CN1702810A - Plasma display device - Google Patents
Plasma display device Download PDFInfo
- Publication number
- CN1702810A CN1702810A CNA2005100706650A CN200510070665A CN1702810A CN 1702810 A CN1702810 A CN 1702810A CN A2005100706650 A CNA2005100706650 A CN A2005100706650A CN 200510070665 A CN200510070665 A CN 200510070665A CN 1702810 A CN1702810 A CN 1702810A
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- China
- Prior art keywords
- integrated circuit
- display
- base plate
- radiator
- circuit modules
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G15/00—Operating chairs; Dental chairs; Accessories specially adapted therefor, e.g. work stands
- A61G15/14—Dental work stands; Accessories therefor
- A61G15/16—Storage, holding or carrying means for dental handpieces or the like
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G15/00—Operating chairs; Dental chairs; Accessories specially adapted therefor, e.g. work stands
- A61G15/10—Parts, details or accessories
- A61G15/12—Rests specially adapted therefor, e.g. for the head or feet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The plasma display device includes a plasma display panel, a chassis base on which the plasma display panel is attached and supported, integrated circuit modules that are mounted on the circuit board assembly on an opposite side of the chassis base to the plasma display panel, and heat sinks, each being attached to one side of each of the integrated circuit modules to dissipate heat therefrom. The heat sink is formed such that one end thereof extends to come in contact with the chassis base.
Description
Technical field
The present invention relates to a kind of plasma scope, especially relate to a kind of can be effectively to being arranged in the plasma scope that switch element on the circuit board assemblies or integrated circuit modules dispel the heat.
Technical background
Generally speaking, plasma display panel (hereinafter referred to as " PDP ") is a kind of display panel, and wherein, the excited by vacuum ultraviolet fluorophor that gas discharge produces in the arc chamber is to form image.The configurations shown of PDP comprises the high capacity of display, brightness, contrast and wide visual angle.And PDP is in light weight, and thickness is little, and screen is big.
According to the plasma scope of prior art have be used for display image PDP, support PDP base plate, be arranged on the base plate facing to a plurality of drive circuit boards of PDP and covering the housing of PDP, base plate and drive circuit board.
Housing has the protecgulum that is positioned at the PDP front and is positioned at the bonnet of PDP back.In general, protecgulum and bonnet can fit together mutually.
Circuit board assemblies is contained on the base plate, and comprise power panel, image processing board, logic card, address buffer plate, keep electrode drive plate, scan electrode drive plate, or the like.Many integrated circuit modules and switch element are installed on various plates.
Keep the switch element of keeping electrode and scan electrode or the integrated circuit modules that can have some control PDP on electrode drive plate and the scan electrode drive plate.Switch element or integrated circuit modules provide high frequency to keep pulse, have produced heat thus.Correspondingly, consider the operation of PDP, switch element or the integrated circuit modules that control need be kept electrode and scan electrode maintain suitable temperature.
But, be arranged on the big electric current that flows through in each integrated circuit modules on the circuit board assemblies, produced a large amount of heat.If heat can not be loose fully to the outside, so, integrated circuit modules just may not can normally moves again.
Some traditional plasma scope has living space between bonnet and circuit board assemblies, and this space is hermetic seal.For circuit board assemblies is dispelled the heat, aeration portions such as fan are set, produce forced convertion.This structure can play the effect of heat radiation well.But the noise that fan produces allows the user feel under the weather.
On the other hand, other plasma scope uses radiator to replace fan, comes circuit board assemblies is dispelled the heat by free convection.In some PDP, be installed in a switch element on the circuit board assemblies or a side of integrated circuit modules through lead-in wire, radiator is set, form radiator thus and be installed in radiator structure on the circuit board assemblies.According to this configuration, formed single direction heat radiation approach, switch element or integrated circuit modules drive the heat that PDP produces, and are passed to radiator through this single direction heat radiation approach, and the heat of being transmitted is then dissipated through the reaction of the convection current in radiator.But this structure is limited to the heat dissipation capacity of integrated circuit modules and entire circuit board component.
Summary of the invention
The invention provides a kind of plasma scope, can make the heat radiation approach variation of the switch element or the integrated circuit modules of circuit board assemblies, strengthen the radiating effect of switch element or integrated circuit modules thus.
According to an exemplary embodiment of the present invention, a kind of plasma scope comprise PDP, can in conjunction with and support PDP base plate, be installed in integrated circuit modules and radiator on the circuit board assemblies that is positioned at the opposite side of base plate.Each radiator is attached to a side of each integrated circuit modules, and integrated circuit modules is dispelled the heat.The generation type of radiator is that the one end extends and contacts with base plate.
Integrated circuit modules can be surface mounted device (SMD) formula or two encapsulation (DIP) formula in upright arrangement, can also be hybrid integrated circuit (HIC) formula or Intelligent Power Module (IPM) formula.
Integrated circuit modules can be positioned at the edge of circuit board assemblies.Radiator has the first that is attached to integrated circuit modules, bends towards the second portion of base plate and the third part of extending and contacting with base plate from second portion from first.First, second and third part has the U-shaped cross section altogether.
First inwardly is attached to the upper surface of integrated circuit modules, and third part outwards is attached to base plate.In addition, first, third part link together through second portion, form heat conduction structure.
First, second portion can be flat, can also have radiating fin.In addition, also tabular of third part.
Radiator can be attached to base plate through cooling pad.Cooling pad can be between the third part of the radiator with first, second and third part and corresponding base plate.
In addition, the side that is attached to integrated circuit modules at radiator can connect additional cooler.
Radiator can be connected to additional cooler through cooling pad.So the heat that is delivered to radiator from integrated circuit modules is delivered to additional cooler through cooling pad.
The other end contact base plate of additional cooler.So the heat that is delivered to additional cooler from integrated circuit modules is passed to base plate.Additional cooler and base plate combine through cooling pad.So the heat that is delivered to additional cooler is passed to base plate through this cooling pad.
Integrated circuit modules can be positioned at the edge of circuit board assemblies, and like this, additional cooler can freely be attached to a side of radiator.
Radiator can be attached to a side of integrated circuit modules sidewards, and additional cooler can endwaysly be attached to a described side of radiator.Therefore, the heat that produces in the integrated circuit modules, its heat radiation approach is various.
In addition, the shape of radiator and additional cooler can be identical.Therefore, these parts can be general.In addition, additional cooler can be L shaped, can be attached to a described side of radiator and a described side of base plate.
Description of drawings
Fig. 1 is the decomposition diagram of plasma scope according to one exemplary embodiment.
Fig. 2 is the enlarged perspective of part " A " among Fig. 1.
Fig. 3 is the cutaway view along the intercepting of the line III-III among Fig. 2.
Fig. 4 is a cutaway view of partly expressing the plasma scope of another illustrative embodiments according to the present invention.
Fig. 5 is a cutaway view of partly expressing the plasma scope of another illustrative embodiments according to the present invention.
Fig. 6 is the decomposition diagram of the plasma scope of another illustrative embodiments according to the present invention.
Fig. 7 is the enlarged perspective of part " B " among Fig. 6.
Fig. 8 is the cutaway view along the intercepting of the line VIII-VIII among Fig. 7.
Fig. 9 is a cutaway view of partly expressing the plasma scope of another illustrative embodiments according to the present invention.
Embodiment
Referring to Fig. 1, an illustrative embodiments of plasma scope of the present invention has the PDP 3 and the base plate 5 of display image.Base plate 5 be attached on the PDP 3 with the reverse surface of the display surface of PDP 3 on.In addition, this plasma displaying appliance has protecgulum 7 that is positioned at PDP 3 tops and the bonnet 9 that is positioned at base plate 5 tops.
The fin (not shown) can be arranged between PDP 3 and the base plate 5, and the heat that PDP 3 is produced is delivered to base plate 5.In addition, filter 11 can be installed on the protecgulum 7, and the electromagnetic wave that PDP 3 is sent shields.
Usually, the shape of PDP 3 is roughly quadrangle (be rectangle in Fig. 1, the length of x direction is greater than the length of y direction).The shape of base plate 5 is similar to PDP 3, and is made by the material that aluminium etc. has an excellent heat conductivity.
Above PDP 3 is attached to a side of base plate 5 and is supported on.Opposite side at base plate 5 is equipped with a plurality of circuit board assemblies 13, and each circuit board assemblies all has the required circuit element of some drivings PDP 3.Circuit board assemblies 13 can be installed on the boss (not shown) that is arranged at base plate 5 rear surfaces by the dog screw (not shown).
Be installed in circuit board assemblies 13 on base plate 5 rear surfaces and can comprise and keep electrode drive plate 13a, scan electrode drive plate 13b, image processing board 13c, switching type power supply (SMPS) plate 13d, or the like.Generally speaking, each plate constitutes by various types of integrated circuit modules such as SMD, DIP, HIC, IPM 15 is installed on the printed circuit board (PCB) through lead-in wire.
With reference to Fig. 2 and Fig. 3 radiator structure according to the integrated circuit modules 15 of an illustrative embodiments is described below.What represent among Fig. 2 and Fig. 3 is the integrated circuit modules 15 with SMD formula switch element.But the present invention is not limited to have the integrated circuit modules of SMD formula switch element.For example, according to concrete integrated circuit structure, the present invention can be applied to DIP formula, HIC formula, IPM formula integrated circuit modules after suitably revising.
As mentioned above, circuit board assemblies 13 usefulness dog screws 18 are fixedly mounted on the boss 17.Integrated circuit modules 15 and other circuit element are installed on the circuit board assemblies 13, form drive circuit.
Each integrated circuit modules 15 all can generate heat when driving PDP 3, therefore, need dispel the heat, and makes integrated circuit modules 15 remain on continuously, drive naturally required suitable temperature.For integrated circuit modules 15 is dispelled the heat, can use radiator 19.In the present embodiment, a side of radiator 19 is attached to integrated circuit modules 15, and opposite side is attached to base plate 5, makes integrated circuit modules 15 be connected to base plate 5 through radiator 19.Radiator 19 can be attached to integrated circuit modules 15 with binding agent or adhesive pad.
That is, radiator 19 is arranged to make interconnective integrated circuit modules 15 and base plate 5 form heat conduction structure.Because this reason, the heat energy that integrated circuit modules 15 produces enough is directly delivered to a side of radiator 19, is passed to base plate 5 subsequently, like this, has dissipated heat.In addition, in the structure of radiator 19 itself, dispel the heat by convection effect.Therefore, the heat radiation approach of integrated circuit modules 15 is various, thus, and the radiating effect of Zeng Qianging effectively.Correspondingly, compare with traditional radiating effect, radiator 19 has good conductibility, and can obtain big as far as possible area of dissipation in limited space.
Can be arranged on a plurality of positions on the circuit board assemblies 13 through the integrated circuit modules 15 that radiator 19 dispels the heat.In order to strengthen advantage of the present invention, in an exemplary embodiment of the present invention, integrated circuit modules 15 is arranged on the edge of circuit board module 13.In addition, radiator 19 can be set individually, perhaps radiator 19 be arranged to be common to adjacent integrated circuit modules 15 for each integrated circuit modules 15.In addition, when design circuit board component 13, integrated circuit modules 15 can be arranged in the edge of circuit board assemblies 13.
The radiator 19 of present embodiment can be applicable to be arranged on all integrated circuit modules 15 on the circuit board assemblies 13, perhaps can optionally only be applied to be arranged on the integrated circuit modules 15 at circuit board assemblies 13 edges.
As shown in Figure 3, the radiator 19 of present embodiment has the U-shaped cross section, comprises the 19a of first, second portion 19b and third part 19c.Radiator 19 is set in place on the integrated circuit modules 15 at circuit board assemblies 13 edges.The 19a of first is attached to integrated circuit modules 15, and second portion 19b bends towards base plate 5 from the 19a of first.In addition, third part 19c and second portion 19b are integrally formed, bend towards the 19a of first and put down and be attached to base plate 5.
More particularly, the inner surface of radiator 19 19a of first is attached to the upper surface of integrated circuit modules 15, and the outer surface of third part 19c is attached to base plate 5.Second portion 19b is connected to third part 19c with the 19a of first, has formed heat conduction structure thus.
The 19a of first is attached on the integrated circuit modules 15, substantially contacts with the entire upper surface of this integrated circuit modules 15.Third part 19c is attached on the base plate 5, substantially contacts with the surface of this base plate 5.
With regard to above-mentioned structure, the radiator with first, second and third part 19a, 19b, 19c can correspondingly be made different shape.When integrated circuit modules 15 was positioned at the edge of circuit board assemblies 13, the cross section of radiator 19 can be a U-shaped.Utilize this radiator 19, increased the area of dissipation that transmits heat from integrated circuit modules 15.
In addition, shown in Fig. 2,3, first and second part 19a, 19b can form tabular simply.Utilize tabular first and second part 19a, 19b, the heat radiation of integrated circuit modules 15 is depended on the heat conduction reaction of base plate 5 rather than convection current reaction.
On the other hand, first and second part 19a, 19b can have radiating fin, can further strengthen the radiating effect of integrated circuit modules 15 like this.
Fig. 4 is a cutaway view of partly expressing the plasma scope of another illustrative embodiments according to the present invention.Fig. 5 is a cutaway view of partly expressing the plasma scope of another illustrative embodiments according to the present invention.
Referring to Fig. 4, radiator 29 has the 29a of first, second portion 29b, third part 29c.The 29a of first has radiating fin 29aa.In addition, referring to Fig. 5, radiator 39 has the 39a of first, second portion 39b, third part 39c.39a of first and second portion 39b have radiating fin 39aa and 39bb respectively.
Radiating fin 29aa, 39aa or 39bb have increased the contact area of radiator 29 or radiator 39 and external environment.As a result, can more effectively integrated circuit modules 15 be dispelled the heat by the heat conduction reaction of convection current reaction and radiator 29 or radiator 39.So, owing to can effectively dispel the heat to integrated circuit modules 15, so the enough elements of energy replace being arranged on the numerous elements on the circuit board assemblies 13.Therefore, reduced number of components and parts.
Different with the 29a of first or 39a, second portion 29b or 39b, third part 29c or 39c are attached to base plate 5, and therefore by tabular formation.Tabular third part 29c or 39c can carry out contacting of essence with base plate 5.
In above-mentioned illustrative embodiments, radiator 19,29,39 can directly be attached to base plate 5.But, also can between radiator 19,29,39 and base plate 5, place cooling pad 21, make radiator contact closelyr with base plate 5, strengthen heat-conduction effect thus.When radiator 19,29,39 had the 19a of first, 29a, 39a, second portion 19b, 29b, 39b, third part 19c, 29c, 39c, cooling pad 21 can be placed between third part and the base plate 5, strengthens heat-conduction effect thus.
Fig. 6 is the decomposition diagram of the plasma scope of another illustrative embodiments according to the present invention.Fig. 7 is the enlarged perspective of part " B " among Fig. 6.Fig. 8 is the cutaway view along the intercepting of the line VIII-VIII among Fig. 7.
When driving PDP 3, therefore integrated circuit modules 15 heatings will dispel the heat continuously to integrated circuit modules 15, integrated circuit modules being remained on suitable temperature, thereby can drive PDP for a long time.In the present embodiment, in order to dissipate the heat that produces in the integrated circuit modules 15, radiator 49 and additional cooler 48 have been used.Radiator 49 is attached to a side of integrated circuit modules 15 sidewards, and additional cooler 48 is connected to a side of radiator 49, makes heat energy enough be delivered to additional cooler 48 from radiator 49.
The additional cooler 48 of band cooling pad 41 makes the heat radiation approach variation of integrated circuit modules 15, has strengthened the radiating efficiency of integrated circuit modules 15 thus.The heat that produces in the integrated circuit modules 15 dissipates through the additional cooler 48 of band cooling pad 41 and the convection effect in the radiator 49.
In addition, a side of additional cooler 48 can be connected to radiator 49, and its opposite side can be connected to base plate 5.In this case, additional cooler 48 and base plate 5 can combine through cooling pad 42.As mentioned above, cooling pad 42 can make the heat that is delivered to additional cooler 48 be delivered to base plate 5 immediately.So the heat radiation approach of additional cooler 48 is various.
The heat that produces in the integrated circuit modules 15 dissipates through radiator 49, additional cooler 48 and base plate 5.Utilize cooling pad 41, the heat that produces in the integrated circuit modules 15 dissipates by the convection effect of additional cooler 48 and radiator 49 and by the conduction effect to base plate 5.At last, heat dissipates by convection effect from the surface of base plate 5.
Integrated circuit modules 15 can be arranged on a plurality of positions on the circuit board assemblies 13.In an illustrative embodiments, integrated circuit modules 15 is arranged on the edge of circuit board assemblies 13.In addition, radiator 49 and additional cooler 48 can be applicable to be arranged on all integrated circuit modules 15 on the circuit board assemblies 13, perhaps optionally only are applied to be provided with the integrated circuit modules 15 on circuit board assemblies 13 edges.
In an illustrative embodiments, additional cooler 48 can be L shaped, with the side that is attached to radiator 49 and a side of base plate 5.Cooling pad 41 can be between L shaped additional cooler 48 and radiator 49, and cooling pad 42 can be between L shaped additional cooler 48 and base plate 5.In this case, can when flowing through radiator 49, cooling pad 41, additional cooler 48, cooling pad 42 and base plate 5 in order, heat be dissipated.
Fig. 9 is a cutaway view of partly expressing the plasma scope of another illustrative embodiments according to the present invention.The structure of this plasma display and operation are similar to aforementioned embodiments substantially.
In the present embodiment, additional cooler 58 is of similar shape with radiator 59.Additional cooler 58 can be attached to a side of radiator 59, to increase the area of convection current reaction, increases the radiating effect of integrated circuit modules 15 thus.
Therefore, this structure can be applied to any structure, no matter where integrated circuit modules 15 is installed in circuit board assemblies 13.
In the present embodiment, additional cooler 58 is attached to circuit board assemblies 13 non-contiguously with base plate 5.
With regard to above-mentioned structure, according to an exemplary plasma display of the present invention, the integrated circuit modules that is arranged on the circuit board assemblies is connected to base plate through radiator, and then, the heat that produces in the integrated circuit modules is dissipated to base plate through heat sink.In addition, utilize the very big radiating fin of area, can strengthen the radiating effect of integrated circuit modules by convection effect.
In addition, because additional cooler is set, so the heat that produces in the integrated circuit modules dissipates through radiator and additional cooler in a side of radiator.In addition, because a side of additional cooler is attached to base plate,, strengthened the radiating effect of integrated circuit modules thus so heat also dissipates by base plate.
Though illustrative embodiments of the present invention is described,, the present invention is not limited to these execution modes.Do not break away from the accessory rights requirement, the detailed description and the accompanying drawings of the present invention are understood under the situation of the theme of the present invention that, and can make various modifications.These modifications also fall within the scope of the invention.
Claims (24)
1. display comprises:
Display panel;
Base plate, described display panel combination also is supported on this base plate;
At least one integrated circuit modules is installed on the circuit board assemblies, and described circuit board assemblies is positioned at a side reverse with described display panel on the described base plate;
At least one radiator can be attached to described at least one integrated circuit modules, is suitable for described at least one integrated circuit modules is dispelled the heat,
Wherein, an end of described at least one radiator extends and contacts described base plate.
2. display as claimed in claim 1, wherein, described at least one integrated circuit modules is to be selected from a kind of in surface mounted device formula, two packaged type in upright arrangement, hybrid integrated circuit formula and the Intelligent Power Module formula.
3. display as claimed in claim 1, wherein, described display is a plasma scope.
4. display as claimed in claim 1, wherein, described at least one integrated circuit modules is positioned at the edge of described circuit board assemblies.
5. display as claimed in claim 1, wherein, described at least one radiator has the first that is attached to described at least one integrated circuit modules, stretches to the second portion of described base plate from described first and extends and contact the third part of described base plate from described second portion.
6. display as claimed in claim 5, wherein, described at least one radiator is a U-shaped.
7. display as claimed in claim 5, wherein, the inner surface of described first is attached to the upper surface of described at least one integrated circuit modules, the outer surface of described third part is attached to described base plate, described first, third part link together through described second portion, form heat conduction structure.
8. display as claimed in claim 5, wherein, described first, described second portion and described third part are flat.
9. display as claimed in claim 5, wherein, at least one part in described first and the described second portion has radiating fin.
10. display as claimed in claim 5, wherein, described at least one radiator is attached to described base plate through cooling pad.
11. display as claimed in claim 10, wherein, described cooling pad is between the described third part and described base plate of described at least one radiator.
12. a display comprises:
Display panel;
Base plate, described display panel combination also is supported on this base plate;
At least one integrated circuit modules is installed on the circuit board assemblies, and described circuit board assemblies is positioned at a side reverse with described display panel on the described base plate;
At least one radiator is attached to described at least one integrated circuit modules, is suitable for described at least one integrated circuit modules is dispelled the heat;
Additional cooler is connected to a side of described at least one radiator.
13. display as claimed in claim 12, wherein, described at least one integrated circuit modules is to be selected from a kind of in surface mounted device formula, two packaged type in upright arrangement, hybrid integrated circuit formula and the Intelligent Power Module formula.
14. display as claimed in claim 12, wherein, described display is a plasma scope.
15. display as claimed in claim 12, wherein, described at least one radiator is connected to described additional cooler through cooling pad.
16. display as claimed in claim 12, wherein, the described base plate of an end in contact of described additional cooler.
17. display as claimed in claim 16 wherein, has cooling pad between described additional cooler and described base plate.
18. display as claimed in claim 12, wherein, described at least one integrated circuit modules is positioned at the edge of described circuit board assemblies.
19. display as claimed in claim 12, wherein, described at least one radiator is attached to a side of described at least one integrated circuit modules, and described additional cooler is attached to the described side of described at least one integrated circuit modules perpendicular to described at least one radiator.
20. display as claimed in claim 19, wherein, described at least one radiator and described additional cooler are of similar shape.
21. display as claimed in claim 19, wherein, described additional cooler is L shaped, can be attached to a side of described at least one radiator and a side of described base plate.
22. the radiator of a display, this display comprise display panel, can in conjunction with and support described display panel base plate, be installed at least one integrated circuit modules on the circuit board assemblies, described circuit board assemblies is positioned at a side reverse with described display panel on the described base plate, and described radiator comprises:
First can be attached to described at least one integrated circuit modules;
Second portion stretches to described base plate from described first;
Third part is extended and is contacted described base plate from described second portion.
23. display as claimed in claim 22, wherein, the inner surface of described first is attached to the upper surface of described at least one integrated circuit modules, and the outer surface of described third part is attached to described base plate, and described first, third part link together through described second portion.
24. display as claimed in claim 22, wherein, at least one part in described first and the described second portion has radiating fin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040035144 | 2004-05-18 | ||
| KR1020040035144A KR100589325B1 (en) | 2004-05-18 | 2004-05-18 | Plasma display device |
| KR1020050031870 | 2005-04-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1702810A true CN1702810A (en) | 2005-11-30 |
| CN100394533C CN100394533C (en) | 2008-06-11 |
Family
ID=35632465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100706650A Expired - Fee Related CN100394533C (en) | 2004-05-18 | 2005-05-18 | Plasma display device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100589325B1 (en) |
| CN (1) | CN100394533C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917074A (en) * | 2014-03-25 | 2014-07-09 | 青岛海信电器股份有限公司 | Display for special purpose |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100705805B1 (en) * | 2004-12-01 | 2007-04-10 | 엘지전자 주식회사 | Plasma Display Apparatus |
| KR100792635B1 (en) * | 2006-04-18 | 2008-01-09 | 엘지이노텍 주식회사 | Complex tuner module |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07322171A (en) * | 1994-05-20 | 1995-12-08 | Fujitsu General Ltd | Display device |
| WO1997014184A1 (en) * | 1995-10-13 | 1997-04-17 | Thermalloy, Inc. | Solderable transistor clip and heat sink |
| JP2000172191A (en) * | 1998-12-04 | 2000-06-23 | Fujitsu Ltd | Planar display device |
| JP2000338904A (en) | 1999-05-27 | 2000-12-08 | Pioneer Electronic Corp | Cooling structure for plasma display |
| KR100337893B1 (en) * | 2000-09-18 | 2002-05-24 | 김순택 | Plasma display panel assembly |
| KR100457622B1 (en) * | 2002-06-05 | 2004-11-17 | 삼성에스디아이 주식회사 | Drive circuit board for plasma display panel and plasma display apparatus using the same |
| JP2004126151A (en) * | 2002-10-01 | 2004-04-22 | Nec Corp | Display device |
| KR20040038527A (en) * | 2002-11-01 | 2004-05-08 | 삼성전자주식회사 | Radiating member for element and printed circuit board and plasma display panel assembly having the same |
-
2004
- 2004-05-18 KR KR1020040035144A patent/KR100589325B1/en not_active IP Right Cessation
-
2005
- 2005-05-18 CN CNB2005100706650A patent/CN100394533C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917074A (en) * | 2014-03-25 | 2014-07-09 | 青岛海信电器股份有限公司 | Display for special purpose |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050110206A (en) | 2005-11-23 |
| KR100589325B1 (en) | 2006-06-14 |
| CN100394533C (en) | 2008-06-11 |
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