CN1700313A - Method of expandable wafer connection pin position, wafer and memory wafer - Google Patents
Method of expandable wafer connection pin position, wafer and memory wafer Download PDFInfo
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- CN1700313A CN1700313A CN 200410042445 CN200410042445A CN1700313A CN 1700313 A CN1700313 A CN 1700313A CN 200410042445 CN200410042445 CN 200410042445 CN 200410042445 A CN200410042445 A CN 200410042445A CN 1700313 A CN1700313 A CN 1700313A
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Abstract
The invention relates to a method of expanding crystal plate link bit and crystal plate and memory crystal plate which uses first interface of first crystal plate to transmit the order of second interface and transmits the second crystal plate's link bit after order decoding to expand first crystal plate's bit, when second crystal plate receives the order of first interface. The second crystal plate is crystal plate with low bit.
Description
Technical field
The present invention relates to a kind of SoC (system on chip, be called for short SOC), particularly relate to a kind of method of expanding wafer connecting pin position and wafer (METHOD AND CHIPS BEING ABLE TOEXPAND I/O PINS OF CHIP), memory chip.
Background technology
Along with the development of SoC design concept is in vogue, the function of integrated circuit is also powerful and complicated day by day thereupon.For with all multi-functional being integrated on the same wafer (wafer is chip, below all be called wafer), make output and input pins (I/O pins) number of wafer also increase increasingly.Because the packaging cost of high pin station integrated circuit is very expensive, so that the ratio that integrated circuit encapsulates shared manufacturing cost also rises day by day, therefore has to the packaging cost of integrated circuit listed in again be designed to consider originally.
In order to overcome the problem of pin deficiency, except can increasing the pin number, normally on special interface, use multifunctional pins and reduce the required pin number of wafer.For example, Intel (Intel) just proposes a kind of LPC (low pin count) interface, because can reduce the pin number of flash memory (flash memory is fast flash memory bank, below all be called flash memory) interface effectively, and widely industry adopts.Yet,, but can't solve the problem of the newly-increased required expansion pin of interface position, so that still must select the encapsulation of the integrated circuit of high pin position, and can't reduce cost though this kind practice can reduce pin number required on the special interface.
This shows, the above-mentioned existing method of expanding wafer connecting pin position and wafer method with use, obviously still have inconvenience and defective, and demand urgently further being improved.In order to solve the problem that the method that can expand wafer connecting pin position and wafer exist, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but does not see always that for a long time suitable design finished by development, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that the above-mentioned existing method of expanding wafer connecting pin position and wafer, memory chip exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of method and wafer of the wafer expanded connecting pin position newly, can effectively improve the general existing method of expanding wafer connecting pin position and wafer, memory chip, make it have more practicality.Through constantly research, design, and after studying repeatedly and improving, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the existing method of wafer connecting pin position and the defective that wafer exists expanded, and a kind of method and wafer of the new wafer expanded connecting pin position be provided, technical matters to be solved is to make it can be with the pin position of the required expansion of first wafer, move on second wafer, to increase a little or not under the condition of the required integrated circuit packaging cost of second wafer, reduce the required integrated circuit packaging cost of first wafer significantly, thereby be suitable for practicality more, and have the value on the industry.
Another object of the present invention is to, overcome the defective that existing memory chip exists, and provide a kind of memory chip of new structure, technical matters to be solved is to solve the problem that the pin position need be expanded in newly-increased interface, to increase a little or not under the condition of integrated circuit packaging cost, reduce the integrated circuit packaging cost significantly, thereby be suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.A kind of method of expanding wafer connecting pin position according to the present invention's proposition, it is suitable for utilizing one first interface of one first wafer, connecting pin position with one second interface of this first wafer, move on one second wafer, it may further comprise the steps: this first wafer makes one second interface command that transmits by this second interface, being encoded to can be by one first interface command of this first interface transmission, with this first interface transmission certainly; And this second wafer receives this first interface command, and this first interface command is decoded as this second interface command, the connecting pin position of this second wafer certainly to transmit.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The aforesaid method of expanding wafer connecting pin position, wherein said first wafer are that a video and audio CD disc (video and audio CD disc is videodisc, below all be called video and audio CD disc) is play wafer.
The aforesaid method of expanding wafer connecting pin position, wherein said second wafer is a memory chip.
The aforesaid method of expanding wafer connecting pin position, wherein said first interface is one address/data bus.
The aforesaid method of expanding wafer connecting pin position, wherein said second interface are a general port,input-output.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.According to a kind of wafer of expanding wafer connecting pin position that the present invention proposes, it comprises: a core logic; One duplex circuit (duplex circuit is multiplexing circuitry, below all be called duplex circuit); One controller is coupled to this core logic and this duplex circuit, in order to the requirement that receives this core logic (requirement is instruction, below all be called requirement), to transmit one first interface command; One command encoder couples this core logic and this duplex circuit, in order to receiving one second interface command of this core logic, and this second interface command is encoded to this first interface command transmits; And a moderator, couple this core logic and this duplex circuit, in order to control this duplex circuit, to select to transmit this first interface command of this controller or this command encoder.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The aforesaid wafer of expanding wafer connecting pin position, wherein said core logic are to play logic for a video and audio CD disc.
The aforesaid wafer of expanding wafer connecting pin position, wherein said controller are to be a memory controller.
The aforesaid wafer of expanding wafer connecting pin position, wherein said first interface command are to be a memory body access command.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.According to a kind of memory chip that the present invention proposes, it comprises: a memory circuit; One address demoder (the address demoder is address decoder, below all be called the address demoder) couples this memory circuit, in order to receiving a memory body access command, and according to the access address of this memory body access command, transmits this memory body access command; And a command decoder, couple this address demoder, in order to this memory body access command of decoding, to transmit from one second interface.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid memory chip, wherein said second interface are a general port,input-output.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present invention thes contents are as follows:
The invention provides a kind of method of expanding wafer connecting pin position, it can be suitable for utilizing first interface of first wafer, and the connecting pin position with second interface of first wafer moves on second wafer.This method that can expand wafer connecting pin position may further comprise the steps: first wafer will be desired second interface command by the transmission of second interface, and being encoded to can be by first interface command of first interface transmission, to transmit from first interface; And second wafer receive first interface command, and first interface command is decoded as second interface command, transmit with connecting pin position from second wafer.
Wherein, first wafer is that video and audio CD disc is play wafer, and second wafer is a memory chip.
Wherein, first interface is address/data bus, and second interface is general I/O port.
The application of aforementioned method, the present invention also provides a kind of wafer of expanding wafer connecting pin position, and it comprises: core logic, duplex circuit, controller, command encoder and moderator.Wherein, controller couples core logic and duplex circuit, in order to receive the requirement of core logic, to transmit first interface command.Command encoder couples core logic and duplex circuit, in order to receiving second interface command of core logic, and second interface command is encoded to first interface command transmits.And moderator also couples core logic and duplex circuit, in order to the control duplex circuit, to select first interface command of transfer control or command encoder.
In one embodiment, this can expand the core logic of the wafer of wafer connecting pin position, for video and audio CD disc is play logic.
In one embodiment, the controller that this can expand the wafer of wafer connecting pin position is memory controller.
In one embodiment, first interface command that this can expand the wafer of wafer connecting pin position is the memory body access command.
In addition, the present invention also provides a kind of memory chip, and it comprises: memory circuit, address demoder and command decoder.Wherein, the address demoder couples memory circuit, in order to receiving the memory body access command, and according to the access address of memory body access command, transmits the memory body access command.Command decoder then couples the address demoder, in order to decoding memory body access command, to transmit from second interface.
In one embodiment, second interface of this memory chip is to be general port,input-output.
By in the above-mentioned explanation as can be known, use a kind of method and wafer of expanding wafer connecting pin position provided by the present invention, then the pin position of the required expansion of first wafer can be moved on second wafer.Therefore, can reduce the packaging cost of the required integrated circuit of first wafer significantly increasing a little or not under the condition of the required integrated circuit packaging cost of second wafer.
Via as can be known above-mentioned, the invention relates to a kind of method and wafer thereof of expanding wafer connecting pin position, it is first interface of using first wafer, transmitting will be by the order of its second interface transmission, and when second wafer receives the order that first interface transmitted, connecting pin position from second wafer after the command decode is transmitted, reach the purpose of the expansion first wafer pin position.Because second wafer is the wafer for low pin position, therefore can increase a little or not under the condition of the required integrated circuit packaging cost of second wafer, reduces the required integrated circuit packaging cost of first wafer significantly.
By technique scheme, the present invention can expand the method for wafer connecting pin position and wafer, memory chip has following advantage at least:
(1) the present invention can expand the method for wafer connecting pin position and wafer, memory chip can be reached the purpose of the expansion first wafer pin position.
(2) the present invention can expand the method for wafer connecting pin position and wafer, memory chip can increase under the condition of the required integrated circuit packaging cost of second wafer a little or not, reduces the required integrated circuit packaging cost of first wafer significantly.
(3) the present invention can expand the method for wafer connecting pin position and wafer, memory chip can for example be to be applicable in the video and audio CD disc player.
In sum, the method of the wafer the expanded connecting pin position that the present invention is special and wafer, memory chip, can be with the pin position of the required expansion of first wafer, move on second wafer, to increase a little or not under the condition of the required integrated circuit packaging cost of second wafer, reduce the required integrated circuit packaging cost of first wafer significantly.It has above-mentioned many advantages and practical value, and in class methods and structure, do not see have similar design to publish or use and really genus innovation, no matter it is all having bigger improvement on method, on the structure or on the function, have technically than much progress, and produced handy and practical effect, and the more existing method of expanding wafer connecting pin position and wafer, memory chip have the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, below with preferred embodiment of the present invention and conjunction with figs. describe in detail as after.
Description of drawings
Fig. 1 is a kind of block schematic diagram of typical video and audio CD disc player system.
Fig. 2 is the block schematic diagram of the video and audio CD disc player system of the preferred embodiment according to the present invention.
110,210: video and audio CD disc is play wafer 120: Dynamic Random Access Memory
130: ROM (read-only memory) 140: rom controller (optical disc controller)
150: microprocessor 160: the television signal scrambler
170: message numerical digit analogy converter 180: front panel
211: core logic 212: duplex circuit (multiplexing circuitry)
213: controller 214: command encoder
215: moderator 220: memory chip (memory chip)
221: memory circuit 222: the address demoder
223: command decoder
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, method and its embodiment of wafer, method, step, structure, feature and the effect thereof of the wafer the expanded connecting pin position that foundation the present invention is proposed, describe in detail as after.
For example in the video and audio CD disc player system, except the SoC that the major function served as is arranged, usually also can be just like memory bodys such as ROM and DRAM, or drive the auxiliary wafer in periphery of other devices such as wafer just like LCD and step motor, realize the function of total system.This is because the integrated circuit of high density or special memory body, high-voltage large current etc. with most common standard logical integrated circuit manufacturing course in the design of General System single-chip, is difficult to be incorporated on the same wafer.
Because the auxiliary wafer in the periphery of system has pin count few usually, characteristics such as packaging cost is cheap, therefore, a kind of method and wafer of expanding wafer connecting pin position provided by the present invention, be on main wafer of system and peripheral auxiliary wafer, respectively insert a coding/decoding circuit, and by for example being typical interface such as address/data bus, transmit expansion wafer needed order in connecting pin position and data, with pin position with the required expansion of the main wafer of system, move on the peripheral auxiliary wafer, reach under the condition that increases the peripheral auxiliary required integrated circuit packaging cost of wafer a little or not, reduce the purpose of the required integrated circuit packaging cost of the main wafer of system significantly.Below will illustrate, be beneficial to understand its cardinal principle with an example.
Seeing also shown in Figure 1ly, is typical video and audio CD disc player system block schematic diagram.Among the figure, this typical video and audio CD disc player system, except the video and audio CD disc of serving as major function is play the wafer (videodisc broadcast chip) 110, also comprise the Dynamic Random Access Memory (DRAM) (DRAM (Dynamic Random Access Memory)) 120 that connects via address/data bus or general I/O port distinct interfaces such as (GPIO), ROM (read-only memory) (ROM) 130, (rom controller is optical disc controller to rom controller 140, below all be called rom controller), microprocessor 150, television signal scrambler 160, peripheral auxiliary wafer such as message numerical digit analogy converter 170 (message numerical digit analogy converter is the message digital analog converter, below all be called message numerical digit analogy converter) and front panel 180.Because video and audio CD disc is play wafer 110 and must be provided simultaneously and the peripheral connecting pin position of assisting wafer such as Dynamic Random Access Memory (DRAM) 120, ROM (read-only memory) (ROM) 130, rom controller 140, microprocessor 150, television signal scrambler 160, message numerical digit analogy converter 170 and front panel 180, cause its connecting pin bit quantity huge, and significantly improved packaging cost.
Seeing also shown in Figure 2ly, is the video and audio CD disc player system block schematic diagram of the preferred embodiment according to the present invention.Among the figure, this video and audio CD disc player system is play the wafer 210 except the video and audio CD disc of serving as major function, also show the memory chip (memory chip) 220 that connects via address/data bus 230, and will for example be that the connecting pin that connects the general port,input-output (GPIO) of front panel 180 is moved on the memory chip 220 among Fig. 1, play the required pin number of wafer 210 to reduce video and audio CD disc, reduce the integrated circuit packaging cost that video and audio CD disc is play wafer 210.
For example, the packing of supposing 210 employings of video and audio CD disc broadcast wafer is the qfp package for 256 pin positions, and the TSOP packing that is packaged as 32 pin positions that memory chip 220 adopts, and the connecting pin position of the general port,input-output (GPIO) of video and audio CD disc broadcast wafer 210 is totally 16 pins, the packing pattern of then rearranging is the qfp package that video and audio CD disc is play wafer 210 employings 240 pin positions, and memory chip 220 adopts the TSOP packing of 48 pin positions.Though whole pin sum does not descend, owing to overall packaging cost has reduced, so can reach the effect that reduces the integrated circuit packaging cost.Wherein, memory chip 220 can be non-volatile type memory bodys such as Dynamic Random Access Memory (DRAM), SDRAM, ROM (read-only memory) (ROM), OTP RAM, MTP RAM, EPROM or flash memory.
Shown in Figure 2 for consulting, this video and audio CD disc is play wafer 210, and it comprises: have core logic 211, duplex circuit (multiplexing circuitry) 212, the controller 213 with memory body control function, command encoder 214 and moderator 215 that video and audio CD disc is play logic function.Wherein, controller 213 couples core logic 211 and duplex circuit 212, and in order to receiving the requirement of core logic 211, with via the interface as address/data bus 230, transmitting for example is first interface command of memory body access command.Command encoder 214 couples core logic 211 and duplex circuit 212, desire second interface command that transmits via general port,input-output (GPIO) in order to receive core logic 211, and second interface command is encoded to the memory body access command transmits via address/data bus 230.And moderator 215 also couples core logic 211 and duplex circuit 212,, selects via address/data bus 230 the memory body access command that comes transfer control 213 or command encoder 214 to produce in order to control duplex circuit 212.
In addition, the memory chip 220 among Fig. 2, it comprises memory circuit 221, address demoder (address decoder) 222 and command decoder (command decoder) 223.Wherein, address demoder 222 couples memory circuit 221, in order to receiving the memory body access command from address/data bus 230, and according to the access address of memory body access command, transmits the memory body access command.For example, when the access address of memory body access command be when dropping in the addressing range of memory circuit 221, the memory body access command to be sent to memory circuit 221, with the data in the access/memory circuit 221.And when the addressing range of memory circuit 221 is not dropped in the access address of memory body access command, then the memory body access command is sent to command decoder 223, at this moment, the memory body access command that command decoder 223 can decoding be received, and the order that will separate gained transmits via the interface as the general I/O port (GPIO) among the figure.
In sum, a kind of method of expanding wafer connecting pin position provided by the present invention, it is the address/data bus interface that is suitable for utilizing first wafer that for example is video and audio CD disc broadcast wafer, video and audio CD disc is play the connecting pin position of the general I/O port interface of wafer, move to for example is on second wafer of memory chip, to increase a little or not under the condition of the required integrated circuit packaging cost of memory chip, reduce the packaging cost that video and audio CD disc is play the required integrated circuit of wafer significantly.This method that can expand wafer connecting pin position is summarized as follows: first wafer will be desired second interface command by general I/O port interface transmission, be encoded to first interface command that can transmit by address/data bus interface, with from the address/the data bus interface transmits; And second wafer receive first interface command, and first interface command is decoded as second interface command, transmit with connecting pin position from second wafer.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (11)
1, a kind of method of expanding wafer connecting pin position is suitable for utilizing one first interface of one first wafer, and the connecting pin position with one second interface of this first wafer moves on one second wafer, it is characterized in that it may further comprise the steps:
This first wafer makes one second interface command that transmits by this second interface, and being encoded to can be by one first interface command of this first interface transmission, with this first interface transmission certainly; And
This second wafer receives this first interface command, and this first interface command is decoded as this second interface command, with the connecting pin position transmission of this second wafer certainly.
2, the method for expanding wafer connecting pin position according to claim 1 is characterized in that wherein said first wafer is that a video and audio CD disc is play wafer.
3, the method for expanding wafer connecting pin position according to claim 1 is characterized in that wherein said second wafer is a memory chip.
4, the method for expanding wafer connecting pin position according to claim 1 is characterized in that wherein said first interface is one address/data bus.
5, the method for expanding wafer connecting pin position according to claim 1 is characterized in that wherein said second interface is a general port,input-output.
6, a kind of wafer of expanding wafer connecting pin position is characterized in that it comprises:
One core logic;
One duplex circuit;
One controller is coupled to this core logic and this duplex circuit, in order to receive the requirement of this core logic, to transmit one first interface command;
One command encoder couples this core logic and this duplex circuit, in order to receiving one second interface command of this core logic, and this second interface command is encoded to this first interface command transmits; And
One moderator couples this core logic and this duplex circuit, in order to control this duplex circuit, to select to transmit this first interface command of this controller or this command encoder.
7, the wafer of expanding wafer connecting pin position according to claim 6 is characterized in that wherein said core logic is to play logic for a video and audio CD disc.
8, the wafer of expanding wafer connecting pin position according to claim 6 is characterized in that wherein said controller is to be a memory controller.
9, the wafer of expanding wafer connecting pin position according to claim 6 is characterized in that wherein said first interface command is to be a memory body access command.
10, a kind of memory chip is characterized in that it comprises:
One memory circuit;
One address demoder couples this memory circuit, in order to receiving a memory body access command, and according to the access address of this memory body access command, transmits this memory body access command; And
One command decoder couples this address demoder, in order to this memory body access command of decoding, to transmit from one second interface.
11, memory chip according to claim 10 is characterized in that wherein said second interface is a general port,input-output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100424452A CN100454395C (en) | 2004-05-21 | 2004-05-21 | Method of expandable wafer connection pin position, wafer and memory wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100424452A CN100454395C (en) | 2004-05-21 | 2004-05-21 | Method of expandable wafer connection pin position, wafer and memory wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1700313A true CN1700313A (en) | 2005-11-23 |
| CN100454395C CN100454395C (en) | 2009-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100424452A Expired - Fee Related CN100454395C (en) | 2004-05-21 | 2004-05-21 | Method of expandable wafer connection pin position, wafer and memory wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116303191A (en) * | 2023-05-15 | 2023-06-23 | 芯耀辉科技有限公司 | Method, equipment and medium for interconnecting wafer-to-wafer interfaces |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62158356A (en) * | 1986-01-07 | 1987-07-14 | Toshiba Corp | Lsi for expanding function |
| CN2582295Y (en) * | 2002-11-22 | 2003-10-22 | 青岛海信电器股份有限公司 | Port expanding circuit for TV set |
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2004
- 2004-05-21 CN CNB2004100424452A patent/CN100454395C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116303191A (en) * | 2023-05-15 | 2023-06-23 | 芯耀辉科技有限公司 | Method, equipment and medium for interconnecting wafer-to-wafer interfaces |
| CN116303191B (en) * | 2023-05-15 | 2023-09-15 | 芯耀辉科技有限公司 | Method, equipment and medium for interconnecting wafer-to-wafer interfaces |
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| CN100454395C (en) | 2009-01-21 |
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