CN1713038A - Method for manufacturing liquid crystal display device - Google Patents
Method for manufacturing liquid crystal display device Download PDFInfo
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- CN1713038A CN1713038A CNA2005100753897A CN200510075389A CN1713038A CN 1713038 A CN1713038 A CN 1713038A CN A2005100753897 A CNA2005100753897 A CN A2005100753897A CN 200510075389 A CN200510075389 A CN 200510075389A CN 1713038 A CN1713038 A CN 1713038A
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- substrate
- liquid crystal
- sealant
- wadding
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
Abstract
A method for manufacturing a liquid crystal display device to simplify a manufacturing process and reduce costs. The method includes simultaneously forming a liquid crystal layer and scattering spacers on one of first and second substrates, applying sealant to a periphery of one of the first and second substrates, and bonding the first and second substrates together.
Description
It is the rights and interests of the application of 2004-44424 that the application requires to enjoy the application number of submitting in Korea S on June 16th, 2004, quotes its full content as a reference at this.
Technical field
The present invention relates to a kind of method that is used to make liquid crystal display device, relate in particular to a kind of manufacture method of the liquid crystal display device that can simplify production technology and reduce production costs.
Background technology
Since have such as low driving voltage, low-power consumption, full color realize, characteristics such as in light weight and compact conformation, the application of liquid crystal display device spreads all over wrist-watch, counter, PC display, notebook computer, TV, aviation monitor, PDA and portable phone.
In liquid crystal display device, has the circuit unit that is used for liquid crystal panel for displaying images and is used to drive liquid crystal panel.
This liquid crystal panel comprises: have thin film transistor (TFT) array first substrate formed thereon, have color filter array second substrate formed thereon and the liquid crystal layer between two substrates.
Have on thin film transistor (TFT) first substrate formed thereon, have many grid lines of arranging along a direction at regular intervals, many perpendicular to the data line of grid line arrangement with the qualification pixel region, a plurality of pixel electrodes that are used for display image at pixel region, and a plurality of thin film transistor (TFT)s (TFT) that are positioned at each pixel region part of grid line and data line infall, the drive signal conduction and cut-off of this TFT response grid line will be arriving pixel electrode from the image signal transmission of data line.
Have on color filter array second substrate formed thereon, have and be used to cover the black matrix layer that incides part light beyond the pixel region, relative R, G, the B color filter layer that is used to realize color with pixel region, and be positioned at the whole lip-deep public electrode that comprises color filter layer.This public electrode is formed on first substrate of liquid crystal display device of IPS (in-plain switching) pattern.
First substrate and second substrate bond together at certain intervals, form liquid crystal layer between first substrate and second substrate.
Liquid crystal injecting method and liquid crystal distributing method can be used to form liquid crystal layer.According to above-mentioned application injection or distribution method, the liquid crystal manufacturing process also can have difference to a certain degree.
Figure 1 shows that the decomposition diagram of prior art liquid crystal display device.
In Fig. 1, the liquid crystal display device of prior art comprises infrabasal plate 1 and the upper substrate 2 that bonds together with predetermined gap, and the liquid crystal layer 3 that injects between infrabasal plate 1 and upper substrate 2.
On infrabasal plate 1, have many grid lines of arranging along a direction at interval with rule 4, arrange to limit the data line 5 of pixel region P perpendicular to grid line 4 at interval with rule with many, a plurality of pixel electrodes that are positioned at the pixel region P of grid line 4 and data line 5 infalls, and a plurality of thin film transistor (TFT) T that is positioned at each pixel region part of grid line and data line infall.
On upper substrate, have to be used to cover and incide the pixel region black matrix layer 7 of part light in addition, be used for R, G, the B color filter layer 8 of Show Color, and the public electrode 9 that is used to realize image.
Thin film transistor (TFT) T comprises: the gate insulating film (not shown) that forms from grid line 4 extended grids, on whole surface, be positioned at active layer on the gate insulating film above the grid, from data line 5 extended source electrodes, and the drain electrode relative with source electrode.
Along with response from the signal of thin film transistor (TFT) T to 3 orientations of the liquid crystal layer on the pixel electrode 6 to adjust light transmission capacity by liquid crystal layer 3, make above-mentioned liquid crystal display device display image.
Figure 2 shows that by using liquid crystal injecting method and make the art methods flow chart of steps of liquid crystal display device.
In Fig. 2, on first substrate, form tft array (not shown) (1S), and on second substrate, form C/F array (not shown) (5S).
Then, on each first substrate and second substrate, form oriented film with aligned liquid-crystal, and grind this oriented film (2S and 6S), clean this first substrate and second substrate (3S and 7S).
Then, distributing on first substrate is used to keep the wadding (4S) in liquid crystal panel box gap, and applies the silver that is used for concentric line is connected to public electrode in the periphery of second substrate, applies the sealant of be used to bond first substrate and second substrate.
In the adhering device (not shown), place first substrate and second substrate and it is bonded together (9S).
Then, first substrate that bondd and second substrate are packed in the curing oven (not shown) to solidify sealing agent (10S).
After finishing curing schedule, first substrate and second substrate to bonding are rule, and be cut into unit liquid crystal panel (11S), in vacuum chamber, insert liquid crystal at the interval of first substrate and second substrate, then encapsulated liquid crystals filling orifice (12S) by the unit liquid crystal panel.
That is,, between two substrates, keep vacuum state, between two substrates, insert liquid crystal by phenomenon of osmosis by the sealant bonding when the liquid crystal filling orifice is put into liquid crystal fluid.When finishing the liquid crystal injection, by sealant encapsulated liquid crystals filling orifice.
Then, check and carry this liquid crystal panel (13S).
Yet owing to the liquid crystal filling orifice is put into liquid crystal fluid and keep vacuum state between two substrates, the prior art liquid crystal injecting method needs the long period to inject liquid crystal, and this can influence throughput rate.And when making the large scale liquid crystal panel, the liquid crystal that injects by liquid crystal injecting method is easy to produce not exclusively injection at liquid crystal panel, thereby produces defective liquid crystal panel.
Therefore, great majority are used for the liquid crystal panel of Portable mobile phone and PDA by the liquid crystal injecting method manufacturing, and the large scale liquid crystal panel is by the liquid crystal distributing method manufacturing.
To illustrate that below prior art is by using the method for liquid crystal distributing method manufacturing liquid crystal display device.
Figure 3 shows that prior art is by using the method flow diagram of liquid crystal distributing method manufacturing liquid crystal display device.
In Fig. 3, on first substrate, form tft array (21S), on second substrate, form C/F array (25S).
In this example, in the process that forms the C/F array, on second substrate, form a plurality of column waddings to keep the box gap.These column waddings are formed on the precalculated position of C/F array base palte.
On each first substrate and second substrate, be formed for the oriented film of aligned liquid-crystal, and oriented film is ground (22S and 26S) respectively and cleans (23S and 27S).
Then, on first substrate, distribute an amount of liquid crystal (24S).In this example, the liquid crystal that drips of the core in each liquid crystal panel zone, and note and will contact with sealant just to make liquid crystal after keeping the box gap up to the sealant full solidification.
Then, outside each liquid crystal panel zone of second substrate, place distribution sealant and silver point (28S).In this example, sealant is respectively at the independent composition of each liquid crystal panel zone quilt.
Therefore established first substrate and second substrate are positioned in the (not shown) of vacuum bonding chamber and bond together (29S).
That is, after the upper table of vacuum bonding chamber was located second substrate, second substrate that overturns made sealant down, had liquid crystal and distributed first substrate thereon to be positioned at lower table.Then, by the vacuum bonding chamber that maintains vacuum state first substrate and second substrate bonding are in the same place.
First and second substrates that will bond then are transported to UV curing oven (not shown) from vacuum bonding chamber, and the direct projection of UV light beam on it with curing sealant (30S).
That is, in order to make only direct projection coating sealant part thereon of UV light beam, the mask that has the light shield layer that is formed at all the other places of substrate by use makes the direct projection of UV light beam on sealant, to solidify the sealing agent by the UV light beam.
Substrate after UV solidifies is then packed on the heat curing stove with by the sealant that is heating and curing (31S).Liquid crystal on each liquid crystal panel begins diffusion.
After finishing UV light beam irradiates and thermal cure step, be unit liquid crystal panel (32S) with first and second substrate cut, the unit liquid crystal panel is polished (33S), checks and carries (34S and 35S).
Make liquid crystal display device and can significantly reduce and be used to inject the required time cycle of liquid crystal by using liquid crystal distributing method, improve throughput rate and avoid not exclusively injecting the defective that liquid crystal caused under the large scale liquid crystal display device situation and taking place making.
Yet there is following problem in the method that is used to make liquid crystal display device in the prior art.
Separate with the step of dispensing liquid crystal on first substrate in the step that forms the column wadding on second substrate, make that whole manufacturing process is complicated.
Secondly, by forming the column wadding at whole base plate surface deposition photochromics, and exposure, this photochromics that develops are with the selective removal photochromics.Thereby, increase cost and make process complications.
Summary of the invention
Therefore the present invention proposes a kind of method that is used to make liquid crystal display device, and this method can overcome because and a plurality of problems that limitation of the prior art and shortcoming produce.
A kind of method that is used to make liquid crystal display device that provides is provided, wherein forms wadding and liquid crystal layer simultaneously with simplified manufacturing technique and reduce cost.
Below supplementary features of the present invention and advantage will be described, a part wherein can make those of ordinary skills feel obviously by following description, or by recognizing putting into practice the present invention.Specifically described structure can realize and reach advantage of the present invention in employing instructions and claims and the accompanying drawing.
In order to realize above-mentioned and other advantage according to purpose of the present invention, below will do concrete and bright in a broad sense, a kind of method that is used to make liquid crystal display device comprises: form liquid crystal layer simultaneously and scatter wadding on one of first and second substrates, periphery to one of first and second substrates applies sealant, and with first and second substrate bondings together.
The step that forms liquid crystal layer simultaneously and scatter wadding on first substrate comprises: with predetermined proportioning concentration crystal layer with scatter wadding, and distribute its potpourri on first substrate.
According to another aspect of the present invention, a kind of method that is used to make liquid crystal display device comprises: form and grind first oriented film on first substrate, on second substrate, form and grind second oriented film, clean first and second substrates, on first substrate, form liquid crystal layer simultaneously and scatter wadding, on second substrate, apply silver point and sealant, first and second substrates bond, solidify the sealant between first and second substrates, with first and second substrate cut of bonding is unit panel, and polishes and detect each unit panel.
It is exemplary with indicative to be appreciated that general description that the present invention is above-mentioned and following detailed are, and is intended to further explain invention required for protection.
Description of drawings
Included being used for represented embodiments of the invention to the accompanying drawing that the invention provides further explanation and introducing formation the application part, and explains principle of the present invention with instructions, in the accompanying drawings:
Figure 1 shows that the decomposition diagram of prior art liquid crystal display device;
Figure 2 shows that by using liquid crystal injecting method and make the art methods flow chart of steps of liquid crystal display device;
Figure 3 shows that prior art is by using the method flow diagram of liquid crystal distributing method manufacturing liquid crystal display device;
Figure 4 shows that the method flow diagram that is used to make liquid crystal display device according to embodiment of the present invention.
Embodiment
Describe the specific embodiment of the present invention in detail hereinafter with reference to the embodiment shown in the accompanying drawing.As much as possible, in whole accompanying drawing, will use identical reference marker to represent same or analogous parts.
Figure 4 shows that the method flow diagram that is used to make liquid crystal display device according to embodiment of the present invention.
In Fig. 4, on first substrate, form tft array (not shown) (101S), and on second substrate, form C/F array (not shown) (105S).In this example, on second substrate, do not form the column wadding.
On first substrate, have many grid lines of arranging at interval with rule along a direction, many data line and a plurality of thin film transistor (TFT)s of arranging perpendicular to grid line at interval with rule are positioned at the pixel electrode at the matrix place of the pixel region that is limited by grid line and data line.
On second substrate, have and be used to cover the black matrix layer that incides part light beyond the pixel region, color filter layer, and public electrode.
If liquid crystal display device is the IPS pattern, on first substrate, forms pixel electrode and public electrode, and on second substrate, form coat rather than public electrode.
Then, application selects the mechanical arm program of first substrate and second substrate to select first substrate and second substrate respectively respectively.
Then, on each first substrate and second substrate, be formed for the oriented film of aligned liquid-crystal, and this oriented film is ground (102S and 106S), and clean first substrate and second substrate (103S and 107S).
Carry out oriented film formation and grinding step sequentially: cleaning, coating oriented film, printing oriented film, baking oriented film, the also grinding of inspection oriented film.
Then, form liquid crystal layer and scatter wadding (104S) simultaneously.That is, mix wadding and liquid crystal layer to form its potpourri, distribute this potpourri to form liquid crystal layer simultaneously and to scatter wadding by distribution devices with predetermined ratio.
Then, apply sealant and silver point (108S) in each liquid crystal panel periphery of second substrate.In this example, in each liquid crystal panel zone sealant is carried out independent composition.
First and second substrates that form in the manner described above are positioned in the vacuum bonding chamber, apply certain pressure, two substrates is bonded together (109S) to it.
Below with the aforesaid bonding process of more detailed description.
Bonding process of the present invention comprises: be written into two substrates in vacuum bonding chamber, aim at two substrates, the bonding two substrates unloads the two substrates that has bondd from vacuum bonding chamber.
Before adding carried base board, can apply sealant second substrate thereon by USC (ultrasonic cleaner) cleaning, to remove the particle that forms in the manufacture process.That is, owing to do not have dispensing liquid crystal on second substrate, and have only sealant and silver point, therefore can clean.
In loading procedure, maintain sealant at the upper table of vacuum bonding chamber by vacuum and apply second substrate on it,, keep first substrate that is formed with liquid crystal layer and is scattered with wadding by vacuum at lower table with its side that sealant arranged down.For example, vacuum bonding chamber can be in atmospheric pressure.
In more detail, mechanical arm keeps and second substrate that will apply sealant is put into vacuum bonding chamber, and its side with sealant down.At this state, the upper table of vacuum bonding chamber moves down and keeps this second substrate by vacuum, and moving to travelling backwards.Except vacuum, can also use static.
Then, mechanical arm comes out from vacuum bonding chamber, and first substrate that will be formed with liquid crystal layer and be scattered with wadding is placed on the lower table of vacuum bonding chamber.
Have formation liquid crystal layer and distribution wadding on thin film transistor (TFT) array first substrate formed thereon although illustrated in this embodiment, and apply sealant having on color filter array second substrate formed thereon, but also can on first substrate, apply sealant, and the arbitrary substrate in two substrates all can form liquid crystal layer and scatter wadding.Yet, under any circumstance, all need to distribute substrate thereon to be positioned over lower table, and another substrate is positioned over upper table with having liquid crystal layer.
Then, according to following method, the substrate container is put into second substrate that remains on upper table under.
At first, when being positioned over second substrate on the substrate container, upper table moves down, or the substrate container moves up, and is very approaching up to second substrate and substrate container.
Then, upper table moves down preset distance, and the substrate container moves up, and makes that second substrate and substrate container are more close, then, second substrate is positioned on the substrate container.
At last, upper table moves down, or the substrate container moves up, perhaps upper table at first moves down, and next the substrate container moves up, and makes second substrate and substrate container near arriving certain distance, then, upper table keeps this second substrate by vacuum.
The below that the substrate container is placed on second substrate when preventing to vacuumize in vacuum bonding chamber because the vacuum tightness that indoor vacuum tightness is higher than worktable when keeping the first and second substrate states by vacuum, thereby when making worktable lose vacuum, cause coming off from upper table, and situation about dropping on first substrate takes place by second substrate that vacuum keeps on upper table.
Therefore, before the bonding chamber vacuumizes, second substrate that remains in upper table can be placed on the substrate container, perhaps will keep the upper table of second substrate and substrate container to place from a distance by vacuum, make in the bonding chamber when vacuumizing, second substrate is put into substrate container top from upper table.
Can have be used to keep substrate when preventing to begin to vacuumize in the bonding chamber because the additional holding device that the substrate that indoor air flow was produced moves on the initialization platform.
If upper and lower worktable keeps first and second substrates by static, then not needing to place below upper table the substrate container can directly vacuumize.
Vacuum bonding chamber is evacuated to vacuum state.Although the vacuum of vacuum bonding chamber changes with the liquid crystal mode of bonding, the vacuum tightness of IPS pattern is greatly about 1.0 * 10
-3Pa～1Pa, and the vacuum tightness of TN pattern is greatly about 1.1 * 10
-3Pa～10
2Pa.
Can vacuumize vacuum chamber by two stages.That is, after keeping substrate by upper and lower worktable respectively and closing door for vacuum chamber, carry out vacuumizing for the first time.Then, below the substrate container being placed upper table and after the substrate that remains on upper table is positioned on the substrate container, perhaps after upper table and substrate container keep at a certain distance away under the state that substrate keeps by vacuum, carry out vacuumizing for the second time.In this example, vacuumize for the second time and vacuumize sooner than for the first time, the vacuum tightness in first vacuumizing phase vacuum bonding chamber is lower than the vacuum tightness of upper table.
Perhaps, vacuumize and not to be divided into two stages, vacuumize but keep substrate and close chamber to carry out uniformly behind the door, below this period, the substrate container was positioned over upper table at each worktable.In this example, require vacuum tightness in vacuum bonding chamber the substrate container to be placed into below the upper table before being higher than the vacuum tightness of upper table.
Vacuum bonding chamber is vacuumized with two stages, can avoid because the base plate deformation in the vacuum chamber that vacuum bonding chamber rapid vacuumizing causes or the situation of displacement take place.
As long as vacuum bonding chamber reaches a certain vacuum tightness, upper and lower worktable keeps first and second substrates by the Electrostatic Absorption method, and this substrate container is got back to initial position.
In the Electrostatic Absorption method, on worktable at least two plate electrodes apply+/-the DC electric current to be to keep substrate.Promptly, by apply "+" or "-" voltage to plate electrode, induce "+" or "-" electric charge at the worktable place, make substrate to be adsorbed on the worktable by the Coulomb force that between conductive layer on the substrate (such as the transparency electrode of public electrode or pixel electrode) and worktable, produces.
If conductive layer substrate formed thereon one side is arranged to worktable, apply voltage range and be approximately 0.1～1KV, and if have conductive layer formed thereon substrate one side worktable dorsad, apply voltage range and be approximately 3～4KV.Upper table is provided with a flexible sheet.
In the process of aiming at two substrates, upper table moves down and makes second substrate near first substrate, aims at first and second substrates.
Below will describe the method for align substrates in detail.
Can be carved with a plurality of coarse alignment marks (about 3 μ m) and fine alignment mark (about 0.3 μ m) respectively in the precalculated position of first substrate and second substrate.
The camera that is used for aiming at the camera of coarse alignment mark and is used to aim at the fine alignment mark is installed on the vacuum adhering device respectively.The reason that camera is installed respectively is, because coarse alignment mark and fine alignment mark are of different sizes and the position, is difficult to aim at coarse alignment mark and fine alignment mark simultaneously by a camera.Each camera focus is in the centre position of first and second substrates.
Therefore, at first, the interstice coverage that upper table moves down between first and second substrates is approximately 0.4mm～0.9mm (0.6mm preferably approximately), and aims at first substrate and second substrate makes the coarse alignment mark of second substrate be positioned the coarse alignment mark of first substrate.Next, upper table moves down up to the about 0.1mm～0.4mm of the interstice coverage of first and second substrates (0.2mm preferably approximately), and accurately aims at first substrate and second substrate makes the fine alignment mark of second substrate accurately be positioned the fine alignment mark of first substrate.
In the alignment procedures of little alignment mark, the liquid crystal on first substrate may with second substrate contacts.
Because designed upper table moves up and down and lower table moves along X and Y direction, therefore mobile lower table in the two substrates alignment procedures.
In the method for aiming at coarse alignment mark and little alignment mark, first method is to assign to realize aiming at by the pars intermedia in the camera focus gap between first base plate mark and second base plate mark that is installed on substrate upside or downside, and second method focuses on to improve degree of accuracy second base plate mark and first base plate mark for replacing by the focus that changes camera.
The coarse alignment mark on first and second substrates and the quantity of fine alignment mark are respectively more than or equal to 4, and along with the size change of substrate is big, this quantity can increase to improve alignment accuracy.Position between the panel that will cut or form coarse alignment mark and fine alignment mark in edge with a plurality of panels original substrate formed thereon,
Can realize rapid and precise aligning by different cameras to the aligning of first and second substrates with the fine alignment mark with the coarse alignment mark.
After finishing the aligning of two substrates, two substrates is in worktable hold mode separately, and upper table moves down, and presses down first and second substrates with the bonding two substrates.In this example, upper table or lower table move in the vertical direction, and change the speed and the pressure of worktable simultaneously.Worktable moves liquid crystal and the wadding and second substrate contacts on first substrate with fixing speed and pressure, and perhaps when pressure boost is when reaching the resulting pressure of expection gradually, the sealant on first and second substrates contacts.That is, load cell (load unit) is installed is used to detect duration of contact on the axle of worktable, make to rigidly connect at two substrates that cohesive pressure is 0.1 ton when touching, intergrade is 0.3 ton, and final stage is 0.4 ton, and is 0.5 ton finishing level.
Although upper table presses down substrate by an axle, a plurality of axle can be provided, each all is equipped with load cell, is used for each pressure of independent measurement.Therefore,, make the sealant failure that evenly bonds, then apply or high or low pressure is used to make sealant evenly to bond to relevant axle if lower table and upper table are not accurate level.
After finishing the bonding of two substrates, stop the maintenance process by the Electrostatic Absorption method, upper table moves up to separate the two substrates of upper table and bonding.
Then, unload the substrate that has bondd.That is, finish bonding after, perhaps move on the upper table, unload first and second substrates that this has bondd by mechanical arm, perhaps move on the upper table, and keep this first and second substrates that bondd, mechanical arm unloads first and second substrates of this bonding from upper table.
In order to shorten cycle process time, can be loaded into one of first and second substrates that next time will bond on the worktable and unload first and second substrates that bondd.Promptly, will be positioned on the upper table at second substrate of execution of following one-period bonding process by mechanical arm, and this upper table keeps after second substrate by vacuum, unload first and second substrates from lower table, perhaps upper table keep first and second substrates bondd and on move, and mechanical arm will unload first and second substrates that bondd after first substrate of next time carrying out bonding process is loaded on the lower table.
Therefore, first and second substrates of bonding are transferred to UV curing oven (not shown) from vacuum bonding chamber, and apply the UV light beam (110S) that is used for curing sealant thereon.
That is, use the mask with optical masking film to apply the UV light beam with curing sealant to sealant, this optical masking film is formed on the part except that the part that is formed with sealant on it, optionally to apply the UV light beam to this part.
Then, will be loaded on the heat curing stove by the substrate that the UV light beam solidifies, by the sealing agent (111S) that is heating and curing.In this example, the liquid crystal on the liquid crystal panel begins diffusion.
After finishing UV light beam and heat curing process, be unit liquid crystal panel (112S), each unit liquid crystal panel is polished (113S), detects (114S), also carries (115S) first and first substrate cut.
In liquid crystal assigning process of the present invention, wadding can mix in advance with liquid crystal, by adopting distribution devices direct potpourri of dispensing liquid crystal and wadding on the large-size glass substrate, the liquid crystal of this distribution is evenly distributed on the whole front panel, and, simultaneously, between two substrates, form constant gap by the pressure that is applied to substrate.
That is, before bonding first and second substrates, mixed liquid crystal and wadding on first substrate, and the potpourri by distribution devices dispensing liquid crystal and wadding.
When second substrate peripheral applies sealant, first and second substrates that bond, and exert pressure to first and second substrates, simultaneously, liquid crystal is under pressure and is diffused into the perimeter, forms liquid crystal layer between first and second substrates uniformly.
Simultaneously, on first substrate, form liquid crystal layer and scatter wadding although illustrated, and apply sealant and silver point, but all can form liquid crystal in two substrates any, scatter wadding, apply sealant and silver point in the periphery in each liquid crystal panel zone of second substrate.
That is, can be on each liquid crystal panel zone of one of first and second substrates the potpourri of dispensing liquid crystal and wadding, and sealant and silver point can put on the periphery in the liquid crystal panel zone of same substrate.
On substrate, carry out the direct distribution of liquid crystal in a short period of time with this liquid crystal distributing method, not only can be formed for the liquid crystal layer of large scale liquid crystal display device fast, and because only make the consumption of liquid crystal minimize direct the distribution, thereby reduce the manufacturing cost of liquid crystal display device according to the requirement of liquid crystal.
As mentioned above, the method that is used to make liquid crystal display device has following advantage.That is, the potpourri of use liquid crystal and wadding forms liquid crystal layer simultaneously and scatters wadding and simplified manufacturing process, has solved about limited space and the problem that reduces cost.
Can clearly understand, those skilled in the art can carry out different modifications and improvement to the present invention without departing from the spirit and scope of the present invention, therefore this invention is intended to comprise modification and modification in claims and the equivalent institute limited range thereof.
Claims (9)
1, a kind of method that is used to make liquid crystal display device comprises:
On one of first substrate and second substrate, form liquid crystal layer simultaneously and scatter wadding;
Periphery to one of first substrate and second substrate applies sealant; And
First substrate and second substrate bonding are in the same place.
2, method according to claim 1 is characterized in that, described first substrate is a thin-film transistor array base-plate.
3, method according to claim 1 is characterized in that, described second substrate is a colour filtering chip basic board.
4, method according to claim 1, it is characterized in that, the described step that forms liquid crystal layer simultaneously and scatter wadding on one of first substrate and second substrate comprises: with predetermined proportioning concentration crystal layer with scatter wadding, and distribute this potpourri on first substrate.
5, method according to claim 1 is characterized in that, both formed liquid crystal layer justice and scatter wadding on first substrate, and sealant puts on second substrate.
6, method according to claim 1 is characterized in that, finishes the process that forms liquid crystal layer, scatters wadding and apply sealant on one of first substrate and second substrate together.
7, method according to claim 1 is characterized in that, also further is included on each first substrate and second substrate and forms oriented film, and ground this oriented film before forming liquid crystal layer, scattering wadding and apply sealant.
8, method according to claim 1 is characterized in that, also further is included in curing sealant after first substrate and second substrate bonding.
9, a kind of method that is used to make liquid crystal display device comprises:
On first substrate, form and grind first oriented film;
On second substrate, form and grind second oriented film;
Clean first and second substrates;
On first substrate, form liquid crystal layer simultaneously and scatter wadding;
On second substrate, apply silver point and sealant;
With first and second substrate bondings together;
Solidify the sealant between first and second substrates;
Is first and second substrate cut that bondd unit panel; And
Polish and detect each unit panel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040044424A KR100641003B1 (en) | 2004-06-16 | 2004-06-16 | method for manufacturing of liquid crystal display device |
| KR1020040044424 | 2004-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1713038A true CN1713038A (en) | 2005-12-28 |
| CN100416360C CN100416360C (en) | 2008-09-03 |
Family
ID=34858887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100753897A Expired - Fee Related CN100416360C (en) | 2004-06-16 | 2005-06-16 | Method for manufacturing liquid crystal display device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050280768A1 (en) |
| JP (1) | JP2006003896A (en) |
| KR (1) | KR100641003B1 (en) |
| CN (1) | CN100416360C (en) |
| GB (1) | GB2415263B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112684640A (en) * | 2019-10-18 | 2021-04-20 | 江苏集萃智能液晶科技有限公司 | Process for preparing liquid crystal dimming device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4820226B2 (en) * | 2006-07-18 | 2011-11-24 | パナソニック液晶ディスプレイ株式会社 | Liquid crystal display |
| JP7468945B2 (en) | 2022-03-03 | 2024-04-16 | Ａｉメカテック株式会社 | Circuit Board Assembly Equipment |
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| JPS6289025A (en) * | 1985-10-15 | 1987-04-23 | Matsushita Electric Ind Co Ltd | Liquid crystal display panel and its production |
| JPH02214814A (en) * | 1989-02-16 | 1990-08-27 | Matsushita Electric Ind Co Ltd | Production of liquid crystal panel |
| JPH0339929A (en) * | 1989-07-07 | 1991-02-20 | Matsushita Electric Ind Co Ltd | Production of liquid crystal panel |
| JPH03102323A (en) * | 1989-09-18 | 1991-04-26 | Matsushita Electric Ind Co Ltd | Liquid crystal panel and its manufacture |
| JPH04275527A (en) * | 1991-03-04 | 1992-10-01 | Fujitsu Ltd | Production of liquid crystal display panel |
| JP3159504B2 (en) * | 1992-02-20 | 2001-04-23 | 松下電器産業株式会社 | Liquid crystal panel manufacturing method |
| JP2939384B2 (en) * | 1992-04-01 | 1999-08-25 | 松下電器産業株式会社 | Liquid crystal panel manufacturing method |
| JPH05281562A (en) * | 1992-04-01 | 1993-10-29 | Matsushita Electric Ind Co Ltd | Manufacture of liquid crystal panel |
| JP3210109B2 (en) * | 1992-12-09 | 2001-09-17 | 株式会社東芝 | Liquid crystal display device |
| JP3978241B2 (en) * | 1995-07-10 | 2007-09-19 | シャープ株式会社 | Liquid crystal display panel and manufacturing method thereof |
| JPH0980369A (en) * | 1995-09-18 | 1997-03-28 | Stanley Electric Co Ltd | Manufacture of liquid crystal display device |
| JPH1026763A (en) * | 1996-07-11 | 1998-01-27 | Seiko Epson Corp | Production of liquid crystal panel and device therefor |
| JP3841190B2 (en) * | 1996-11-08 | 2006-11-01 | ソニー株式会社 | Liquid crystal element manufacturing method and manufacturing apparatus thereof |
| US5978065A (en) * | 1996-11-08 | 1999-11-02 | Sony Corporation | Liquid crystal device and manufacturing method and apparatus therefor |
| JPH1164880A (en) * | 1997-08-26 | 1999-03-05 | Fuji Xerox Co Ltd | Reflection type liquid crystal color display device |
| JP4022786B2 (en) * | 1998-02-13 | 2007-12-19 | ソニー株式会社 | Manufacturing method of liquid crystal element |
| JP2002023128A (en) * | 2000-07-06 | 2002-01-23 | Minolta Co Ltd | Method for manufacturing liquid crystal display element and method for manufacturing hollow liquid crystal display element |
| JP2002090761A (en) * | 2000-09-12 | 2002-03-27 | Ran Technical Service Kk | Method for manufacturing liquid crystal display liquid crystal injecting tool and vessel for scattering liquid crystal |
| KR100510719B1 (en) * | 2002-02-05 | 2005-08-30 | 엘지.필립스 엘시디 주식회사 | Method for manufacturing liquid crystal display device |
| KR100741902B1 (en) * | 2002-05-30 | 2007-07-24 | 엘지.필립스 엘시디 주식회사 | System and method for manufacturing liquid crystal display device |
| US7295279B2 (en) * | 2002-06-28 | 2007-11-13 | Lg.Philips Lcd Co., Ltd. | System and method for manufacturing liquid crystal display devices |
| JP2004045614A (en) * | 2002-07-10 | 2004-02-12 | Seiko Epson Corp | Liquid crystal device, method for manufacturing liquid crystal device and electronic appliance |
-
2004
- 2004-06-16 KR KR1020040044424A patent/KR100641003B1/en not_active IP Right Cessation
-
2005
- 2005-06-14 JP JP2005173172A patent/JP2006003896A/en not_active Withdrawn
- 2005-06-14 GB GB0512101A patent/GB2415263B/en not_active Expired - Fee Related
- 2005-06-15 US US11/152,090 patent/US20050280768A1/en not_active Abandoned
- 2005-06-16 CN CNB2005100753897A patent/CN100416360C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112684640A (en) * | 2019-10-18 | 2021-04-20 | 江苏集萃智能液晶科技有限公司 | Process for preparing liquid crystal dimming device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2415263A (en) | 2005-12-21 |
| CN100416360C (en) | 2008-09-03 |
| US20050280768A1 (en) | 2005-12-22 |
| KR100641003B1 (en) | 2006-11-02 |
| GB2415263B (en) | 2006-11-08 |
| KR20050119360A (en) | 2005-12-21 |
| GB0512101D0 (en) | 2005-07-20 |
| JP2006003896A (en) | 2006-01-05 |
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