CN1714982A - System and method for generating and controlling multiple independently steerable laser beams for material processing - Google Patents

System and method for generating and controlling multiple independently steerable laser beams for material processing Download PDF

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Publication number
CN1714982A
CN1714982A CNA2004100769602A CN200410076960A CN1714982A CN 1714982 A CN1714982 A CN 1714982A CN A2004100769602 A CNA2004100769602 A CN A2004100769602A CN 200410076960 A CN200410076960 A CN 200410076960A CN 1714982 A CN1714982 A CN 1714982A
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China
Prior art keywords
pencil
mirror
laser
processing system
group
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CNA2004100769602A
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Chinese (zh)
Inventor
T·E·里造特
O·奥哈尔
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Priority claimed from US10/883,290 external-priority patent/US20040251243A1/en
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1714982A publication Critical patent/CN1714982A/en
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Abstract

A laser process system with multiple, independently steerable laser beamlets and including a laser and beam shaper for generating a shaped source beam, a splitter stage for generating a plurality of beamlets from the shaped source beam, a beamlet controller including an independently steerable beamlet steering mirror for and corresponding to each beamlet for independently directing the corresponding beamlet, a mirror controller for controlling each beamlet steering mirror, and an optical path including a scanning lens for directing each steered beamlet to a target area of a workpiece. Each beamlet steering mirror is a multi-axis micro-electro-mechanical mirror and the system further includes a beam dump located in the optical path for intercepting a beamlet steered into the beam dump by the corresponding beamlet steering mirror.

Description

For the generation of materials processing with control the System and method for of many steerable laser beams of independence
Technical field
The present invention relates to a kind of method and apparatus that generates and guide many independent laser beams that are used for materials processing.
Background technology
Focus on directed laser beam and generally be used for various processing, such as getting out blind hole, through hole and little path, laser imaging, cutting substrate and finishing or custom layout, boring, cutting and selective material are removed and other complicated machined and smart machine operations, wherein relate to materials such as thin metal, polymer, integrated circuit and substrate.Some processing is called " focus machined ", and purpose generally is one or more laser beam energy to be gathered together converge at the point of an expectation, or is called " laser imaging ", and purpose is that the aperture area of laser beam is imaged onto on the target surface.This class is handled extremely complicated, be usually directed to take place at the same time or continuous operation in, simultaneously or use single or multiple laser instruments or multiclass laser instrument continuously, such as visible light, infrared (IR) and ultraviolet (UV) laser instrument.
Yet this class treated side is to some reproductions and relevant problem, and for example operation of a certain appointment such as getting out path or smart machined integrated circuit or mechanical part, often only needs a part of laser beam power, and many laser powers are not fully utilized.This problem is relevant with another problem again, promptly to specifying the required time of workpiece processing.In other words, the processing of many application laser, such as drilling through the hole or integrated circuit or mechanical part are made machine operations in circuit board, substrate or integrated circuit, number of operations is extremely many, finishes and specifies the time of workpiece quite long.
The general solution of these two problems is well-known, comprises single laser beam is divided into many strips bundle or pencil, does a plurality of same operations abreast simultaneously.
In the typical laser-processing system of original technology of using these methods, the source bundle that laser instrument produces is by one or more beam splitter levels, each beam splitter level comprises a beam splitter and a related with it collimation prism, the former is divided into two or many pencils to wall scroll source bundle, and the latter is gathered into one group of parallel pencil to the pencil guiding from this beam splitter.Repeat beam splitting and alignment procedure continuously, in each group, generate the pencil of requirement and the pencil group of requirement.Every group of pencil passes through one " path balanced device " then, and each " path balanced device " comprises that it is the length that workpiece passes through that a transmission path by the little mirror of a plurality of galvanometer control types, little mirror are arranged to be controlled to balanced each small echo arrival target.So last allows respectively to organize parallel pencil by " manipulation " abreast with gather on the workpiece target area of expectation to handling little mirror and one group of shared scanning mirror of pencil every group of pencil.This equilibrium path also comprises " carefully " at last, handles every group of parallel pencil in view of the above, makes one group the masked or absorber element interception of one or more pencil, is promptly eliminated by " collection " in this group.
Though these methods are in widespread usage, but problem of this type systematic long-term existence, little mirror is general to be allowed every group of pencil to be independent of other each group and is handled though for example can handle in the beam Propagation path, and the pencil pattern in every group generally is limited to the parallel pencil pattern of fixing that the one or more beam splitter levels of the sort of picture are produced.In other words, though in the transmission path handle little mirror can the group in pencil between the interval control to some degree, and, still can not be manipulated to desired destination to all pencils in the group one by one in organizing by some pencil being dropped into beam dump and they being eliminated.
Therefore, unless target pattern such as the track layout that will get out conform to existing pencil pattern in the group, otherwise must be by some pencil at least in the line collecting method elimination group, in order to avoid get out undesired path.As a result, owing to " collect " pencil greatly, thereby with regard to the utilization of effective laser power, efficient is invalid greatly can to make system.And, owing to having reduced the effective pencil quantity of each procedure of processing and therefore having increased required number of steps, just obviously increased the required time of processing work.
Summary of the invention
The present invention is directed to the laser-processing system of the steerable laser pencil of many independences of a kind of usefulness processing work, this system comprises the laser instrument that generates shaping source bundle with the beam shaping device, by the beam splitter level and the pencil controller of many pencils of shaping source Shu Shengcheng, wherein comprises to be used for and to handle mirror, control each pencil and handle the little mirror controller of mirror and contain scanning mirror with respectively being handled the lead light path of workpiece target area of pencil so that the independence of independent this correspondence pencil of guiding can be handled pencil corresponding to each pencil.
It is a kind of multiaxis microcomputer Electronic Speculum that each pencil is handled mirror, can handle around at least one axle, generally can handle around twin shaft.This laser-processing system comprises that also one is positioned at the beam dump of light path, and available corresponding pencil is handled mirror controlled pencil is blocked into this beam dump.
Description of drawings
The present invention is described with reference to the accompanying drawings for example, wherein:
Figure 1A illustrates the laser-processing system of an original technology;
Figure 1B illustrates the laser beam splitter device that connects the beam collimation device after;
Fig. 1 C illustrates a general beam splitter level;
Fig. 1 D is the general pencil pattern that the laser-processing system of original technology generates;
Fig. 2 A illustrates a laser-processing system of the present invention;
Fig. 2 B is the correction of laser-processing system among Fig. 2 A;
Fig. 3 A illustrates the optical beam steering method in the laser-processing system of original technology;
Optical beam steering method in Fig. 3 B diagram laser-processing system of the present invention; With
Fig. 4 illustrates another embodiment of laser-processing system of the present invention.
The specific embodiment
A, original technological system brief introduction (Figure 1A and 1B)
With reference to Figure 1A~1D the general structure of original technology laser-processing system and the difference between operation and original technology and system of the present invention are described.
Shown in Figure 1A~1D, the laser-processing system 10 of original technology comprises laser instrument 12, and it is generation source bundle 14 in visible light or ultraviolet (UV) or infrared (IR) scope.Source bundle 14 is by one or more one-tenth form classes 16, and the latter is shaped and formation source bundle 14, again by one or more beam splitter levels 18.Each beam splitter level 18 comprises beam splitter 20, and each input beam such as source bundle 14 is divided into two or more pencils 22, and it comprises for example illustrated prism or half-reflecting mirror, can produce reflecting bundle and transmitted beam, and each bundle all is a pencil 22.Beam splitter level 18 generally also comprises the collimation prism 24 of an association, pencil 20 can be imported parallel pencil 22 group 26 again from beam splitter 20.Shown in Figure 1A, system 10 comprises two or more beam splitter levels 18, one or more input beams that 18 pairs of each beam splitter levels are received from laser instrument 12 for example or last beam splitter level 16 carry out beam splitting and collimation, produce the quantity of the group 26 of the pencil 22 of requirement and required pencil 22 in every group 26.
This respect must be pointed out that with reference to Fig. 1 C this moment, general beam splitter level 18 may be the input beam 28 of source bundle 14 or pencil 22 along power shaft 30 receptions, and produced the output group 32 that contains many output beams 34.The axis of every output bundle 34 is parallel to single output shaft 36, thereby is parallel to the axis of each other output beam 34, forms pattern 38 in passing through the pattern plane 40 of output shaft 36, shown in Fig. 1 C.As to be discussed below, the output beam 34 of each group 32 is every group 26 a pencil 22, led into one a group of parallel pencil rather than a rule pencil by the optical element of system 10, significant limitation the adaptability of 38 pairs of various patterns in workpiece target area of pattern of pencil 22.
Refer again to Figure 1A, by a path balanced device 42, the latter comprises two balanced branch roads 44 to every group 26 pencil 22, is designated as balanced branch road 44A and 44B from beam splitter level 18.The polylith that is controlled by galvanometer 48 separately can be handled mirror 46 and handle by balanced branch road 44A or 44B and respectively organize 26 pencil 22.Known as association area, the function of path balanced device 42 is that each pencil 20 of balance arrives the path that workpiece 52 target areas 50 are passed through.
At last, the pencil of group 26 is handled gathered on the target area 50 of workpiece 52 handling mirror 46 and scanning mirror 54 along last of balanced branch road 44A and 44B, and scanning mirror 54 is shared by balanced branch road 44A and 44B, also is the common terminal of balanced branch road 44.This respect uses x-y workbench 54 as shown in the figure, and workpiece 52 is generally made located lateral along horizontal plane to the last pattern 38 of pencil 22, locatees along vertical positive axis and workbench 54 is also sure.
At last, every balanced branch road 44A and 44B comprise a beam dump 56, handle in view of the above and respectively organize 26 parallel pencil 22 by balanced branch road 44, one or more pencil 22 of group 26 is tackled by the mask of beam dump 40 or absorber element, thereby from organizing 26 li " collections " or eliminating pencil 22.
Must be pointed out now, one or as one group polylith can handle mirror 46 along a path each group target goal district 34, promptly respectively organizing all pencils 22 of 26 can handle mirror 46 and reflect in groups from each, and same incident and angle of reflection are arranged, thereby keep being parallel to each other and in pattern plane 40, being in same relative position mutually.Can handle unique effect that mirror 46 reboots the pencil 22 of group 26 at every turn, be to reboot whole group 26 pencil 20 along new axis, and can change the interval between the pencil 20 that passes pattern plane 40 that this incident and angle of reflection geometry from little mirror is known.Know that also group 26 is passed any interval variation between all pencils 22 on pattern plane 40, on direction between group 26 all pencils 22 and amplitude, be the linear ratio relation.Change a kind of words method, group 26 is for " handling " in groups, and the yardstick of its pattern 38 changes in proportion, can not handle in group 26 but organize 26 interior each pencils 22.
Therefore, can or shrink around transversal line expansion though organize the transverse pattern 38 of 26 pencils 22, pattern 38 can not change itself, unless with beam dump 56 " collection " one or more pencil 22.So, for example, just must collect the pencil 22 of pencil 22 minimizing groups 26 thereon if the pattern of the target area 50 that the pattern 38 of group 26 pencils 22 and pencil 22 are worked mismatches, match up to the pattern 38 of residue pencil 22 and some target area 50 at least.
This respect will point out, beam dump 56 is general " clamps " pattern of group 26 pencils 22 along fixing lines, thereby still limited the ability of selecting the pencil 22 that will collect.And, " clamping lines " can not with the pattern optimization orientation of the pattern and the target area 50 of pencil 22.Therefore, pattern " collection " pencil 22 that is fit to target area 50 for the pattern that makes pencil 22, the pencil 22 that can cause use is than the pencil much less that comes in handy, and correspondingly reduced the utilization rate that 14 effective power are restrainted in the source, prolonged and finished the required time of action required.
B, explanation of the present invention (Fig. 2 A and 2B)
Explanation the present invention now is noted that label 100 and above label are used in following explanation for ease of describing the present invention and distinguishing mutually with above-mentioned original technology, and original technology is then used the label in 10~56.
Various details laser-processing system 100, it is by being provided with all problems that independent steerable pencil 22 and further feature have solved above-mentioned original technology.
The laser-processing system 100 of the present invention's one example is shown in Fig. 2 A and 2B, and wherein Fig. 2 A illustrates 3 laser-processing systems 100, and Fig. 2 B illustrates the correction type of laser-processing system 100 among Fig. 2 A.
Shown in Fig. 2 A and 2B, at least one laser instrument 102 for example is a kind of visible light, infrared (IR) or ultraviolet (UV) laser instrument.System 100 comprises a plurality of dissimilar laser instruments 102, or the flexibility of the laser type that is provided for processing, or allowing to use more than a kind of laser instrument or more than one laser instrument carries out simultaneously or continuous operation.But for simple and clear, 100 of the exemplary laser systems of processing of below describing the present invention and being discussed illustrate a laser instrument 102.
As shown in the figure, the source bundle 104 that laser instrument 102 produces is by the aperture 108 of one or more light-beam shapers 106 and optional array of apertures 110, constitute a source bundle 112 that is shaped, then, shaping source bundle 112 is by a multistage beam splitter 114, and every grade of the latter produces many pencils 116 according to source bundle 112 or from the input pencil 116 of last beam splitter level.
Multistage beam splitter 114 comprises the beam splitter level 118 of arranging by branched sequence, and each beam splitter level 118 is divided into two or more output beams to the input beams from previous stage, and progression depends on the quantity of the pencil 116 of the quantity of pencil 116 of generations at different levels and expectation.As showing in the row system 100 at Fig. 2 A and 2B, multistage beam splitter 114 comprises beam splitter level 118A~118C, wherein import beam splitter level 118A shaping source bundle 112 is divided into two pencils 116, each bar output pencil 116 guiding second level beam splitting is one corresponding among 118B and the 118C, and second level beam splitter level 118B and 118C export pencils 116 to two of input pencil 116 generations separately.
In the embodiment of Fig. 2 A and 2B, each beam splitter level 118 comprise beam splitter 120 and after the collimation prism 122 that connects, each first order bundle 116 of beam splitter level 118A output is fixed one corresponding among little mirror 124A or 124B right angle guiding second level beam splitter level 118B and the 118C accordingly.But should be understood that beam splitter level 118 can constitute with multiple mode, such as being equipped with one or more prism or a half-reflecting mirror, with reflection and emission part bundle, or adapted combined type prism and little mirror.And, also 118 designs of beam splitter level and formation unnecessary output pencil be can be produced from single input beam, and control shaping source bundle 112 or pencil 116 led with some kinds of elements such as little mirror or prism etc.Should also be understood that continuous beam splitter level 118 can be constituted " straight line " arranges, be not by continuous angle light beam from the one-level next stage that leads, if between the output pencil enough horizontal separations are arranged, then the inter-stage changed course means does not need little mirror or prism.
Shown in Fig. 2 A and 2B, multistage beam splitter 114 also comprises the entrance of the path balanced device of being made up of equilibrium path 126A and 126B 126, as shown in the figure, equilibrium path 126A and 126B comprise pencil controller 128, be called pencil controller 128A and 128B, provide independently operation and " collection " pencil 116 from multistage beam splitter 114.
In the laser-processing system 100 of Fig. 2 A, the pencil 116 of each pencil controller 128A and 128B output is directed to corresponding fixed mirror 130A and 130B, the latter handles mirror 132A and 132B to pencil 116 guiding by some angles, and they all are the little mirrors of galvanometer control.Handle the entrance hole diameter 134 that mirror 132A and 132B then operably import pencil 116 single scanning mirror 136, the latter collimates pencil 116 and gather on the target area of selecting on workpiece 142 working faces 140 138.
In the laser-processing system 100 of Fig. 2 B is revised, by fixed mirror 130A and 130B, handle the assembly that mirror 132A and 132B and scanning mirror 136 are formed, can be divided with copying as and separate and parallel path, " can be collected " independently and can handle independently respectively respectively from the pencil 116 of fixed mirror 130A and 130B.This correction allow by the pencil 116 that fixed mirror 130A and 130B handle handled and remained in the target area different on workpiece 142 working faces 140 138, on the workpiece 142 different operating faces 140 on the interior or different workpieces 142 different operating faces in different target area 138 in the different target area 138.
Should be understood that, this correction has obviously improved the flexibility of the Laser Processing of laser-processing system 100, and no matter target area 138 is positioned at same still different working surface 140, perhaps even on different workpiece 142, the quantity of the target area 138 that laser-processing system 100 can be operated has thereon simultaneously enlarged one times.
Refer again to pencil controller 128, each controller 128 comprises that one is used for and corresponding to handling mirror 144 from the steerable pencil of the independence of respectively importing pencil 116 of multistage beam splitter 114, it is designated as pencil manipulation mirror 144A~144D in Fig. 2 A and 2B.Each pencil manipulation mirror 144 is positioned at the path from multistage beam splitter 114 corresponding each pencils 116, generally is made up of micro electronmechanical (MEM) mirror.Each pencil of each pencil controller 128 is handled the MEM controller 146 that mirror 144 is controlled by respective fine bundle controller 128 one by one dividually, is designated as MEM controller 146A and 146B, so can control each pencil 116 independently.
This respect need be pointed out, containing pencil, to handle the size of MEM mirror of mirror 144 more much smaller than the size of the little mirror of galvanometer control type, make pencil handle mirror 144 along by abutting against together every must being enough to, and pencil is handled the path that mirror is positioned at every such pencil 120 from a plane of 114 every groups of pencils of multistage beam splitter, 116 axis or some interplanars.Known to those skilled in the relevant art, the little mirror of MEM also constitutes usually and can or tilt around one or two axis rotations, thereby can control the incidence angle of each pencil 116, and the reflecting surface that corresponding pencil is handled mirror 144 is this two axis and controlled relatively.Can critically control the direction of each pencil 116 so again one by one, thereby pencil handles mirror 114 and can handle corresponding each bar pencil 116 from multistage beam splitter 114 one by one, and by the angle and the direction that determine each bar pencil 116 from MEM controller 146A and 146B control signal corresponding one by one.
This respect will point out that also the controller 128 of respectively restrainting of laser-processing system 100 comprises at least one beam dump 148, and an independent every pencil 116 that is used for and handles corresponding to control device of light beam 128 from beam dump 148.As discussed, beam dump 148 can be got " sheltering " form that absorbing material surrounds pencil 116 paths, thereby by do skew fully along arbitrary axis, just can import " sheltering " to pencil 116, the i.e. absorbing trap that is provided with along the path of pencil 116 is as long as pencil 116 is handled this " trap ".As in the embodiment of Fig. 2 B, beam dump 148 is positioned at " downstream " of pencil manipulation mirror 114 and normally can handles outside the path at each pencil 116, thereby corresponding pencil manipulation mirror 114 can handle beam dump 148 with each bar pencil 116.Among the embodiment shown in Fig. 2 A, each pencil 116 has a beam dump 148 independently, and it is positioned at the light path next door.In other embodiments, surrounded every light path by some pencils 116 shared beam dumps 148, so one " window " in the pencil 46 transmitted beam flow collectors 148.
As previously mentioned, beam dump 148 is used for reducing the quantity of pencil 116, and its method for example is the path that stops pencil 116 with " optical gate ", or " trap " of the path of pencil 116 importing absorbing material.Just as discussed, in the system of original technology, 116 of pencils are formed to be handled, and pencil in groups 116 lines up fixed pattern in group, thus will by along shelter qualification one fixedly the lines pattern of " clamping " pencil 116 from this pattern, remove pencil 116.Yet, because the pencil 116 of laser-processing system 100 is steerable one by one, therefore can not only revise the pattern of pencil 116, can also handle independently by the pencil 116 that every is selected and go into common " beam dump " or the beam dump 148 special-purpose separately, " collection " pencil 116 one by one the pencil 116 of this selection.
In a word, in the system of original technology, every group of pencil forms fixing parallel pencil pattern, and this pattern can only be formed manipulation, and form that can only be by " clamping " one group of light beam along fixing straight line or curve could be changed the pencil pattern with beam dump.On the contrary, in laser-processing system 100 of the present invention, available pencil is handled mirror 144 and is handled every pencil 116 one by one publicly, thereby the pencil 116 of laser-processing system 100 of the present invention can be manipulated to from pencil and handle any point in the light path that mirror 144 extends to scanning mirror 136 and pass the aperture or transverse plane, so every pencil 116 can be manipulated to the target area of freely selecting accordingly on workpiece 142 working faces 140 138 independently one by one.With the same manner, every pencil 116 handle can be gone into beam dump 148 one by one dividually, thereby can eliminate each bar pencil 116 for 116 li, this and the location independent of pencil 116 in organizing from one group of pencil.
Fig. 3 A and 3B show this difference of the laser-processing system 10 of laser-processing system 100 of the present invention and original technology, promptly be independent of in the group other pencil 116 and handle the ability of every pencil 116 dividually, with can only group operation one group 26 the ability of pencil 22 shine in pairs.
Fig. 3 A is the partial simplified figure of the laser-processing system 10 of original technology, shows the control of pencil 22, wherein organizes 26 pencil 22 and can only control in groups.As shown in the figure, the pencil 22 of group 26 is directed to can handle little mirror 46A, for the purpose of simply understanding, is shown around two axis rotations handling little mirror 46A among the figure.Little mirror 46A by an optional angle the pencil 22 of the group 26 little mirror of next piece that leads, the latter also be one as shown handle little mirror 46B or a fixing little mirror.Such as has been noted, can handle or rotation around two axis of x and y because of handling little mirror 46A, so little mirror 46A can along with respect to group 26 normal direction cener lines arbitrary whole or any make up ± x or ± pencil 22 of y coordinate or axis manipulation or deflection group 26.Be shown in the drawings along group 26 path with can handle related certain of little mirror 46B a bit, beam dump 56 can be set, thereby organize 26 edge ± x ,+y or-one of y coordinate or axis do enough big deflection, will cause one or more pencil 22 to be caught by beam dump 56 and from organizing elimination 26.22 grades of need of pencil of group 26 arrive workpiece 52 by the remaining light path that can handle little mirror 46 (being illustrated as 46C) and scanning mirror 54 that generally also comprises.Obviously as previously mentioned, the pencil 22 of group 26 can only be handled as the group 26 with fixed pattern 38.In other words, group 26 can along arbitrary ± x ,+y or-y coordinate or axis or along combination arbitrarily ± x ,+y or-y coordinate or axis can only be offset with forming, itself fully make these pencil 22 interception beam dumps 56 and organize 26, can only be made into " collection " or " clamping " some pencil 22 by such skew.
Fig. 3 B is the local sketch of laser-processing system 100 of the present invention, and as can be seen, laser-processing system 100 generally is similar to laser-processing system 10.But point out that monolithic can be handled little mirror 46A and be replaced by the independent steerable pencil control mirror 144 of polylith, the latter can pass through the little mirror of twin shaft line-controlled micro electronmechanical (MEM).As previously mentioned, corresponding to every pencil 116 have one independently pencil handle mirror 114, thereby can along arbitrary whole or any make up+x ,+y ,-x or-y coordinate or axis handle every pencil 116 one by one independently, shown in Fig. 3 B.Therefore, can not only be positioned at every pencil 116 independently in this group pencil 116, also the pencil 116 of arbitrary pencil 116 or combination arbitrarily can be handled beam dump 148 respectively independently.This situation is shown in Fig. 3 B, is handled beam dump 148 being shown as from a pencil 116 in the middle of this group pencil 116 among the figure, so just can be manipulated to the arbitrary position in the target area 138 on workpiece 142 working faces 140 to pencil 116 one by one independently.And Fig. 3 B also illustrates, and pencil 116 is handled in the target area 138 of irregular alignment, and this arrangement comprises three in four pencils 116, and a pencil 116 in the middle of the group is just by " collection ".
Study other implementation column of laser-processing system 100 of the present invention now, Fig. 4 illustrates the embodiment of the laser-processing system 100 of using beam splitter 120, and beam splitter 120 produces many pencils 116 by for example 112 or inputs of input forming source bundle pencils 116.As in Fig. 3 embodiment, beam splitter 120 produces 6 pencils 116 by input beam, every pencil 116 is collimated prism 122 accordingly and is received and orientation, and collimation prism 122 for example comprises corresponding polylith collimation prism 122 or a diffactive lens, guides corresponding biaxial pencil to handle mirror 144.
Should also be understood that in the embodiment of other laser-processing system 100 available beam splitter 120 continuous or cascade produces the pencil 116 of requirements, the little mirror of also available polylith mono-axial MEM is carried out the performed operation of biaxial micro electronmechanical (MEM) little mirror.
Therefore, because can be to above-mentioned certain variation of laser-processing system work and without prejudice to this paper mentioned spirit of the present invention and scope, so above-mentioned explanation or all main contents shown in the drawings can only be interpreted as showing the example of bright this paper innovative idea, must not think restriction the present invention.

Claims (5)

1. laser-processing system with many steerable laser pencil of independence processing works, it is characterized in that comprising: the laser instrument and the light-beam shaper that generate shaping source bundle, beam splitter level by many pencils of shaping source Shu Shengcheng, the pencil controller comprises and is used for handling mirror corresponding to every pencil with the steerable pencil of the independence that guides this corresponding pencil independently, handle the little mirror controller of mirror with every pencil of control, and comprise the light path of the scanning mirror of the pencil of every manipulation guiding workpiece target area.
2. laser-processing system as claimed in claim 1 is characterized in that, it is the micro electronmechanical little mirror of a multiaxis that every pencil is handled mirror.
3. laser-processing system as claimed in claim 2 is characterized in that, pencil is handled mirror and can be handled around an axis.
4. laser-processing system as claimed in claim 2 is characterized in that, pencil is handled mirror and can be handled around at least two axis.
5. laser-processing system as claimed in claim 1 is characterized in that, comprises that also one is positioned at the beam dump of light path, is used for corresponding pencil executor one controlled pencil being blocked into this beam dump.
CNA2004100769602A 2004-07-01 2004-08-31 System and method for generating and controlling multiple independently steerable laser beams for material processing Pending CN1714982A (en)

Applications Claiming Priority (2)

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US10/883,290 2004-07-01
US10/883,290 US20040251243A1 (en) 2003-04-10 2004-07-01 System and method for generating and controlling multiple independently steerable laser beams for material processing

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481462B (en) * 2010-12-07 2015-04-21 Sumitomo Heavy Industries Laser processing device and laser processing method

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Publication number Priority date Publication date Assignee Title
JP4786698B2 (en) 2008-12-09 2011-10-05 株式会社東芝 Processing equipment
CN111868602B (en) * 2018-03-20 2022-07-26 罗伯特·博世有限公司 Apparatus and method for shaping a laser beam by a programmable beam shaper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481462B (en) * 2010-12-07 2015-04-21 Sumitomo Heavy Industries Laser processing device and laser processing method

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