CN1700447A - Use of chemical and mechanical polishing in joining polycrystalline silicon plug bolt manufacture and arrangement thereof - Google Patents
Use of chemical and mechanical polishing in joining polycrystalline silicon plug bolt manufacture and arrangement thereof Download PDFInfo
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- CN1700447A CN1700447A CN200410024614.XA CN200410024614A CN1700447A CN 1700447 A CN1700447 A CN 1700447A CN 200410024614 A CN200410024614 A CN 200410024614A CN 1700447 A CN1700447 A CN 1700447A
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- 238000005498 polishing Methods 0.000 title claims abstract description 44
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims description 110
- 239000000126 substance Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title description 13
- 238000000034 method Methods 0.000 claims abstract description 105
- 150000004767 nitrides Chemical class 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 239000002210 silicon-based material Substances 0.000 claims abstract description 21
- 229920005591 polysilicon Polymers 0.000 claims description 84
- 239000010410 layer Substances 0.000 claims description 47
- 239000011229 interlayer Substances 0.000 claims description 44
- 238000005516 engineering process Methods 0.000 claims description 36
- 239000003989 dielectric material Substances 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 28
- 238000012856 packing Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 17
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 abstract description 11
- 239000010703 silicon Substances 0.000 abstract description 11
- 230000010354 integration Effects 0.000 abstract 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 24
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 24
- 239000005380 borophosphosilicate glass Substances 0.000 description 19
- 230000004048 modification Effects 0.000 description 15
- 238000012986 modification Methods 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Abstract
This invention relates to integration circuit element like DRAM method, which comprises the following steps: providing semi-conductor underlay; forming the several MOS transistors located on the semi-conductor underlay; forming several MOS transistor medium layer to remove the part of the medium materials to expose three MOS transistors several parts and relative three areas of the transistor; filling the silicon into the exposed three areas and three transistor top; processing the CMP on the multi-silicon materials; continuing CMP to remove the medium layer materials and multi-silicon mask materials; using the each MOS transistor top cover nitride layer as polishing terminal layer.
Description
Technical field
The present invention relates to the manufacturing of integrated circuit and semiconductor device.More specifically, the invention provides the joint in dynamic random access memory (" the DRAM ") integrated circuit (IC)-components inserted and fasten method and the structure thereof that (contact) structure is carried out chemico-mechanical polishing.But, should be realized that the present invention has applicability more widely.For example, the present invention can be applied to various other application, for example application-specific integrated circuit (ASIC), microprocessor, microcontroller, other memory application etc.
Background technology
In the past few decades, integrated circuit develops into millions of devices from the interconnect devices that is manufactured on the minority on the single silicon.Performance and complexity are considerably beyond the imagination originally.For the raising of implementation complexity and current densities (that is, can be fabricated onto the quantity of the device on the given chip area), for integrated circuit, the size of minimum device feature (being also referred to as device " how much ") becomes more and more littler for each.Some semiconductor device is being made into the characteristic size less than 0.10 micron.
Constantly the current densities that increases has not only improved the complexity and the performance of circuit, and provides more cheap price for the client.Build traditional semiconductor fabrication factory usually may spend hundreds and thousands of ten thousand, even tens00000000 dollars.Every suit manufacturing equipment has the output in several thousand to several ten thousand wafer raw materials every month.To have the chip output of some on every wafer.By making more and more littler individual devices, more device can manufactured semi-conductive given area in, so just can increase the output of manufacturing equipment.Make device have very big challenge more for a short time, because all there is the limit in each technology that is used for producing the semiconductor devices.That that is to say that a kind of given technology can only be worked into a certain specific characteristic size usually, and in whether technology is exactly that device layout need be changed.
The cost that chip is made in operation also improves greatly.As everyone knows, the company or the factory building of many Americanized chips that can move in nineteen seventies and mid-1980s have no longer existed now.The 1980s has been moved to Japan in some chip manufacturing, and has moved Korea S and TaiWan, China in the nineties subsequently.Along with for the continuous demand of making chip more cheaply, the China's Mainland has become the selection on the geographical position of making chip that is used to go into operation now.A lot of companies have announced the plan at China's operation manufacturing chip.Such company includes but not limited to, Motorola Inc., Taiwan integrated circuit manufacturing company (being also referred to as TSMC) etc.Though may be lower at the Chinese labour force cost, along with the continuous demand for low-cost silicon, still existing manyly still needs to be lowered or even the cost eliminated.
As can be seen from the above, the improvement technology that is used to handle semiconductor device is that people are needed.
Summary of the invention
According to the present invention, provide the technology that is used for producing the semiconductor devices.More specifically, the invention provides the slotting method and the structure thereof of carrying out chemico-mechanical polishing of fastening of the joint polysilicon in the dynamic random access memory integrated circuit (IC)-components.Here, for one of ordinary skill in the art, term " engage (landed) " is meant similar structure with " (landing) of joint ".But, should be realized that the present invention has applicability more widely.For example, the present invention can be applied to various other application, for example application-specific integrated circuit (ASIC), microprocessor, microcontroller, other memory application etc.
In specific embodiment, this method provides the method that polysilicon is inserted the chemico-mechanical polishing of fastening that engages that is used to form.In specific embodiment, oxide lapping liquid rather than traditional polysilicon grinding liquid are used in chemico-mechanical polishing.Preferably, by the chemico-mechanical polishing of use oxide lapping liquid according to the present invention, obtain suitable grid silicon nitride critical size.The more important thing is that except other advantage, this method has also obtained lower cost, good material selectivity, the depression that reduces, lower corrosion and higher output is provided.
Preferably, this method provides a kind of method, and described method can be polished three different films simultaneously, and also obtains suitable grid silicon nitride critical size.We have found that traditional polysilicon grinding liquid has polysilicon and is commonly called selectivity between the boron-phosphorosilicate glass of " BPSG ", it is satisfactory that this makes that such traditional handicraft is difficult to.
According to the present invention, used oxide lapping liquid polishing according to the present invention such as three kinds of polysilicon, BPSG and silicon nitride different materials.The example of conventional art does not use oxide lapping liquid according to the present invention to polish.Referring to for example U.S. Patent No. 5,700,706, No.6,200,875 and No.6,524,906.
In a specific embodiment, this method provides a kind of method that is used for the integrated circuit (IC)-components of Production Example such as DRAM.This method comprises provides Semiconductor substrate, for example Silicon Wafer.This method comprises that formation is positioned at a plurality of MOS transistor devices on the described Semiconductor substrate.Each described MOS transistor device all has nitride and covers and nitride sidewall spacers.Each described transistor is spaced-apart by the preset width of for example 0.1 μ m.This method comprises that formation is positioned at the interlayer dielectric layer (for example BPSG) on described a plurality of MOS transistor device, and remove the part of described interlayer dielectric material, to expose certain part at least in three MOS transistor devices and to expose at least three zones (for example substrate surface) between the corresponding MOS transistor device.Preferably, described three zones are corresponding to the active region of MOS transistor device.This method is deposited on the trizonal top of described exposure and the top of described three MOS transistor devices with the polysilicon packing material.Then, this method is carried out chemical-mechanical planarization technology to described polycrystalline silicon material, and the thickness that reduces polycrystalline silicon material is to expose the part of described interlayer dielectric material.This method is proceeded described chemical-mechanical planarization technology to remove described interlayer dielectric material and described polysilicon film material, and the cover nitride layer on each described MOS transistor is exposed.This method uses the cover nitride layer that is positioned at each described MOS transistor top as polishing stop layer.
In optional another embodiment, this method provides a kind of method that is used for the integrated circuit (IC)-components of Production Example such as DRAM.This method comprises provides Semiconductor substrate, for example Silicon Wafer.This method comprises that formation is positioned at a plurality of MOS transistor devices on the described Semiconductor substrate.Each described MOS transistor device all has nitride and covers and nitride sidewall spacers.The scheduled width of each described transistor is spaced-apart.This method comprises that formation is positioned at the interlayer dielectric layer on described a plurality of MOS transistor device, and remove the part of described interlayer dielectric material, to expose the several portions at least in three MOS transistor devices and to expose at least three zones between the corresponding MOS transistor device.This method comprises the trizonal top that the polysilicon packing material is deposited on described exposure, and the top of described three MOS transistor devices, and using the oxide lapping liquid that described polycrystalline silicon material is carried out chemical-mechanical planarization technology, the thickness that reduces polycrystalline silicon material is to expose the part of described interlayer dielectric material.This method is proceeded described chemical-mechanical planarization technology to remove described interlayer dielectric material and described polysilicon film material, and the cover nitride layer on each described MOS transistor is exposed.This method uses the cover nitride layer that is positioned at each described MOS transistor top as polishing stop layer.
Obtained lot of advantages by the present invention than conventional art.For example, present technique provides a kind of use to depend on the straightforward procedure of the technology of conventional art.In certain embodiments, this method provides the higher device yield by tube core of each wafer.In addition, this method provides compatible and need not carry out the technology of substantial modification to legacy equipment and technology with conventional process techniques.The joint polysilicon that uses the oxide lapping liquid that provides on the other hand of this method is inserted the CMP (Chemical Mechanical Polishing) process of fastening, with the homogeneity that obtains lower cost, suitable grid silicon nitride critical size, improvement, lower depression and the corrosion that engages polysilicon and BPSG.In another embodiment, this method provides a kind of technology that comprises etch-back technics, and it at first eat-backs after deposit spathic silicon, then carries out chemico-mechanical polishing.Also have, the invention provides the direct chemical mechanical polishing process, it engages polysilicon and inserts the chemico-mechanical polishing of fastening after deposit spathic silicon.Preferably, the invention provides a kind of technology, it uses the dilution of specific oxide lapping liquid, and has identical or close polysilicon and BPSG removal speed, and lower silicon nitride is removed speed.According to embodiment, can obtain one or more in these advantages.At this specification hereinafter, will these and other advantage be described more specifically in detail also.
Reference is detailed description and drawings hereinafter, can more fully understand various other purpose of the present invention, feature and advantage.
Description of drawings
Fig. 1 is the simplification diagrammatic sketch according to the etch-back technics of the embodiment of the invention.
Fig. 2 is a simplification diagrammatic sketch of inserting the CMP (Chemical Mechanical Polishing) process of fastening according to the direct joint polysilicon of the embodiment of the invention.
Fig. 3 is rake angle cross-sectional scans Electronic Speculum figure (SEM) after inserting the chemico-mechanical polishing of fastening according to the joint polysilicon of the embodiment of the invention.
Fig. 4 is the cross section SEM of active region after inserting the chemico-mechanical polishing of fastening according to the joint polysilicon of the embodiment of the invention.
Fig. 5 engages polysilicon to insert the cross section SEM that fastens pattern after inserting the chemico-mechanical polishing of fastening according to the joint polysilicon of the embodiment of the invention.
Fig. 6 is according to the embodiment of the invention, has used the terminal point curve chart of optical end point system.
Embodiment
According to the present invention, provide the technology that is used for producing the semiconductor devices.More specifically, the invention provides the slotting method and the structure thereof of carrying out chemico-mechanical polishing of fastening of the joint polycrystalline in dynamic random access memory (" the DRAM ") integrated circuit (IC)-components.But, should be realized that the present invention has applicability more widely.For example, the present invention can be applied to various other application, for example application-specific integrated circuit (ASIC), microprocessor, microcontroller, other memory application etc.
CMP (chemico-mechanical polishing) method can be summarized as follows according to an embodiment of the invention.
1. provide Semiconductor substrate, for example Silicon Wafer;
2. form a plurality of MOS transistor devices (each all has gate oxide, nitride covering and nitride spacer and source/drain region) that are positioned on the Semiconductor substrate;
3. form the interlayer dielectric layer (for example BPSG) that is positioned on a plurality of MOS transistor devices;
4. remove the part of interlayer dielectric material, to expose the several portions at least (for example grid structure) in three MOS transistor devices and to expose at least three zones (for example, source/drain region) between the corresponding MOS transistor device;
5. the polysilicon packing material is deposited on the trizonal top of the exposure that is used to electrically contact, and the top of three MOS transistor devices;
6. use the oxide lapping liquid,, reduce the part of the thickness of polycrystalline silicon material with dielectric material between exposed surface so that polycrystalline silicon material is carried out chemical-mechanical planarization technology;
7. proceed chemical-mechanical planarization technology to remove interlayer dielectric material and polysilicon film material, nitride layer on each MOS transistor covers and is exposed, and uses the nitride layer that is positioned at each MOS transistor top to cover as polishing stop layer simultaneously; And
8. carry out other step on demand.
The step of said sequence provides according to an embodiment of the invention being used for to insert the method for carrying out CMP of fastening to engaging polysilicon.Go out as shown, this method has been used and has been comprised that use oxide cmp lapping liquid is to engaging the slotting combination of fastening the step of carrying out the CMP method of polysilicon.Also have many other alternative methods equally, wherein under the situation of the scope that does not deviate from the claim here, add some step, remove one or more steps, perhaps one or more steps are carried out according to different orders.The further detailed description of the present invention can be found in this manual, hereinafter with for a more detailed description.
Fig. 1 is the simplification diagrammatic sketch according to the etch-back technics of the embodiment of the invention.This figure is only as example, and here it should not limit the scope of claim inadequately.Those of ordinary skill in the art can find a lot of variations, modification and substitute.As shown in the figure, the present invention includes the method for the integrated circuit (IC)-components that is used for Production Example such as DRAM.Still as shown in the figure, this method illustrates the transistor in unit area 102 and the outer peripheral areas 104.Outer peripheral areas can comprise logical circuit.The unit area comprises memory cell etc.Memory cell can be a dynamic random access storage unit etc.Certainly, those of ordinary skill in the art can find other variation, modification and substitute.
This method comprises provides Semiconductor substrate 100, for example Silicon Wafer.This method comprises that formation is positioned at a plurality of MOS transistor devices 101 of Semiconductor substrate top.Each MOS transistor device has nitride covering 103 and nitride sidewall spacers 105.Each device also comprises the area of grid of the source of being coupled to/drain region.In the transistor each is spaced from each other by for example preset width 107 of 0.1 μ m.In source/drain region and the area of grid each separates.
Preferably, this method comprises that formation is positioned at the interlayer dielectric layer 109 of a plurality of MOS transistor devices top.Preferably, interlayer dielectric is the doped glass layer such as BPSG, FSG etc.This method comprises a part of removing the interlayer dielectric material, to expose the several portions at least in three MOS transistor devices and to expose at least three zones between the corresponding MOS transistor device.Described three area exposed are the source/drain regions that are used for described MOS transistor device.
Then, this method is deposited on the trizonal top of described exposure and the top of described three MOS transistor devices with polysilicon packing material 111.Preferably, the polysilicon packing material can be the doped polycrystalline silicon materials, for example original position (in-situ) doped polycrystalline silicon materials.According to using, can deposit described material with noncrystalline state or polysilicon state.If be deposited with noncrystalline state, then it is crystallized into the polysilicon state after a while.According to using, dopant can be a phosphorus, has from about 1.4 * 10
20Cm
-3To about 1.4 * 10
21Cm
-3Concentration range.Preferably, the polysilicon packing material forms the good electrical contact with the source/drain region that exposes, and directly contacts with the source/drain region of these exposures.
Alternatively, go out as shown, this method is carried out etch-back technics 131.Etch-back technics can use any suitable etching technics, for example dry method or wet etching or their combination.Can use reactive ion etching (RIE) technology.Preferably, can eat-back, and the periphery of described structure has used masking layer to protect.Use the selective etch technology of removing dielectric substance layer between polysilicon and retaining layer to eat-back.Certainly, those of ordinary skill in the art can find other variation, modification and substitute.
Then, this method is carried out chemical-mechanical planarization technology 133 to polycrystalline silicon material, reduces the part of the thickness of polycrystalline silicon material with dielectric material between exposed surface.This method is proceeded chemical-mechanical planarization technology to remove interlayer dielectric material and polysilicon film material, and the nitride layer on each MOS transistor covers and is exposed.Preferably, polysilicon packing material and interlayer dielectric material are removed simultaneously.This method uses the nitride layer that is positioned at each MOS transistor top to cover as polishing stop layer.
Preferably, this method is used the oxide lapping liquid, to remove described packing material and interlayer dielectric layer simultaneously.The oxide lapping liquid can also provide the selectivity between polysilicon packing material and the interlayer dielectric material to nitride layer covering and nitride spacer.In a specific embodiment, the oxide lapping liquid can dilute with water.As just example, the oxide lapping liquid can be by CabotMicroelectronics Corporation of 870 Commons Drive, the SS-25 that Aurora IL 60564 makes, but also can be other.SS-25 can dilute with 10: 1 to 2: 1 (water with SS-25 ratio).Other variation, modification and replacement can be arranged certainly.In a specific embodiment, CMP (Chemical Mechanical Polishing) process is carried out with the downforce of 44rpm and 3psi.
Fig. 2 inserts according to the direct joint polysilicon of the simplification of the embodiment of the invention to fasten CMP (Chemical Mechanical Polishing) process.This figure is only as example, and here it should not limit the scope of claim inadequately.Those of ordinary skill in the art can find a lot of variations, modification and substitute.As shown in the figure, the present invention includes the method for the integrated circuit (IC)-components that is used for Production Example such as DRAM.Still as shown in the figure, this method illustrates the transistor in unit area and the periphery.Outer peripheral areas can comprise logical circuit.The unit area comprises memory cell etc.Memory cell can be a dynamic random access storage unit etc.Certainly, those of ordinary skill in the art can find other variation, modification and substitute.
This method comprises provides Semiconductor substrate, for example Silicon Wafer.This method comprises that formation is positioned at a plurality of MOS transistor devices 101 of Semiconductor substrate top.Each MOS transistor device has nitride and covers and nitride sidewall spacers.In the transistor each is spaced from each other by for example preset width of 0.1 μ m.
Preferably, this method comprises that formation is positioned at the interlayer dielectric layer of a plurality of MOS transistor devices top.Preferably, interlayer dielectric is the doped glass layer such as BPSG, FSG etc.This method comprises a part of removing the interlayer dielectric material, to expose the several portions at least in three MOS transistor devices and to expose at least three zones between the corresponding MOS transistor device.Come out from interlayer dielectric at least three zones between the transistor.Come out from interlayer dielectric in transistorized at least four zones.
Then, this method is deposited on the trizonal top of described exposure and the top of described three MOS transistor devices with polysilicon packing material 111.Preferably, the polysilicon packing material can be the doped polycrystalline silicon materials, for example in-situ doped polycrystalline silicon material.According to using, can deposit described material with noncrystalline state or polysilicon state.If with the noncrystalline state deposition, then it is crystallized into the polysilicon state after a while.According to using, dopant can be a phosphorus, has from about 1.4 * 10
20Cm
-3To about 1.4 * 10
21Cm
-3Concentration range.
Then, this method is carried out chemical-mechanical planarization technology to polycrystalline silicon material, reduces the part of the thickness of polycrystalline silicon material with dielectric material between exposed surface.This method is proceeded chemical-mechanical planarization technology to remove interlayer dielectric material and polysilicon film material, and the nitride layer on each MOS transistor covers and is exposed.Preferably, polysilicon packing material and interlayer dielectric material are removed simultaneously.This method uses the nitride layer that is positioned at each MOS transistor top to cover as polishing stop layer.Other variation, modification and replacement can be arranged certainly.
In a specific embodiment, this method provides the method for polishing polycrystalline silicon, BPSG and silicon nitride when using the oxide lapping liquid and stopping at the grid silicon nitride.After having formed grid and having used CMP polishing BPSG, connect the slotting pattern of fastening of polysilicon and be formed by exposure and etching.Doped polycrystalline silicon is deposited over BPSG and engages on slotting the fastening.Use etch-back technics, the etching doped polysilicon layer is exposed until bpsg film.Bpsg layer and joint polysilicon are polished and are stopped at the grid silicon nitride together.This method comprises excessive polishing time, is used for contact polishing part silicon nitride layer, forms the slotting pattern of fastening of final joint polysilicon.Preferably, a spot of silicon nitride film is removed at the pattern place, to obtain suitable grid silicon nitride critical size, reduces to cave in and reduces the corrosion of polysilicon and BPSG.
Use direct chemical mechanical polishing process, doped polycrystalline silicon is at first polished, and bpsg layer and joint polysilicon are polished then, and then the slotting BPSG that fastens pattern, engages between polysilicon and the grid of part joint polysilicon on the grid silicon nitride is removed.Described technology is removed a spot of grid silicon nitride at the pattern place then, to obtain suitable grid silicon nitride critical size, to obtain suitable grid silicon nitride critical size, reduces to cave in and reduces the corrosion of polysilicon and BPSG.
Engaging slotting the fastening of polysilicon usually is the critical process that is used for 0.13 μ m DRAM and DRAM of future generation, but it need insert the homogeneity of the top grid AEI critical size that keeps good after fastening CMP (poly CMP) step engaging polysilicon, and lower depression and corrosion, and this to utilize traditional polysilicon grinding liquid be what be difficult to realize.The present invention has so a kind of method, and this method uses oxide lapping liquid to come polishing polycrystalline silicon, BPSG and silicon nitride simultaneously, polysilicon is inserted fasten to work and obtain high yield.In addition, according to embodiment, comprise that etch-back technics also can not comprise etch-back technics.
Fig. 3 is rake angle cross-sectional scans Electronic Speculum figure (SEM) after inserting the chemico-mechanical polishing of fastening according to the joint polysilicon of the embodiment of the invention.This figure is only as example, and here it should not limit the scope of claim inadequately.Those of ordinary skill in the art can find a lot of variations, modification and substitute.
Fig. 4 is the cross section SEM of the simplification of pattern after inserting the chemico-mechanical polishing of fastening according to the joint polysilicon of the embodiment of the invention.This figure is only as example, and here it should not limit the scope of claim inadequately.Those of ordinary skill in the art can find a lot of variations, modification and substitute.As shown in the figure, originally illustrate depression and corrosion is very little, and show depression for about 100～400A, this expects just.By also finding out among the figure, wherein the polysilicon packing material forms a plug structure between each described MOS transistor device, and described plug structure has 0.06 micron to 0.15 micron width.
Fig. 5 engages the cross section SEM that polysilicon is inserted the simplification of fastening pattern after inserting the chemico-mechanical polishing of fastening according to the joint polysilicon of the embodiment of the invention.This figure is only as example, and here it should not limit the scope of claim inadequately.Those of ordinary skill in the art can find a lot of variations, modification and substitute.As shown in the figure, originally illustrate depression and corrode lessly, but they are greater than the active region, and this is because insert and fasten the higher silicon nitride removal amount in specific activity zone, pattern place engaging polysilicon.The polysilicon depression is about 200～400A, and the BSPG depression is about 300～600A.
Fig. 6 is according to the embodiment of the invention, has used the terminal point curve chart of optical end point system.This figure is only as example, and here it should not limit the scope of claim inadequately.Those of ordinary skill in the art can find a lot of variations, modification and substitute.Data show optical end point can play gratifying effect.According to embodiment, can be relevant for other details of the present invention.
In a preferred embodiment, the invention provides a kind of slotting method of fastening chemico-mechanical polishing of polysilicon that is used to engage.This method comprises: form the grid that comprises thicker silicon nitride deposition; Insert to form after fastening photoetching and etching and engage the slotting pattern of fastening of polysilicon engaging polysilicon; The joint polysilicon is slotting fastens the dopant deposition polysilicon to form; Utilize chemico-mechanical polishing control grid silicon nitride critical size, and keep engaging lower depression and the corrosion of polysilicon plug and BPSG.Preferably, this method uses oxide lapping liquid rather than polysilicon grinding liquid to come polishing polycrystalline silicon, BPSG and silicon nitride.In addition, this method is used the lapping liquid of Cobat Microelectronics SS-55 by name and other suitable mixture any dilution as the oxide lapping liquid of oxide lapping liquid and all or some kinds.Preferably, the grid silicon nitride than in the past thicker 200 dust to 800 dusts.Alternatively, according to specific embodiment, this method can also comprise etch-back technics.
Preferably, this method is included in the identical or close removal speed between polysilicon and the BPSG, and to the lower removal speed of silicon nitride film, described silicon nitride film is used as polishing stop layer.According to embodiment, the removal speed of polysilicon and BPSG is about 1200A/min to 5000A/min, and silicon nitride removal speed is about 120A/min to 800A/min.Other variation, modification and replacement can be arranged certainly.
It is also understood that example as described herein and embodiment just for illustrative purposes, those of ordinary skill in the art can be according to the foregoing description modifications and variations of the present invention are.These modifications and variations are all in the application's spirit and scope, and also within the scope of the appended claims.
Claims (20)
1. method that is used to make integrated circuit (IC)-components, described method comprises:
A Semiconductor substrate is provided;
Formation is positioned at a plurality of MOS transistor devices on the described Semiconductor substrate, and each described MOS transistor device all has a nitride and covers and nitride sidewall spacers, and each described transistor is spaced-apart by a predetermined width;
Formation is positioned at an interlayer dielectric layer on described a plurality of MOS transistor device;
Remove the part of described interlayer dielectric material, to expose the several portions at least in three MOS transistor devices and to expose at least three zones between the corresponding MOS transistor device;
The polysilicon packing material is deposited on the trizonal top of described exposure and the top of described three MOS transistor devices;
Described polycrystalline silicon material is carried out chemical-mechanical planarization technology, and the thickness that reduces polycrystalline silicon material is to expose the part of described interlayer dielectric material;
Proceed described chemical-mechanical planarization technology to remove described interlayer dielectric material and described polysilicon film material, the nitride cap on each described MOS transistor is exposed; And
Use is positioned at the nitride cap of each described MOS transistor top as polishing stop layer.
2. the method for claim 1, wherein said interlayer dielectric layer is a boron-phosphorosilicate glass.
3. the method for claim 1, wherein said polysilicon packing material is in-situ doped, and deposits with amorphous state.
4. the method for claim 1, wherein said chemical-mechanical planarization technology comprises that having for described interlayer dielectric and polysilicon selective is about 1: 1 lapping liquid.
5. the method for claim 1, wherein said chemical-mechanical planarization lapping liquid is the SS-25 of U.S. Jia Bai company.
6. the method for claim 1, wherein said chemical-mechanical planarization technology be characterised in that, grind clearance for polysilicon and nitride and be at least polysilicon: it is 3: 1 that nitride grinds clearance, is preferably greater than 8: 1.
7. the method for claim 1, wherein said three MOS devices are provided in the unit area.
8. the method for claim 1 also comprises the terminal point that detects described chemico-mechanical polishing flatening process.
9. the method for claim 1, polished 200 dusts of wherein said covering nitride or littler.
10. the method for claim 1, wherein said polysilicon packing material forms a plug structure between each described MOS transistor device, and described plug structure has 0.06 micron to 0.15 micron width.
11. the method for claim 1 also is included in before the chemical-mechanical planarization, the use etch-back technics is removed the part in the described polysilicon packing material.
12. a method that is used to make integrated circuit (IC)-components, described method comprises:
A Semiconductor substrate is provided;
Formation is positioned at a plurality of MOS transistor devices on the described Semiconductor substrate, and each described MOS transistor device all has a nitride and covers and nitride sidewall spacers, and each described transistor is spaced-apart by a predetermined width;
Formation is positioned at the interlayer dielectric layer on described a plurality of MOS transistor device;
Remove the part of described interlayer dielectric material, to expose the several portions at least in three MOS transistor devices and to expose at least three zones between the corresponding MOS transistor device;
The polysilicon packing material is deposited on the trizonal top of described exposure and the top of described three MOS transistor devices;
Use the oxide lapping liquid, described polycrystalline silicon material is carried out chemical-mechanical planarization technology, the thickness that reduces polycrystalline silicon material is to expose the part of described interlayer dielectric material;
Proceed described chemical-mechanical planarization technology to remove described interlayer dielectric material and described polysilicon film material, the cover nitride layer on each described MOS transistor is exposed; And
Use is positioned at the cover nitride layer of each described MOS transistor top as polishing stop layer.
13. method as claimed in claim 12, wherein said CMP (Chemical Mechanical Polishing) process is carried out with the downforce of 44rpm and 3psi.
14. method as claimed in claim 12, wherein said interlayer dielectric material comprises boron-phosphorosilicate glass.
15. method as claimed in claim 12 is wherein utilized described chemical-mechanical planarization technology, removes the part of described interlayer dielectric material and the part of described polycrystalline silicon material simultaneously.
16. method as claimed in claim 12, wherein said chemical-mechanical planarization technology is also removed the part of the described interlayer dielectric material in the outer peripheral areas, and one or more in the described cover nitride layer on described corresponding MOS transistor are exposed.
17. a method that is used to make integrated circuit (IC)-components, described method comprises:
A Semiconductor substrate is provided;
Formation is positioned at a plurality of MOS transistor devices on the described Semiconductor substrate, and each described MOS transistor device all has a nitride and covers and nitride sidewall spacers, and each described transistor is spaced-apart by a predetermined width;
Formation is positioned at an interlayer dielectric layer on described a plurality of MOS transistor device;
Remove the part of described interlayer dielectric material, to expose the several portions at least in three MOS transistor devices and to expose at least three zones between the corresponding MOS transistor device;
The polysilicon packing material is deposited on the trizonal top of described exposure and the top of described three MOS transistor devices;
Use the oxide lapping liquid, described polycrystalline silicon material is carried out chemical-mechanical planarization technology, the thickness that reduces the polysilicon packing material is to expose the part of described interlayer dielectric material;
Proceed described chemical-mechanical planarization technology;
Use described oxide lapping liquid to carry out described chemical-mechanical planarization technology, remove described interlayer dielectric material and described polysilicon packing material simultaneously, the cover nitride layer on each described MOS transistor is exposed; And
Use is positioned at the cover nitride layer of each described MOS transistor top as polishing stop layer, and removes described interlayer dielectric material and described polysilicon packing material simultaneously; And
Polishing is positioned at the part of the described cover nitride layer of each described MOS transistor top, with each described MOS transistor of patterning;
Wherein the polishing to described cover nitride layer part is in order to obtain a predetermined critical size of each described MOS transistor.
18. method as claimed in claim 17, wherein said interlayer dielectric layer is a boron-phosphorosilicate glass.
19. method as claimed in claim 17, wherein said MOS transistor is used for dynamic random access storage unit.
20. method as claimed in claim 17 also comprises the etch-back technics for described polysilicon packing material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410024614XA CN100461373C (en) | 2004-05-20 | 2004-05-20 | Use of chemical and mechanical polishing in joining polycrystalline silicon plug bolt manufacture and arrangement thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410024614XA CN100461373C (en) | 2004-05-20 | 2004-05-20 | Use of chemical and mechanical polishing in joining polycrystalline silicon plug bolt manufacture and arrangement thereof |
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| CN1700447A true CN1700447A (en) | 2005-11-23 |
| CN100461373C CN100461373C (en) | 2009-02-11 |
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| CNB200410024614XA Expired - Fee Related CN100461373C (en) | 2004-05-20 | 2004-05-20 | Use of chemical and mechanical polishing in joining polycrystalline silicon plug bolt manufacture and arrangement thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263030A (en) * | 2010-05-25 | 2011-11-30 | 北大方正集团有限公司 | Method for manufacturing groove-type power device |
| CN118658835A (en) * | 2024-08-14 | 2024-09-17 | 合肥晶合集成电路股份有限公司 | Method for manufacturing semiconductor device, semiconductor device and test method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200875B1 (en) * | 1998-12-21 | 2001-03-13 | Taiwan Semiconductor Manufacturing Company | Chemical mechanical polishing of polysilicon plug using a silicon nitride stop layer |
| US6723655B2 (en) * | 2001-06-29 | 2004-04-20 | Hynix Semiconductor Inc. | Methods for fabricating a semiconductor device |
| KR100546133B1 (en) * | 2002-07-19 | 2006-01-24 | 주식회사 하이닉스반도체 | Method of forming a semiconductor device |
| US6787439B2 (en) * | 2002-11-08 | 2004-09-07 | Advanced Micro Devices, Inc. | Method using planarizing gate material to improve gate critical dimension in semiconductor devices |
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2004
- 2004-05-20 CN CNB200410024614XA patent/CN100461373C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263030A (en) * | 2010-05-25 | 2011-11-30 | 北大方正集团有限公司 | Method for manufacturing groove-type power device |
| CN102263030B (en) * | 2010-05-25 | 2013-04-10 | 北大方正集团有限公司 | Method for manufacturing groove-type power device |
| CN118658835A (en) * | 2024-08-14 | 2024-09-17 | 合肥晶合集成电路股份有限公司 | Method for manufacturing semiconductor device, semiconductor device and test method |
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| CN100461373C (en) | 2009-02-11 |
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