CN1708207A - Method for preventing interwelding pad of circuit board from generating - Google Patents
Method for preventing interwelding pad of circuit board from generating Download PDFInfo
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- CN1708207A CN1708207A CN 200410046249 CN200410046249A CN1708207A CN 1708207 A CN1708207 A CN 1708207A CN 200410046249 CN200410046249 CN 200410046249 CN 200410046249 A CN200410046249 A CN 200410046249A CN 1708207 A CN1708207 A CN 1708207A
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- weld pad
- circuit board
- solder mask
- mask structure
- overflow
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Abstract
The method of preventing tin overflow between soldering pads in circuit board is to form soldering inhibiting structure between soldering pads. The soldering inhibiting structure can inhibit the soldering tin from overflowing to adjacent soldering pads to avoid short circuit. The soldering inhibiting structure may be added into circuit board in the circuit design stage and has no difficulty in making, no altering in electronic element structure, no increase in making complexity and no increase in cost. In addition, the soldering inhibiting structure may be checked automatically with optical inspection machine.
Description
Technical field
The present invention is a kind of method of the tin that prevents to overflow, particularly about producing the tin that overflows between a kind of weld pad that prevents electronic component, avoiding taking place between each weld pad the method that electrically connects.
Background technology
Along with the epoch of information arrive, the information age band is just leading people to move towards the modish tip of scientific and technological fashion.Simultaneously,, driven the rise of consumption electronic products, made that for example the sales volumes of product in the whole world such as personal computer, person communication system, digital and electronic communication product increase every year along with making rapid progress of communication product.Therefore, the different electronic components of integration are more important for the electronic product of manufacturing on circuit board.And, because portable information electronic product and mobile communication product be towards the trend development of compact, multi-functional, high-reliability and low priceization, also must stride forward towards long-pending body integration in the circuit design of electronic product.
Yet for meeting the requirement of above-mentioned long-pending body integration, electronic component must quite closely be arranged on the circuit board, make on the circuit board with each electronic component terminal corresponding pad also need design quite approaching.So when electronic component was soldered to circuit board, often approaching because of distance between the weld pad of electronic component, the scolding tin of overflow was connected to each other between each weld pad, the result causes the generation of short circuit phenomenon.
Caused the generation of short circuit phenomenon for fear of the tin that overflows, patents such as No. the 469678th, Taiwan patent announcement and No. 469679 propose the method for head it off in the past.Wherein, the Taiwan patent announcement is for No. 469678 the structure that changes the fixed connecting end that combines with circuit board in the terminal of electronic component, and the Taiwan patent announcement then provides one to be provided with ccontaining channel No. 469679, passes through and fixing insulation shell for terminal.
Because above-mentioned patent all need change the structure of electronic component or increase other assembly, thereby complexity or the manufacturing cost made have been increased.In addition, the terminal of above-mentioned patent is with existing surface adhering technology (Surface Mounted Technology, SMT) be fixed on the circuit board, but above-mentioned patent all discloses the defectiveness that whether is connected how to check each electronic component and circuit board after reflow, said method might be with the defective that is connected that causes between electronic component and circuit board, cause the connection status between detected electrons part and circuit board in time, thereby the product fine rate is descended.
Moreover patent announcement No. 371369 patent in Taiwan proposes the inspection method that a kind of inspection is used for pattern on the connection of IC socket pin end connecting portion of IC encapsulation and the printed circuit board (PCB).This method is by the change of the scolding tin position standard of the IC socket pin end through hole that is used for the IC encapsulation, checks the phenomenon whether failure welding or short circuit are arranged.Though No. 371369 patent of Taiwan patent announcement can be by checking the IC socket, the deterioration of avoiding the IC packaging part to cause because of heating after reflow with the mode of visual inspection time and effort consuming not only, also easily produces erroneous judgement, does not have economic benefit.
The applicant also proposed a kind of Short Item of automatic optical checking machine and method of short circuit False Rate of reducing 2002 on July 30, again, this method be after reflow by automatic optical checking machine (or automatic visual inspection system) automatic inspection for example Short Item, anti-insert, wrong part, short circuit, open circuit, polarity, set up a monument, skew, free foot, tin is many, tin is few, edge-on, turn over defectives such as part, anti-white, empty weldering, cold welding, to solve necessary in the past employing visual examination and automatic optical checking machine higher disadvantages of False Rate on Short Item and test for short-circuit.
Yet, though should reduce the Short Item of automatic optical checking machine and the method for short circuit False Rate, after the reflow according to circuit board in order to indicate the pattern of electronic component, check the defectiveness that whether is connected of each electronic component and circuit board, but above-mentioned technology is the back segment that is used in the SMT production line; In other words, above-mentioned technology only can inform that the producer makes relevant treatment after producing solder overflow, but can't avoid the generation of solder overflow in advance.Therefore above-mentioned technology can't solve the root problem of the tin that takes place to overflow, and the work that also need remove after inspection or remake of above-mentioned other patent, thus higher time and the cost of cost.
Therefore, since above-mentioned prior art need change electronic component structure, increase other assembly, can't check after reflow that whether each electronic component is connected defectiveness or only can informs that the producer makes relevant treatment producing the solder overflow rear with circuit board, make that complexity increases, manufacturing cost increase, the decline of product fine rate, can't avoid solder overflow to treat many shortcomings in advance thereby cause.Prior art can't be taken into account the demand in manufacturing and the coherent detection, truly has variety of problems, exists to demand improvements urgently.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide the method that produces the tin that overflows between a kind of weld pad that prevents circuit board that can avoid solder overflow to take place in advance.
Another object of the present invention is to provide the method that produces the tin that overflows between a kind of weld pad that prevents circuit board, still can be after reflow for the defectiveness that whether is connected of checking each electronic component and circuit board, take into account make and coherent detection on demand.
A further object of the present invention is to provide the method that produces the tin that overflows between a kind of weld pad that prevents circuit board, need not need to change the structure of electronic component or increase other assembly, can avoid solder overflow to take place in advance.
Another purpose of the present invention is to provide the method that produces the tin that overflows between a kind of weld pad that prevents circuit board, can simplify to make formality and end cost enough falls in prodigiosin.
Another purpose again of the present invention is to provide the method that produces the tin that overflows between a kind of weld pad that prevents circuit board, can supply follow-up usefulness such as Short Item, short circuit or other test item, the acceptance rate of raising product.
In order to reach above-mentioned and other purpose, produce the method for the tin that overflows between the weld pad of circuit board that the present invention prevents, be included in the step of the formation of the zone between at least two weld pads solder mask structure on this circuit board, the scolding tin that separates overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent weld pad, avoid the generation of short circuit phenomenon.Wherein, respectively this weld pad is to be welded on usefulness on the circuit board such as electronic component such as the semiconductor chip of resistance, electric capacity, inductance, tantalum matter electric capacity, electrochemical capacitor or circular electrochemical capacitor, transistor or tripod diode, exclusion, row's appearance, IC, connector or oscillating crystal, six pin crystal, six pin IC or six pin diodes and spherical grid array type (BGA) encapsulation or IC or other electronic component that has two terminals at least.
Zone or the zone between this weld pad that this solder mask structure can be selected to contain between most weld pads form the structure that stops, and the height of this solder mask structure is also can select more than or equal to this weld pad.Simultaneously, also can select to make the part height of this solder mask structure less than this weld pad.In addition, this solder mask structure may be selected to be solid or non-solid quadrilateral structure, and also can select to be formed with at least one spacer portion and/or at least one buffer part, to promote the welding resistance function.
So, just can avoid solder overflow to take place in advance by this solder mask structure, solve in the prior art and need check whether being connected defectiveness or only informing that after producing solder overflow the producer makes relevant treatment of each electronic component and circuit board after the reflow, thereby cause the shortcoming of making that complexity increases, manufacturing cost increases, the product fine rate descends, can't avoiding the solder overflow generation in advance.
Simultaneously, solder mask structure among the present invention can add at the beginning of board design in the circuit board, difficulty on not having to make, more can avoid prior art need change electronic component structure, increase problems such as manufacturing complexity increase that other assembly causes, manufacturing cost increase.
In addition, the solder mask structure that forms in the method for the present invention also can be used as on this circuit board in order to indicate the pattern of this a group weld pad, makes this solder mask structure can supply for example defective such as Short Item and short circuit of automatic optical checking machine (or automatic visual inspection system) automatic inspection after reflow.In other words, after reflow, can check the defectiveness that whether is connected of each electronic component and circuit board, so more can promote the product fine rate by this solder mask structure, avoid prior art to take into account making with coherent detection on the shortcoming of demand.
Description of drawings
Fig. 1 is the method according to this invention forms solder mask structure between weld pad a schematic diagram;
Fig. 2 A to Fig. 2 F shows the schematic diagram of other solder mask structure;
Fig. 3 is the end view of Fig. 1; And
Fig. 4 A to Fig. 4 F shows that method of the present invention forms the schematic diagram of other execution mode of solder mask structure between weld pad.
Embodiment
Embodiment
The specific implementation process that below cooperates Fig. 1 to Fig. 4 F figure explanation the inventive method.The present invention is the method that produces the tin that overflows between a kind of weld pad that prevents circuit board, respectively this weld pad 1 is that the sub-part of power supply is welded on the circuit board (figure is mark not), this method is included on this circuit board the step that zone between at least two weld pads 1 forms solder mask structure 3, as shown in Figure 1.
Be simplified, only (being equivalent to paper) and each electronic component terminal corresponding pad 1 on the protracting circuit plate in each accompanying drawing, and, omitted the icon of each electronic component in order to scolding tin (figure the is mark) overflow that prevents to be present in 1 of this weld pad respectively solder mask structure 3 to adjacent welding-pad.Wherein, this electronic component may be selected to be: resistance, electric capacity, inductance, tantalum matter electric capacity, electrochemical capacitor or circular electrochemical capacitor etc. have the part of two terminals; Transistor or tripod diode etc. have the part of three terminals; Exclusion, row's appearance, IC, connector or oscillating crystal etc. roughly have the part of two row terminals; Six pin crystal, six pin IC or six pin diodes etc. have the part of five terminals; And the semiconductor chip or the IC of spherical grid array type (BGA) encapsulation.Because the formation of above-mentioned electronic component and other electronic component that is suitable for is a prior art all with effect, so this no longer description more.
In the present embodiment, more clear understandable for making the present invention, be to be the example explanation with electronic component with two terminals.But it should be noted that the present invention is not limited thereto, it can be applicable to the electronic component with varying number terminal.
The zone that solder mask structure 3 among Fig. 1 is contained 1 of two weld pad of the overwhelming majority forms.As shown in the figure, this solder mask structure 3 is formed in 1 of this weld pad, and for example is solid quadrilateral structure, and the zone that makes 1 of this weld pad becomes the suitable zone of blocking by this solder mask structure 3.So, the scolding tin of 1 overflow during manufacture of this weld pad just can be separated the variety of problems of avoiding prior art to cause because of solder overflow by this solder mask structure 3.
In other embodiments, this solder mask structure 3 also can be such as structures such as " mouth " font, " worker " font, " ㄖ " font, " two " fonts, shown in Fig. 2 A to Fig. 2 D.In addition, as shown in the figure, this solder mask structure 3 can select to be formed up to a few spacer portion 31.Just, this solder mask structure 3 is not to exceed with solid quadrilateral structure, the quadrilateral structure that it is can right and wrong solid or such as rhombus, difform other structure.
So, not only can make the scolding tin of 1 overflow of this weld pad be stopped by this solder mask structure 3, and if the tin that overflows when serious, more can hold the scolding tin of overflow by this spacer portion 31, reach tangible blocking effect in the zone between this weld pad 1.
Shown in Fig. 2 E and Fig. 2 F, this solder mask structure 3 also can select at least one side to form the structure of sawtooth pattern, undaform, from but have structure such as buffer part 33.So, just can when stopping overflow scolding tin, provide the buffering effect that weakens scolding tin overflow strength by this buffer part 33.Certainly, be applied to when having two electronic components more than the terminal, this solder mask structure 3 can select to form a plurality of spacer portion 31 or buffer part 33, is not with exceeding shown in the accompanying drawing.
Simultaneously, this is formed with the solder mask structure 3 of spacer portion 31 or buffer part 33, lacks than these solder mask structure 3 spent materials that are not formed with spacer portion 31 or buffer part 33, can further reduce cost.
And, this solder mask structure 3 can add wherein at the beginning of board design, so not only can be for the scolding tin that stops overflow, more can be after reflow check the defective recognition structure that whether is connected of each electronic component and circuit board as automatic optical checking machine (or automatic visual inspection system) (figure is mark), take into account make and coherent detection on demand.Wherein, owing to utilize automatic optical checking machine to check that the technology and the principle of the connection status of each electronic component and circuit board belong to prior art, so explain no longer in addition at this.
In addition, this solder mask structure 3 is preferably selected to be made of non electrically conductive material, with when stopping overflow scolding tin, avoids forming electrical connection between this weld pad 1.Wherein, this solder mask structure 3 may be selected to be white paint for example or other and can be constituted by the material that automatic optical checking machine or automatic visual inspection system are detected, but is not as limit.
Fig. 3 is the end view of Fig. 1.As shown in Figure 3, the height of this solder mask structure 3 is greater than this weld pad 1, can not cross this solder mask structure 3 with the scolding tin that makes 1 overflow of this weld pad and causes connection between the weld pad 1.Certainly, the height of this solder mask structure 3 also may be selected to be and equals this weld pad 1; In other words, preferable selection be the height of this solder mask structure 3 for more than or equal to this weld pad 1, but also non-ly be confined to this.
For instance, this solder mask structure 3 can be that the part height is higher than this weld pad 1 or is scalariform, other irregular structure, shown in Fig. 4 A to Fig. 4 F.Wherein, this solder mask structure 3 about each side or upper surface can select to have different shapes.
Simultaneously, height change shown in Fig. 4 A to Fig. 4 F and other variation, can combine with the variation shown in Fig. 2 E to Fig. 2 F, thereby form multiple solder mask structure 3 with welding resistance function, and this solder mask structure 3 also can use such as Short Item, short circuit or other test item for detecting, make the present invention except can avoiding in advance solder overflow takes place, still can be after reflow for the defectiveness that whether is connected of checking each electronic component and circuit board.
By the foregoing description as can be known, when being applied in such as electronic components such as the semiconductor chip of resistance, electric capacity, inductance, tantalum matter electric capacity, electrochemical capacitor or circular electrochemical capacitor, transistor or tripod diode, exclusion, row's appearance, IC, connector or oscillating crystal, six pin crystal, six pin IC or six pin diodes and spherical grid array type encapsulation or IC, even the weld pad of above-mentioned electronic component 1 has various spread geometry, specification and size, all can use the present invention, the zone that the weld pad on this circuit board is 1 forms solder mask structure 3.In view of the above, make this solder mask structure 3 can adopt quite and form to prevent excessive tin and the clear mode that indicates for the detection position, avoid the shortcoming of existing method near the weld pad group.Therefore, each electronic component of Any shape, size, color and direction on the method energy adaptive circuit plate of the present invention, provide a kind of tin that overflows that solves between weld pad, to form the problem that electrically connects, and still can be for the solder mask structure of checking each electronic component and circuit board connection status after reflow.
In sum, the invention provides the method that produces the tin that overflows between a kind of weld pad that prevents circuit board that can avoid solder overflow to take place in advance, still can be after reflow for the defectiveness that whether is connected of checking each electronic component and circuit board, take into account make and coherent detection on demand.Simultaneously, the present invention need not need to change the structure of electronic component or increase other assembly, can avoid the generation of solder overflow in advance, simplifies and makes formality and have the low characteristics of cost, has further improved production efficiency and degree of fine qualities, improves the product fine rate.
Claims (10)
1. produce the method for the tin that overflows between a weld pad that prevents circuit board, respectively this weld pad is that the sub-part of power supply is welded on this circuit board, it is characterized in that, this method is included in the step of the zone formation solder mask structure between at least two weld pads of this circuit board, separate the scolding tin of overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent weld pad.
2. the method for claim 1 is characterized in that, the height of this solder mask structure is more than or equal to this weld pad.
3. the method for claim 1 is characterized in that, the part height of this solder mask structure is less than this weld pad.
4. the method for claim 1 is characterized in that, this solder mask structure is formed with at least one spacer portion.
5. the method for claim 1 is characterized in that, this solder mask structure is formed with at least one buffer part.
6. produce the method for the tin that overflows between a weld pad that prevents circuit board, it is characterized in that, respectively this weld pad is to be welded on this circuit board for being selected from an electronic component that comprises in the group that is made up of resistance, electric capacity, inductance, tantalum matter electric capacity, electrochemical capacitor and circular electrochemical capacitor, this method comprises: the step that forms solder mask structure at least in the zone between two weld pads on this circuit board, separate the scolding tin of overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent welding-pad.
7. produce the method for the tin that overflows between a weld pad that prevents circuit board, it is characterized in that, respectively this weld pad is to be welded on this circuit board for being selected from an electronic component that comprises in the group that is made up of transistor and tripod diode, this method comprises: the step that forms solder mask structure at least in the zone between two weld pads on this circuit board, separate the scolding tin of overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent weld pad.
8. produce the method for the tin that overflows between a weld pad that prevents circuit board, it is characterized in that, respectively this weld pad is to be welded on this circuit board for being selected from an electronic component that comprises in the group that is made up of exclusion, row's appearance, IC, connector and oscillating crystal, this method comprises: the step that forms solder mask structure at least in the zone between two weld pads on this circuit board, separate the scolding tin of overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent weld pad.
9. produce the method for the tin that overflows between a weld pad that prevents circuit board, it is characterized in that, respectively this weld pad is to be welded on this circuit board for being selected from an electronic component that comprises in the group that is made up of six pin crystal, six pin IC and six pin diodes, this method comprises: the step that forms solder mask structure at least in the zone between two weld pads on this circuit board, separate the scolding tin of overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent weld pad.
10. produce the method for the tin that overflows between a weld pad that prevents circuit board, it is characterized in that, respectively this weld pad is to be welded on this circuit board for the semiconductor chip of BGA encapsulation or the electronic component of IC, this method is included in the step of the formation of the zone between at least two weld pads solder mask structure on this circuit board, separate the scolding tin of overflow between this weld pad by this solder mask structure, prevent to exist the respectively scolding tin overflow between this weld pad to adjacent weld pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410046249 CN1708207A (en) | 2004-06-04 | 2004-06-04 | Method for preventing interwelding pad of circuit board from generating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410046249 CN1708207A (en) | 2004-06-04 | 2004-06-04 | Method for preventing interwelding pad of circuit board from generating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1708207A true CN1708207A (en) | 2005-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410046249 Pending CN1708207A (en) | 2004-06-04 | 2004-06-04 | Method for preventing interwelding pad of circuit board from generating |
Country Status (1)
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| CN (1) | CN1708207A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403299A (en) * | 2010-09-13 | 2012-04-04 | 矽品精密工业股份有限公司 | Circuit board structure and fabricating method for same |
| CN102076180B (en) * | 2009-11-20 | 2012-06-27 | 南亚电路板股份有限公司 | Circuit board structure and forming method thereof |
| CN103687325A (en) * | 2012-09-11 | 2014-03-26 | 联想(北京)有限公司 | Electronic component installing and testing method for printed circuit board |
| CN103996532A (en) * | 2013-02-14 | 2014-08-20 | 德克萨斯仪器股份有限公司 | Interdigitated chip capacitor assembly |
| CN106028648A (en) * | 2016-06-28 | 2016-10-12 | 北京中讯四方科技股份有限公司 | Apparatus and method allowing surface acoustic wave device to work normally under high temperature condition |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
| CN114175864A (en) * | 2019-07-17 | 2022-03-11 | 三星电子株式会社 | Electronic device including interposer |
-
2004
- 2004-06-04 CN CN 200410046249 patent/CN1708207A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076180B (en) * | 2009-11-20 | 2012-06-27 | 南亚电路板股份有限公司 | Circuit board structure and forming method thereof |
| CN102403299A (en) * | 2010-09-13 | 2012-04-04 | 矽品精密工业股份有限公司 | Circuit board structure and fabricating method for same |
| CN103687325A (en) * | 2012-09-11 | 2014-03-26 | 联想(北京)有限公司 | Electronic component installing and testing method for printed circuit board |
| CN103996532A (en) * | 2013-02-14 | 2014-08-20 | 德克萨斯仪器股份有限公司 | Interdigitated chip capacitor assembly |
| CN103996532B (en) * | 2013-02-14 | 2021-06-25 | 德克萨斯仪器股份有限公司 | Interdigitated chip capacitor assembly |
| CN106028648A (en) * | 2016-06-28 | 2016-10-12 | 北京中讯四方科技股份有限公司 | Apparatus and method allowing surface acoustic wave device to work normally under high temperature condition |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
| CN114175864A (en) * | 2019-07-17 | 2022-03-11 | 三星电子株式会社 | Electronic device including interposer |
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