CN1694601A - Electronic element assembling device in electronic equipment - Google Patents
Electronic element assembling device in electronic equipment Download PDFInfo
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- CN1694601A CN1694601A CN 200510074380 CN200510074380A CN1694601A CN 1694601 A CN1694601 A CN 1694601A CN 200510074380 CN200510074380 CN 200510074380 CN 200510074380 A CN200510074380 A CN 200510074380A CN 1694601 A CN1694601 A CN 1694601A
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Abstract
This invention relates to an electronic element assembling device in an electronic device, which presets two rows of parallel and spaced circuit connection points on the master CB surface in an electronic device and designs an electronic element on the master CB at the center of the two rows of connection points, besides, a first CB set is composed of two soft CB and a first electronic element, which can be conducted with a corresponding circuit on the master CB via the soft CB, the weld points between the soft CB and the first electronic element are set on both edges of the top surface of the element on the master CB to make the first element to be set right on the above position of the element of the master CB.
Description
Technical field
The invention relates to a kind of apparatus for installing electronic components of electronic equipment internal, refer to the package assembly of assembling electronic component especially by flexible circuit board.
Background technology
Continuous development along with hyundai electronics science and technology, occurred at present various on the market for the individual electronic product of carrying and using, so as to the management of personal data is provided, mobile phone communication, two-way call, all functions such as multimedia audiovisual and wireless network online, especially extremely paying attention in the industrial and commercial society of operating efficiency and speed, this type of possesses the portable electronic product that multi-functional effectiveness is arranged more becomes trifling affairs or the worker indispensable instrument of being engaged in of handling in the daily life, this series products is carried for the ease of the consumer's, and meet the demand of consumer on function of use simultaneously, its product in appearance little by little towards compact and design, go up most of consumer demand to cater to society.So, in the design of Related product and since be subject to constantly dwindle on the product appearance its volume size design so, the space size that makes the electronic product internal body can be used to be provided with electronic component also is compressed gradually relatively and reduces.
In the internal body of electronic product in the past, when on original main circuit board can be ccontaining the IC chip or during the electronic component insufficient space, IC chip or the electronic component that other desire is installed is arranged on other the circuit board in addition often, and this circuit board corresponded to main circuit board, parallelly repeatedly place on the main circuit board and be provided with, then be to connect mutually between main circuit board and the circuit board with connector, so as to finishing the design on its hardware circuit layout, but because main circuit board and circuit board often all are with rigid printed circuit board (PCB) (Printed Circuit Board, PCB) constitute, printed circuit board (PCB) not only its thickness thicker outside, and need two groups of circuit boards to be engaged by connector in addition to be fixed on one, make at the electronic product internal body when carrying out the relevant layout of hardware circuit, usually because of being provided with under the limited or not enough situation in space that its inside is reserved, yield the IC chip or the electronic component that design or assemble other, make the associated electrical product after miniaturization Design, cause the partial function that can provide to be sacrificed simplification on the contrary, and can not meet popular demand.
Summary of the invention
Main purpose of the present invention is to provide a kind of apparatus for installing electronic components of electronic equipment internal, remedies electronic equipment internal because of the not enough shortcoming that electronic component can't be set of main circuit board area so as to reaching.
Another object of the present invention is to provide a kind of apparatus for installing electronic components of electronic equipment internal, makes when electronic component is installed on internal body, can reach the space when reducing part and being provided with, and reaches the purpose of dwindling small product size simultaneously.
For reaching above-mentioned purpose, the present invention mainly is being provided with a circuit board group, this circuit board group then is repeatedly putting mode, makes set electronic component on the circuit board group just can be arranged at the surface, place, electronic component top of main circuit board, and is connected with this main circuit board and is a circuit turn-on.
Circuit board group of the present invention is provided with an electronic component by a flexible circuit board surface to be formed, and this flexible circuit board surface has plural circuit junction, can electrically connect on it for set pin on this electronic component.
Flexible circuit board end of the present invention has more plural circuit junction, is can be connected in the solid welding mode mutually with set corresponding circuit junction on the main circuit board to be a circuit turn-on.
The present invention more can be by being provided with plural circuit board group, and circuit board group is to be arranged on the main circuit board in mutual stacking mode, and be connected with this main circuit board respectively and be a circuit turn-on.
Description of drawings
Fig. 1 is the perspective exploded view of the first embodiment of the present invention;
Fig. 2 is the combination schematic diagram of the first embodiment of the present invention;
Fig. 3 is the end view of the first embodiment of the present invention;
Fig. 4 is the side cutaway view of the second embodiment of the present invention;
Fig. 5 is the side cutaway view of the third embodiment of the present invention;
Fig. 6 is the side cutaway view of the fourth embodiment of the present invention;
Fig. 7 is the schematic perspective view of the fifth embodiment of the present invention;
Fig. 8 is the side cutaway view of the fifth embodiment of the present invention;
Fig. 9 is the perspective exploded view of the sixth embodiment of the present invention;
Figure 10 is the three-dimensional combination figure of the sixth embodiment of the present invention;
Figure 11 is the side cutaway view of the seventh embodiment of the present invention.
Embodiment
Seeing also Figure 1 and Figure 2, is respectively perspective exploded view and constitutional diagram for the first embodiment of the present invention.As shown in the figure, the present invention is preset with two row's circuit junctions 12 parallel and separately on inner main circuit board 10 surfaces of electronic equipment body (figure does not show), main circuit board 10 surfaces are gone up in two row's circuit junctions, 12 central authorities and then are provided with an electronic component 14, wherein main circuit board 10 is to be a printed circuit board (PCB) (Printed Circuit Board, PCB), other is provided with a first circuit board group 20, first circuit board group 20 has two flexible circuit board 22 (FlexiblePrinted Circuit, FPC) and one first electronic component 24,24 in this first electronic component is meant an IC packaged chip in the present embodiment, please consult shown in Figure 3 simultaneously, on flexible circuit board 22 two ends, lower surface respectively is provided with plural pad 222,224, wherein first electronic component, 24 both sides are provided with plural pin 242, can be welded to each other fixing with the set pad 222 of flexible circuit board 22 1 ends respectively, the set pad 224 of flexible circuit board 22 other ends then with main circuit board 10 on corresponding circuit junction 12 welding fixing, make the electronic component 24 of winning can be via flexible circuit board 22 with main circuit board 10 on be connected with corresponding circuits (figure does not show) that circuit junction 12 connects.
The pad 222 of aforementioned flexible circuit board 22 mainly is the place, upper surface two edges that is arranged at electronic component set on the main circuit board 10 14, make first electronic component 24 be able to just be provided with the place, electronic component 14 tops that is positioned at main circuit board 10, or fit in electronic component 14 upper surface places in the mode of putting repeatedly; Again, first circuit board group 20 set first electronic components 24 not only are applicable to single first electronic component 24 in the present invention, the electronic component that can be provided with in order to solid welding with plural first electronic component 24 or other still can be set, and itself and close-packed array are arranged between two flexible circuit boards 22; Disturb for not making the electronic component 24 of winning produce signals with electronic component 14 in addition, flexible circuit board 22 surfaces can be provided with a metallic spacer (scheming not show), and are a conducting with the conductive layer of main circuit board 10, to reach the effect that noise covers.
Because flexible circuit board 22 has pliability, can reduce setting, and can irregularly shapedly design for joint, electric wire or other packaged unit, or ccontaining in small space; So in the first embodiment of the present invention, mainly be by the character that relies on flexible circuit board 22, with first electronic component 24 be mounted in advance on two flexible circuit boards 22 constitute first circuit board group 20 after, and the circuit junction 12 that reservation can provide flexible circuit board 22 to weld on main circuit board 10, make first circuit board group 20 to be an electric connection with main circuit board 10 via being welded in circuit junction 12, so can be in the area of limited main circuit board 10, with more first electronic component 24 of ccontaining design, certainly first electronic component of the ccontaining design of institute's desire in the present invention is not limited to the IC packaged chip, and can design various electronic component on main circuit board 10 equally applicable to other; Again, because in the present invention, in order to first electronic component 24 is assembled on the main circuit board 10 for having flexual flexible circuit board 22, and because the comparatively general again main circuit board 10 of flexible circuit board 22 thickness is frivolous, so when flexible circuit board 22 is arranged at electronic equipment body inside, can be fully by its pliability and frivolous characteristic, be placed in the confined space of electronic equipment body inside, be not arranged on the main circuit board 10 and do not need picture circuit design in the past to assemble side by side by another piece multilayer circuit board, need expend the bigger space that is provided with, and make the outward appearance of electronic equipment be difficult for reaching the target of microminiaturization.
Seeing also shown in Figure 4ly, is the side cutaway view for the second embodiment of the present invention.As shown in the figure, in the present embodiment, it mainly is the laminated first circuit board group 20 that is provided with two groups on main circuit board 10, wherein two groups first circuit board group 20 equally all has two flexible circuit boards 22 and one first electronic component 24, first electronic component 24 is meant an IC packaged chip equally in the present embodiment, and flexible circuit board 22 two ends all are provided with plural pad 222,224, first electronic component, 24 both sides are provided with plural pin 242, can be welded to each other fixingly with the set pad 222 of flexible circuit board 22 1 ends respectively, set corresponding circuit junction 12 welding be fixing on 224 of set pads of flexible circuit board 22 other ends and the main circuit board 10.
In the present embodiment, two first circuit board groups 20 mainly be above the electronic component 14 of main circuit board 10 surface in regular turn in stacking mode, be welded in that main circuit board 10 surface is gone up and the purpose that reaches assembling, wherein the pad 222 of flexible circuit board 22 mainly is the place, upper surface two edges that the position is electronic component set on the main circuit board 10 14, make first electronic component 24 be arranged at the place, electronic component 14 tops of main circuit board 10 just, or fit in electronic component 14 upper surface places in the mode of putting repeatedly, therefore can fully reach whereby and apply flexibly electronic equipment body volume inside, and be used and save the effect that the space is set; And first circuit board group 20 set first electronic components 24 among aforementioned the present invention not only are applicable to single first electronic component 24, the electronic component that can be provided with in order to solid welding with plural first electronic component 24 or other still can be set, and itself and close-packed array are arranged between two flexible circuit boards 22.
Other sees also shown in Figure 5, is the side cutaway view for the third embodiment of the present invention.As shown in the figure, in the third embodiment of the present invention, be provided with a second circuit board group 30, wherein second circuit board group 30 has two flexible circuit boards 32 and one second electronic component 34, second electronic component 34 is meant an IC packaged chip in the present embodiment, second electronic component 34 of second circuit board group 30 is the lower surface places that are arranged at two flexible circuit boards 32, wherein the lower surface place at flexible circuit board 32 two ends all is provided with plural pad 322,324, second electronic component, 34 both sides then are provided with plural pin 342, can be welded to each other fixing with the set pad 322 of flexible circuit board 32 1 ends respectively, set corresponding circuit junction 12 welding are fixing on 324 of pads that flexible circuit board 32 other ends are set and the main circuit board 10, so as to second circuit board group 30 is incorporated on the main circuit board 10, so can make pin 342 and the pad 322 of corresponding flexible circuit board 10 of second electronic component 34 can be hidden in the lower surface of flexible circuit board 32 respectively, so as to avoiding pin 342 and pad 322 places can be subjected to the collision of other foreign object and damaging, make second electronic component 34 be able to just be provided with the place, electronic component 14 tops that is positioned at main circuit board 10 simultaneously, or fit in electronic component 14 upper surface places in the mode of putting repeatedly; And second circuit board group 30 set second electronic components 34 among aforementioned the present invention not only are applicable to single second electronic component 34, the electronic component that can be provided with in order to solid welding with plural second electronic component 34 or other still can be set, and itself and close-packed array are arranged between two flexible circuit boards 32.
Seeing also shown in Figure 6ly, is the side cutaway view for the fourth embodiment of the present invention.As shown in the figure, in the fourth embodiment of the present invention, main is to be respectively arranged with two groups second circuit board group 30 on main circuit board 10 equally, wherein two groups second circuit board group 30 equally respectively has two flexible circuit boards 32 and one second electronic component 34, second electronic component 34 is meant an IC packaged chip equally in the present embodiment, this second circuit board group 30 of two groups mainly be above the electronic component 14 of main circuit board 10 surface in regular turn in stacking mode, be welded in that main circuit board 10 surface is gone up and the purpose that reaches assembling, wherein the pad of flexible circuit board 32 mainly is the place, upper surface two edges that the position is electronic component set on the main circuit board 10 14, and make second electronic component 34 be arranged at the place, electronic component 14 tops of main circuit board 10 just, or fit in electronic component 14 upper surface places in the mode of putting repeatedly, and set second electronic component 34 of second circuit board group 30, because of being the lower surface place that second electronic component 34 is mounted on flexible circuit board 32, get so that the pin 342 of second electronic component 34 and the pad 322 of flexible circuit board 32 corresponding with it can obtain preferable protection; And second circuit board group 30 set second electronic components 34 among aforementioned the present invention not only are applicable to single second electronic component 34, the electronic component that can be provided with in order to solid welding with plural second electronic component 34 or other still can be set, and itself and close-packed array are arranged between two flexible circuit boards 32.
Please consulting Fig. 7 and shown in Figure 8 respectively, is schematic perspective view and side cutaway view for the fifth embodiment of the present invention; As shown in the figure, in the fifth embodiment of the present invention, mainly be to be provided with a tertiary circuit plate group 40, wherein tertiary circuit plate group 40 has a flexible circuit board 42 and one the 3rd electronic component 44, the 3rd electronic component 44 is meant an IC packaged chip in the present embodiment, flexible circuit board 42 is respectively arranged with the pad 422 of plural number near upper face center and lower surface end, 424, make the pin 442 of the 3rd electronic component 44 can directly be arranged at flexible circuit board 42 surperficial going up on the corresponding pad 422, and flexible circuit board 42 is repeatedly placed on main circuit board 10 surfaces, the set pad 422 of flexible circuit board 42 upper surfaces wherein, the pad 422 that promptly is positioned at flexible circuit board 42 inner surfaces mainly is to correspond to the electronic component 14 of main circuit board 10 and be provided with, make 422 of pads be the place, upper surface two edges of electronic component 14, and make the 3rd electronic component 44 be arranged at the place, top of electronic component 14 just, and make flexible circuit board 42 lower surfaces that are positioned at the 3rd electronic component 44 belows be glued and placed in the upper surface place of electronic component 14, corresponding circuit junction 12 is connected in the solid welding mode mutually and is a circuit turn-on on 424 of the pads of 42 liang of outer ends of flexible circuit board and the main circuit board 10 again.
In the fifth embodiment of the present invention, they are different with first embodiment, so be electrically connected on the wall scroll flexible circuit board 42 in that the 3rd electronic component 44 is directly set firmly, but not be connected in separately respectively with two flexible circuit boards 42 on the pin 442 of the 3rd electronic component 44 both sides, the mode of a kind of comparatively easy assembling the 3rd electronic component 44 on flexible circuit board 42 that provide is provided; And tertiary circuit plate group 40 set the 3rd electronic components 44 among aforementioned the present invention not only are applicable to single the 3rd electronic component 44, the electronic component that can be provided with in order to solid welding with plural number the 3rd electronic component 44 or other still can be set, and itself and close-packed array be arranged at the upper face center place of flexible circuit board 42.
Aforementioned first embodiment to the, five embodiment mainly are the chip types that is applied to symmetrical pin position encapsulation DIP (DualIn-line Package).Please consulting Fig. 9 and shown in Figure 10 respectively in addition, is perspective exploded view and three-dimensional combination schematic diagram for the sixth embodiment of the present invention.As shown in the figure, in sixth embodiment of the invention, it mainly is to be preset with plural circuit junction 12 on main circuit board 10 surfaces of electronic equipment body inside, main circuit board 10 is to be printed circuit board (PCB), other is provided with one the 4th circuit board group 50, the 4th circuit board group 50 has a flexible circuit board 52 and a quadrielectron element 54, quadrielectron element 54 is meant an IC packaged chip in the present embodiment, and present embodiment mainly may be implemented in miniaturization encapsulation (TSOP, Thin Small Outline Package) chip type, its typical feature is pin to be arranged at around the chip in the Chip Packaging mode promptly, in the present embodiment, the upper face center place of flexible circuit board 52 is provided with and surrounds foursquare four row's pads 522 jointly, two outer end lower surfaces then respectively are provided with row's pad 524, wherein side is provided with plural pin 542 around the quadrielectron element 54, can be welded to each other fixing with the set corresponding pad 522 of flexible circuit board 52 upper face center respectively, 52 of flexible circuit boards are repeatedly to place on electronic component 14 surfaces of main circuit board 10, the set pad 522 of flexible circuit board 52 upper surfaces wherein, mainly be to correspond to electronic component 14 positions of main circuit board 10 and be provided with, make pad 522 be able to correspondence and around the peripheral region of the upper surface of electronic component 14, and make quadrielectron element 54 be arranged at the place, top of electronic component 14 just, and make flexible circuit board 52 lower surfaces that are positioned at quadrielectron element 54 belows be glued and placed in the upper surface place of electronic component 14, and corresponding circuit junction 12 is connected and is a circuit turn-on on the pad 524 that makes flexible circuit board 52 two ends lower surfaces and the main circuit board 10 mutually in the solid welding mode; And the 4th circuit board group 50 set quadrielectron elements 54 among aforementioned the present invention not only are applicable to single quadrielectron element 54, the electronic component that can be provided with in order to solid welding with plural quadrielectron element 54 or other still can be set, and itself and close-packed array be arranged at the upper face center place of flexible circuit board 52.
Seeing also shown in Figure 11ly, is the side cutaway view for the seventh embodiment of the present invention.As shown in the figure, present embodiment is that main circuit board 10 is provided with one the 5th circuit board group 60, the 5th circuit board group 60 has a flexible circuit board 62 and one the 5th electronic component 64, the 5th electronic component 64 is meant an IC packaged chip in the present embodiment, mainly be to be applied in to cover the chip type of crystalline substance (Flip-Chip) semiconductor packages mode, wherein flexible circuit board 62 upper face center and lower surface two outer ends place is provided with pad 622 and the row's pad 624 that is the arranged plural number respectively, and the position the tin ball piece 642 of the 5th electronic component 64 bottom surfaces directly solid welding be arranged on flexible circuit board 62 central surfaces on the corresponding pad 622,62 of flexible circuit boards are repeatedly to place on main circuit board 10 surfaces, wherein be positioned at set pad 622 on flexible circuit board 62 central surfaces, mainly be to correspond to electronic component 14 positions of main circuit board 10 and be provided with, make pad 622 be able to correspondence and around the peripheral region of the upper surface of electronic component 14, and make the 5th electronic component 64 be arranged at the place, top of electronic component 14 just, and make flexible circuit board 62 lower surfaces that are positioned at the 5th electronic component 64 belows be glued and placed in the upper surface place of electronic component 14, corresponding circuit junction 12 is connected in the solid welding mode mutually and is a circuit turn-on on 624 of the pads at flexible circuit board 62 two ends and the main circuit board 10, also can provide assembling so as to making the electronic component with the chip that covers crystalline substance (Flip-Chip) semiconductor packages mode; Certainly, the 5th circuit board group 60 set the 5th electronic components 64 among aforementioned the present invention not only are applicable to single the 5th electronic component 64, the electronic component that can be provided with in order to solid welding with plural number the 5th electronic component 64 or other still can be set, and itself and close-packed array be arranged at the upper face center place of flexible circuit board 62.
Brought forward is described, the present invention mainly is to solve the main circuit board of electronic equipment internal when carrying out circuit design or desire expansion electronic functionalities, there has not been any space on the main circuit board can the holding electronic element time, then can be by electronic component (being in the present invention) with the explanation of chip as embodiment with the desire assembling, after being arranged on the flexible circuit board earlier, and setting can be for the circuit junction of flexible circuit board electric connection on main circuit board, after making that the flexible circuit board that is provided with electronic component can repeatedly place on the main circuit board surface, wherein set on the flexible circuit board surface in order to the pad of chip to be set, mainly be to correspond to the positions of electronic parts of main circuit board and be provided with, make that pad is able to be provided with corresponding to the top surface location of electronic component, and make chip be arranged at the place, top of electronic component just, or make chip repeatedly the mode of being put fit in electronic component upper surface place, and corresponding circuit junction is connected in the solid welding mode mutually and is a circuit turn-on on the pad that makes flexible circuit board two ends lower surface and the main circuit board, reach and expand the purpose that circuit is set, and can solve simultaneously when being provided with rigid multilayer circuit board in the past, owing to need use electronic equipment body volume inside in a big way, cause the electronic equipment appearance design to be difficult to the target that reaches compact; Again, because flexible circuit board itself has preferable pliability, and its material is also comparatively frivolous, so be arranged at the electronic equipment body when inner when it is assembled, can be adjusted at an easy rate that to be arranged at the electronic equipment body inner preferable or have a position in spacious space, make electronic component when assembling, can obtain preferable elastic space design; At last, because the present invention sees through flexible circuit board to make electronic component be assembled on the main circuit board, because the material of flexible circuit board is comparatively frivolous, so being provided with in the space at inner same range as size of electronic equipment body and height, can be by stacking multilayer by circuit board group that a plurality of electronic component and flexible circuit board constituted, reach best space utilization effectiveness, and by rigid in the past multilayer circuit board, because rigid circuit board material is comparatively thick and heavy, and need be one by connector and main circuit board electrically conducts, so it is low than the present invention in the same number of components such as electronic component that can settle in the space of being provided with relatively, and is also relatively poor for the function extendibility of product.
The above; it only is a preferred embodiment of the present invention; be not to be used for limiting scope of the invention process, the equalization of doing according to the described shape of the present patent application claim, structure, feature and spirit changes and modifies such as, all should be included in the claim protection range of the present invention.
Claims (20)
1, a kind of apparatus for installing electronic components of electronic equipment internal is characterized in that, comprising:
One main circuit board, its upper surface are provided with two row's circuit junctions separately;
One electronic component is arranged on this main circuit board between this two rows circuit junction; And
One first circuit board group has:
One first electronic component is arranged at place, this electronic component top and has corresponding dual-side, and respectively is provided with plural pin in this side edge; And
Two flexible circuit boards, this flexible circuit board one terminal upper surface has the plural pad that correspondence connects these these pins of first electronic component, and another terminal lower surface of this flexible circuit board has the plural pad that correspondence connects the circuit junction on this main circuit board.
2, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 1, it is characterized in that, wherein the pad that connects these these pins of first electronic component in order to correspondence is the place, upper surface two edges that is arranged at electronic component set on this main circuit board, the place, electronic component top that makes this first electronic component be able to be provided with just to be positioned at this main circuit board.
3, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 1, it is characterized in that, wherein this main circuit board is provided with the above first circuit board group of at least two groups, and the upper surface of this main circuit board is provided with plural number row circuit junction separately, is arranged at this electronic component both sides respectively; Make these first circuit board groups, be on the electronical elements surface of this main circuit board with this first electronic component in stacking mode, repeatedly place this place, electronic component top.
As the apparatus for installing electronic components of claim 1,2 or 3 described electronic equipment internal, it is characterized in that 4, wherein this first electronic component is to be an IC packaged chip.
5, a kind of apparatus for installing electronic components of electronic equipment internal is characterized in that, comprising:
One main circuit board, its upper surface are provided with two row's circuit junctions separately;
One electronic component is arranged on this main circuit board between this two rows circuit junction; And
One second circuit board group has:
One second electronic component is arranged at place, this electronic component top and has corresponding dual-side, and respectively is provided with plural pin in this side edge; And
Two flexible circuit boards, the terminal lower surface of this flexible circuit board place respectively has the plural pad that correspondence connects these these pins of first electronic component, and the corresponding plural pad that connects the circuit junction on this main circuit board.
6, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 5, it is characterized in that, wherein the pad that connects these these pins of second electronic component in order to correspondence is the place, upper surface two edges that is arranged at electronic component set on this main circuit board, the place, electronic component top that makes this second electronic component be able to be provided with just to be positioned at this main circuit board.
7, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 5, it is characterized in that, wherein this main circuit board is provided with the above second circuit board group of at least two groups, and the upper surface of this main circuit board is provided with plural number row circuit junction separately, is arranged at this electronic component both sides respectively; Make these second circuit board groups, be on the electronical elements surface of this main circuit board with this second electronic component in stacking mode, repeatedly place this place, electronic component top.
As the apparatus for installing electronic components of claim 5,6 or 7 described electronic equipment internal, it is characterized in that 8, wherein this second electronic component is to be an IC packaged chip.
9, a kind of apparatus for installing electronic components of electronic equipment internal is characterized in that, comprising:
One main circuit board, its upper surface are provided with two row's circuit junctions separately;
One electronic component is arranged on this main circuit board between this two rows circuit junction; And
One tertiary circuit plate group has:
One the 3rd electronic component is arranged at place, this electronic component top and has corresponding dual-side, and respectively is provided with plural pin in this side edge; And
One flexible circuit board, this flexible circuit board is respectively arranged with plural pad near upper face center and lower surface end, in order to connect these pins of the 3rd electronic component, reaches the corresponding circuit junction that is connected on this main circuit board with respectively.
10, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 9, it is characterized in that, wherein the pad that connects the 3rd these pins of electronic component in order to correspondence is the place, upper surface two edges that is arranged at electronic component set on this main circuit board, the place, electronic component top that makes the 3rd electronic component be able to be provided with just to be positioned at this main circuit board.
11, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 9, it is characterized in that, wherein this main circuit board is provided with the above tertiary circuit plate group of at least two groups, and the upper surface of this main circuit board is provided with plural number row circuit junction separately, is arranged at this electronic component both sides respectively; Make these tertiary circuit plate groups, be on the electronical elements surface of this main circuit board with the 3rd electronic component in stacking mode, repeatedly place this place, electronic component top.
As the apparatus for installing electronic components of claim 9,10 or 11 described electronic equipment internal, it is characterized in that 12, wherein the 3rd electronic component is to be an IC packaged chip.
13, a kind of apparatus for installing electronic components of electronic equipment internal is characterized in that, comprising:
One main circuit board, its upper surface are provided with two row's circuit junctions separately;
One electronic component is arranged on this main circuit board between this two rows circuit junction; And
One the 4th circuit board group has:
One quadrielectron element be arranged at this place, electronic component top, and side respectively is provided with plural pin around it; And
One flexible circuit board, its upper face center place is provided with and surrounds foursquare four row's pads jointly, two outer end lower surfaces then respectively are provided with row's pad, in order to connect this these pins of quadrielectron element, reach the corresponding circuit junction that is connected on this main circuit board with respectively.
14, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 13, it is characterized in that, wherein the pad that connects these these pins of quadrielectron element in order to correspondence be provided be bordering on electronic component set on this main circuit board go up the table peripheral region, the place, electronic component top that makes this quadrielectron element be able to be provided with just to be positioned at this main circuit board.
15, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 13, it is characterized in that, wherein this main circuit board is provided with the 4th above circuit board group of at least two groups, and the upper surface of this main circuit board is provided with plural number row circuit junction separately, is arranged at this electronic component both sides respectively; Make these grade in an imperial examination four circuit board group, be on the electronical elements surface of this main circuit board with this quadrielectron element in stacking mode, repeatedly place this place, electronic component top.
As the apparatus for installing electronic components of claim 13,14 or 15 described electronic equipment internal, it is characterized in that 16, wherein this quadrielectron element is to be an IC packaged chip.
17, a kind of apparatus for installing electronic components of electronic equipment internal is characterized in that, comprising:
One main circuit board, its upper surface are provided with two row's circuit junctions separately;
One electronic component is arranged on this main circuit board between this two rows circuit junction; And
One the 5th circuit board group has:
One the 5th electronic component be arranged at this place, electronic component top, and side respectively is provided with plural pin around it; And
One flexible circuit board, its upper face center and place, lower surface two outer ends respectively are respectively arranged with pad and the row's pad that is the arranged plural number, in order to connect these pins of the 5th electronic component, reach the corresponding circuit junction that is connected on this main circuit board with respectively.
18, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 17, it is characterized in that, wherein the pad that connects the 5th these pins of electronic component in order to correspondence be provided be bordering on electronic component set on this main circuit board go up the table peripheral region, the place, electronic component top that makes this quadrielectron element be able to be provided with just to be positioned at this main circuit board.
19, the apparatus for installing electronic components of electronic equipment internal as claimed in claim 17, it is characterized in that, wherein this main circuit board is provided with the 5th above circuit board group of at least two groups, and the upper surface of this main circuit board is provided with plural number row circuit junction separately, is arranged at this electronic component both sides respectively; Make these grade in an imperial examination five circuit board group, be on the electronical elements surface of this main circuit board with the 5th electronic component in stacking mode, repeatedly place this place, electronic component top.
As the apparatus for installing electronic components of claim 17,18 or 19 described electronic equipment internal, it is characterized in that 20, wherein the 5th electronic component is to be an IC packaged chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510074380 CN1694601A (en) | 2005-05-26 | 2005-05-26 | Electronic element assembling device in electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510074380 CN1694601A (en) | 2005-05-26 | 2005-05-26 | Electronic element assembling device in electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN1694601A true CN1694601A (en) | 2005-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510074380 Pending CN1694601A (en) | 2005-05-26 | 2005-05-26 | Electronic element assembling device in electronic equipment |
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| CN (1) | CN1694601A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103750834A (en) * | 2014-02-13 | 2014-04-30 | 重庆海睿科技有限公司 | Electrocardiosignal collecting wire |
| CN105323961A (en) * | 2014-06-09 | 2016-02-10 | 易鼎股份有限公司 | Power supply path structure of flexible circuit board |
| CN105516407A (en) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
| CN105960097A (en) * | 2016-07-20 | 2016-09-21 | 苏州福莱盈电子有限公司 | Circuit board convenient to install |
| CN106102318A (en) * | 2016-07-20 | 2016-11-09 | 苏州福莱盈电子有限公司 | A kind of wiring board of flexible extension |
| CN107683022A (en) * | 2017-11-01 | 2018-02-09 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and electronic equipment |
| CN115496031A (en) * | 2022-11-15 | 2022-12-20 | 苏州浪潮智能科技有限公司 | Design method, device, equipment and medium of chip test carrier plate |
| WO2023103450A1 (en) * | 2021-12-08 | 2023-06-15 | 荣耀终端有限公司 | Electronic assembly and electronic apparatus |
-
2005
- 2005-05-26 CN CN 200510074380 patent/CN1694601A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103750834A (en) * | 2014-02-13 | 2014-04-30 | 重庆海睿科技有限公司 | Electrocardiosignal collecting wire |
| CN105323961A (en) * | 2014-06-09 | 2016-02-10 | 易鼎股份有限公司 | Power supply path structure of flexible circuit board |
| CN105323961B (en) * | 2014-06-09 | 2019-01-29 | 易鼎股份有限公司 | power supply path structure of flexible circuit board |
| CN105516407A (en) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
| CN105516407B (en) * | 2015-12-21 | 2018-11-13 | 惠州Tcl移动通信有限公司 | Mobile terminal and its circuit board assemblies |
| CN105960097A (en) * | 2016-07-20 | 2016-09-21 | 苏州福莱盈电子有限公司 | Circuit board convenient to install |
| CN106102318A (en) * | 2016-07-20 | 2016-11-09 | 苏州福莱盈电子有限公司 | A kind of wiring board of flexible extension |
| CN107683022A (en) * | 2017-11-01 | 2018-02-09 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and electronic equipment |
| WO2023103450A1 (en) * | 2021-12-08 | 2023-06-15 | 荣耀终端有限公司 | Electronic assembly and electronic apparatus |
| CN115496031A (en) * | 2022-11-15 | 2022-12-20 | 苏州浪潮智能科技有限公司 | Design method, device, equipment and medium of chip test carrier plate |
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