CN106028648A - Apparatus and method allowing surface acoustic wave device to work normally under high temperature condition - Google Patents

Apparatus and method allowing surface acoustic wave device to work normally under high temperature condition Download PDF

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Publication number
CN106028648A
CN106028648A CN201610481702.5A CN201610481702A CN106028648A CN 106028648 A CN106028648 A CN 106028648A CN 201610481702 A CN201610481702 A CN 201610481702A CN 106028648 A CN106028648 A CN 106028648A
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shaped
strip
hole
saw device
circular
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CN106028648B (en
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李刚
胡成云
王建
张敬钧
王宁
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Beijing Zhongxun Sifang Science and Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Underground Structures, Protecting, Testing And Restoring Foundations (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明提出一种使声表器件在高温条件下能正常工作的装置，涉及声表器件技术领域，包括声表器件及耐高温的铜制PCB基板，所述铜制PCB基板上设有贯穿其的多个圆形通孔区及多个条形通孔区，所述圆形通孔区及条形通孔区沿所述铜制PCB基板周向设置，且所述圆形通孔区及条形通孔区相隔设置，所述圆形通孔区包含多个圆形通孔，所述条形通孔区包含多个条形通孔，所述条形通孔区设有多个声表器件焊盘，所述声表器件焊盘被所述条形通孔分隔开，所述声表器件的底部及条形通孔之内灌注有耐高温树脂。本发明采用物理隔离的方法，使声表器件引脚及焊锡都物理隔离，实现在高温下即使焊锡融化也不至于流动让声表器件引脚短路而不能工作的缺陷。

The present invention proposes a device for enabling SAW devices to work normally under high temperature conditions, and relates to the technical field of SAW devices, including SAW devices and high temperature resistant copper PCB substrates. A plurality of circular through-hole areas and a plurality of strip-shaped through-hole areas, the circular through-hole areas and strip-shaped through-hole areas are arranged along the circumference of the copper PCB substrate, and the circular through-hole areas and The strip-shaped through-hole areas are arranged at intervals, the circular through-hole area includes a plurality of circular through-holes, the strip-shaped through-hole area includes a plurality of strip-shaped through-holes, and the strip-shaped through-hole area is provided with a plurality of acoustic Surface device pads, the SAW device pads are separated by the strip-shaped through holes, and the bottom of the SAW device and the inside of the strip-shaped through holes are filled with high temperature resistant resin. The invention adopts the method of physical isolation to physically isolate the pins of the SAW device and the solder, so that even if the solder melts at high temperature, it will not flow and cause the pins of the SAW device to short-circuit and fail to work.

Description

一种使声表器件在高温条件下能正常工作的装置及方法 A device and method for enabling sound surface devices to work normally under high temperature conditions

技术领域 technical field

本发明涉及声表器件技术领域，具体的是指一种使声表器件在高温条件下能正常工作的装置。 The invention relates to the technical field of SAW devices, in particular to a device for enabling SAW devices to work normally under high temperature conditions.

背景技术 Background technique

常见电子装连采用低温锡膏和高温锡膏，低温锡膏的熔点在138度左右，高温锡膏的熔点305度左右。一般电子设备工作温度在80度以下，采用以上焊锡都能满足要求，但是在一些特殊应用场合，例如当环境温度在400度以上时，一般的焊锡都不能满足这种极端的工作条件。 Common electronic assembly uses low-temperature solder paste and high-temperature solder paste. The melting point of low-temperature solder paste is about 138 degrees, and the melting point of high-temperature solder paste is about 305 degrees. Generally, the working temperature of electronic equipment is below 80 degrees, and the above soldering tin can meet the requirements, but in some special applications, such as when the ambient temperature is above 400 degrees, the general soldering tin cannot meet this extreme working condition.

发明内容 Contents of the invention

本发明的目的在于解决上述问题而提出一种使声表器件在高温条件下能正常工作的装置，该装置采用物理隔离的方法，使声表器件引脚及焊锡都物理隔离，实现在高温下即使焊锡融化也不至于流动让声表器件引脚短路而不能工作的缺陷。 The purpose of the present invention is to solve the above problems and propose a device that enables the SAW device to work normally under high temperature conditions. Even if the solder melts, it will not flow and short-circuit the pins of the SAW device and fail to work.

为了实现上述目的，本发明采取的技术方案如下： In order to achieve the above object, the technical scheme that the present invention takes is as follows:

本发明提出一种使声表器件在高温条件下能正常工作的装置，包括声表器件及铜制PCB基板，所述声表器件通过焊锡固定连接于铜制PCB基板之上，所述铜制PCB基板为圆盘状，所述铜制PCB基板上设有贯穿其的多个圆形通孔区及多个条形通孔区，所述圆形通孔区及条形通孔区沿所述铜制PCB基板周向设置，且所述圆形通孔区及条形通孔区相隔设置，所述圆形通孔区包含多个圆形通孔，所述条形通孔区包含多个条形通孔，所述条形通孔区设有多个声表器件焊盘，所述声表器件焊盘被所述条形通孔分隔开，所述声表器件的底部及条形通孔之内灌注有耐高温树脂。 The present invention proposes a device for enabling the SAW device to work normally under high temperature conditions, including the SAW device and a copper PCB substrate, the SAW device is fixedly connected to the copper PCB substrate by soldering, and the copper SAW device is fixedly connected to the copper PCB substrate. The PCB substrate is disc-shaped, and the copper PCB substrate is provided with a plurality of circular through-hole areas and a plurality of strip-shaped through-hole areas passing through it, and the circular through-hole areas and the strip-shaped through-hole areas are arranged along the The copper PCB substrate is arranged circumferentially, and the circular through-hole area and the strip-shaped through-hole area are arranged separately, the circular through-hole area includes a plurality of circular through-holes, and the strip-shaped through-hole area includes a plurality of circular through-holes. A strip-shaped through hole, the strip-shaped through-hole area is provided with a plurality of SAW device pads, the SAW device pads are separated by the strip-shaped through hole, the bottom of the SAW device and the strip The high temperature resistant resin is poured into the through hole.

进一步的，所述圆形通孔区及条形通孔区均为4个，每个条形通孔区上均设有一个声表器件。 Further, there are four circular through-hole areas and four strip-shaped through-hole areas, and one SAW device is provided on each strip-shaped through-hole area.

进一步的，所述条形通孔为“L”形，所述条形通孔区包括四个条形通孔，所述条形通孔围成“井”字形结构并将所述条形通孔区分割成8个声表器件焊盘区，每个声表器件焊盘区内设有一个声表器件焊盘。 Further, the strip-shaped through hole is "L" shape, and the strip-shaped through-hole area includes four strip-shaped through-holes, and the strip-shaped through-holes enclose a "well"-shaped structure and connect the strip-shaped through-holes The hole area is divided into 8 SAW device pad areas, and each SAW device pad area is provided with a SAW device pad.

进一步的，所述装置还包括弹簧天线，所述弹簧天线设置于声表器件的上方，所述圆形通孔区内设有弹簧天线焊盘，所述弹簧天线的一端向下延伸并设置在弹簧天线焊盘处。 Further, the device also includes a spring antenna, the spring antenna is arranged above the SAW device, a spring antenna pad is provided in the circular through-hole area, and one end of the spring antenna extends downward and is arranged on the Spring antenna pad.

基于上述装置，本发明还提出一种使声表器件在高温条件下能正常工作的方法，包括如下步骤： Based on the above-mentioned device, the present invention also proposes a method for enabling the SAW device to work normally under high temperature conditions, comprising the following steps:

S100、在铜制PCB基板上设置声表器件焊盘； S100, setting the SAW device pad on the copper PCB substrate;

S200、通过在铜制PCB基板上开槽或者打孔将上述声表器件焊盘分割成若干个区域； S200, dividing the above-mentioned SAW device pad into several regions by slotting or punching holes on the copper PCB substrate;

S300、将声表器件通过焊锡固定于铜制PCB基板之上的声表器件焊盘处； S300, fixing the SAW device on the pad of the SAW device on the copper PCB substrate by soldering;

S400、在声表器件焊盘及开槽或者打孔处灌注耐高温树脂。 S400. Pouring high-temperature-resistant resin on the welding pads and slots or holes of the SAW device.

本发明的有益效果：本发明通过物理隔离的方法，使声表器件引脚及焊锡都物理隔离，实现在高温下即使焊锡融化也不至于流动让声表器件引脚短路而不能工作的缺陷，具体通过在铜制PCB基板上加工出条形通孔，并通过条形通孔将声表器件的焊盘位置给分隔开，再将耐高温树脂灌注于声表器件的底部以及条形通孔的内部，使得耐高温树脂起到隔开声表器件引脚的作用，达到声表器件能够工作于高温环境下的目的。 Beneficial effects of the present invention: the present invention physically isolates the pins of the SAW device and the solder, so that even if the solder melts at high temperature, it will not flow and the pins of the SAW device will be short-circuited and unable to work. Specifically, a strip-shaped through hole is processed on the copper PCB substrate, and the pad position of the SAW device is separated through the strip-shaped through hole, and then the high-temperature resistant resin is poured into the bottom of the SAW device and the strip-shaped through hole. The inside of the hole makes the high-temperature-resistant resin play the role of separating the pins of the SAW device, so that the SAW device can work in a high-temperature environment.

附图说明 Description of drawings

图1为本发明一种使声表器件在高温条件下能正常工作的装置的结构示意图； Fig. 1 is a kind of structural representation of the device that makes SAW device work normally under high temperature condition of the present invention;

图2为本发明一种使声表器件在高温条件下能正常工作的装置的声表器件与铜制PCB基板的结构示意图； Fig. 2 is a structural schematic diagram of the SAW device and the copper PCB substrate of a device that enables the SAW device to work normally under high temperature conditions;

图3为本发明一种使声表器件在高温条件下能正常工作的装置的铜制PCB基板的结构示意图。 Fig. 3 is a structural schematic diagram of a copper PCB substrate of a device for enabling SAW devices to work normally under high temperature conditions according to the present invention.

其中，1-声表器件，2-铜制PCB基板，3-弹簧天线，21-圆形通孔区，22-条形通孔区，211-圆形通孔，212-弹簧天线焊盘，221-条形通孔，222-声表器件焊盘。 Among them, 1-sound meter device, 2-copper PCB substrate, 3-spring antenna, 21-circular through-hole area, 22-strip-shaped through-hole area, 211-circular through-hole, 212-spring antenna pad, 221-strip-shaped through hole, 222-SAW device pad.

具体实施方式 detailed description

为了更清楚地说明本发明实施例的技术方案，下面将结合实施例并参照附图对本发明的作进一步描述，显而易见地，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。 In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the present invention will be further described below in conjunction with the embodiments and with reference to the accompanying drawings. Obviously, the described embodiments are some of the embodiments of the present invention, not all of them. . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

为了解决背景技术中所述的由于焊锡在高温条件下容易融化而致使声表器件不能正常工作的缺陷，本发明提出一种使声表器件在高温条件下能正常工作的装置，如图1所示，该装置包括铜制PCB基板2、设置在铜制PCB基板2上的声表器件1以及弹簧天线3，本发明如传统技术一样也是通过印刷焊锡将声表器件1固定连接在铜制PCB基板2之上，但在此过程中，本发明通过有效的技术手段使得焊锡与声表器件2的引脚能够被分隔开而免于遭到高温的影响，本发明采取的技术手段具体如下： In order to solve the defects in the background technology that the SAW device cannot work normally because the solder is easy to melt under high temperature conditions, the present invention proposes a device that enables the SAW device to work normally under high temperature conditions, as shown in Figure 1 As shown, the device includes a copper PCB substrate 2, an SAW device 1 disposed on the copper PCB substrate 2, and a spring antenna 3. The present invention also fixes the SAW device 1 on the copper PCB by printing solder as in the conventional technology. On the substrate 2, but in the process, the present invention enables the solder and the pins of the SAW device 2 to be separated from the influence of high temperature through effective technical means. The technical means adopted by the present invention are specifically as follows :

在本发明的一具体实施例中，铜制PCB基板1为圆盘状，所述铜制PCB基板2上设有贯穿其的多个圆形通孔区21及多个条形通孔区22，所述圆形通孔区21及条形通孔区22沿所述铜制PCB基板2周向设置，且所述圆形通孔区21及条形通孔区22相隔设置，所述圆形通孔区21包含多个圆形通孔211，所述条形通孔区22包含多个条形通孔221，所述条形通孔区22设有多个声表器件焊盘222，所述声表器件焊盘222被所述条形通孔221分隔开，所述声表器件1的底部及条形通孔221之内灌注有耐高温树脂，至此，本发明通过物理隔离的方法，使声表器件引脚及焊锡都物理隔离，实现在高温下即使焊锡融化也不至于流动让声表器件引脚短路而不能工作的缺陷。 In a specific embodiment of the present invention, the copper PCB substrate 1 is disc-shaped, and the copper PCB substrate 2 is provided with a plurality of circular through-hole areas 21 and a plurality of strip-shaped through-hole areas 22 passing through it. , the circular through-hole area 21 and the strip-shaped through-hole area 22 are arranged along the circumferential direction of the copper PCB substrate 2, and the circular through-hole area 21 and the strip-shaped through-hole area 22 are arranged apart from each other, and the circle The through-hole region 21 includes a plurality of circular through-holes 211, the through-hole region 22 includes a plurality of through-holes 221, and the through-hole region 22 is provided with a plurality of SAW device pads 222, The SAW device pads 222 are separated by the strip-shaped through holes 221, and the bottom of the SAW device 1 and the strip-shaped through holes 221 are filled with high temperature resistant resin. The method is to physically isolate the pins of the SAW device and the solder, so that even if the solder melts at a high temperature, it will not flow and cause the SAW device pins to short-circuit and fail to work.

具体的，上述条形通孔221为“L”形，条形通孔区22包括四个条形通孔221，上述四个“L”形的条形通孔221围成“井”字形结构，显然，“井”字形结构将条形通孔区22分割成8个区域，这8个区域即为声表器件焊盘区，声表器件焊盘区上设有声表器件的焊盘222，当声表器件1通过焊锡安装于铜制PCB基板2上时，声表器件1的引脚就可以被条形通孔221给分隔开，进一步的，再将耐高温树脂灌注于声表器件1的底部以及条形通孔221的内部，使得耐高温树脂起到隔开声表器件1引脚的作用，达到声表器件1能够工作于高温环境下的目的。 Specifically, the above-mentioned strip-shaped through holes 221 are "L"-shaped, and the strip-shaped through-hole area 22 includes four strip-shaped through-holes 221, and the above-mentioned four "L"-shaped strip-shaped through-holes 221 form a "well"-shaped structure , obviously, the "well" shape structure divides the strip-shaped through-hole area 22 into 8 areas, and these 8 areas are the pad areas of the SAW device, and the pads 222 of the SAW device are arranged on the pad area of the SAW device. When the SAW device 1 is mounted on the copper PCB substrate 2 by soldering, the pins of the SAW device 1 can be separated by the strip-shaped through holes 221, and further, the high temperature resistant resin is poured into the SAW device The bottom of 1 and the inside of the strip-shaped through hole 221 make the high-temperature-resistant resin play the role of separating the pins of the SAW device 1, so that the SAW device 1 can work in a high-temperature environment.

需要说明的是，本发明所述的条形通孔221并不局限于“L”形，任何可将声表器件1的焊盘分隔开若干区域的条形通孔都应该涵盖在本发明的保护范围之内，例如上述条形通孔可以直线型条形通孔，直线型条形通孔交叉设置即可将声表器件的焊盘分割呈若干个区域，使得声表器件的引脚被分隔开。 It should be noted that the strip-shaped through hole 221 described in the present invention is not limited to the "L" shape, and any strip-shaped through hole that can separate the pads of the SAW device 1 into several areas should be covered by the present invention. Within the scope of protection, for example, the above-mentioned strip-shaped through-holes can be linear strip-shaped through-holes, and the cross-setting of straight-line strip-shaped through-holes can divide the pad of the SAW device into several regions, so that the pins of the SAW device are separated.

作为一种优选方案，圆形通孔区21及条形通孔区22均为4个，每个条形通孔区22上均设有一个声表器件1，上述4个圆形通孔区21及条形通孔区22均分所述铜制PCB基板2，将圆形通孔区21及条形通孔区22设定为4个，使得该装置在整体造型上显得更加对称，更加美观。 As a preferred solution, there are four circular through-hole areas 21 and strip-shaped through-hole areas 22, and each strip-shaped through-hole area 22 is provided with a SAW device 1, and the above-mentioned four circular through-hole areas 21 and the strip-shaped through-hole area 22 are equally divided into the copper PCB substrate 2, and the circular through-hole area 21 and the strip-shaped through-hole area 22 are set to four, so that the overall shape of the device appears more symmetrical and more beautiful.

基于上述使声表器件在高温条件下能正常工作的装置，本发明还提出一种使声表器件在高温条件下能正常工作的方法，该方法具体包括如下步骤： Based on the above-mentioned device for enabling the SAW device to work normally under high temperature conditions, the present invention also proposes a method for enabling the SAW device to work normally under high temperature conditions. The method specifically includes the following steps:

S100、在铜制PCB基板上设置声表器件焊盘； S100, setting the SAW device pad on the copper PCB substrate;

S200、通过在铜制PCB基板上开槽或者打孔将上述声表器件焊盘分割成若干个区域； S200, dividing the above-mentioned SAW device pad into several regions by slotting or punching holes on the copper PCB substrate;

S300、将声表器件通过焊锡固定于铜制PCB基板之上的声表器件焊盘处； S300, fixing the SAW device on the pad of the SAW device on the copper PCB substrate by soldering;

S400、在声表器件焊盘及开槽或者打孔处灌注耐高温树脂。 S400. Pouring high-temperature-resistant resin on the welding pads and slots or holes of the SAW device.

以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应所述以权利要求的保护范围为准。 The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (5)

1.一种使声表器件在高温条件下能正常工作的装置，包括声表器件（1）及铜制PCB基板（2），所述声表器件（1）通过焊锡固定连接于铜制PCB基板（2）之上，其特征在于，所述铜制PCB基板（2）为圆盘状，所述铜制PCB基板（2）上设有贯穿其的多个圆形通孔区（21）及多个条形通孔区（22），所述圆形通孔区（21）及条形通孔区（22）沿所述铜制PCB基板（2）周向设置，且所述圆形通孔区（21）及条形通孔区（22）相隔设置，所述圆形通孔区（21）包含多个圆形通孔（211），所述条形通孔区（22）包含多个条形通孔（221），所述条形通孔区（22）设有多个声表器件焊盘（222），所述声表器件焊盘（222）被所述条形通孔（221）分隔开，所述声表器件（1）的底部及条形通孔（221）之内灌注有耐高温树脂。 1. A device for enabling the SAW device to work normally under high temperature conditions, including the SAW device (1) and the copper PCB substrate (2), and the SAW device (1) is fixedly connected to the copper PCB by soldering On the substrate (2), it is characterized in that the copper PCB substrate (2) is disc-shaped, and the copper PCB substrate (2) is provided with a plurality of circular through-hole areas (21) passing through it and a plurality of strip-shaped through-hole areas (22), the circular through-hole area (21) and the strip-shaped through-hole area (22) are arranged along the circumference of the copper PCB substrate (2), and the circular The through-hole area (21) and the strip-shaped through-hole area (22) are arranged separately, the circular through-hole area (21) includes a plurality of circular through-holes (211), and the strip-shaped through-hole area (22) includes A plurality of strip-shaped through holes (221), the strip-shaped through-hole area (22) is provided with a plurality of SAW device pads (222), and the SAW device pads (222) are covered by the strip-shaped through holes (221), the bottom of the SAW device (1) and the strip-shaped through hole (221) are filled with high temperature resistant resin. 2.根据权利要求1所述的一种使声表器件在高温条件下能正常工作的装置，其特征在于，所述圆形通孔区（21）及条形通孔区（22）均为4个，每个条形通孔区（22）上均设有一个声表器件（1）。 2. A device for enabling SAW devices to work normally under high temperature conditions according to claim 1, characterized in that the circular through-hole area (21) and the strip-shaped through-hole area (22) are both 4, each strip-shaped through-hole area (22) is provided with a sound meter device (1). 3.根据权利要求1所述的一种使声表器件在高温条件下能正常工作的装置，其特征在于，所述条形通孔（221）为“L”形，所述条形通孔区（22）包括四个条形通孔（221），所述条形通孔（221）围成“井”字形结构并将所述条形通孔区（22）分割成8个声表器件焊盘区，每个声表器件焊盘区内设有一个声表器件焊盘（222）。 3. A device for enabling SAW devices to work normally under high temperature conditions according to claim 1, characterized in that the strip-shaped through hole (221) is "L"-shaped, and the strip-shaped through-hole The zone (22) includes four strip-shaped through-holes (221), and the strip-shaped through-holes (221) enclose a "well"-shaped structure and divide the strip-shaped through-hole zone (22) into 8 SAW devices In the pad area, each SAW device pad area is provided with a SAW device pad (222). 4.根据权利要求1所述的一种使声表器件在高温条件下能正常工作的装置，其特征在于，所述装置还包括弹簧天线（3），所述弹簧天线（3）设置于声表器件（1）的上方，所述圆形通孔区（21）内设有弹簧天线焊盘（212），所述弹簧天线（3）的一端向下延伸并设置在弹簧天线焊盘（212）处。 4. A device for enabling SAW devices to work normally under high temperature conditions according to claim 1, characterized in that the device also includes a spring antenna (3), and the spring antenna (3) is arranged on the acoustic Above the surface device (1), a spring antenna pad (212) is provided in the circular through hole area (21), and one end of the spring antenna (3) extends downward and is arranged on the spring antenna pad (212 ) place. 5.一种使声表器件在高温条件下能正常工作的方法，其特征在于，包括如下步骤： 5. A method for making an acoustic surface device work normally under high temperature conditions, characterized in that, comprising the steps: S100、在铜制PCB基板上设置声表器件焊盘； S100, setting the SAW device pad on the copper PCB substrate; S200、通过在铜制PCB基板上开槽或者打孔将上述声表器件焊盘分割成若干个区域； S200, dividing the above-mentioned SAW device pad into several regions by slotting or punching holes on the copper PCB substrate; S300、将声表器件通过焊锡固定于铜制PCB基板之上的声表器件焊盘处； S300, fixing the SAW device on the pad of the SAW device on the copper PCB substrate by soldering; S400、在声表器件焊盘及开槽或者打孔处灌注耐高温树脂。 S400. Pouring high-temperature-resistant resin on the welding pads and slots or holes of the SAW device.
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