CN1725475A - 散热器 - Google Patents
散热器 Download PDFInfo
- Publication number
- CN1725475A CN1725475A CNA2004100508284A CN200410050828A CN1725475A CN 1725475 A CN1725475 A CN 1725475A CN A2004100508284 A CNA2004100508284 A CN A2004100508284A CN 200410050828 A CN200410050828 A CN 200410050828A CN 1725475 A CN1725475 A CN 1725475A
- Authority
- CN
- China
- Prior art keywords
- radiating fin
- radiator
- protective device
- framework
- baffle plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100508284A CN100372106C (zh) | 2004-07-22 | 2004-07-22 | 散热器 |
US11/135,575 US7218522B2 (en) | 2004-07-22 | 2005-05-23 | Heat dissipating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100508284A CN100372106C (zh) | 2004-07-22 | 2004-07-22 | 散热器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1725475A true CN1725475A (zh) | 2006-01-25 |
CN100372106C CN100372106C (zh) | 2008-02-27 |
Family
ID=35656904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100508284A Expired - Fee Related CN100372106C (zh) | 2004-07-22 | 2004-07-22 | 散热器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7218522B2 (zh) |
CN (1) | CN100372106C (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100717791B1 (ko) * | 2005-05-25 | 2007-05-11 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
US20070084583A1 (en) * | 2005-10-14 | 2007-04-19 | Wen-Hsing Pan | Structure for connecting radiating fins |
KR100775761B1 (ko) | 2006-09-05 | 2007-11-09 | 김현종 | 히트싱크장치 |
JPWO2008035540A1 (ja) * | 2006-09-19 | 2010-01-28 | 日本電気株式会社 | 電子装置搭載機器とその共振抑制方法 |
DE112008001425T5 (de) * | 2007-05-25 | 2010-04-15 | Molex Inc., Lisle | Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet |
US20090284933A1 (en) * | 2008-05-15 | 2009-11-19 | Edison Opto Corporation | Combination type heat dissipation module |
TW201333408A (zh) * | 2012-02-06 | 2013-08-16 | Hon Hai Prec Ind Co Ltd | 散熱器組合 |
JP5722394B2 (ja) * | 2013-07-11 | 2015-05-20 | 株式会社タクボ精機製作所 | 熱交換器 |
KR102671866B1 (ko) | 2019-01-17 | 2024-05-31 | 엘에스일렉트릭(주) | 인버터용 방열모듈 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4009752A (en) | 1975-02-24 | 1977-03-01 | Honeywell Information Systems Inc. | Warp-resistant heat sink |
JPH02243356A (ja) * | 1989-03-17 | 1990-09-27 | Seiko Epson Corp | インパクトドットヘッド |
CN2310973Y (zh) * | 1997-01-15 | 1999-03-17 | 欧可辉 | 插片式散热器 |
CN2307279Y (zh) * | 1997-01-30 | 1999-02-10 | 吴宗 | 高密度鳍片式散热片 |
CN2364421Y (zh) * | 1999-02-27 | 2000-02-16 | 富准精密工业(深圳)有限公司 | 散热装置 |
TW433255U (en) | 1999-10-25 | 2001-05-01 | Chi Jing Optoelectronics Corp | Packing positioning seat for LCD glass substrate |
JP2002190683A (ja) * | 2000-12-22 | 2002-07-05 | Fujikura Ltd | ヒートシンク |
CN2519325Y (zh) | 2001-11-28 | 2002-10-30 | 双鸿科技股份有限公司 | 改良型薄型散热器 |
JP4125929B2 (ja) * | 2002-08-23 | 2008-07-30 | マルヤス工業株式会社 | 空冷式熱交換器用プロテクタ |
CN2657198Y (zh) | 2003-09-27 | 2004-11-17 | 鸿富锦精密工业(深圳)有限公司 | 组合鳍片式散热器 |
-
2004
- 2004-07-22 CN CNB2004100508284A patent/CN100372106C/zh not_active Expired - Fee Related
-
2005
- 2005-05-23 US US11/135,575 patent/US7218522B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7218522B2 (en) | 2007-05-15 |
CN100372106C (zh) | 2008-02-27 |
US20060018096A1 (en) | 2006-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yantai Fu Precision Electronics Co., Ltd. Assignor: Hung Fujin Precision Industry (Shenzhen) Co., Ltd.|Hon Hai Precision Industry Co Contract record no.: 2011990000050 Denomination of invention: Radiator casing and its manufacture Granted publication date: 20080227 License type: Exclusive License Open date: 20060125 Record date: 20110120 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080227 Termination date: 20140722 |
|
EXPY | Termination of patent right or utility model |