CN112671341A - Temperature compensation crystal oscillator and temperature compensation method - Google Patents
Temperature compensation crystal oscillator and temperature compensation method Download PDFInfo
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- CN112671341A CN112671341A CN202011611665.8A CN202011611665A CN112671341A CN 112671341 A CN112671341 A CN 112671341A CN 202011611665 A CN202011611665 A CN 202011611665A CN 112671341 A CN112671341 A CN 112671341A
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Abstract
The invention belongs to the technical field of crystal oscillators, and discloses a temperature compensation crystal oscillator and a temperature compensation method, wherein the temperature compensation crystal oscillator comprises a packaging part, a crystal, an oscillation chip and a compensation circuit, wherein the crystal and the oscillation chip are positioned in the packaging part, the oscillation chip is electrically connected with the crystal to form the crystal oscillator, a temperature sensing part is integrated on the oscillation chip, and the compensation circuit is positioned outside the packaging part; the temperature compensation method uses the temperature compensated crystal oscillator described above. The crystal and the oscillation chip are arranged in a close manner and are packaged in the packaging piece, the temperature sensing piece can accurately sense the temperature of the crystal, the compensation circuit can receive the temperature of the crystal and carry out accurate frequency compensation on the oscillation chip, and the precision of temperature compensation is improved.
Description
Technical Field
The invention relates to the technical field of crystal oscillators, in particular to a temperature compensation crystal oscillator and a temperature compensation method.
Background
The temperature compensated crystal oscillator includes an analog temperature compensated crystal oscillator and a digital temperature compensated crystal oscillator. The temperature compensation crystal oscillator circuit comprises an oscillating circuit and a compensating circuit, wherein the oscillating circuit and a crystal form a crystal oscillator together, the compensating circuit can provide accurate compensating voltage, and the compensating voltage changes the crystal load capacitance of the oscillating circuit, so that the current output frequency of the crystal oscillator is changed, and the output frequency is controlled within a small error when the temperature changes.
The digital temperature compensation crystal oscillator of the prior art integrates an MCU (micro controller Unit), an oscillation circuit and a temperature sensor, and the crystal is packaged separately. The MCU, the oscillating circuit and the temperature sensor are integrated together, and the temperature sensed by the temperature sensor is higher than the ambient temperature due to the characteristics of large power consumption, small volume and poor heat dissipation of the MCU; and the crystal is packaged independently, the difference between the temperature and the ambient temperature is not large, and further the temperature of the crystal and the induction temperature of the temperature sensor are not synchronous, and finally the compensation precision of the compensation circuit is poor.
Based on the above situation, it is desired to design a temperature compensated crystal oscillator to solve the above problems.
Disclosure of Invention
One object of the present invention is: the utility model provides a temperature compensation crystal oscillator can improve the accuracy of the actual temperature of the crystal that temperature-sensing spare sensed, and then improves the temperature compensation precision.
Another object of the invention is: a temperature compensation method is provided for improving the temperature compensation precision by using the temperature compensation crystal oscillator.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a temperature compensated crystal oscillator is disclosed, comprising:
a package;
a crystal located within the package;
the oscillating chip is positioned in the packaging piece and electrically connected with the crystal, and a temperature sensing piece is integrated on the oscillating chip and used for sensing the temperature of the crystal;
and the compensation circuit is positioned outside the packaging piece and can receive the temperature sensed by the temperature sensing piece and carry out frequency compensation on the oscillating chip.
Preferably, the temperature compensated crystal oscillator further includes a PCB (Printed Circuit Board), and the oscillation chip is electrically connected to the PCB.
Preferably, the package includes a base mounted on the PCB and a cover closing an opening of the base.
Preferably, the base is a ceramic base.
Preferably, the compensation circuit is electrically connected to the PCB.
As a preferred scheme, the compensation circuit comprises an MCU and a memory, the MCU is in communication connection with the memory, the input end of the MCU is electrically connected with the temperature sensing part, and the output end of the MCU is electrically connected with the oscillation chip.
Preferably, the compensation circuit further includes an ADC (Analog To Digital Converter) and a DAC (Digital To Analog Converter), an input end of the MCU is electrically connected To the temperature sensor through the ADC, and an output end of the MCU is electrically connected To the oscillation chip through the DAC.
Preferably, the temperature sensing element is configured as an analog temperature sensor that senses the temperature of the crystal through a thermal coupling.
Preferably, an oscillation circuit is further integrated on the oscillation chip, and the oscillation chip is electrically connected with the crystal through the oscillation circuit.
In another aspect, a temperature compensation method is also disclosed for using the above temperature compensated crystal oscillator, comprising:
the temperature sensing piece senses the temperature of the crystal;
the compensation circuit receives the temperature sensed by the temperature sensing element, and the compensation circuit calculates the value of the compensation voltage according to the temperature sensed by the temperature sensing element;
and the compensation circuit outputs the compensation voltage of the value to the oscillation chip.
The invention has the beneficial effects that: the crystal and the oscillation chip are packaged in the packaging part, the compensation circuit is positioned outside the packaging part, the oscillation chip and the crystal are electrically connected to form the crystal oscillator, the oscillation chip is integrated with the temperature sensing part, the compensation circuit does not influence the sensing temperature of the temperature sensing part, the oscillation chip and the crystal are arranged closely, the temperature sensing part can accurately sense the temperature of the crystal, and the compensation circuit can receive the temperature of the crystal and carry out accurate frequency compensation on the oscillation chip; and a temperature compensation method using the temperature compensation crystal oscillator is also provided, so that the accuracy of temperature compensation is improved.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
FIG. 1 is an exploded view of an embodiment of a temperature compensated crystal oscillator;
FIG. 2 is a schematic diagram of a temperature compensated crystal oscillator according to an embodiment;
FIG. 3 is a flowchart illustrating a temperature compensation method according to an embodiment.
In fig. 1 to 3:
1. a package; 11. a base; 12. a cover plate;
2. a crystal;
3. oscillating the chip;
4. a compensation circuit; 41. MCU;
5、PCB。
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The first embodiment is as follows:
as shown in fig. 1 and 2, the present embodiment provides a temperature compensated crystal oscillator, including a package 1, a crystal 2, an oscillation chip 3, and a compensation circuit 4, the crystal 2 being located in the package 1; the oscillation chip 3 is positioned in the packaging part 1, the oscillation chip 3 is electrically connected with the crystal 2, and a temperature sensing part is integrated on the oscillation chip 3 and used for sensing the temperature of the crystal 2; the compensation circuit 4 is located outside the package 1, and the compensation circuit 4 can receive the temperature sensed by the temperature sensing element and perform frequency compensation on the oscillation chip 3. In this embodiment, the oscillation chip 3 and the crystal 2 are electrically connected to form a crystal oscillator, a temperature sensor is integrally disposed on the oscillation chip 3, the oscillation chip 3 and the crystal 2 are both packaged in the package 1, the compensation circuit 4 is disposed outside the package 1, and one end of the compensation circuit 4 is electrically connected to the temperature sensor and the other end is electrically connected to the oscillation chip 3. When the compensation circuit 4 performs temperature compensation, the temperature sensing element in the package 1 senses the temperature of the crystal 2 in the package 1, the compensation circuit 4 outside the package 1 receives the temperature of the crystal 2 and calculates the value of the compensation voltage, and then the compensation circuit 4 outputs the compensation voltage of the value to the oscillation chip 3, so that the output frequency of the oscillation chip 3 is stable. Because crystal 2 and temperature-sensing piece all are located packaging part 1, press close to the setting, and compensating circuit 4 is located outside packaging part 1 moreover, and compensating circuit 4's work can not influence crystal 2's actual temperature and temperature-sensing piece's induced temperature, and then accurate crystal temperature can be sensed to temperature-sensing piece, has finally improved compensating circuit 4's temperature compensation precision.
In the present embodiment, the temperature compensated crystal oscillator further includes a PCB5, the oscillation chip 3 is electrically connected to the PCB5, and the compensation circuit 4 is electrically connected to the PCB 5. The PCB5 facilitates wiring of the oscillation chip 3 and the compensation circuit 4, realizes miniaturization, and can provide a stable power supply for the oscillation chip 3 and the compensation circuit 4.
The package 1 includes a base 11 and a cover 12, the base 11 being mounted on the PCB5, the cover 12 closing an opening of the base 11. The base 11 is a ceramic base, the ceramic base is installed on the PCB5 to form a packaging space, the oscillation chip 3 and the crystal 2 are located in the packaging space, the oscillation chip 3 and the crystal 2 are packaged, and the cover plate 12 seals an opening of the packaging space. In other embodiments of the present invention, the base 11 may also be a metal base, which is not described herein.
In this embodiment, the compensation circuit 4 includes an MCU41 and a memory, the MCU41 is in communication connection with the memory, an input terminal of the MCU41 is electrically connected to the temperature sensing element, and an output terminal of the MCU41 is electrically connected to the oscillation chip 3. After the MCU41 receives the temperature of the crystal 2, the memory is used to calculate the corresponding compensation voltage value by looking up the table, and then the compensation voltage is outputted to the oscillation chip 3, so that the output frequency of the oscillation chip 3 is stable.
In this embodiment, the compensation circuit 4 further includes an ADC and a DAC, an input terminal of the MCU41 is electrically connected to the temperature sensing element through the ADC, and an output terminal of the MCU41 is electrically connected to the oscillation chip 3 through the DAC. The temperature-sensing piece sets up to simulation temperature sensor, after simulation temperature sensor inducted the temperature of crystal 2 through the thermal coupling, ADC converted analog signal into digital signal and sent to MCU41, MCU41 reachs the numerical value of offset voltage and output offset voltage's digital signal through looking up the table, DAC converted offset voltage into analog signal and sent to oscillation chip 3 to adjust crystal load capacitance. In other embodiments of the present invention, the temperature sensing element can also be configured as a digital temperature sensor, and in this case, the compensation circuit 4 does not need to be configured with an ADC, and can also achieve the same function.
In this embodiment, an oscillation circuit is further integrated on the oscillation chip 3, and the oscillation chip 3 is electrically connected to the crystal 2 through the oscillation circuit. The oscillating circuit and the crystal 2 are electrically connected to form a crystal oscillator, and the compensation circuit 4 can reduce the influence of the temperature change of the crystal 2 on the output frequency of the crystal oscillator, so that the output frequency of the oscillating circuit is kept stable.
Example two:
as shown in fig. 3, the present embodiment provides a temperature compensation method for using the temperature compensated crystal oscillator according to the first embodiment, which includes the following steps:
and S100, sensing the temperature of the crystal by a temperature sensing element.
An analog temperature sensor on the oscillation chip 3 senses the crystal temperature, and the ADC converts an analog signal of the crystal temperature into a digital signal and sends the digital signal to the MCU41 of the compensation circuit 4.
S200, the compensation circuit 4 receives the temperature sensed by the temperature sensing element, and the compensation circuit 4 calculates the value of the compensation voltage according to the temperature sensed by the temperature sensing element.
The MCU41 receives the crystal temperature and then uses the memory to look up the value of the compensation voltage by looking up the table.
And S300, outputting the compensation voltage of the value to the oscillation chip 3 by the compensation circuit 4.
The MCU41 outputs a digital signal of the compensation voltage, the DAC converts the digital signal into an analog signal of the compensation voltage and sends the analog signal to the oscillation chip 3, and the crystal load capacitance is adjusted through voltage control temperature, so that the output frequency of the crystal oscillator is compensated.
In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A temperature compensated crystal oscillator, comprising:
a package (1);
a crystal (2) located within the package (1);
the oscillating chip (3) is positioned in the packaging piece (1), the oscillating chip (3) is electrically connected with the crystal (2), and a temperature sensing piece is integrated on the oscillating chip (3) and used for sensing the temperature of the crystal (2);
and the compensation circuit (4) is positioned outside the packaging piece (1), and the compensation circuit (4) can receive the temperature sensed by the temperature sensing piece and carry out frequency compensation on the oscillating chip (3).
2. The temperature compensated crystal oscillator of claim 1, further comprising a PCB (5), the oscillator chip (3) being electrically connected to the PCB (5).
3. The temperature compensated crystal oscillator of claim 2, wherein the package (1) comprises a base (11) and a cover plate (12), the base (11) being mounted on the PCB (5), the cover plate (12) closing an opening of the base (11).
4. A temperature compensated crystal oscillator according to claim 3, wherein the base (11) is provided as a ceramic base.
5. The temperature compensated crystal oscillator of claim 2, wherein the compensation circuit (4) is electrically connected on the PCB (5).
6. The temperature compensated crystal oscillator of claim 1, wherein the compensation circuit (4) comprises an MCU (41) and a memory, the MCU (41) and the memory are communicatively connected, an input of the MCU (41) is electrically connected to the temperature sensing element, and an output of the MCU (41) is electrically connected to the oscillation chip (3).
7. The temperature compensated crystal oscillator of claim 6, wherein the compensation circuit (4) further comprises an ADC and a DAC, the input of the MCU (41) is electrically connected to the temperature sensing member through the ADC, and the output of the MCU (41) is electrically connected to the oscillation chip (3) through the DAC.
8. The temperature compensated crystal oscillator of claim 7, wherein the temperature sensing member is an analog temperature sensor that senses the temperature of the crystal (2) by thermal coupling.
9. The temperature-compensated crystal oscillator of claim 1, wherein an oscillating circuit is further integrated on the oscillating chip (3), and the oscillating chip (3) is electrically connected with the crystal (2) through the oscillating circuit.
10. A temperature compensation method for using the temperature compensated crystal oscillator of any of claims 1-9, comprising:
the temperature sensing piece senses the temperature of the crystal;
the compensation circuit (4) receives the temperature sensed by the temperature sensing element, and the compensation circuit (4) calculates the value of the compensation voltage according to the temperature sensed by the temperature sensing element;
the compensation circuit (4) outputs the compensation voltage of the value to the oscillation chip (3).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011611665.8A CN112671341A (en) | 2020-12-30 | 2020-12-30 | Temperature compensation crystal oscillator and temperature compensation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011611665.8A CN112671341A (en) | 2020-12-30 | 2020-12-30 | Temperature compensation crystal oscillator and temperature compensation method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691494A (en) * | 2004-04-21 | 2005-11-02 | 台湾晶技股份有限公司 | Oscillator packaging structure and element mounting method thereof |
| CN1855710A (en) * | 2005-04-21 | 2006-11-01 | 三星电机株式会社 | Temperature compensation oscillator and method of manufacturing same |
| CN102857196A (en) * | 2011-06-29 | 2013-01-02 | 中兴通讯股份有限公司 | Method and system of dynamic compensation crystal frequency deviation |
| CN103444075A (en) * | 2011-02-14 | 2013-12-11 | 高通股份有限公司 | Wireless chipset with a non-temperature compensated crystal reference |
| CN107453751A (en) * | 2016-05-13 | 2017-12-08 | 日本电波工业株式会社 | The manufacture method of crystal oscillator and crystal oscillator |
| CN111614339A (en) * | 2019-02-22 | 2020-09-01 | 精工爱普生株式会社 | Oscillator, electronic apparatus, and moving object |
-
2020
- 2020-12-30 CN CN202011611665.8A patent/CN112671341A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691494A (en) * | 2004-04-21 | 2005-11-02 | 台湾晶技股份有限公司 | Oscillator packaging structure and element mounting method thereof |
| CN1855710A (en) * | 2005-04-21 | 2006-11-01 | 三星电机株式会社 | Temperature compensation oscillator and method of manufacturing same |
| CN103444075A (en) * | 2011-02-14 | 2013-12-11 | 高通股份有限公司 | Wireless chipset with a non-temperature compensated crystal reference |
| CN102857196A (en) * | 2011-06-29 | 2013-01-02 | 中兴通讯股份有限公司 | Method and system of dynamic compensation crystal frequency deviation |
| CN107453751A (en) * | 2016-05-13 | 2017-12-08 | 日本电波工业株式会社 | The manufacture method of crystal oscillator and crystal oscillator |
| CN111614339A (en) * | 2019-02-22 | 2020-09-01 | 精工爱普生株式会社 | Oscillator, electronic apparatus, and moving object |
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Address after: 523000 Room 401 and 402, building 5, No. 24, industrial East Road, Songshanhu Park, Dongguan City, Guangdong Province Applicant after: Guangdong daguangxin Technology Co.,Ltd. Address before: 523808 the first, second and third floors of building 16, small and medium-sized science and technology enterprise Pioneer Park, North Industrial City, Songshanhu high tech Industrial Development Zone, Dongguan City, Guangdong Province Applicant before: Guangdong Dapu Telecom Technology Co.,Ltd. |