CN100446633C - Lighting element with composite base plate - Google Patents
Lighting element with composite base plate Download PDFInfo
- Publication number
- CN100446633C CN100446633C CNB031566707A CN03156670A CN100446633C CN 100446633 C CN100446633 C CN 100446633C CN B031566707 A CNB031566707 A CN B031566707A CN 03156670 A CN03156670 A CN 03156670A CN 100446633 C CN100446633 C CN 100446633C
- Authority
- CN
- China
- Prior art keywords
- base plate
- composite base
- light
- emitting component
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
- Led Devices (AREA)
Abstract
The present invention discloses a luminous element with a composite base board, which comprises a composite base board, wherein the composite base board comprises a high heat conducting layer and a base board surrounding the periphery of the high heat conducting layer, an adhering layer formed on the composite base board and a luminous lamination layer formed on the adhering layer. Thus, when crystal grains are cut, the metal layer can be easily cut.
Description
Technical field
The present invention is about a kind of light-emitting component, especially about a kind of light-emitting component with composite base plate.
Background technology
The application of light-emitting component is rather extensive, for example, can be applicable to optical display, laser diode, traffic sign, data memory device, communication device, lighting device and medical treatment device.
The material of traditional light-emitting component is mainly semiconductor, and the thermal conduction characteristic of this kind material is not good.When light-emitting component is switched on, because light-emitting component is luminous, can therefore produce heat, because light-emitting component is a semiconductor material, so heat conduction is not good, these heat are if can't suitably be removed, then light-emitting component will reduce luminous efficiency because of being heated, as the material of AlGaInP composition, under identical current condition operation, when the temperature in the external world was warming up to 80 ℃ by 20 ℃, brightness was with decline 20%-50%.Aforesaid problem is on undersized light-emitting component, because in the low current operation, electric current is less than 30mA～50mA, the heat of luminous generation also can be led by lamination reluctantly and remove, so problem is also not too obvious; But when occurring in large-sized light-emitting component, in high current practice, electric current is greater than 100mA～1A, then the heat that produced of this large scale light-emitting component can't in time remove, and then the temperature of light-emitting component will rise, brightness just obviously descends, and makes the luminous power of light-emitting component reduce greatly.
Disclose a kind of light-emitting diode in No. the 6287882nd, United States Patent (USP), it makes this light-emitting diode have the function of reflection and heat conduction with metallic reflection binding agent bond a luminescence unit and a metal substrate.A kind of semiconductor element with metal substrate is disclosed in No. the 151410th, Taiwan patent, it utilizes galvanoplastic that metal material is plated on the semiconductor light emitting lamination, form a metal substrate, replace biography conventional semiconductors substrate, reach the function of heat conduction with metal substrate.But above-mentioned two kinds of structures are in technology, and during back segment crystal grain (tube core) cutting, metal substrate has its degree of difficulty in cutting.
Summary of the invention
Main purpose of the present invention is to provide a kind of light-emitting component with composite base plate, utilizes a composite base plate, and wherein this composite base plate has a high heat conduction layer and the substrate around the high heat conduction layer.So, what this composite base plate possessed metal substrate provides heat energy dissipation function, to solve the problem that heat energy can't remove immediately in the light-emitting component.
Another object of the present invention is to provide a kind of light-emitting component with composite base plate, when crystal grain cuts, directly cut the substrate in this composite base plate, in the time of so can solving the crystal grain cutting, metal substrate is difficult for the problem of cutting.
The light-emitting component with composite base plate according to one preferred embodiment of the present invention comprises a composite base plate, and wherein this composite base plate is made up of a high heat conduction layer and the substrate around high heat conduction layer; With a tack coat this composite base plate and a luminous lamination are combined.
Aforesaid high heat conduction layer comprises at least a material or other the alternative materials that is selected from the material group that Cu, Al, Au, Ag, W and alloy thereof constitute; Aforesaid substrate comprises and is selected from Si, GaAs, Ge, Al
2O
3, at least a material or other alternative materials in the material group that glass, InP and GaP constituted.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise: a composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer, and this composite base plate exposes this high heat conduction layer in its first side; Be formed at the tack coat on this first side of this composite base plate; And be formed at a luminous lamination on this tack coat.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise: a composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer; Be formed at the tack coat on this composite base plate; And be formed at a luminous lamination on this tack coat, wherein, this tack coat is an electrically conducting transparent tack coat.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise: a composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer; Be formed at the tack coat on this composite base plate; And be formed at a luminous lamination on this tack coat, wherein, this tack coat is an opaque tack coat.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise: a composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer; Be formed at the tack coat on this composite base plate; And be formed at a luminous lamination on this tack coat, wherein, between this composite base plate and this tack coat, also comprise one first conversion zone.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise: a composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer; Be formed at the tack coat on this composite base plate; And be formed at a luminous lamination on this tack coat, wherein, between this tack coat and this luminous lamination, also comprise one second conversion zone.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise: a composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer; Be formed at the tack coat on this composite base plate; And be formed at a luminous lamination on this tack coat, wherein, this tack coat is a metallic reflection tack coat.
According to the present invention, a kind of light-emitting component with composite base plate is provided, comprise:
One composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer;
Be formed at the tack coat on this composite base plate; And
Be formed at the luminous lamination on this tack coat,
Wherein, between this high heat conduction layer and this substrate, also comprise a binder couse.
Description of drawings
Fig. 1 is a schematic diagram, shows a kind of light-emitting component with composite base plate according to one embodiment of the present invention;
Fig. 2 is a schematic diagram, shows a kind of light-emitting component with composite base plate according to another preferred embodiment of the present invention; And
Fig. 3 is a schematic diagram, shows a kind of light-emitting component with composite base plate according to the another preferred embodiment of the present invention.
Description of reference numerals in the accompanying drawing is as follows:
1 light-emitting component
10 composite base plates
101 high heat conduction layer 102 substrates
11 metallic reflectors, 12 transparent bonding layers
13 transparency conducting layers, 14 luminous laminations
15 first link electrodes, 16 second link electrodes
2 light-emitting components
20 composite base plates, 201 high heat conduction layers
202 substrates, 21 metallic reflectors
22 conductive, transparent tack coats, 23 transparency conducting layers
24 luminous lamination 25 link electrodes
3 light-emitting components
30 composite base plates, 301 high heat conduction layers
302 substrates, 31 metal bonding coatings
32 luminous lamination 33 link electrodes
Embodiment
When how this case inventor solves aforesaid problem in thinking, think that wherein this composite base plate is by a high heat conduction layer and around high heat conduction layer substrate on every side if utilize a composite base plate; With a tack coat this composite base plate and a luminous lamination are combined.So, what this composite base plate had metal substrate concurrently provides heat energy dissipation function, when crystal grain cut, directly cuts the substrate portion in the composite base plate simultaneously, and in the time of so can solving the crystal grain cutting, metal substrate is difficult for the difficulty of cutting.
See also Fig. 1, according to the light-emitting component with composite base plate 1 of one embodiment of the present invention 1, comprise a composite base plate 10, wherein this composite base plate comprises a high heat conduction layer 101 and the substrate 102 around the high heat conduction layer; Be formed at the metallic reflector 11 on this composite base plate; Be formed at the transparent bonding layer 12 on this metallic reflector; Be formed at the transparency conducting layer 13 on this transparent bonding layer, wherein, the upper surface of this transparency conducting layer comprises a first surface zone and a second surface zone; Be formed at the luminous lamination 14 on this first surface zone; Be formed at one first link electrode 15 on this second surface zone; And be formed at one second link electrode 16 on this luminous lamination.
In the above embodiments 1, between this metallic reflector and this transparent bonding layer, can form one first conversion zone; Between this transparent bonding layer and this transparency conducting layer, can form one second conversion zone, to improve adhesive force therebetween.
In the above embodiments 1, this metallic reflector also can be formed between transparent bonding layer and the transparency conducting layer.This transparent bonding layer can also replace by opaque tack coat in the above embodiments in addition, and this metallic reflector is formed between opaque tack coat and the transparency conducting layer simultaneously.
See also Fig. 2, according to the light-emitting component with composite base plate 2 of one embodiment of the present invention 2, comprise a composite base plate 20, wherein this composite base plate comprises a high heat conduction layer 201 and the substrate 202 around the high heat conduction layer; Be formed at the metallic reflector 21 on this composite base plate; Be formed at the conductive, transparent tack coat 22 on this metallic reflector; Be formed at the transparency conducting layer 23 on this conductive, transparent tack coat; Be formed at the luminous lamination 24 on this transparency conducting layer; And be formed at a link electrode 25 on this luminous lamination.
In the above embodiments 2, between this metallic reflector and this conductive, transparent tack coat, can form one first conversion zone; Between this conductive, transparent tack coat and this transparency conducting layer, can form one second conversion zone, to improve adhesive force therebetween.
In the above embodiments, this metallic reflector also can be formed between conductive, transparent tack coat and the transparency conducting layer.This conductive, transparent tack coat can also conduct electricity tack coat and replaces in the above embodiments in addition, and this metallic reflector is formed between conduction tack coat and the transparency conducting layer simultaneously.
See also Fig. 3, according to the light-emitting component with composite base plate 3 of the another preferred embodiment 3 of the present invention, comprise a composite base plate 30, wherein this composite base plate comprises a high heat conduction layer 301 and the substrate 302 around the high heat conduction layer; Be formed at the metal bonding coating 31 on this composite base plate; Be formed at the luminous lamination 32 on this metal bonding coating; And be formed at a link electrode 33 on this luminous lamination.
In each above-mentioned embodiment 1,2 or 3, between the high heat conduction layer of composite base plate and substrate, can form a binder couse, make that the engaging force between high heat conduction layer and substrate is stronger.
Aforementioned high heat conduction layer can exist for single or multiple high heat conduction layer kenels; The formation method of aforementioned high heat conduction layer is to comprise at least a method or other the alternative methods among plating, electroforming, electroless plating and the electric arc evaporation of being selected from; Aforementioned high heat conduction layer is to comprise at least a material that is selected from Cu, Al, Au, Ag, W and the constituent material group of alloy institute thereof; Aforementioned binder couse is to comprise to be selected from tin indium oxide, GeAu, BeAu, SiN
x, SiO
2, at least a material in Au, Cu, Ti and the Pd institute constituent material cohort; Aforesaid substrate is to comprise to be selected from Si, GaAs, Ge, Al
2O
3, at least a material in glass, InP and the constituent material group of GaP institute; Aforementioned luminous lamination is at least a material that comprises in AlGaInP, AlInGaN and the constituent material group of AlGaAs series institute; Aforementioned transparent bonding layer is to comprise at least a material that is selected from polyimides (PI), benzocyclobutene (BCB) or mistake fluorine cyclobutane (PFCB) the institute constituent material cohort; This conductive, transparent tack coat comprises and is selected from least a material in the conductive doped material institute constituent material cohort in intrinsic conduction macromolecule (Intrinsically conducting polymer) or the macromolecule, wherein, this conductive material comprises at least a material that is selected from tin indium oxide, cadmium tin, antimony tin, zinc oxide, zinc-tin oxide, Au and the Ni/Au institute constituent material cohort; Aforementioned first conversion zone is to comprise to be selected from SiN
x, at least a material in Ti or the Cr institute constituent material cohort; Aforementioned second conversion zone is to comprise to be selected from SiN
x, at least a material in Ti or the Cr institute constituent material cohort; The aforementioned metal reflector is to comprise at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn or the AuZn institute constituent material cohort; The aforementioned metal tack coat is to comprise at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu, AuBe, AuGe, Ni, PbSn or the AuZn institute constituent material cohort.
The application of light-emitting component of the present invention is rather extensive, for example, can be applicable to optical display, laser diode, traffic sign, data memory device, communication device, lighting device and medical treatment device.
Though light-emitting component of the present invention with preferred embodiment openly as above, scope of the present invention is not limited to above preferred embodiment, should be as the criterion so that claims are determined.Therefore those skilled in the art should make any change not breaking away under claim of the present invention and the spirit.
Claims (10)
1. light-emitting component with composite base plate comprises:
One composite base plate, wherein this composite base plate comprises a high heat conduction layer and the substrate around the high heat conduction layer, and this composite base plate exposes this high heat conduction layer in its first side;
Be formed at the tack coat on this first side of this composite base plate; And
Be formed at the luminous lamination on this tack coat.
2. the light-emitting component with composite base plate as claimed in claim 1, wherein, this tack coat is a transparent bonding layer.
3. the light-emitting component with composite base plate as claimed in claim 1, wherein, this tack coat is a metal bonding coating.
4. the light-emitting component with composite base plate as claimed in claim 1, wherein, this high heat conduction layer comprises at least a material that is selected from Cu, Al, Au, Ag, W and the constituent material group of alloy institute thereof.
5. the light-emitting component with composite base plate as claimed in claim 1, wherein, this substrate comprises and is selected from Si, GaAs, Ge, Al
2O
3, at least a material in glass, InP and the constituent material group of GaP institute.
6. the light-emitting component with composite base plate as claimed in claim 2, wherein, this transparent bonding layer comprises at least a material that is selected from polyimides, benzocyclobutene and the constituent material group of mistake fluorine cyclobutane institute.
7. the light-emitting component with composite base plate as claimed in claim 3, wherein, this metal bonding coating comprises at least a material that is selected from In, Sn, Al, Au, Pt, Zn, Ge, Ag, Ti, Pb, Pd, Cu and the constituent material group of alloy institute thereof.
8. the light-emitting component with composite base plate as claimed in claim 1, wherein, this luminous lamination comprises at least a material in AlGaInP, AlInGaN and the AlGaAs series institute constituent material cohort.
9. the light-emitting component with composite base plate as claimed in claim 1 wherein, exposes in second side of this composite base plate thereby this high heat conduction layer passes this composite base plate, and this second side and this first side are toward each other.
10. the light-emitting component with composite base plate as claimed in claim 2, wherein, this tack coat is a transparent non-conductive tack coat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031566707A CN100446633C (en) | 2003-09-05 | 2003-09-05 | Lighting element with composite base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031566707A CN100446633C (en) | 2003-09-05 | 2003-09-05 | Lighting element with composite base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1592513A CN1592513A (en) | 2005-03-09 |
| CN100446633C true CN100446633C (en) | 2008-12-24 |
Family
ID=34598492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031566707A Expired - Lifetime CN100446633C (en) | 2003-09-05 | 2003-09-05 | Lighting element with composite base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100446633C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9337407B2 (en) | 2009-03-31 | 2016-05-10 | Epistar Corporation | Photoelectronic element and the manufacturing method thereof |
| TWI589021B (en) * | 2011-02-07 | 2017-06-21 | 晶元光電股份有限公司 | Light-emitting element and the manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05136292A (en) * | 1991-08-07 | 1993-06-01 | Nippon Cement Co Ltd | Heat dissipating composite substrate |
| US6287882B1 (en) * | 1999-10-04 | 2001-09-11 | Visual Photonics Epitaxy Co., Ltd. | Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same |
| JP2002372647A (en) * | 2001-06-13 | 2002-12-26 | Japan Aviation Electronics Industry Ltd | Light source device |
| US20030155579A1 (en) * | 2001-04-06 | 2003-08-21 | Kuang-Neng Yang | Light emitting diode and method of making the same |
| US20030164503A1 (en) * | 2002-03-04 | 2003-09-04 | United Epitaxy Co., Ltd. | High efficiency light emitting diode and method of making the same |
-
2003
- 2003-09-05 CN CNB031566707A patent/CN100446633C/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05136292A (en) * | 1991-08-07 | 1993-06-01 | Nippon Cement Co Ltd | Heat dissipating composite substrate |
| US6287882B1 (en) * | 1999-10-04 | 2001-09-11 | Visual Photonics Epitaxy Co., Ltd. | Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same |
| US20030155579A1 (en) * | 2001-04-06 | 2003-08-21 | Kuang-Neng Yang | Light emitting diode and method of making the same |
| JP2002372647A (en) * | 2001-06-13 | 2002-12-26 | Japan Aviation Electronics Industry Ltd | Light source device |
| US20030164503A1 (en) * | 2002-03-04 | 2003-09-04 | United Epitaxy Co., Ltd. | High efficiency light emitting diode and method of making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1592513A (en) | 2005-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103872229A (en) | Light emitting element | |
| JP4648031B2 (en) | Organic adhesive light emitting device with metal bulge | |
| CN103489983A (en) | Flip-chip light emitting diode and manufacturing method and application thereof | |
| CN103811631A (en) | Chip flip type light emitting diode packaging module and manufacturing method thereof | |
| TWI577045B (en) | Light-emitting element | |
| TWI635772B (en) | Light-emitting device | |
| WO2008039573A1 (en) | Vertical led with eutectic layer | |
| CN110265517B (en) | Light-emitting element | |
| CN101488544B (en) | Light emitting element and method for manufacturing the same | |
| CN100446633C (en) | Lighting element with composite base plate | |
| CN100350642C (en) | Organic bonding luminous assembly with verticals tructure | |
| CN103165782A (en) | Flip-chip light emitting diode and manufacturing method and application thereof | |
| TWI220577B (en) | Light emitting device having composite substrate | |
| CN103165783A (en) | Flip-chip light emitting diode and manufacturing method and application thereof | |
| CN100461470C (en) | Semiconductor light emitting device and production thereof | |
| CN1266779C (en) | Light-emitting diode with adhered reflecting layer and its making method | |
| CN104576870B (en) | Light-emitting component | |
| CN100359706C (en) | Organic bonding luminous assembly with ohmic metal contact | |
| CN102610726A (en) | Light-emitting assembly | |
| CN101488541A (en) | Semiconductor light-emitting apparatus and manufacturing method thereof | |
| CN101752466A (en) | Light-emitting component | |
| CN100350643C (en) | Organic adhesive light-emitting element with ohm method lug | |
| CN100433377C (en) | Nitride lighting element with sticking reflecting layer | |
| TWI605615B (en) | Light-emitting element | |
| CN1652358A (en) | Light emitting element with metal base composite material carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081224 |
|
| CX01 | Expiry of patent term |