CN1677699A - Organic adhesive light-emitting element with ohm method lug - Google Patents
Organic adhesive light-emitting element with ohm method lug Download PDFInfo
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- CN1677699A CN1677699A CN 200410033262 CN200410033262A CN1677699A CN 1677699 A CN1677699 A CN 1677699A CN 200410033262 CN200410033262 CN 200410033262 CN 200410033262 A CN200410033262 A CN 200410033262A CN 1677699 A CN1677699 A CN 1677699A
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- Prior art keywords
- ohmic metal
- metal projection
- organic adhesive
- ohmic
- projection
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- 239000000853 adhesive Substances 0.000 title claims description 42
- 230000001070 adhesive effect Effects 0.000 title claims description 42
- 238000000034 method Methods 0.000 title abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 177
- 229910052751 metal Inorganic materials 0.000 claims abstract description 177
- 239000000463 material Substances 0.000 claims abstract description 130
- 238000003475 lamination Methods 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 79
- 239000012790 adhesive layer Substances 0.000 claims description 42
- 239000000470 constituent Substances 0.000 claims description 42
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 229910020658 PbSn Inorganic materials 0.000 claims description 15
- 101150071746 Pbsn gene Proteins 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 229910052738 indium Inorganic materials 0.000 claims description 15
- 229910052763 palladium Inorganic materials 0.000 claims description 15
- 229910052697 platinum Inorganic materials 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- 229910052725 zinc Inorganic materials 0.000 claims description 15
- 239000011701 zinc Substances 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 10
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 10
- 229910052804 chromium Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 9
- 229910002704 AlGaN Inorganic materials 0.000 claims description 8
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- ANVRDUDUNKHRMI-UHFFFAOYSA-N C1CCC1.[F] Chemical compound C1CCC1.[F] ANVRDUDUNKHRMI-UHFFFAOYSA-N 0.000 claims description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
- CSBHIHQQSASAFO-UHFFFAOYSA-N [Cd].[Sn] Chemical compound [Cd].[Sn] CSBHIHQQSASAFO-UHFFFAOYSA-N 0.000 claims description 4
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 4
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 229910052732 germanium Inorganic materials 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011156 metal matrix composite Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The luminous element comprises a conducting base plate, a luminous lamination, a metal layer formed on the conducting base plate, a reflecting layer formed on the luminous lamination and an organic bonding layer of ohmic metal lug. The organic bonding layer of ohmic metal lug includes an ohmic metal lug and a binding material around periphery of the ohmic metal lug. The binding material binds the metal layer and the reflecting layer. The ohmic metal lug forms ohmic contact with the metal layer and the reflecting layer. The disclosed structure simplifies technique for fabricating LED.
Description
Technical field
The present invention relates to a kind of light-emitting diode, particularly relate to a kind of organic adhesive light-emitting component with ohmic metal projection.
Background technology
The application of light-emitting diode is rather extensive, for example, can be applicable to optical display, traffic sign, data memory device, communication device, lighting device and medical treatment device.In this skill, the brightness of one of technical staff's important topic for how improving light-emitting diode at present, how another important topic is for reducing the manufacturing cost of light-emitting diode.
Disclose a kind of light-emitting diode and method for making thereof No. 474094 in the Taiwan patent announcement, utilize a transparent insulation adhesive linkage, a light-emitting diode lamination and a transparency carrier are bonded together.Because adhesive linkage is non-conductive, so this Prior Art method is only applicable to the light-emitting diode that two electrodes are positioned at the same side, can't be applied to the light-emitting diode that electrode is positioned at the light-emitting diode upper and lower surface.Because two electrodes need be positioned at the same side, so must add etched step in the manufacturing process again, the light-emitting diode lamination of part is removed that waste material not only increases the complexity of manufacturing process simultaneously.
Summary of the invention
When how the present application people solves aforesaid shortcoming in thinking, obtain an invention inspiration, think if mat uses the organic adhesive layer of an ohmic metal projection to link a luminous lamination and an electrically-conductive backing plate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection and is distributed in this ohmic metal projection binding material on every side, by this binding material bond this electrically-conductive backing plate and this luminous lamination, this ohmic metal projection forms ohmic contact with this electrically-conductive backing plate and this luminous lamination respectively, so, it is non-conductive to solve aforesaid adhesive linkage, can't be applied to the problem of the light-emitting diode of vertical stratification, do not need in the fabrication schedule simultaneously to form electrode through etching step, simplified manufacturing technique reduces manufacturing cost.
Main purpose of the present invention is to provide the light-emitting diode with ohmic metal projection organic adhesive layer, it utilizes an ohmic metal projection organic adhesive layer to link an electrically-conductive backing plate and a luminous lamination, in its manufacturing process, mat uses an ohmic metal projection organic adhesive layer, links a luminous lamination and an electrically-conductive backing plate; In addition,, therefore form ohmic contact with this electrically-conductive backing plate and this luminous lamination respectively, make that electric current can conducting by this ohmic metal projection owing in this ohmic metal projection organic adhesive layer an ohmic metal projection is arranged.Because this method for making does not have the problem of aforementioned Prior Art, thereby can reach simplified manufacturing technique, the purpose that reduces cost.
Have the organic adhesive light-emitting component of ohmic metal projection according to one embodiment of the present invention, comprise an electrically-conductive backing plate; One luminous lamination; One metal level is formed on this electrically-conductive backing plate; One reflector is formed on this luminous lamination; An and ohmic metal projection organic adhesive layer, wherein this ohmic metal layer comprises an ohmic metal projection and is distributed in this ohmic metal projection binding material on every side, with this binding material bond this metal level and this reflector, form ohmic contact with this metal level and this reflector respectively with this ohmic metal projection.
Aforementioned electrically-conductive backing plate comprises at least a material or other the replaceable material that are selected from GaP, GaAsP, AlGaAs, Si, SiC and the Ge institute constituent material cohort; Aforementioned binding material comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) or mistake fluorine cyclobutane (PFCB) the institute constituent material cohort; The aforementioned metal projection comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn or the AuZn institute constituent material cohort; Aforesaid reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn, AuZn or the tin indium oxide institute constituent material cohort; Aforesaid metal level comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn or the AuZn institute constituent material cohort; Aforementioned luminous lamination comprises at least a material that is selected from AlGaInP, GaN, InGaN and the AlInGaN institute constituent material cohort.
Description of drawings
Fig. 1 is a schematic diagram, shows a kind of light-emitting diode with ohmic metal projection organic adhesive layer according to one embodiment of the present invention;
Fig. 2 is a schematic diagram, shows a kind of light-emitting diode with ohmic metal projection organic adhesive layer according to another preferred embodiment of the present invention;
Fig. 3 is a schematic diagram, shows a kind of light-emitting diode with ohmic metal projection organic adhesive layer according to the another preferred embodiment of the present invention.
The simple symbol explanation
1 light-emitting diode
10 electrically-conductive backing plates
11 metal levels
12 ohmic metal projection organic adhesive layers
121 ohmic metal projections
122 binding materials
13 reflector
14 transparency conducting layers
15 first contact layers
16 first bond courses
17 luminescent layers
18 second bond courses
19 second contact layers
20 first electrodes
21 second electrodes
2 light-emitting diodes
210 electrically-conductive backing plates
211 ohmic metal projection organic adhesive layers
2111 ohmic metal projections
2112 binding materials
212 reflector
213 transparency conducting layers
214 first contact layers
215 first bond courses
216 luminescent layers
217 second bond courses
218 second contact layers
220 first electrodes
221 second electrodes
3 light-emitting diodes
310 metal substrates
311 ohmic metal projection organic adhesive layers
3111 ohmic metal projections
3112 binding materials
312 reflector
313 transparency conducting layers
314 first contact layers
315 first bond courses
316 luminescent layers
317 second bond courses
318 second contact layers
319 electrodes
Embodiment
See also Fig. 1, the organic adhesive light-emitting component 1 that has the ohmic metal projection according to one embodiment of the present invention, comprise one first electrode 20, be formed at the electrically-conductive backing plate 10 on this first electrode, be formed at the metal level 11 on this electrically-conductive backing plate, be formed at the ohmic metal projection organic adhesive layer 12 on this metal level, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection 121 and is distributed in this ohmic metal projection binding material 122 on every side, this binding material and part metals layer are bonding, this ohmic metal projection and another partly metal level form ohmic contact, be formed at the reflector 13 on this ohmic metal projection organic adhesive layer, wherein this binding material and partially reflecting layer are bonding, and this ohmic metal projection and another partly reflector form ohmic contact, be formed at the transparency conducting layer 14 on this reflector, be formed at one first contact layer 15 on this transparency conducting layer, be formed at one first bond course 16 on this first contact layer, be formed at the luminescent layer 17 on this first bond course, be formed at one second bond course 18 on this luminescent layer, be formed at one second contact layer 19 on this second bond course, and be formed at one second electrode 21 on this second contact layer.The function in above-mentioned reflector is improving brightness, and is therefore also removable, can't influence enforcement of the present invention.If remove above-mentioned reflector, then above-mentioned metal level also can a metallic reflector substitute as function of reflecting.
See also Fig. 2, the light-emitting diode 2 that has ohmic metal projection organic adhesive layer according to one embodiment of the present invention, comprise one first electrode 220, be formed at the electrically-conductive backing plate 210 on this first electrode, be formed at the ohmic metal projection organic adhesive layer 211 on this electrically-conductive backing plate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection 2111 and is distributed in this ohmic metal projection binding material 2112 on every side, this binding material and partially conductive are bonding, this ohmic metal projection and another partly electrically-conductive backing plate form ohmic contact, be formed at the reflector 212 on this ohmic metal projection organic adhesive layer, wherein this binding material and partially reflecting layer are bonding, and this ohmic metal projection and another partly reflector form ohmic contact, be formed at the transparency conducting layer 213 on this reflector, be formed at one first contact layer 214 on this transparency conducting layer and be formed at one first bond course 215 on this first contact layer, be formed at the luminescent layer 216 on this first bond course, be formed at one second bond course 217 on this luminescent layer, be formed at one second contact layer 218 on this second bond course, and be formed at one second electrode 221 on this second contact layer.Above-mentioned reflector can replace it by a metal level, and forms ohmic contact with this ohmic metal projection
See also Fig. 3, the light-emitting diode 3 that has ohmic metal projection organic adhesive layer according to one embodiment of the present invention, comprise a metal substrate 310, be formed at the ohmic metal projection organic adhesive layer 311 on this metal substrate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection 3111 and is distributed in this ohmic metal projection binding material 3112 on every side, this binding material and part metals substrate are bonding, this ohmic metal projection and another partly metal substrate form ohmic contact, be formed at the reflector 312 on this ohmic metal projection organic adhesive layer, wherein this binding material and partially reflecting layer are bonding, and this ohmic metal projection and another partly reflector form ohmic contact, be formed at the transparency conducting layer 313 on this reflector, be formed at one first contact layer 314 on this transparency conducting layer, be formed at one first bond course 315 on this first contact layer, be formed at the luminescent layer 316 on this first bond course, be formed at one second bond course 317 on this luminescent layer, be formed at one second contact layer 318 on this second bond course, and be formed at a electrode 319 on this second contact layer.
Aforementioned electrically-conductive backing plate comprises at least a material or other the replaceable material that are selected from GaP, GaAsP, AlGaAs, Si, SiC and the Ge institute constituent material cohort; The aforementioned metal substrate, comprise and be selected from Cu, Al, Mo and metal-matrix composite (Metal Matrix Composites, MMC) at least a material or other the replaceable material in the carrier institute constituent material cohort, wherein this metal-matrix composite carrier has in the carrier of hole in one and is filled into suitable metal matrix, but the heat that makes this metal-matrix composite carrier have modulation passes coefficient or thermal coefficient of expansion feature.Aforementioned binding material comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) and mistake fluorine cyclobutane (PFCB) the institute constituent material cohort; The aforementioned metal projection comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort; Aforesaid reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn, AuZn and the tin indium oxide institute constituent material cohort; Aforesaid metal level comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn and the AuZn institute constituent material cohort; Aforesaid metallic reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn and the AuZn institute constituent material cohort; Aforesaid transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide and the zinc-tin oxide institute constituent material cohort; Aforementioned first bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlInGaN institute constituent material cohort; Aforementioned light emission layer comprises at least a material that is selected from AlGaInP, GaN, InGaN and the AlInGaN institute constituent material cohort; Aforementioned second bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlInGaN institute constituent material cohort; Aforementioned second contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort; Aforementioned first contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.
Claims (34)
1, a kind of organic adhesive light-emitting component with ohmic metal projection comprises at least:
One electrically-conductive backing plate;
Be formed at the ohmic metal projection organic adhesive layer on this electrically-conductive backing plate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection, and be distributed in a binding material around this ohmic metal projection, this binding material and a part of electrically-conductive backing plate are bonding, and this ohmic metal projection and another partly electrically-conductive backing plate form ohmic contact; And
Be formed at the luminous lamination on this ohmic metal projection organic adhesive layer, wherein this binding material and a part of luminous lamination are bonding, and this ohmic metal projection and another partly luminous lamination form ohmic contact.
2, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 1, wherein, also be included in and form a metal level between this electrically-conductive backing plate and this ohmic metal projection organic adhesive layer, this metal level forms ohmic contact with this ohmic metal projection respectively, and is bonding with this binding material.
3, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 1 wherein, also is included in and forms a reflector between this ohmic metal projection organic adhesive layer and this luminous lamination.
4, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 2, wherein, this metal level also can replace it by a metallic reflector.
5, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 1, wherein, this electrically-conductive backing plate comprises at least a material or other the replaceable material that are selected from GaP, GaAsP, AlGaAs, Si, Ge and the SiC institute constituent material cohort.
6, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 1, wherein, this metal coupling comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort.
7, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 1, wherein, this binding material comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) and mistake fluorine cyclobutane (PFCB) the institute constituent material cohort.
8, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 2, wherein, this metal level comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn and the AuZn institute constituent material cohort.
9, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 3, wherein, this reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn, AuZn and the tin indium oxide institute constituent material cohort.
10, a kind of organic adhesive light-emitting component with ohmic metal projection comprises at least:
One metal substrate;
Be formed at the ohmic metal projection organic adhesive layer on this metal substrate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection, and be distributed in a binding material around this ohmic metal projection, this binding material and a part of metal substrate are bonding, and this ohmic metal projection and another partly metal substrate form ohmic contact; And
Be formed at the luminous lamination on this ohmic metal projection organic adhesive layer, wherein this binding material and a part of luminous lamination are bonding, and this ohmic metal projection and another partly luminous lamination form ohmic contact.
11, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 10 wherein, also is included in and forms a reflector between this ohmic metal projection organic adhesive layer and this luminous lamination.
12, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 10, wherein, this metal substrate comprises at least a material or other the replaceable material that are selected from Cu, Al, Mo and the MMC carrier institute constituent material cohort.
13, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 10, wherein, this metal coupling comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort.
14, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 10, wherein, this binding material comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) and mistake fluorine cyclobutane (PFCB) the institute constituent material cohort.
15, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 11, wherein, this reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn, AuZn and the tin indium oxide institute constituent material cohort.
16, a kind of organic adhesive light-emitting component with ohmic metal projection comprises at least:
One first electrode
Be formed at the electrically-conductive backing plate on this first electrode;
Be formed at the metal level on this electrically-conductive backing plate;
Be formed at the ohmic metal projection organic adhesive layer on this metal level, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection, and be distributed in a binding material around this ohmic metal projection, this binding material and a part of metal level are bonding, and this ohmic metal projection and another partly metal level form ohmic contact;
Be formed at the reflector on this ohmic metal projection organic adhesive layer, wherein this binding material and a part of reflector are bonding, and this ohmic metal projection and another partly reflector form ohmic contact;
Be formed at the transparency conducting layer on this reflector;
Be formed at one first contact layer on this transparency conducting layer
Be formed at one first bond course on this first contact layer;
Be formed at the luminescent layer on this first bond course;
Be formed at one second bond course on this luminescent layer;
Be formed at one second contact layer on this second bond course; And
Be formed at one second electrode on this second contact layer.
17, a kind of organic adhesive light-emitting component with ohmic metal projection comprises at least:
One first electrode
Be formed at the electrically-conductive backing plate on this first electrode;
Be formed at the ohmic metal projection organic adhesive layer on this electrically-conductive backing plate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection, and be distributed in a binding material around this ohmic metal projection, this binding material and a part of electrically-conductive backing plate are bonding, and this ohmic metal projection and another partly electrically-conductive backing plate form ohmic contact;
Be formed at the reflector on this ohmic metal projection organic adhesive layer, wherein this binding material and a part of metallic reflector are bonding, and this ohmic metal projection and another partly metallic reflector form ohmic contact;
Be formed at the transparency conducting layer on this reflector;
Be formed at one first contact layer on this transparency conducting layer;
Be formed at one first bond course on this first contact layer;
Be formed at the luminescent layer on this first bond course;
Be formed at one second bond course on this luminescent layer;
Be formed at one second contact layer on this second bond course; And
Be formed at one second electrode on this second contact layer.
18, a kind of organic adhesive light-emitting component with ohmic metal projection comprises at least:
One metal substrate;
Be formed at the ohmic metal projection organic adhesive layer on this metal substrate, wherein this ohmic metal projection organic adhesive layer comprises an ohmic metal projection, and be distributed in a binding material around this ohmic metal projection, this binding material and a part of metal substrate are bonding, and this ohmic metal projection and another partly metal substrate form ohmic contact;
Be formed at the reflector on this ohmic metal projection organic adhesive layer, wherein this binding material and a part of reflector are bonding, and this ohmic metal projection and another partly reflector form ohmic contact;
Be formed at the transparency conducting layer on this reflector;
Be formed at one first contact layer on this transparency conducting layer;
Be formed at one first bond course on this first contact layer;
Be formed at the luminescent layer on this first bond course;
Be formed at one second bond course on this luminescent layer;
Be formed at one second contact layer on this second bond course; And
Be formed at one first electrode on this second contact layer.
19, as claim 16 or 17 described organic adhesive light-emitting components with ohmic metal projection, wherein, this electrically-conductive backing plate comprises at least a material or other the replaceable material that are selected from GaP, GaAsP, AlGaAs, Si, Ge and the SiC institute constituent material cohort.
20, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 18, wherein, this metal substrate comprises at least a material or other the replaceable material that are selected from Cu, Al, Mo and the MMC carrier institute constituent material cohort.
21, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this metal coupling comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn and the AuZn institute constituent material cohort.
22, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this binding material comprises at least a material that is selected from polyimides (PI), benzocyclobutane (BCB) and mistake fluorine cyclobutane (PFCB) the institute constituent material cohort.
23, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 16, wherein, this metal level comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn and the AuZn institute constituent material cohort.
24, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this reflector comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, Cr, PbSn, AuZn and the tin indium oxide institute constituent material cohort.
25, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide, zinc-tin oxide, Be/Au, Ge/Au and the Ni/Au institute constituent material cohort.
26, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this first contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort.
27, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this first bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlInGaN institute constituent material cohort.
28, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this luminescent layer comprises at least a material that is selected from AlGaInP, GaN, InGaN and the AlInGaN institute constituent material cohort.
29, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this second bond course comprises at least a material that is selected from AlGaInP, AlInP, AlN, GaN, AlGaN, InGaN and the AlInGaN institute constituent material cohort.
30, as claim 16,17 or 18 described organic adhesive light-emitting components with ohmic metal projection, wherein, this second contact layer comprises at least a material that is selected from GaP, GaAs, GaAsP, InGaP, AlGaInP, AlGaAs, GaN, InGaN and the AlGaN institute constituent material cohort.
31, as claim 16 or 17 described organic adhesive light-emitting components, wherein can be included on this second contact layer, form a transparency conducting layer under second electrode with ohmic metal projection.
32, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 18 wherein can be included on this second contact layer, forms a transparency conducting layer under first electrode.
33, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 31, wherein, this transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide, zinc-tin oxide, Be/Au, Ge/Au and the Ni/Au institute constituent material cohort.
34, the organic adhesive light-emitting component with ohmic metal projection as claimed in claim 32, wherein, this transparency conducting layer comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide, zinc-tin oxide, Be/Au, Ge/Au and the Ni/Au institute constituent material cohort.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100332624A CN100350643C (en) | 2004-03-29 | 2004-03-29 | Organic adhesive light-emitting element with ohm method lug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100332624A CN100350643C (en) | 2004-03-29 | 2004-03-29 | Organic adhesive light-emitting element with ohm method lug |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1677699A true CN1677699A (en) | 2005-10-05 |
| CN100350643C CN100350643C (en) | 2007-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100332624A Expired - Lifetime CN100350643C (en) | 2004-03-29 | 2004-03-29 | Organic adhesive light-emitting element with ohm method lug |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109873062A (en) * | 2019-01-29 | 2019-06-11 | 南昌大学 | A kind of AlGaInP red light emitting diodes device architecture with composite reflector |
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| CN103811593B (en) | 2012-11-12 | 2018-06-19 | 晶元光电股份有限公司 | The production method of semiconductor optoelectronic element |
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| JP4374720B2 (en) * | 2000-04-21 | 2009-12-02 | 昭和電工株式会社 | Group III nitride semiconductor light-emitting device and method for manufacturing the same |
| JP3854053B2 (en) * | 2000-09-29 | 2006-12-06 | 京セラ株式会社 | LED for infrared remote control |
| CN1198339C (en) * | 2002-04-04 | 2005-04-20 | 国联光电科技股份有限公司 | Structure of light-emitting diode and method for making the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873062A (en) * | 2019-01-29 | 2019-06-11 | 南昌大学 | A kind of AlGaInP red light emitting diodes device architecture with composite reflector |
| CN109873062B (en) * | 2019-01-29 | 2020-06-16 | 南昌大学 | AlGaInP red light-emitting diode device structure with composite reflector |
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| CN100350643C (en) | 2007-11-21 |
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