CN1691494A - Oscillator packaging structure and element mounting method thereof - Google Patents
Oscillator packaging structure and element mounting method thereof Download PDFInfo
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- CN1691494A CN1691494A CN 200410032796 CN200410032796A CN1691494A CN 1691494 A CN1691494 A CN 1691494A CN 200410032796 CN200410032796 CN 200410032796 CN 200410032796 A CN200410032796 A CN 200410032796A CN 1691494 A CN1691494 A CN 1691494A
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Abstract
The invention relates to an oscillator packaging structure and a method for installing components. Using the capillary phenomenon of fluid and the theory of surface tension force, the size of the oscillator can be reduced and piezoelectric element can be kept away from contamination. The packaging structure of oscillator comprises: a flat with a top surface and a bottom surface; multiple sides upwardly extend from the surrounding of the said top surface to a certain height to form an upwardly opening container with the top surface and it can take in a piezoelectric element; forming a closed environment with an up covering on the top of the upwardly opening container; a printed circuit spreading on the bottom surface can joint at least one electric component; multiple mounts of same height spread on the printed circuit; a down covering is jointed with these mounts and forms a part of opening environment with the bottom surface, there's a hole for filling glue on the down covering; and the plastic materials are filled into the opening environment through the hole for filling glue.
Description
Technical field
The present invention relates to the frequency control apparatus field, refer to oscillator encapsulating structure and component mounting method thereof especially.
Background technology
(Temperature Compensated CrystalOscillator TCXO) is frequency controller commonly used in the electronic product to the temperature compensated quartz oscillator.One typical temperature compensated quartz oscillator is to utilize a piezoelectric element (Piezoelectric Material), be generally a quartz crystal, itself and a temperature-compensation circuit be as a reliable and stable frequency outputting device, particularly can be applicable to need high frequency and be in movable electronic product such as mobile phone, beeper or radio modem etc. in the variations in temperature environment.And along with the electronic product size is tending towards compact, the encapsulating structure of temperature compensated quartz oscillator also need meet this trend.
Fig. 1 is the encapsulating structure schematic diagram of a temperature compensated quartz oscillator 100 in the known techniques, this temperature compensated quartz oscillator 100 comprise a piezoelectric element 101, a temperature-compensating integrated circuit 102, a plurality of electric capacity 103, an I/o pad (not shown), one hide 104 and one shell 105 can take in these electronic components and with this coverings 104 formation one driving fit space.
When the characteristic of one piezoelectric element is this piezoelectric element stress application, can make its surface produce electric charge and cause potential difference, on the contrary, can cause its deformation when this piezoelectric element is added an electric field, and then can produce a radio frequency (Radio Frequency).
Therefore, when a voltage was provided in this piezoelectric element 101, this piezoelectric element 101 can produce a resonance frequency.But if the temperature change in this shell, then this resonance frequency may produce a small skew (Drift) because of the variations in temperature in this shell 105, therefore, a temperature compensation means is integrated into 102 of temperature-compensating integrated circuits usually and places in this shell 105 so that the compensated information about ambient temperature to be provided.
Yet; above-mentioned temperature compensated quartz oscillator 100 structures are packaged in this piezoelectric element 101 in the same confined space with this temperature-compensating integrated circuit 102; on the one hand; this structure also is unfavorable for dwindling the encapsulation volume of these temperature compensated quartz oscillator 100 integral body; on the other hand; usually can be on this temperature-compensating integrated circuit 102 coated with an epoxy resin (Epoxy) as the usefulness of this temperature-compensating integrated circuit 102 of protection with other electronic component; and this epoxy resin can pollute this piezoelectric element 101, thereby influences the change of its resonance frequency.
Therefore, the temperature compensated quartz oscillator structure of an improvement is shown in Fig. 2 A and Fig. 2 B.
Fig. 2 A is a temperature compensated quartz oscillator 200 cutaway views of improvement.
The agent structure of this temperature compensated quartz oscillator 200 is a platform 201, a plurality of sides 202 extend upward and end at the contact hole 210 of a plurality of metals formations and form a upwards open container 204 around this platform 201, wherein these contact holes 210 are in order to connecting external circuit, and have a plurality of sides 203 to extend around this platform 201 in addition downwards and form an open container 205 downwards.The configurable temperature-compensating integrated circuit 206 and a plurality of electric capacity 207 or other electron component of the middle body of the platform 201 in the container 204 that should upwards open; The then configurable piezoelectric element 208 of platform 201 in should open downwards container 205 and with one hide the 209 common sealed environments that form.This temperature compensated quartz oscillator 200; its structure is the both sides up and down that temperature-compensating integrated circuit 206 and piezoelectric element 208 are disposed at this platform 201 respectively; so; this temperature-compensating integrated circuit 206 is after protecting coated with epoxy resin, and this piezoelectric element 208 will not polluted because of it is sealed in this open downwards container 205.Therefore, can keep the stability and the reliability of these piezoelectric element 208 resonance frequencys.
Yet, if the size of desiring to dwindle temperature compensated quartz oscillator structure during with volume, uses above-mentioned structure can produce some restrictions and difficult.
Fig. 2 B is the vertical view of this temperature compensated quartz oscillator 200.Among Fig. 2 B, have the weld pad 211 that a plurality of metals constitute on the side 202 of these temperature compensated quartz oscillator 200 upsides, these weld pads 211 are in order to be engaged in this temperature compensated quartz oscillator 200 on the printed circuit board (PCB) or other substrate of its applied electronic product.Because those are for the area that must possess fixed size in conjunction with the weld pad 211 of usefulness, so in the size of dwindling this temperature compensated quartz oscillator 200, these platform 201 upper surfaces can also dwindle with the employed area of other electron component for this temperature-compensating integrated circuit 206 thereupon, so, will increase the degree of difficulty that this temperature-compensating integrated circuit 206 and other electron component are installed, and then cause problems such as cost increase or yield reduction.
In sum, can't overcome dwindling and avoiding piezoelectric element to suffer pollution problems of temperature compensated quartz oscillator size in the known techniques simultaneously for solving, the present invention proposes an oscillator encapsulating structure and its component mounting method, it can solve caused problem of temperature compensated quartz oscillator or restriction in the known techniques simultaneously, and further can be applicable to other oscillator encapsulation or related semiconductor component package.
Summary of the invention
The present invention proposes the method that an oscillator encapsulating structure and its element are installed, and it is to utilize the capillarity of fluid and capillary principle and can dwindle the size of oscillator simultaneously and protect this piezoelectric element not contaminated.Oscillator encapsulating structure proposed by the invention, it comprises: a platform comprises a upper surface, a lower surface; A plurality of sides can be taken in a piezoelectric element in the extending upward a height on every side of this upper surface at least with the common container of upwards opening that forms of this upper surface of this platform; Covering is overlying on this upwards open container and forms a closed environment on one; One printed circuit is distributed in this lower surface can engage at least one electronic component; The support of a plurality of equal heights is distributed on this printed circuit; Covering once is engaged in those supports and forms a part of open environment jointly with this lower surface, and wherein this time hides and have a glue filling opening; And one plastic material be filled in this opening environment via this glue filling opening.
The present invention proposes the method that an oscillator encapsulating structure element is installed, and it comprises: provide an encapsulating structure to have a upper end open container and a lower surface; Engage and seal a piezoelectric element in the open container in this upper end; Engage the lower surface of a plurality of electronic components in this encapsulating structure; Make the lower surface of a plurality of supports in this encapsulating structure; Joint one has the following of a glue filling opening and hides in those supports to form a part of open environment; Fill a plastic material via this glue filling opening in this opening environment; And the frequency of adjusting this piezoelectric element.
The pollution problem that above-described oscillator encapsulating structure proposed by the invention and its component mounting method can solve known techniques caused temperature compensated quartz oscillator size restrictions and piezoelectric element in fact; can dwindle the oscillator size and reach the protection piezoelectric element not contaminated by oscillator encapsulating structure proposed by the invention, and further can be applicable to encapsulation of other oscillator or related semiconductor component package.
Description of drawings
Fig. 1 is the encapsulating structure schematic diagram of a temperature compensated quartz oscillator 100 in the known techniques.
Fig. 2 A is the cutaway view of a temperature compensated quartz oscillator 200 of improvement.
Fig. 2 B is the vertical view of this temperature compensated quartz oscillator 200.
Fig. 3 is the element top exploded view of first embodiment of the invention.
Fig. 4 is that the element of first embodiment of the invention is looked up exploded view.
Fig. 5 is the element scheme of installation of first embodiment of the invention.
Fig. 6 A fills a plastic material 401 in the lower surface 307 common schematic diagrames that form a part of environment opened of this time covering 340 with this platform 301 among the present invention.
Fig. 6 B and 6C be among the present invention this packing material 401 because of structural representation that capillarity and surface tension produced.
Fig. 7 is an oscillator encapsulating structure schematic diagram of the present invention.
Among the figure
100 temperature compensated quartz oscillators, 101 piezoelectric elements
102 temperature-compensating integrated circuits, 103 electric capacity
104 hide 105 shells
200 temperature compensated quartz oscillators, 201 platforms
202 sides, 203 sides
The 204 upwards open open downwards containers of container 205
206 temperature-compensating integrated circuits, 207 electric capacity
208 piezoelectric elements 209 hide
210 contact holes, 211 weld pads
300 oscillators, 301 platforms
302 upper surfaces, 303 sides
304 weld pads, 305 sides
306 conduction electrodes, 307 lower surfaces
308 internal circuits, 309 weld pads
310 piezoelectric elements, 311 electrodes
Hide on 312 weld pads 320
330 supports hide for 340 times
341 glue filling openings, 342 weld pads
350 integrated circuits, 351 electric capacity
352 metal wires, 400 syringes
401 plastic materials, 402 concave inward structures
403 outer male structure
Embodiment
Describe conjunction with figs. in detail the specific embodiment of the present invention below.
Fig. 3 to Fig. 7 is the first embodiment of the present invention.Fig. 3 is the element decomposition plan view of first embodiment of the invention.As shown in Figure 3, oscillator 300 encapsulating structures of the present invention its mainly comprise hide 320 on a platform 301, a piezoelectric element 310, the integrated circuit 350 (Fig. 4),, a plurality of support 330 and hide 340 once.
This platform 301 can be a ceramic material and constitutes, it has a upper surface 302, a lower surface 307 and a plurality of side 305, wherein peripheral part of this upper surface 302 extends upward a height and forms a plurality of sides 303, these side 303 tops have a plurality of weld pads 309, wherein these weld pads 309 can be one and have the metal gasket of specific thicknesses or the metal coating of a thinner thickness, represent with metal coating among Fig. 3.The upper surface 302 common upwards open containers that form of those sides 303, weld pad 309 and this platform 301, wherein the upper surface 302 of this platform 301 is in this upwards open container and dispose a plurality of weld pads 304.A plurality of weld pads 312 of configuration and electrode 311 on one piezoelectric element 310, wherein this piezoelectric element 310 can be an AT-CUT quartz crystal or other analog structure thing.This piezoelectric element 310 can engage with these weld pads 304 of the upper surface 302 of this platform 301, but by these weld pads 304,312 and this piezoelectric element 310 of electrode 311 conductings can with a plurality of conduction electrodes 306 or the internal circuit 308 on the side 305 of this platform 301.
Hide 320 on one and then be covered in 303 common formation on this upwards open container of this platform 301 and those sides, wherein should go up covering and can comprise a metal.Should go up covering 320 and this platform 30 together after a hot environment, should go up hide 320 engages with these weld pads 309 on those side 303 tops, so should go up covering 320 and should form a closed environment jointly by upwards open container, wherein this closed environment can completely be taken in this piezoelectric element 310.
Fig. 4 is the element exploded bottom view of first embodiment of the invention.The lower surface 307 of this platform 301 has an internal circuit 308, and these internal circuit 308 configurable a plurality of electric capacity 351 also can see through a plurality of metal wires 352 joints one integrated circuits 350, and wherein this integrated circuit 350 can be a temperature-compensating integrated circuit.In addition, the support 330 of a plurality of equal heights is disposed on the internal circuit 308 of this lower surface 307, and wherein those supports 330 comprise an electric conducting material and it highly can be 200 μ m to 1000 μ m at least.
Fig. 5 is the element scheme of installation of first embodiment of the invention.Hiding 340 once can be made of a ceramic material or a printed circuit board material, and this time hides 340 and have a glue filling opening 341 and a plurality of weld pads 342, and wherein these weld pads 342 are evenly distributed in this time with similar number and hide 340 upper and lower surface and mutual conduction.Then, as shown in Figure 5, this time hidden 340 by these weld pads 342 those supports 330 of joint, on the one hand, this time hides 340 can form a part of open environment jointly with the lower surface 307 of this platform 301, on the other hand, but open by this part of those weld pad 342 conductings.Electronic component to one external circuit of being taken in the environment.
Fig. 6 A fills a plastic material in the lower surface 307 common schematic diagrames that form a part of environment opened of this time covering 340 with this platform 301 among the present invention.
As shown in Figure 6, after covering 320 on this and this time covering 340 are mounted to this platform 301, then fill a plastic material 401 to this time covering 340 these partly open environment with 307 common formation of lower surface of this platform 301 with a syringe 400 via the glue filling opening 341 of this time covering 340, wherein this plastic material 401 can be an epoxy resin.Because being the height with those supports 330, the distance that the lower surface of this time covering 340 and this platform 301 is 307 determined, it can be 200 μ m to 1000 μ m, therefore when being injected in this partly open environment, this plastic material 401 can spread and be full of this partly open environment because of the capillarity of its fluid itself, moreover, the plastic material 401 of this filling also can stop this boundary because of the surface tension of fluid itself when diffusing to the border of this partly open environment, the loading of its visual this plastic material 401 and can form a concave inward structure 402 (Fig. 6 C) or outer male structure 403 (Fig. 6 C).Principle by this can have a cushion space and reduce excessive or not enough situation for the loading of this plastic material 401 and take place, thereby can improve the yield of this oscillator 300.
Fig. 7 is an oscillator encapsulating structure schematic diagram of the present invention.After this plastic material 401 was filled and finished, the solvent evaporates that will wherein be comprised via a heating steps and producing was solidified and can be obtained as shown in Figure 7 structure.At last, adjust the output frequency of this oscillator 300 and test its function, promptly finish oscillator 300 encapsulating structures of the present invention.
Oscillator encapsulating structure that the present invention is so far proposed and component mounting method thereof can be applicable to temperature compensated quartz oscillator and other oscillator field, the encapsulation of Xiang Guan semiconductor element even in fact.Therefore, should be cheer and bright and can not deviate from the modification and the change of spirit of the present invention and scope for knowing this operator.Therefore, disclosed and can be involved in modification of the present invention and all should include in the scope that following claim protects with change.
Claims (14)
1. an oscillator encapsulating structure is characterized in that, comprises:
One platform comprises a upper surface, a lower surface;
A plurality of sides can be taken in a piezoelectric element in the extending upward a height on every side of this upper surface at least with the common container of upwards opening that forms of this upper surface of this platform;
Covering is overlying on this upwards open container and forms a closed environment on one;
One internal circuit is distributed in this lower surface can engage at least one electronic component;
The support of a plurality of equal heights is distributed on this internal circuit;
Covering once is engaged in these supports and forms a part of open environment jointly with this lower surface, and wherein this time hides and have a glue filling opening; And
One plastic material is filled in this opening environment via this glue filling opening.
2. structure according to claim 1 is characterized in that this platform further comprises a plurality of sides, but is distributed with this internal circuit to one external circuit of a plurality of conduction electrode conductings on these sides.
3. structure according to claim 1 is characterized in that the material of this platform can be a ceramic material.
4. structure according to claim 1 is characterized in that, those a plurality of sides tops further comprise a plurality of weld pads, and those weld pads hide in order to engage to go up.
5. structure according to claim 4 is characterized in that, these weld pads can be a metal or the metal coating with specific thicknesses.
6. structure according to claim 1 is characterized in that, this piezoelectric element can be an AT-CUT quartz crystal.
7. structure according to claim 1 is characterized in that, this at least one electronic component can be an integrated circuit and a plurality of electric capacity.
8. structure according to claim 1 is characterized in that, covering comprises a metal at least on this.
9. structure according to claim 1 is characterized in that these supports comprise an electric conducting material at least.
10. structure according to claim 1 is characterized in that, this time covering can be a ceramic material or a printed circuit board material constitutes.
11. structure according to claim 1 is characterized in that, this time covering further comprises a upper surface and a lower surface, but wherein this upper surface and this lower surface of this time covering are distributed with these support to one external circuits of a plurality of metal pad conductings respectively.
12. structure according to claim 1 is characterized in that, this plastic material can be an epoxy resin.
13. structure according to claim 1 is characterized in that, it is to utilize capillarity and surface tension that this plastic material is limited in common this partly open environment that forms of this time covering, those supports and this lower surface.
14. the component mounting method of oscillator encapsulation is characterized in that, comprises:
Provide an encapsulating structure to have a upper end open container and a lower surface;
Joint also seals a piezoelectric element in this container of putting of this upper end;
Engage the lower surface of a plurality of electronic components in this encapsulating structure;
Make the lower surface of a plurality of supports in this encapsulating structure;
Joint one has the following of a glue filling opening and hides in these supports to form a part of open environment;
Fill a plastic material via this glue filling opening to this opening environment; And
The function of adjusting the frequency of this oscillator and testing this oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410032796 CN1691494A (en) | 2004-04-21 | 2004-04-21 | Oscillator packaging structure and element mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410032796 CN1691494A (en) | 2004-04-21 | 2004-04-21 | Oscillator packaging structure and element mounting method thereof |
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| Publication Number | Publication Date |
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| CN1691494A true CN1691494A (en) | 2005-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410032796 Pending CN1691494A (en) | 2004-04-21 | 2004-04-21 | Oscillator packaging structure and element mounting method thereof |
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| Country | Link |
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| CN (1) | CN1691494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112671341A (en) * | 2020-12-30 | 2021-04-16 | 广东大普通信技术有限公司 | Temperature compensation crystal oscillator and temperature compensation method |
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2004
- 2004-04-21 CN CN 200410032796 patent/CN1691494A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112671341A (en) * | 2020-12-30 | 2021-04-16 | 广东大普通信技术有限公司 | Temperature compensation crystal oscillator and temperature compensation method |
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