CN1752244A - 一种用于制造高强度导电器件的三元铜合金 - Google Patents
一种用于制造高强度导电器件的三元铜合金 Download PDFInfo
- Publication number
- CN1752244A CN1752244A CN 200510012848 CN200510012848A CN1752244A CN 1752244 A CN1752244 A CN 1752244A CN 200510012848 CN200510012848 CN 200510012848 CN 200510012848 A CN200510012848 A CN 200510012848A CN 1752244 A CN1752244 A CN 1752244A
- Authority
- CN
- China
- Prior art keywords
- copper
- alloy
- magnesium
- conductive devices
- strength conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 12
- 229910052749 magnesium Inorganic materials 0.000 claims description 12
- 239000011777 magnesium Substances 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000003723 Smelting Methods 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 2
- 230000036314 physical performance Effects 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 description 10
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 8
- 229910052718 tin Inorganic materials 0.000 description 8
- 229910002056 binary alloy Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- KRDOMHYKEZZOQY-UHFFFAOYSA-N [Sn].[Mg].[Cu] Chemical compound [Sn].[Mg].[Cu] KRDOMHYKEZZOQY-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- PLZFHNWCKKPCMI-UHFFFAOYSA-N cadmium copper Chemical compound [Cu].[Cd] PLZFHNWCKKPCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100128487A CN100348753C (zh) | 2005-09-27 | 2005-09-27 | 一种用于制造高强度导电器件的三元铜合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100128487A CN100348753C (zh) | 2005-09-27 | 2005-09-27 | 一种用于制造高强度导电器件的三元铜合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1752244A true CN1752244A (zh) | 2006-03-29 |
CN100348753C CN100348753C (zh) | 2007-11-14 |
Family
ID=36679248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100128487A Active CN100348753C (zh) | 2005-09-27 | 2005-09-27 | 一种用于制造高强度导电器件的三元铜合金 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100348753C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1933037B (zh) * | 2006-08-25 | 2011-08-03 | 邢台鑫晖铜业特种线材有限公司 | 具有优良综合性能的铜合金接触线的制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840530B2 (ja) * | 1976-07-05 | 1983-09-06 | 日本純薬株式会社 | 巴布剤組成物 |
-
2005
- 2005-09-27 CN CNB2005100128487A patent/CN100348753C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1933037B (zh) * | 2006-08-25 | 2011-08-03 | 邢台鑫晖铜业特种线材有限公司 | 具有优良综合性能的铜合金接触线的制备方法 |
Also Published As
Publication number | Publication date |
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CN100348753C (zh) | 2007-11-14 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Triple copper alloy for making high-strength conductive devices Effective date of registration: 20190917 Granted publication date: 20071114 Pledgee: China Everbright Bank Limited by Share Ltd. Shijiazhuang branch Pledgor: XINGTAI XINHUI COPPER INDUSTRY SPECIAL WIRES Co.,Ltd. Registration number: Y2019130000005 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200918 Granted publication date: 20071114 Pledgee: China Everbright Bank Limited by Share Ltd. Shijiazhuang branch Pledgor: XINGTAI XINHUI COPPER INDUSTRY SPECIAL WIRES Co.,Ltd. Registration number: Y2019130000005 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A ternary copper alloy for manufacturing high strength conductive devices Effective date of registration: 20200927 Granted publication date: 20071114 Pledgee: China Everbright Bank Limited by Share Ltd. Shijiazhuang branch Pledgor: XINGTAI XINHUI COPPER INDUSTRY SPECIAL WIRES Co.,Ltd. Registration number: Y2020130000024 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221028 Granted publication date: 20071114 Pledgee: China Everbright Bank Limited by Share Ltd. Shijiazhuang branch Pledgor: XINGTAI XINHUI COPPER INDUSTRY SPECIAL WIRES Co.,Ltd. Registration number: Y2020130000024 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |