CN1739002A - Method and apparatus for measuring thickness of a test object between two eddy current sensor heads - Google Patents
Method and apparatus for measuring thickness of a test object between two eddy current sensor heads Download PDFInfo
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Abstract
A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
Description
Related application
The present invention is based on following U.S. Patent application, require their right of priority, and incorporate their full content into this paper at this with way of reference: on October 14th, 2003 submitted to, application number is 10/685,210 U.S. Patent application, this application has required again to submit on Dec 13rd, 2002, sequence number is 60/433, the right of priority of 429 U.S. Provisional Patent Application, their title are " METHOD AND APPARATUS FOR MEASURING OBJECTTHICKNESS ".
Background of invention
Technical field
The present invention relates generally to a kind of device of Measuring Object thickness, particularly a kind of device of Measuring Object thickness with eddy current sensor.
Background technology
Eddy current sensor is a noncontact measurement device, is used to measure the thickness of conductive body.Briefly, an eddy current sensor comprises a sensing coil, when sensing coil is driven by alternating current, can produce an oscillating magnetic field, and this oscillating magnetic field can produce eddy current on the surface of the conductive body of a vicinity.The size of this eddy current depends on the intensity in magnetic field and the impedance of this conductive body, and the resistance coefficient of the thickness of the impedance of this conductive body and this conductive body and this conductive body is relevant.So the thickness of this object can be determined by known resistance coefficient of this object and measured eddy current or impedance.
In semiconductor was made, eddy current sensor generally was used to measure the thickness of the conductive layer (for example copper layer) that deposits on wafer substrates.Eddy current sensor is used to measure the thickness at a conductive layer different sampling spots place on this wafer.In most applications, for fear of in subsequent processes (as etching), going wrong, have a thickness roughly the uniform conductive layer be very important.Therefore, the thickness of correctly measuring conductive layer is also just very important, so that in needs, can carry out suitable correction operation to obtain required thickness to wafer.Perhaps, directly discarded this wafer is to avoid unnecessary further processing.
Generally speaking, the currents sensing device of conductive layer thickness is very slow on the existing measurement wafer.And the currents sensing device moves very responsive for determinand with respect to the chance of eddy current sensor.Therefore, existing currents sensing device often has very complicated and expensive location control mechanism, so that keep a fixing distance between currents sensing device sensor and determinand (wafer).
Summary of the invention
The invention provides the method and apparatus of the thickness of measuring determinand (for example being deposited on the part of the conductive layer on the wafer substrates).The device of one or more embodiment comprises an eddy current sensor with first sensing head and second sensing head according to the present invention.Described sensing head positioned so that have a predetermined slit between the two, so that allow the part of determinand at least therebetween from passing.When determinand passes between sensing head, the measurement that sensing head carries out the given sampling spot on the determinand.This device also comprises a position sensing mechanism, in order to determine the position of the sampling spot on the determinand.This device also comprises an evaluation circuits, and it is connected with eddy current sensor and position sensing mechanism, to determine the thickness of determinand at each sampling spot.This device also can comprise a mechanism that determinand is moved through described slit when measuring.
According to one or more embodiment of the present invention, this device also comprises a displacement transducer, so that detect any displacement of determinand on the bearing of trend between first sensing head and second sensing head.Displacement transducer is communicated with this evaluation circuits, and this evaluation circuits is adjusted measured data, so that compensation is because of any error that displacement caused that is detected of determinand.
A kind of method according to one or more embodiment of the present invention comprises utilizes first sensing head and second sensing head that is positioned at the determinand opposition side, and the sampling spot place on determinand is measured.This method also comprises the position of determining the sampling spot on the determinand, and calculates the thickness of determinand at a plurality of sampling spots.During measurement, determinand is with respect to first sensing head and second sensing head and move.
According to one or more embodiment of the present invention, this method also comprises the step that detects any displacement of determinand on the bearing of trend between first sensing head and second sensing head.And measured data will be adjusted, so that any of compensation determinand is detected the error that displacement causes.
In the following detailed description, described before these features and further feature can easily be understood, and the mode by graphic extension in detailed description illustrates and introduced the specific embodiment of the present invention.Be appreciated that the present invention can have other different embodiment, and its various aspects can be modified all, but all modifications can not depart from the scope of the present invention.Therefore, accompanying drawing of the present invention and description only are illustrative, and not restrictive.
Description of drawings
Fig. 1 is a kind of synoptic diagram of representational eddy current sensor head;
Fig. 2 is the calcspar of a kind of Measuring Object thickness device of one or more embodiment according to the present invention;
Fig. 3 is the stereographic map of some assembly in Fig. 2 device;
Fig. 4 is the synoptic diagram that the magnetic flux line of a kind of single eddy current sensor of prior art distributes:
Fig. 5 is the synoptic diagram that the magnetic flux line of two eddy current sensor head measurement mechanisms of Fig. 2 distributes;
Fig. 6 illustrated a kind of according to the present invention the device of one or more embodiment, its variation for distance between determinand and the eddy current sensor head is more insensitive.
Fig. 7 is the synoptic diagram that the representative value of the compensated distance factor of one or more embodiment according to the present invention changes along with the determinand shift length: and
Fig. 8 is the process flow diagram of explanation process of a kind of Measuring Object thickness approach of one or more embodiment according to the present invention.
Embodiment
The present invention relates generally to a kind of dynamic currents sensing device, it can be rapidly and determines the thickness of determinand at its different sampling spots place exactly.In simple terms, this device comprises an eddy current sensor, and it has the sensing head in two predetermined slits that are separated by.When measuring, some part of determinand moves through this slit, and when determinand moves, and determinand can be measured comes out at the thickness of different sampling spots.This device also comprises a position transducer, so that when measuring, determine the position of each sampling spot with respect to determinand.
Be positioned at two eddy current sensor heads of determinand opposition side by utilization, the measuring accuracy of this device increases considerably.This is (convergence or away from sensing head) or shake and seem more insensitive because the moving inadvertently of the predetermined sampling spot that this device is produced when moving through this slit for determinand.So this device can be measured dynamically, allow a plurality of sampling spots promptly to be measured.
One or more embodiment expectation of the present invention comprises a kind of Z position transducer, so that measure the distance between determinand and the sensing head, and then determines compensating factor any and distance dependent.Thereby and compensating factor is applied in the measured raw data with complementary range and shock effect further improves the degree of accuracy of measuring.
Fig. 1 schematically illustrates a kind of representative eddy current sensor head 10 in the measurer for thickness of can be used for according to various embodiments of the invention.Eddy current sensor head 10 comprises a pot-shaped core 12 and a sensing coil 14.For instance, pot-shaped core 12 can be a kind of ferrite pot-shaped core of riving.For example, the diameter of pot-shaped core 12 is about 9 millimeters, highly is about 4 millimeters.Also can use core with other structure and size.14 available sizes of sensing coil are 26-32 number lead, and the number of turn is about the 10-30 circle.Also can use the lead and the loop construction of other size.
Sensing coil 14 can produce oscillating magnetic field when being driven by alternating current, and oscillating magnetic field can produce eddy current on the surface of contiguous conductive body.The size of this eddy current depends on the intensity in the magnetic field that alternating current produces and the impedance of conductive body, and the impedance of conductive body is relevant with the thickness and the resistance coefficient thereof of conductive body.So the thickness of conductive body can calculate by the known resistance coefficient of conductive body with by the detected ededy current gauge of sensing coil.
Also can use the eddy current sensor head of other type, for example a sensing head with two sensing coils.One of them main coil is being driven and is producing oscillating magnetic field by alternating current, another pick-up loop receives the response signal from this determinand simultaneously.
Fig. 2 be a kind of according to the present invention the representational calcspar of the device 20 of the Measuring Object thickness of one or more embodiment.Fig. 3 is the stereographic map of some element in the device 20.Refer now to Fig. 2 and Fig. 3, device 20 comprises an eddy current sensor, and it has two sensing heads 24,26, and both are connected with the form of series circuit or parallel circuit.Eddy current sensor head 24,26 is mounted respectively on support 28 separately, the preset distance so that they are separated by each other, thus form a door or slit betwixt.The distance in this slit can change along with the size of measured determinand.Generally speaking, for example measure when being deposited on the thickness of the rete on the wafer in semiconductor processing process, the scope of this clearance distance is between the 2-6 millimeter.Find that such scope provides suitable spot size, signal intensity and processing procedure fiduciary level in typical semiconductor processing process is used.
Eddy current sensor head 24,26 can be connected to a sensor board circuit 30.Sensor board circuit 30 is except produce driving the required alternating current of eddy current sensor head 24,26, and receives the pickup eddy current signal of an indication determinand thickness in the self-sensing head 24,26.Pickup eddy current signal with voltage form is transferred to controller 32, and controller 32 comprises an analog to digital converter, with the processing that the pick-up conversion of signals is become digital signal will describe below being used for.
It is variable being used for the alternating current of drive coil.For example, the frequency that drives alternating current but also can be used other current value between about 300kHz to 5MHz.
Device 20 also comprises an array that is made of position transducer 34, and when determinand 22 moved through slit between the eddy current sensor head 24,26, position transducer 34 detected the position of determinands 22.Position transducer 34 is connected to controller 32, and its middle controller 32 can be determined the sampling spot on the determinand 22 when carrying out thickness measure.The example that can be used in the position transducer in this array is optical sensor (for example, penetration (through beam) optical sensor).The example of suitable position transducer comprises the EX-11 type sensor that can buy from Japanese SUNX company.
In order further to improve the degree of accuracy of measuring, one or more embodiment expectations of the present invention comprise a Z position transducer 36, so that measure the distance between determinand 22 and the sensing head 24,26.So that determine any compensating factor relevant, and it is applied in the measured raw data influence of complementary range and vibrations with the position.And the example of suitable Z position transducer is a laser distance sensor.An example of this sensor is the XZ-30V type sensor that can buy from Japan OMRON.
Controller 32 calculates the thickness of determinand 22 at different sampling spots based on the reading separately that obtains from sensor.A kind of representational controller 32 can comprise an analog to digital converter, a programmable logic controller (PLC) (PLC) and a personal computer.The analog signal conversion that analog to digital converter will come from eddy current sensor and Z position transducer becomes digital form so that handle.Programmable logic controller (PLC) receives the transducing signal that comes from sensor, and carries out data recording (logging) or collecting function.Personal computer then receives the data that come from programmable logic controller (PLC), and carries out and measure and compensation calculating.Measurement result can be output to an output unit 33, for example graphoscope or printer.
There are many known methods can calculate the thickness of determinand according to the reading of eddy current sensor.For example, wherein a kind of known method utilization produces a sensor reading calibration curve from the empirical data of the eddy current sensor reading that particular test obtained of many known thickness.When using this device, the reading that eddy current sensor produces can be mapped to this calibration curve, thereby determines the thickness of measured determinand.
For example, will be described in now how operative installations 20 is measured a thickness that is positioned at the conductive layer on the wafer 22.Wafer 22 is located on the end effector that links to each other with the robots arm 38.Then the robots arm is activated and mobile wafer 22, and it is passed by two eddy current sensor heads, 24,26 formed slits.When wafer 22 moves through the slit, can be through the array that is constituted by position transducer 34, the position transducer 34 that is positioned at diverse location can be started or start to the leading edge of wafer 22 continuously simultaneously.When wafer 22 first position transducers 34 of process, the sensing flow process just is activated.The sensing flow process can comprise that eddy current sensor periodically reads the reading of thickness (for example sampling rate is that per second reads 1000 readings), and when the edge of wafer 22 each continuously arranged sensor of process, position transducer 34 detects to determine the speed of wafer 22.
Utilize these information, controller 32 can be determined in each sampling spot measured thickness and the position of each sampling spot on wafer.According to this kind mode, controller 32 can be obtained the measurement data on the certain line that extends through wafer 22.When obtaining the data on another certain line if desired, wafer 22 can be turned on the position that needs, and it is moved through device 20, to obtain the data of measurement.
This device is suitable for kinetic measurement, just measures when wafer moves through slit between two eddy current sensor heads.This device can be taken a sample apace, makes this device can promptly measure the thickness of wafer.For instance, according to one or more embodiment of the present invention, diameter is about 300 millimeters wafer can be in about 2 seconds, measured with the sampling number of about 2000 sampling spots, but also can use other sampling rate.
Lay respectively at two eddy current sensor heads of determinand opposition side by use, measured data cause casual or accidental the moving (convergence or away from sensing head) or the vibrations of predetermined sampling spot to seem more insensitive when moving through this slit for determinand.Therefore, can carry out more accurate measurement at each sampling spot.Simultaneously, can avoid using huge location control mechanism, and promptly finish measurement.When determinand moved through slit between two eddy current sensor heads, two eddy current sensor heads can read reading continuously.
By measuring the thickness of conductive layer on the wafer rapidly and exactly, can revise operation when needed, to obtain needed conductive layer thickness.For example, if need one roughly during homogeneous thickness, but measurement data demonstrates thickness and even inadequately, then wafer can be carried out optionally chemically mechanical polishing or other processing, so that obtain needed uniform thickness.
Fig. 4 is that the representative magnetic flux line that employed a kind of single eddy current sensor 50 is produced in the measurer for thickness of prior art distributes, and eddy current sensor also produces a kind of magnetic flux line pattern.Determinand intersects with many magnetic flux lines in the specific range being separated by with eddy current sensor.So if determinand 22 accidental convergences or away from eddy current sensor (even if very minutely move), the quantity of the magnetic flux line that intersects with determinand 22 just can marked change.And along with the change of the magnetic flux line quantity that intersects with determinand 22, the survey measurements of this eddy current sensor also can be along with change, and therefore the degree of accuracy of measuring also can reduce.
Fig. 5 is that the representative magnetic flux line that the two eddy current sensor heads 24,26 according to the measurement mechanism 20 of various embodiment of the present invention recited above are produced distributes.As shown in Figure 5, determinand 22 can convergence or away from eddy current sensor head 24,26, but the minimizing that keeps count of with its magnetic flux line that intersects with being changed significantly.Therefore, device 20 is more insensitive for the variation of distance between the two of determinand and eddy current sensor head.
Fig. 6 has illustrated the disparity map of the measurement result of two kinds of devices for the susceptibility of variable in distance, and wherein a kind of device only has single eddy current sensor head, and another kind of device then has two eddy current sensor heads.The size of shown eddy current sensor is only for reference among Fig. 6, and its size can be different according to specific application.
For more one going on foot the degree of accuracy of promoting thickness measure, can use a Z position transducer 36 to compensate careless the move error that caused of determinand on the bearing of trend between two eddy current sensor heads.Z position transducer 36 can detect the distance between determinand 22 and two eddy current sensor heads 24,26, so that determine a compensating factor relevant with the position, and it is applied in the raw data of measurement gained, with the influence of complementary range and vibrations.Fig. 7 is one and shows representative offset figure that representative offset wherein is based on determinand and selects with respect to the displacement of sensing head.Numerical value among this figure and can change because of the difference of employed device and determinand to some extent by the experiment gained.
Fig. 8 is the process flow diagram that a kind of process of the Measuring Object thickness approach according to one or more embodiment of the present invention has been described.In step 100, when mobile determinand by in first sensing head of determinand opposition side and the slit between second sensing head time, the thickness of determinand is measured at a sampling spot place on determinand.In step 110, determine the position of sampling spot on determinand.In step 120, detect determinand in the roughly any displacement on the bearing of trend between first sensing head and second sensing head.In step 130, determinand will be calculated and be adjusted at the thickness at sampling spot place, and when needed in order to compensate any displacement that is detected of determinand.
Described embodiments of the invention in detail, be appreciated that and carrying out various modifications to embodiments of the invention without departing from the spirit and scope of the present invention.
Claims (22)
1. device of dynamically measuring determinand thickness, it comprises:
Eddy current sensor with first sensing head and second sensing head, described first sensing head and described second sensing head are positioned, so that have a predetermined slit between the two, thereby allow at least a portion of described determinand pass from described slit, when described determinand was in place, described slit, described first sensing head and described second sensing head were measured the one or more sampling spots on the described determinand;
A mechanism that when carrying out described the measurement, is used for described determinand is moved through described slit;
A position sensing mechanism, it is used to determine one or more positions of the described one or more sampling spots on the described determinand; And
An evaluation circuits that is connected with described eddy current sensor and described position sensing mechanism, it is used to determine the thickness of described determinand at described one or more sampling spots place.
2. device according to claim 1, the wherein said mechanism that is used for described determinand is moved through described slit comprises an end effector of robot.
3. device according to claim 1 further comprises a displacement transducer, and it is used to detect the displacement of described determinand on bearing of trend between described first sensing head and described second sensing head.
4. device according to claim 3, wherein said displacement transducer is connected with described evaluation circuits, and wherein said evaluation circuits adjusts the measurement data of described first sensing head and second sensing head, to compensate the displacement of detected described determinand.
5. device according to claim 3, wherein said displacement transducer comprise a laser distance sensor.
6. device according to claim 1, wherein said evaluation circuits are embodied in a computer control.
7. device according to claim 6, wherein said computer control comprise an analog to digital converter, a programmable logic controller (PLC) and a personal computer.
8. device according to claim 1, wherein said position sensing mechanism comprises an array that is made of position transducer, when described determinand moved through described slit, described position transducer detected an edge of described determinand continuously.
9. device according to claim 8, wherein said evaluation circuits are determined the speed of described determinand according to the output of described position transducer.
10. device according to claim 8, wherein each position transducer comprises an optical sensor.
11. a method of measuring determinand thickness, it comprises the following steps:
(a) move described determinand and pass two slits between the eddy current sensor head;
(b) when described determinand moves through described slit, utilize the one or more sampling spots place of described eddy current sensor head on described determinand dynamically to measure;
(c) determine one or more positions of the described one or more sampling spots on the described determinand; And
(d) calculate the thickness of described determinand at described one or more sampling spots place.
12. method according to claim 11 wherein moves the step of described determinand and utilizes an end effector of robot to carry out.
13. method according to claim 11 further comprises and detects the displacement of described determinand on bearing of trend between described first sensing head and second sensing head.
14. method according to claim 13 further comprises and adjusts described measurement data, to compensate the described displacement of described determinand.
15. method according to claim 11 determines that wherein the step of the position of the described sampling spot on the described determinand comprises when described determinand moves through described sensing head, detects an edge of described determinand continuously.
16. method according to claim 15 further comprises the speed of determining described determinand.
17. a method of measuring determinand thickness, it comprises the following steps:
(a) when described determinand moves with respect to a given position, on the opposition side of described determinand, produce a magnetic flux, and measure the eddy current that is induced on the described determinand at a plurality of sampling spots place on the described determinand;
(b) determine the position of described sampling spot; And
(c) calculate the thickness of described determinand at described sampling spot place.
18. method according to claim 17, wherein said magnetic flux is produced by two relative eddy current sensor heads, and wherein said given position is a position between described sensing head.
19. method according to claim 17, wherein said magnetic flux is produced by two relative eddy current sensor heads, and described method further comprises the displacement of the described determinand of detection on bearing of trend between described first and second sensing heads.
20. method according to claim 19 further comprises and adjusts the thickness that calculates, to compensate the displacement of described determinand.
21. a method of measuring determinand thickness, it comprises the following steps:
(a) utilize an end effector of robot that described determinand is moved through an eddy current sensor;
(b) when described determinand moves through described eddy current sensor, utilize described eddy current sensor that one or more sampling spots of described determinand are dynamically measured;
(c) determine one or more positions of the described one or more sampling spots on the described determinand; And
(d) calculate the thickness of described determinand at described one or more sampling spots place.
22. method according to claim 21 determines that wherein the step of the position of the described sampling spot on the described determinand comprises when described determinand moves through described eddy current sensor, detects an edge of described determinand continuously.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43342902P | 2002-12-13 | 2002-12-13 | |
| US60/433,429 | 2002-12-13 | ||
| US10/685,210 | 2003-10-14 |
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| CN1739002A true CN1739002A (en) | 2006-02-22 |
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| CN 200380108698 Pending CN1739002A (en) | 2002-12-13 | 2003-12-12 | Method and apparatus for measuring thickness of a test object between two eddy current sensor heads |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102183198A (en) * | 2011-03-15 | 2011-09-14 | 清华大学 | Device for measuring film thickness of silicon slice |
| CN102410822A (en) * | 2010-09-21 | 2012-04-11 | 捷毅系统股份有限公司 | Device and method for measuring thickness |
| CN102538655A (en) * | 2012-01-09 | 2012-07-04 | 清华大学 | Device and method for measuring thickness of conductor membrane |
| CN103234449A (en) * | 2013-05-09 | 2013-08-07 | 清华大学 | Conductor film thickness measurement method and device capable of effectively reducing effect of fluctuation of lift-off |
| CN102080949B (en) * | 2009-12-01 | 2013-11-06 | 无锡华润上华半导体有限公司 | Silicon epitaxial film thickness measuring method and device |
| CN105806234A (en) * | 2016-04-27 | 2016-07-27 | 中北大学 | Automatic detection device and detection method for thickness of solid rocket engine coating |
| CN106500639A (en) * | 2016-12-08 | 2017-03-15 | 太仓源凯汽车配件有限公司 | A kind of executor's detection means |
| CN106969700A (en) * | 2017-06-02 | 2017-07-21 | 江苏理工学院 | A kind of sheet metal thickness detection apparatus |
| CN113664712A (en) * | 2021-08-13 | 2021-11-19 | 芯盟科技有限公司 | Eddy current detection device and method for measuring thickness of metal layer |
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2003
- 2003-12-12 CN CN 200380108698 patent/CN1739002A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102080949B (en) * | 2009-12-01 | 2013-11-06 | 无锡华润上华半导体有限公司 | Silicon epitaxial film thickness measuring method and device |
| CN102410822B (en) * | 2010-09-21 | 2013-07-24 | 捷毅系统股份有限公司 | Device and method for measuring thickness |
| CN102410822A (en) * | 2010-09-21 | 2012-04-11 | 捷毅系统股份有限公司 | Device and method for measuring thickness |
| CN102183198B (en) * | 2011-03-15 | 2012-08-22 | 清华大学 | Device for measuring film thickness of silicon slice |
| CN102183198A (en) * | 2011-03-15 | 2011-09-14 | 清华大学 | Device for measuring film thickness of silicon slice |
| CN102538655A (en) * | 2012-01-09 | 2012-07-04 | 清华大学 | Device and method for measuring thickness of conductor membrane |
| CN102538655B (en) * | 2012-01-09 | 2014-04-09 | 清华大学 | Device and method for measuring thickness of conductor membrane |
| CN103234449A (en) * | 2013-05-09 | 2013-08-07 | 清华大学 | Conductor film thickness measurement method and device capable of effectively reducing effect of fluctuation of lift-off |
| CN103234449B (en) * | 2013-05-09 | 2015-12-09 | 清华大学 | Reduce electrically conductive film method for measuring thickness and the device of lift-off influence of fluctuations |
| CN105806234A (en) * | 2016-04-27 | 2016-07-27 | 中北大学 | Automatic detection device and detection method for thickness of solid rocket engine coating |
| CN106500639A (en) * | 2016-12-08 | 2017-03-15 | 太仓源凯汽车配件有限公司 | A kind of executor's detection means |
| CN106969700A (en) * | 2017-06-02 | 2017-07-21 | 江苏理工学院 | A kind of sheet metal thickness detection apparatus |
| CN113664712A (en) * | 2021-08-13 | 2021-11-19 | 芯盟科技有限公司 | Eddy current detection device and method for measuring thickness of metal layer |
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