CN1710762A - Method for raising semiconductor laser yield - Google Patents
Method for raising semiconductor laser yield Download PDFInfo
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- CN1710762A CN1710762A CN 200510019010 CN200510019010A CN1710762A CN 1710762 A CN1710762 A CN 1710762A CN 200510019010 CN200510019010 CN 200510019010 CN 200510019010 A CN200510019010 A CN 200510019010A CN 1710762 A CN1710762 A CN 1710762A
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- low temperature
- tank body
- hermetically sealed
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- laser
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Abstract
The invention is related to modifying technique for packaging semiconductor laser. Other packaging steps finished and not closed over laser modules are put into airtight container with good heat-conducting property to carry out high and low temperature cycle. After residual stress is released fully, fine adjustment is carried out for coupling welded support in light power changed modules through laser beat etc. technique to make their light power get back to level before high and low temperature cycle. Then, steps including closing over, burn in screen, testing, packaging are carried out for the modules, which are through the said laser beat, passed high and low temperature cycle again and unchanged light power, so as to obtain high reliable semiconductor laser in high yield. The invention prevents wasting material and working hours, and saves cost.
Description
Technical field
The present invention relates to a kind of method that improves semiconductor laser yield in the field of semiconductor photoelectron technique, specifically, relate to a kind of improvement of noise spectra of semiconductor lasers packaging technology, particularly to the improvement of the fine semiconductor laser packaging technology of high-power magnetic tape trailer.
Background technology
Low-cost, high reliability is the basic demand that optical communication technique development noise spectra of semiconductor lasers proposes, the rate of finished products that improves laser on the basis that guarantees reliability is the effective way that reduces production costs, therefore, it is just particularly important how to improve the reliability of laser and rate of finished products.
The factor that influences laser device reliability and rate of finished products is many, has integrated following two kinds:
1, in the packaging technology of laser, because the physical parameter of various element materials does not match, make inner each the material joining place of laser have stress, these stress have just brought displacement in the dispose procedure afterwards slowly, thereby caused the laser coupling efficiency to change, when this variation surpassed a certain feasible value, laser had just lost efficacy.
Traditional individual laser package technology is to adopt the method for high-temperature baking to discharge stress, does high low temperature Cycle Screening after the laser assembly capping is finished again.After each circulation, always there is laser assembly power that comparatively obvious variation has taken place greater than 10%.For these lasers, most requirements that can reach qualified product through processing back power stabilities of doing over again such as the displacement corrections of uncapping; But the disposable rate of finished products of device can not get improving.It is qualified to be adjusted to after even underproof device uncapped again, and its consequence is the production cycle that prolongs device, increases production cost, and can bring such as new hidden danger of quality such as air-tightness after the capping once more are bad.The laser assembly that also has is basic just to be eliminated operation and has just dispatched from the factory through high low temperature this step of circulating, rate of finished products is also than higher outwardly, but these lasers are not discharged fully owing to internal stress, displacement has taken place in each the element junction of laser that has after work a period of time, thereby cause the fiber power of laser to reduce, reliability can't effectively be guaranteed, all will bring tremendous loss for device manufacturer and system manufacturer.
2, the intrinsic defective of chip of laser itself has caused laser device reliability not high, such as epitaxial wafer in the material growth course or the back technology of epitaxial wafer produced some damage zone of defective or laser in making.When these defectives or some damage zone propagated into active area, device will be degenerated fast.For powerful laser, when the absorption of the end face generation light of laser, also can produce electron hole pair, and produce non-radiative compound at end face, thereby the temperature of end face is improved, temperature raises band gap is shunk, thereby light absorption is further increased again, and temperature further raises, when temperature finally reaches the fusing point of material, just produced burning suddenly of end catastrophic optical damage damage (COD) has promptly taken place.For this a kind of factor that influences reliability, in the encapsulation process of laser, can't avoid; But can in time find out and eliminate the production cost that these problematic tube cores also help reducing semiconductor laser with minimum cost by the improvement of technology.
Summary of the invention
Purpose of the present invention is exactly to overcome the problems referred to above that prior art exists, and a kind of method that improves semiconductor laser yield is provided.
To achieve these goals, in potting process, to finish other packaging process but also not the laser assembly of capping put into a good airtight container of heat conductivility and carry out the circulation of high low temperature, after treating that residual stress discharges fully, (it is to beat on the support of fixing metal optical fiber by the energy of laser that laser beats to technology such as the assembly employing laser that luminous power is changed beats, the displacement that release owing to stress brings is proofreaied and correct) support that welds carries out trickle adjustment to being coupled, make its luminous power return to high low temperature circulation level before, and once more through high low temperature circulation, just laser assembly is carried out capping behind the power no change, burn-in screen, test, packing obtains a kind of high reliability at last, the semiconductor laser of high finished product rate.
As Fig. 1, the present invention has the following step successively:
Assembly is put into tank body A, tank body is put into stuffing box B, fill dry gas C to stuffing box, hermetically sealed can is locked D, hermetically sealed can is put into high low temperature circulating box E, high low temperature circulation F, take out hermetically sealed can G, qualified assembly is carried out capping, burn-in screen, combines and survey, pack H;
Defective assembly laser beaten carry out displacement calibration I, high low temperature circulation F takes out hermetically sealed can G, to qualified assembly carry out capping, burn-in screen, combine survey, packing H.
Specifically,
1. assembly being put into tank body A will finish operations laser assemblies afterwards such as assembling, coupling welding, baking and lie in tank body 1.1;
2. tank body is put into stuffing box B tank body 1.1 is put into a big stuffing box; Usually can be placed in the stuffing box of laying capsuling machine;
3. fill dry gas C to stuffing box and give the gas that charges and discharge drying in the stuffing box, duration of ventilation is 25-35 minute;
4. the oxygen content that hermetically sealed can is locked in the D case to be sealed is 18-22%, when water vapour content is 4800-5200ppm, the tank body 1.1 that laser assembly is housed is covered cover 1.2, and cover 1.2 is embedded with sealing ring 1.3 with the connecting place of tank body 1.1, locks by screw;
5. hermetically sealed can is put into high low temperature circulating box E and taken out hermetically sealed can 1, then hermetically sealed can 1 is put into high low temperature circulating box from stuffing box;
6. high low temperature circulation F opens high low temperature circulating box, and set the temperature range of circulation :-40-85 ℃, the time of setting each cycle period is 1.5-2.5 hour;
7. take out hermetically sealed can G and finish 18-22, when treating that temperature is 22-28 ℃ in the high low temperature circulating box, from high low temperature circulating box, take out hermetically sealed can 1 as after the 6. described high low temperature circulation of step;
8. capping, burn-in screen, combine survey, packing H opens hermetically sealed can 1, takes out laser assembly and also tests its power, is no more than 15% assembly for variable power before and after the high low temperature circulation, just can carry out capping, burn-in screen, combine and survey, pack;
9. laser beats and carries out displacement calibration I for defective assembly, be that variable power surpasses 15% assembly before and after the high low temperature circulation, the support that adopts the laser technology of beaing that coupling is welded carries out trickle adjustment, make its luminous power return to high low temperature circulation level before, 6. 7. 8. selected through above-mentioned steps once more.
What obtain at last is the semiconductor laser of a collection of high reliability.
The present invention has the following advantages and good effect:
1. the stress that brings of laser assembly in encapsulation process is further discharged fully, improve the reliability and the rate of finished products of device;
2. because the dry air that laser in whole temperature cycles process, is sealed is protected, play the effect of capping, do not have condensing of steam on the tube core, chip is not polluted generation, this is very necessary for the life-span of safeguarding laser;
3. simultaneously for those defectiveness and underproof laser assembly also can be eliminated in early days effectively, avoid the waste in material and man-hour, help saving cost.
Description of drawings
Fig. 1-step block diagram of the present invention;
Fig. 2-hermetically sealed can structural representation.
Wherein:
A-puts into tank body with assembly;
B-puts into stuffing box with tank body;
C-fills dry gas to stuffing box;
D-locks hermetically sealed can;
E-puts into high low temperature circulating box with hermetically sealed can;
The high low temperature circulation of F-;
G-takes out hermetically sealed can;
H-capping, burn-in screen, comprehensive survey, packing;
I-laser beats and carries out the displacement calibration;
The 1-hermetically sealed can comprises:
1.1-tank body, 1.2-cover, 1.3-sealing ring.
Embodiment
1, the optimum state of relevant step
3. step fills dry gas C to stuffing box, and duration of ventilation is 30 minutes.
4. step locks D with hermetically sealed can, and the oxygen content in the stuffing box is 20%, and water vapour content is 5000ppm.
The 6. high low temperature circulation of step F, each cycle period setting-up time is 2 hours.
7. step takes out hermetically sealed can G, finishes 20 as after the 6. described high low temperature circulation of step, when temperature is 25 ℃ in the case to be recycled, takes out hermetically sealed can 1 from circulating box.
2, the structure of hermetically sealed can 1
As Fig. 1, hermetically sealed can 1 is made up of tank body 1.1, cover 1.2, sealing ring 1.3; Between tank body 1.1 and cover 1.2, sealing ring 1.3 is arranged, pass through screw.
Described tank body 1.1, its structure are a kind of canisters that the edge is arranged, and are evenly equipped with aperture for connection on the edge;
Described cover 1.2, its structure are the adaptive crown caps of a kind of and tank body 1.1 sizes, and the edge is provided with the aperture same with tank body 1.1;
Described sealing ring 1.3, its structure are a kind of and the adaptive round rubber circles of tank body 1.1 sizes; Its material is a kind of butyl rubber of high-low temperature resistant circulation.
Claims (7)
1, a kind of method that improves semiconductor laser yield is characterized in that the following step is arranged:
1. assembly being put into tank body (A) will finish operations laser assemblies afterwards such as assembling, coupling welding, baking and lie in tank body (1.1);
2. tank body is put into stuffing box (B) tank body (1.1) is put into a big stuffing box;
3. fill dry gas (C) to stuffing box and give the gas that charges and discharge drying in the stuffing box, duration of ventilation is 25-35 minute;
4. be 18-22% with the oxygen content in hermetically sealed can locking (D) case to be sealed, when water vapour content is 4800-5200ppm, the tank body (1.1) that laser assembly is housed is covered cover (1.2), and cover (1.2) is embedded with sealing ring (1.3) with the connecting place of tank body (1.1), locks by screw;
5. hermetically sealed can is put into high low temperature circulating box (E) and taken out hermetically sealed can 1, then hermetically sealed can (1) is put into high low temperature circulating box from stuffing box;
6. high low temperature circulating box is opened in high low temperature circulation (F), and set the temperature range of circulation :-40-85 ℃, the time of setting each cycle period is 1.5-2.5 hour;
7. take out hermetically sealed can (G) and finish 18-22, when treating that temperature is 22-28 ℃ in the high low temperature circulating box, from high low temperature circulating box, take out hermetically sealed can (1) as after the 6. high low temperature circulation of step (F);
8. capping, burn-in screen, combine survey, packing (H) opens hermetically sealed can (1), takes out laser assembly and also tests its power, is no more than 15% assembly for variable power before and after the high low temperature circulation, just can carry out capping, burn-in screen, combine and survey, pack;
9. laser beats and carries out displacement calibration (I) for defective assembly, be that variable power surpasses 15% assembly before and after the high low temperature circulation, the support that adopts the laser technology of beaing that coupling is welded carries out trickle adjustment, make its luminous power return to high low temperature circulation level before, 6. 7. 8. selected through above-mentioned steps once more.
2, by the described a kind of method that improves semiconductor laser yield of claim 1, it is characterized in that:
3. step fills dry gas (C) to stuffing box, and duration of ventilation is 30 minutes.
3, by the described a kind of method that improves semiconductor laser yield of claim 1, it is characterized in that:
Step is 4. with hermetically sealed can locking (D), and the oxygen content in the stuffing box is 20%, and water vapour content is 5000ppm.
4, by the described a kind of method that improves semiconductor laser yield of claim 1, it is characterized in that:
The 6. high low temperature circulation of step (F), each cycle period setting-up time is 2 hours.
5, by the described a kind of method that improves semiconductor laser yield of claim 1, it is characterized in that:
7. step takes out hermetically sealed can (G), finishes 20 as after the 6. described high low temperature circulation of step, when temperature is 25 ℃ in the case to be recycled, takes out hermetically sealed can (1) from circulating box.
6, by the described a kind of method that improves semiconductor laser yield of claim 1, it is characterized in that:
Hermetically sealed can (1) is made up of tank body (1.1), cover (1.2), sealing ring (1.3); Between tank body (1.1) and cover (1.2), sealing ring (1.3) is arranged, pass through screw;
Described tank body (1.1), its structure are a kind of canisters that the edge is arranged, and are evenly equipped with aperture for connection on the edge;
Described cover (1.2), its structure are a kind of and the adaptive crown cap of tank body (1.1) size, and the edge is provided with and the same aperture of tank body (1.1);
Described sealing ring (1.3), its structure are a kind of and the adaptive round rubber circle of tank body (1.1) size.
7, by the described a kind of sealing ring of claim 6 (1.3), it is characterized in that:
Its material is a kind of butyl rubber of high-low temperature resistant circulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100190100A CN1326298C (en) | 2005-06-29 | 2005-06-29 | Method for raising semiconductor laser yield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100190100A CN1326298C (en) | 2005-06-29 | 2005-06-29 | Method for raising semiconductor laser yield |
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| CN1710762A true CN1710762A (en) | 2005-12-21 |
| CN1326298C CN1326298C (en) | 2007-07-11 |
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| CNB2005100190100A Active CN1326298C (en) | 2005-06-29 | 2005-06-29 | Method for raising semiconductor laser yield |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055132A (en) * | 2010-11-26 | 2011-05-11 | 中国科学院物理研究所 | Semiconductor laser device capable of deep cooling and sealing device thereof |
| CN102412500A (en) * | 2011-11-30 | 2012-04-11 | 江苏飞格光电有限公司 | Packaging method of semiconductor laser |
| CN104846184A (en) * | 2015-05-22 | 2015-08-19 | 大连藏龙光电子科技有限公司 | Laser welding inner stress releasing method of TOSA (transmitter optical subassembly) |
| CN110205472A (en) * | 2019-06-10 | 2019-09-06 | 大连藏龙光电子科技有限公司 | A kind of optical module stress release method |
| CN112234411A (en) * | 2020-10-15 | 2021-01-15 | 西南技术物理研究所 | Anti-detuning method for resonant cavity of vehicle-mounted solid laser |
| CN113036585A (en) * | 2021-03-03 | 2021-06-25 | 无锡锐科光纤激光技术有限责任公司 | High-power semiconductor optical fiber coupling laser packaging method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19611046A1 (en) * | 1996-03-20 | 1997-09-25 | Siemens Ag | Semiconductor device |
| DE19644941C1 (en) * | 1996-10-29 | 1998-01-15 | Jenoptik Jena Gmbh | High power diode laser |
| DE19821544A1 (en) * | 1998-05-14 | 1999-12-16 | Jenoptik Jena Gmbh | Diode laser component with heat sink providing less thermal expansion stress |
| WO2000058999A2 (en) * | 1999-03-26 | 2000-10-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor structures having a strain compensated layer and method of fabrication |
| JP2003163407A (en) * | 2001-11-28 | 2003-06-06 | Fujitsu Ltd | Optical semiconductor device |
-
2005
- 2005-06-29 CN CNB2005100190100A patent/CN1326298C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055132A (en) * | 2010-11-26 | 2011-05-11 | 中国科学院物理研究所 | Semiconductor laser device capable of deep cooling and sealing device thereof |
| CN102412500A (en) * | 2011-11-30 | 2012-04-11 | 江苏飞格光电有限公司 | Packaging method of semiconductor laser |
| CN104846184A (en) * | 2015-05-22 | 2015-08-19 | 大连藏龙光电子科技有限公司 | Laser welding inner stress releasing method of TOSA (transmitter optical subassembly) |
| CN110205472A (en) * | 2019-06-10 | 2019-09-06 | 大连藏龙光电子科技有限公司 | A kind of optical module stress release method |
| CN112234411A (en) * | 2020-10-15 | 2021-01-15 | 西南技术物理研究所 | Anti-detuning method for resonant cavity of vehicle-mounted solid laser |
| CN113036585A (en) * | 2021-03-03 | 2021-06-25 | 无锡锐科光纤激光技术有限责任公司 | High-power semiconductor optical fiber coupling laser packaging method |
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| Publication number | Publication date |
|---|---|
| CN1326298C (en) | 2007-07-11 |
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