (and/or any harmful or unwanted material) that encapsulates 900 inside.In one embodiment, the described technology that removes is implemented by a MEMS etch system, and for example, use can be from X3 series of X etch system that XACIX (USA) buys and the MEMS ETCHER system that can buy from Penta Vacuum (Singapore).

Figure 12 be one according to another embodiment from the inner synoptic diagram that removes the process of water vapour of encapsulation.In this embodiment, be not to use a seal that one backboard is sealed to transparent substrates to come capsule envelope interferometric modulator, but depositing a film 1020 on the transparent substrates 1010 and on interferometric modulator 1030, forming a sacrifice layer.Do not need independent seal in this embodiment.But in film 1020, form inlet 1040 as shown in figure 12 and export 1050.Should be appreciated that, need remove sacrifice layer to form a cavity that can move therein for the moving-member (for example mechanical part 14a, 14b) of interferometric modulator 1030.For removing sacrifice layer, can be by the perforate 1040,1050 in the film 1020 to the inner release material (xenon difluoride (XeF for example that introduces of encapsulating structure 1000 ₂)) remove sacrifice layer.After removing sacrifice layer, can use method mentioned above to remove the inner water vapour of encapsulation.A kind of encapsulating structure with a film backboard is set forth in the 11/045th, No. 738 U.S. patent application case of filing an application on January 28th, 2005, and this application case is incorporated herein with way of reference.

Figure 13 is a synoptic diagram that removes the process of water vapour from an encapsulation 1100 according to another embodiment.In this embodiment, in backboard 1120 but not in seal 1140, form an inlet 1150.As indicated above, because backboard 1120 is to be made by for example materials such as glass, metal or flexomer, thereby for example can use scriber or laser instrument in backboard 1120, to form inlet 1150 effectively.Preferably in seal 1140, form an outlet 1160, as shown in figure 13 by granting a discontinuous seal.Can by enter the mouth 1150 to the encapsulation 1100 in feed gas to remove water vapour and/or deleterious material.Perhaps, should be appreciated that inlet can be formed in the seal, and outlet can be formed in the backboard.

Figure 14 one shows that according to another embodiment one is used for removing from an encapsulation 1200 synoptic diagram of the packaging structure of water vapour.In this embodiment, inlet 1250 and outlet 1260 the two all be formed in the backboard 1220 but not be formed at as shown in figure 13 in the seal 1240.After forming inlet 1250 and exporting 1260, can in encapsulation 1200, feed gas remove water vapour and/or deleterious material.Should be appreciated that inlet 1250 and export 1260 and can in the manufacturing process of backboard 1220, be formed in the backboard 1220.

Figure 15 one shows that according to another embodiment one is used for removing from an encapsulation 1300 synoptic diagram of the packaging structure of water vapour.In this embodiment, in transparent substrates 1310, form an inlet 1350 and in seal 1340, form outlet 1360, as shown in figure 15 by granting a discontinuous seal.As indicated above, because transparent substrates 1310 is to be made by for example materials such as glass, plastics or polymkeric substance, thereby can for example use scriber or laser instrument in transparent substrates 1310, to define inlet 1350 effectively.After forming inlet 1350 and exporting 1360, can in encapsulation 1300, introduce gas and remove the inner water vapour of encapsulation.

Figure 16 A-16C is for showing the synoptic diagram that removes the process of water vapor according to another embodiment from an encapsulation 1400.In this embodiment, preferablely only form a perforate in 1400 in encapsulation.Shown in Figure 16 A, can in seal 1440, form perforate 1450.Perhaps, shown in Figure 16 B, can in backboard 1420, form perforate 1460.In another embodiment, shown in Figure 16 C, can in transparent substrates 1410, form perforate 1470.In these embodiments, can in encapsulation 1400, introduce through the air of heating or the water vapour in a kind of next dry encapsulation 1400 of gas through heating.Gas through heating provided to encapsulation 1400 inside, also can implement to vacuumize to encapsulate 1400 inside certainly and extract any residual water vapor out.Should be appreciated that, describe in detail as mentioned that perforate 1450,1460,1470 also can be used for being injected into drying agent, release material or self aligned unimolecular layer.

Figure 17 A is according to an embodiment, the synoptic diagram of the process that the perforate in a pair of encapsulation 1500 seals.After the inside that encapsulates 1600 certainly removes water vapour and/or harmful material basically or thoroughly, preferable any perforate 1560 is sealed to form end envelope.Figure 17 B is the plan view from above of Figure 17 A illustrated embodiment before perforate 1560 is sealed.Shown in the plan view from above among Figure 17 B, in seal 1540, form perforate 1560 by granting a discontinuous seal 1540.In Figure 17 A illustrated embodiment, the perforate 1560 in 1550 pairs of seals 1540 of same material of use and the peripheral seal 1540 of formation seals.Should be appreciated that,, yet also can implement same or analogous seal process other embodiment although Figure 17 A shows that one has the packaging process for packaging of perforate in seal 1540.For example, the material identical materials that can use and form backboard is come the perforate in the seal back plate.Perhaps, the material identical materials that can use and form transparent substrates is come the perforate in the sealed transparent substrate.The those skilled in the art will know, also can use equivalent material to seal described perforate, and these equivalent material include but not limited to preferable epoxy resin, weld seam, solder, metal cap and glass cap with low viscous heat curing or UV curing.

Usually, can vacuum, between vacuum to the pressure between the environmental pressure (and comprising environmental pressure) or be higher than under the pressure of environmental pressure and finish encapsulation process, comprise end envelope process.Also can be during the sealing processing procedure have in the environment of variable and controlled high or low pressure and finish encapsulation procedure one.In the environment of bone dry interferometric modulator being encapsulated may be comparatively favourable, but and nonessential like this.

As indicated above, during seal process, the pressure that the perforate in backboard or the peripheral seal is equal to the outside maintenance of encapsulating structure in encapsulating structure.Packaging environment can be the inert gas that is under the environmental baseline.Encapsulate under environmental baseline and can reduce the technology cost, this is because its operation that more may realize the diversity of choice of equipment and can not influence device because described device can transport under environmental baseline.

Figure 18 A and 18B are the system block diagram of another embodiment of demonstration one display device 2040.Display device 2040 for example can be cellular phone or mobile phone.Yet the same components of display device 2040 and the form of doing slightly to change thereof also can be used as for example illustration of all kinds such as TV and portable electronic device display device.

Display device 2040 comprises a shell 2041, a display 2030, an antenna 2043, a loudspeaker 2045, an input media 2048 and a microphone 2046.Shell 2041 is made by any technology in the known numerous kinds of manufacturing process of those skilled in the art usually, comprises injection moulding and vacuum forming.In addition, shell 2041 can be made by any material in the numerous kinds of materials, includes but not limited to the combination of plastics, metal, glass, rubber and pottery or one.In one embodiment, shell 2041 comprises removable part (not shown), and these removable parts can have removable part different colours or that comprise different identification, picture or symbol with other and use instead.

The display 2030 of exemplary display device 2040 can be any in the numerous kinds of displays, comprises bi-stable display as herein described.In other embodiments, display 2030 comprises flat-panel monitors such as plasma scope for example mentioned above, EL, OLED, STN LCD or TFT LCD or non-tablet display such as CRT or other tubular devices for example, and these displays are known by the those skilled in the art.Yet for ease of the explanation present embodiment, display 2030 comprises just like interferometric modulator display as herein described.

The assembly that in Figure 18 B, schematically shows an embodiment of exemplary display device 2040.Example illustrated display device 2040 comprises a shell 2041, and can comprise that other are closed in assembly wherein at least in part.For example, in one embodiment, exemplary display device 2040 comprises a network interface 2027, and this network interface 2027 comprises that one is coupled to the antenna 2043 of a transceiver 2047.Transceiver 2047 is connected to processor 2021, and processor 2021 is connected to again regulates hardware 2052.Regulating hardware 2052 can be configured to a signal is regulated (for example a signal being carried out filtering).Regulate hardware 2052 and be connected to a loudspeaker 2045 and a microphone 2046.Processor 2021 also is connected to an input media 2048 and a driving governor 2029.Driving governor 2029 is coupled to one frame buffer 2028 and is coupled to array driver 2022, and array driver 2022 is coupled to an array of display 2030 again.One power supply 2050 is all component power supply according to the designing requirement of particular exemplary display device 2040.

Network interface 2027 comprises antenna 2043 and transceiver 2047, so that exemplary display device 2040 can communicate by network and one or more device.In one embodiment, network interface 2027 also can have some processing capacity, to reduce the requirement to processor 2021.Antenna 2043 is to launch being used to known to the those skilled in the art and any antenna of received signal.In one embodiment, this antenna is launched according to IEEE802.11 standard (comprising IEEE802.11 (a), (b), or (g)) and is received the RF signal.In another embodiment, this antenna is launched according to bluetooth (BLUETOOTH) standard and is received the RF signal.If be cellular phone, then this antenna is designed to receive CDMA, GSM, AMPS or other and is used for the known signal that communicates at the mobile phone network.2047 pairs of signals that receive from antenna 2043 of transceiver carry out pre-service, so that it can be received and further be handled by processor 2021.Transceiver 2047 is also handled the signal that self processor 2021 receives, so that they can be by antenna 2043 from exemplary display device 2040 emissions.

In an alternate embodiment, can replace transceiver 2047 by a receiver.In another alternate embodiment, can replace network interface 2027 by an image source, this image source can store or produce and send out the view data of delivering to processor 2021.For example, this image source can be one and contains the software module that the digital video disk (DVD) of view data or hard disk drive or produce view data.

The overall operation of processor 2021 common control examples display device 2040.Processor 2021 automatic network interfaces 2027 or an image source receive data (for example Ya Suo view data), and this data processing is become raw image data or is processed into a kind of form that is easy to be processed into raw image data.Then, the data after processor 2021 will be handled are sent to driving governor 2029 or are sent to frame buffer 2028 and store.Raw data typically refers to the information that can discern the picture characteristics of each position in the image.For example, described picture characteristics can comprise color, saturation degree and gray level.

In one embodiment, processor 2021 comprises a microcontroller, CPU or is used for the logical block of the operation of control examples display device 2040.Regulating hardware 2052 generally includes and is used for sending signals and being used for amplifier and wave filter from microphone 2046 received signals to loudspeaker 2045.Adjusting hardware 2052 can be the discrete component in the exemplary display device 2040, perhaps can incorporate in processor 2021 or other assemblies.

Driving governor 2029 direct self processors 2021 or receive the raw image data that produces by processor 2021 from frame buffer 2028, and suitably with the raw image data reformatting so as high-speed transfer to array driver 2022.Particularly, driving governor 2029 is reformated into one with raw image data and has the data stream of grating class form, so that it has a chronological order that is suitable for scanning array of display 2030.Then, the information after driving governor 2029 will format is sent to array driver 2022.Although driving governor 2029 (for example lcd controller) normally as one independently integrated circuit (IC) be associated with system processor 2021, yet these controllers also can make up by many kinds of modes.It can be used as hardware and is embedded in the processor 2021, is embedded in the processor 2021 or together fully-integrated with example, in hardware and array driver 2022 as software.

Usually, the self-driven controllers 2029 of array driver 2022 receive the information after the format and video data are reformated into one group of parallel waveform, and the parallel waveform per second of this group many times is applied to from hundreds of of the x-y picture element matrix of display, thousands of lead-in wires sometimes.

In one embodiment, driving governor 2029, array driver 2022, and array of display 2030 be applicable to the display of arbitrary type as herein described.For example, in one embodiment, driving governor 2029 is a traditional display controller or bistable display controllers (a for example interferometric modulator controller).In another embodiment, array driver 2022 is a legacy drive or a bistable display driver (a for example interferometric modulator display).In one embodiment, a driving governor 2029 integrates with array driver 2022.This embodiment is very common in the integrated system of for example cellular phone, wrist-watch and other small-area display equal altitudes.In another embodiment, array of display 2030 is a typical array of display or a bistable array of display (a for example display that comprises an interferometric modulator array).

Input media 2048 makes the operation that the user can control examples display device 2040.In one embodiment, input media 2048 comprises a keypad (for example qwerty keyboard or telephone keypad), a button, a switch, a touch sensitive screen, a pressure-sensitive or thermosensitive film.In one embodiment, microphone 2046 is input medias of exemplary display device 2040.When using microphone 2046, can provide voice command to come the operation of control examples display device 2040 by the user to these device input data.

Power supply 2050 can comprise many kinds of energy storing devices, and this is well-known in affiliated field.For example, in one embodiment, power supply 2050 is a rechargeable accumulator, for example a nickel-cadmium accumulator or a lithium-ions battery.In another embodiment, power supply 2050 is a regenerative resource, capacitor or solar cell, comprises plastic solar cell and solar cell lacquer.In another embodiment, power supply 2050 is configured to the socket reception electric power on wall.

In certain embodiments, programmability is as indicated above is present in the driving governor in control, and this driving governor can be arranged on several positions of electronic display system.In some cases, the control programmability is present in the array driver 2022.The those skilled in the art will know, can reach the above-mentioned optimization of enforcement in different configurations in number of hardware and/or the component software arbitrarily.

Although above describe in detail is to show, illustrate and point out the novel feature that is applicable to various embodiment of the present invention, yet should be appreciated that, the those skilled in the art can be to the various omissions of making of shown device or technology, alternative and change on form and details, and this does not deviate from spirit of the present invention.Should know,, thereby can not provide in the form of all features as herein described and advantage one and implement the present invention because some feature can use with other features or try out mutually independently.

Claims (87)

1, a kind of method of manufacturing one display device, it comprises:

The transparent substrates that is formed with an interferometric modulator above one is provided; And

By apply a seal between a backboard and described transparent substrates described backboard is engaged to described transparent substrates to form an encapsulation, wherein said interferometric modulator is sealed by described package encapsulation, and described encapsulation has at least one perforate.

2, the method for claim 1, it further is included in described backboard is engaged to and seals described at least one perforate after the described transparent substrates.

3, the method for claim 1, it further is included in described backboard is engaged to described transparent substrates afterwards by described at least one perforate introducing drying agent.

4, the method for claim 1, it comprises:

Deposition one sacrifice layer on described transparent substrates and microelectromechanicdevices devices; And

Deposition one film backboard is to form an encapsulation on described sacrifice layer, and wherein said film has at least one perforate.

5, as claim 1 or 4 described methods, it further is included in described backboard is engaged to introduces a release material by described at least one perforate after the described transparent substrates.

6, method as claimed in claim 5, wherein said release material are xenon difluoride.

7, method as claimed in claim 4, it introduces a gas by described at least one perforate after further being included in and removing described sacrifice layer in described encapsulation.

8, method as claimed in claim 7, it seals described at least one perforate after further being included in and introducing described gas.

9, method as claimed in claim 7, wherein said film has at least two perforates.

10, method as claimed in claim 7, wherein said gas is through heating.

11, method as claimed in claim 7, wherein said gas are nitrogen or argon gas.

12, the method for claim 1, it further is included in described backboard is engaged to introduces a self aligned unimolecular layer by described at least one perforate after the described transparent substrates.

13, the method for claim 1, wherein said at least one perforate is arranged in described backboard.

14, method as claimed in claim 13, it comprises that further use one metal cap seals described at least one perforate.

15, method as claimed in claim 13 is wherein implemented described sealing by soldering.

16, method as claimed in claim 13, wherein said seal are a continuous seal body.

17, the method for claim 1 wherein was applied to described backboard with drying agent before described backboard is engaged to described transparent substrates.

18, the method for claim 1, wherein said method is carried out in environmental baseline.

19, the method for claim 1, it comprises that further use one polymkeric substance seals described at least one perforate.

20, the method for claim 1, wherein said at least one perforate is arranged in described seal.

21, a kind of display device of making by the method for claim 1.

22, a kind of device based on MEMS (micro electro mechanical system), it comprises:

The transmission member that is used for transmitted light;

Be used for the modulation member that the light of described transmission member is modulated is passed in transmission;

Be used to cover the covering member of described modulation member; And

Be used for described covering member is engaged to described transmission member forming the containment member of an encapsulation, and wherein said covering member or described containment member comprise the perforate of a sealing.

23, device as claimed in claim 22, wherein said transmission member comprises a transparent substrates.

24, device as claimed in claim 22, wherein said modulation member comprises an interferometric modulator array.

25, device as claimed in claim 22, wherein said covering member comprises a backboard.

26, device as claimed in claim 25, wherein said backboard are a film backboard.

27, device as claimed in claim 22, wherein said containment member comprises a sticker.

28, device as claimed in claim 22, it is injected into drying agent in the described encapsulation by described perforate before further being included in the described perforate of sealing.

29, device as claimed in claim 22, wherein said covering member has the drying agent that puts on the inside surface.

30, device as claimed in claim 22, the perforate of wherein said sealing is arranged in described covering member.

31, device as claimed in claim 30, the perforate of wherein said sealing is formed by a metal cap.

32, device as claimed in claim 30, the perforate of wherein said sealing is formed by a solder.

33, device as claimed in claim 22, the perforate of wherein said sealing is arranged in described containment member.

34, device as claimed in claim 33, the perforate of wherein said sealing is formed by the material that a viscosity is lower than the viscosity of described containment member.

35, device as claimed in claim 22, the perforate of wherein said sealing is formed by a polymkeric substance.

36, a kind of device based on MEMS (micro electro mechanical system), it comprises:

Be formed with the transparent substrates of a microelectromechanicdevices devices above one;

One backboard; And

One seal, described backboard is engaged to described transparent substrates described microelectromechanicdevices devices is encapsulated in the encapsulation, wherein said backboard or seal have the perforate of a sealing through structure for it.

37, device as claimed in claim 36, it comprises that further one was injected into drying agent in the described encapsulation by described perforate before the described perforate of sealing.

38, device as claimed in claim 36, wherein said backboard has the drying agent that puts on the inside surface.

39, device as claimed in claim 36, the perforate of wherein said sealing is arranged in described backboard.

40, device as claimed in claim 39, the perforate of wherein said sealing is formed by a metal cap.

41, device as claimed in claim 39, the perforate of wherein said sealing is formed by a solder.

42, device as claimed in claim 36, the perforate of wherein said sealing is arranged in described seal.

43, device as claimed in claim 42, the perforate of wherein said sealing is formed by the material that a viscosity is lower than the viscosity of described seal.

44, device as claimed in claim 36, the perforate of wherein said sealing is formed by a polymkeric substance.

45, device as claimed in claim 36, wherein said microelectromechanicdevices devices are an interferometric modulator.

46, device as claimed in claim 36, it further comprises:

One with the processor of described microelectromechanicdevices devices electric connection, described processor is configured to image data processing; And

One memory storage, itself and described processor electric connection.

47, device as claimed in claim 36, it further comprises one drive circuit, described driving circuit is configured to send at least one signal to described microelectromechanicdevices devices.

48, device as claimed in claim 36, it comprises that further one is configured to send to described driving circuit the controller of at least a portion of described view data.

49, device as claimed in claim 36, it comprises that further one is configured to send to described processor the image source module of described view data.

50, device as claimed in claim 36, wherein said image source module comprise a receiver, transceiver, reach at least one in the transmitter.

51, device as claimed in claim 36, it further comprises an input media that is configured to receive the input data and described input data is sent to described processor.

52, a kind of method of manufacturing one display device, it comprises:

The transparent substrates that is formed with a microelectromechanicdevices devices above one is provided;

By use a seal between a backboard and described transparent substrates described backboard is engaged to described transparent substrates to form an encapsulation, wherein said microelectromechanicdevices devices is sealed by described package encapsulation, and described encapsulation has at least one perforate; And

Reduce moisture in the described encapsulation by in described encapsulation, introduce a gas through described at least one perforate.

53, method as claimed in claim 52, it seals described perforate after further being included in and introducing described gas.

54, method as claimed in claim 52, wherein said gas is through heating.

55, method as claimed in claim 52, wherein said encapsulation has at least two perforates.

56, method as claimed in claim 55, wherein water vapour is discharged described encapsulation by a perforate in described at least two perforates.

57, method as claimed in claim 52, wherein said gas are an inert gas.

58, method as claimed in claim 57, wherein said inert gas are nitrogen or argon gas.

59, method as claimed in claim 52 wherein reduces moisture and further is included in and removes water vapour by described at least one perforate from described encapsulation before introducing described gas.

60, method as claimed in claim 59, wherein said remove to be included at least one parital vacuum is provided around the described encapsulation.

61, method as claimed in claim 52, wherein said at least one perforate is arranged in described seal.

62, method as claimed in claim 52, wherein said at least one perforate is arranged in described backboard.

63, method as claimed in claim 52, wherein said at least one perforate is arranged in described transparent substrates.

64, a kind of display device of making by method as claimed in claim 52.

65, a kind of display device, it comprises:

The transmission member that is used for transmitted light;

Be used for the modulation member that the light of described transmission member is modulated is passed in transmission;

Be used to cover the covering member of described modulation member; And

Be used for described backboard is engaged to described transparent substrates described microelectromechanicdevices devices is encapsulated in the containment member in the encapsulation, wherein said encapsulation has at least one end envelope, and wherein, described at least one end envelope is configured to allow the gas stream mistake before described at least one the end envelope of sealing for removing the moisture in the described encapsulation.

66, as the described device of claim 65, wherein said transmission member comprises a transparent substrates.

67, as the described device of claim 66, wherein said end envelope is arranged in described transparent substrates.

68, as the described device of claim 65, wherein said modulation member comprises an interferometric modulator array.

69, as the described device of claim 65, wherein said covering member comprises a backboard.

70, as the described device of claim 69, wherein said backboard is a film backboard.

71, as the described device of claim 65, wherein said containment member comprises a sticker.

72, as the described display device of claim 65, wherein said gas is water vapour.

73, as the described display device of claim 65, wherein said end envelope is arranged in described covering member.

74, as the described display device of claim 65, wherein said end envelope is arranged in described containment member.

75, as the described display device of claim 65, wherein said encapsulation has at least two end envelopes, and an end envelope in the described end envelope is configured to allow an inert gas is introduced in the described encapsulation, and another end envelope in the described end envelope is configured to allow water vapour to discharge described encapsulation before the described end envelope of sealing.

76, a kind of device based on MEMS (micro electro mechanical system), it comprises:

Be formed with the transparent substrates of a microelectromechanicdevices devices above one;

One backboard; And

One seal, it is engaged to described transparent substrates described microelectromechanicdevices devices is encapsulated in the encapsulation with described backboard, wherein said seal puts between described backboard and the described transparent substrates, and described encapsulation has at least one end envelope, wherein, described at least one end envelope is configured to allow the gas stream mistake before described at least one the end envelope of sealing for removing the moisture in the described encapsulation.

77, as the described device of claim 76, wherein said at least one end envelope is arranged in described backboard.

78, as the described device of claim 76, wherein said at least one end envelope is arranged in described seal.

79, as the described device of claim 76, wherein said at least one end envelope is arranged in described transparent substrates.

80, as the described device of claim 76, wherein said encapsulation has at least two end envelopes, and an end envelope in the described end envelope is configured to allow an inert gas is introduced in the described encapsulation, and another end envelope in the described end envelope is configured to allow water vapour to discharge described encapsulation before the described end envelope of sealing.

81, as the described device of claim 76, wherein said microelectromechanicdevices devices is an interferometric modulator.

82, as the described device of claim 76, it further comprises:

One with the processor of described microelectromechanicdevices devices electric connection, described processor is configured to image data processing; And

One memory storage, itself and described processor electric connection.

83, as the described device of claim 82, it comprises that further one is configured to send to described microelectromechanicdevices devices the driving circuit of at least one signal.

84, as the described device of claim 83, it comprises that further one is configured to send to described driving circuit the controller of at least a portion of described view data.

85, as the described device of claim 82, it comprises that further one is configured to send to described processor the image source module of described view data.

86, as the described device of claim 85, wherein said image source module comprises a receiver, transceiver, reaches at least one in the transmitter.

87, as the described device of claim 82, it further comprises an input media that is configured to receive the input data and described input data is sent to described processor.

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