CN1674262A - Image sensing device and encapsulating method thereof - Google Patents
Image sensing device and encapsulating method thereof Download PDFInfo
- Publication number
- CN1674262A CN1674262A CNA2004100085398A CN200410008539A CN1674262A CN 1674262 A CN1674262 A CN 1674262A CN A2004100085398 A CNA2004100085398 A CN A2004100085398A CN 200410008539 A CN200410008539 A CN 200410008539A CN 1674262 A CN1674262 A CN 1674262A
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- side frame
- glass plate
- conjunction
- image sensor
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
A image sensor consists of substrate with formed crystal pads, side frame around crystal pads, image sensing chip set on substrate crystal pads, glass plate for sealing sensing chip in the frame and shallow slot for adjusting amount of adhesive. Its packaging method includes forming crystal pads on substrate, integrating side frame, setting image sensing chip, setting glass plate and carrying out cutting to shape glass plate.
Description
Technical field
The invention belongs to image sensor and method for packing thereof, particularly a kind of image sensor and method for packing thereof.
Background technology
Optics complementary metal oxide semiconductor element (CMOS) also combines with mobile phone closely over several years gradually except being applied to digital still camera as the image sensor, and the additional function of image capture is provided for individual mobile phone.
As shown in Figure 6, commonly used image sensor for first of the optics CMOS (Complementary Metal Oxide Semiconductor) kind in the past, its assembling process is roughly as described below, at first single closed side frame 103 is positioned on the substrate 101, and use the hot pressing mode combination, substrate 101 sticks together image sensing wafer 102, via lead-in wire bonding step image sensing wafer 102 is connected to pin on the substrate 101, side frame 103 end faces being sticked together in the gummed mode has dustproof glass sheet 107 again, sticks together in dustproof glass sheet 107 lens group 104 is set again.
The shortcoming of this kind combination is: side frame 103 is positioned over substrate 10, dustproof glass sheet 107 is placed in substrate 101 and lens group 104 the work on the dustproof glass sheet 107 of being placed in is with manual work and finish, and in when an element is placed in the end face of another element, all will form the problem of left and right sides offset error, when substrate 10, side frame 103, the left and right sides offset error that dustproof glass sheet 107 and lens group 104 are finished after the combination successively can't be grasped especially, make the focusing precision of adjusting lens 105 and image sensing wafer 102 produce difficulty, make yield can't obtain control.And the coating of side frame 103 end faces is not good if the viscose amount is controlled for the glutinous viscose of establishing the dustproof sheet 107 of glass, easily produces to overflow glue or bind problems such as not firm; In the bonding process, in side frame 103 end faces and dustproof glass sheet 107 surface engagement places if there is too much viscose, then dustproof glass sheet 107 also is difficult to be maintained at level after in conjunction with lens group 104, and this kind situation also can reduce the reliability of Image Sensor encapsulation.
As shown in Figure 7, another kind is commonly used the assembly program of packaged type of image sensor also for sticking together on the single substrate 101 image sensing wafer 102 to be set with manual type, via lead-in wire bonding step image sensing wafer 102 is connected to pin on the substrate 101, structure is adorned closed side frame 103 around wafer substrate 101, and so far complete image sensing wafer 102 has encapsulated to be finished.When practical application, the folded identical as shown in Figure 6 lens group 104 of setting up on the image sensing wafer 102, its central authorities form has the central hole of internal thread, and spiral shell is provided with the lens mount 107 that forms hollow channel in the central hole, is provided with several lens 105 in lens mount 107 hollow channels; Opening 106 corresponding to image sensing wafer 102 top positions is then formed on the top of lens group 104; Be formed with on the side of lens group 104 belows with side frame 103 on convex binding block 1031 corresponding fastening holes 1041, binding block 1031 can be incorporated into lens group 104 on the side frame 103 with after fastening hole 1041 combines.
The major defect of image sensing wafer 102 encapsulation of this kind structure is that image sensing wafer 102 tops have no any barrier structure, when installing lens group 104 or adjust lens mount 107 upper and lower displacements with formation focusing, in case have any dust fall promptly directly to be attached to image sensing wafer 102 surfaces, will influence its image capture ability thus.
Very consuming time on the assembling process of above-mentioned two kinds of image sensor, be located on the substrate 101 side frame 103 is glutinous one by one with manual type, again the sheet glass 107 through cutting into suitable size is fitted on the side frame 103, finish the installing of lens group 104 at last, because of central process involves a large amount of manpower operations, not only the overall package yield can't effectively promote, and its encapsulation reliability is difficult to control especially.
Summary of the invention
The purpose of this invention is to provide a kind of assembling operation efficient height, labor intensive is few, the finished product yield is easy to control image sensor and method for packing thereof.
Image sensor package method of the present invention is included in and is processed to form several on the wafer substrate in advance for the brilliant pad of the formation step of filling up in conjunction with the image sensing wafer crystalline substance, in conjunction with the side frame step, in conjunction with the image sensing wafer step, in conjunction with glass plate step and cutting step; In conjunction with the side frame step for being incorporated on the wafer substrate that form several brilliant pads with mutual several rectangle side frame individualities connected to one another, and make each side frame individuality respectively correspondence be located on around each brilliant pad, and form shallow slot respectively in each side frame end face; In conjunction with the glass plate step is in side frame plate top applying glass plate; Cutting step is that cutting glass plate, side frame plate and substrate are to form independent image sensor.Image sensor of the present invention comprises the wafer substrate that forms brilliant pad, be located on side frame around the brilliant pad, be arranged at the image sensing wafer on the brilliant pad of substrate and be bonding on the glass plate that the side frame upper surface is sealed in image sensing wafer side frame inside whereby; The side frame upper surface forms the shallow slot of scalable viscose amount.
Wherein:
Cutting step comprises the phase I of cutting glass plate and side frame plate and substrate is cut to form the independently second stage of image sensor; Phase I is to make glass plate become with side frame unidimensional individuality such as have, and separates the side frame individuality that connects each other.
In conjunction with being coated with on the side frame plate in the glass plate step so as to binding the viscose of glass plate.
Form brilliant pad and form several substrate orientation holes and the side frame plate reference column of corresponding combination in conjunction with wafer substrate in the side frame step and side frame plate surface respectively.
Form so as to lens group location hole on the wafer substrate of side frame periphery in conjunction with lens group.
Form several brilliant pad location holes on the wafer substrate around the brilliant pad; The side frame bottom surface forms shallow slot, and in shallow slot, be convexly equipped with wafer substrate on the corresponding side frame projection of brilliant pad location hole.
Because being included in, method for packing of the present invention is processed to form several on the wafer substrate in advance for the brilliant pad of the formation of filling up, in conjunction with side frame, in conjunction with image sensing wafer, in conjunction with glass plate and cutting step in conjunction with the image sensing wafer crystalline substance; In conjunction with side frame for being incorporated on the wafer substrate that form several brilliant pads with mutual several rectangle side frame individualities connected to one another, and make each side frame individuality respectively correspondence be located on around each brilliant pad, and form shallow slot respectively in each side frame end face; In conjunction with glass plate is in side frame plate top applying glass plate; Be cut into cutting glass plate, side frame plate and substrate to form independent image sensor.Image sensor of the present invention comprises the wafer substrate that forms brilliant pad, be located on side frame around the brilliant pad, be arranged at the image sensing wafer on the brilliant pad of substrate and be bonding on the glass plate that the side frame upper surface is sealed in image sensing wafer side frame inside whereby; The side frame upper surface forms the shallow slot of scalable viscose amount.The encapsulation process of image sensor of the present invention is for utilizing the generalization assembling of side frame plate and glass plate elder generation, thereafter constitute number image sensor individuality through cutting step again, compared to commonly using earlier with the substrate cut individuation, again in the manpower mode side frame, the glass dustproof sheet is bonding on the substrate one by one, the present invention is not only promoted packaging efficiency, and encapsulation process does not have and involves a large amount of manual work, its finished product yield is easier to control, really having possessed apparent effect promotes, assembling operation efficient height not only, labor intensive is few, and the finished product yield is easy to control, thereby reaches purpose of the present invention.
Description of drawings
Fig. 1, for image sensor package method schematic diagram of the present invention.
Fig. 2, for image sensor side frame structural representation stereogram of the present invention.
Fig. 3, for image sensor package method cutaway view of the present invention.
Fig. 4, for image sensor structure schematic sectional view of the present invention.
Fig. 5, for image sensor of the present invention in conjunction with the structural representation cutaway view of lens group.
Fig. 6, be the image sensor commonly used structural representation cutaway view in conjunction with lens group.
Fig. 7, be the structural representation cutaway view of the another kind of image sensor of commonly using in conjunction with lens group.
Embodiment
As shown in Figure 1, image sensor package method of the present invention comprises the steps:
Step 1
Form brilliant pad 11
In around and middle position be provided with and be processed to form several brilliant pads 11 on the wafer substrate 10 in substrate orientation hole 12 in advance, and around crystalline substance pad 11, form several brilliant pad location hole 13 and lens group location holes 14 respectively.
Step 2
In conjunction with side frame 31
As shown in Figure 1 and Figure 2, at first form side frame plate 30 in the pressing mold mode, side frame plate 30 is provided with rib 32 mutual several rectangle side frame 31 individualities connected to one another; Substrate orientation hole 12 parts that rib 32 correspondences are formed at wafer substrate 10 are formed with side frame plate positioning convex column 33; Make each side frame 31 individuality respectively correspondence be located on around each brilliant pad 11, side frame 31 is arranged at around the brilliant pad 11; Be formed for regulating the shallow slot 311,312 that is coated on side frame 31 tops and bottom surface viscose on side frame 31 end face upper surfaces and the bottom surface, shallow slot is the ring-type shallow slot in the present embodiment, also can be the shallow slot of other form, for example, in side frame 31 tops and lower surface can form two independent relatively shallow slots.As shown in Figure 3, be convexly equipped with in side frame 31 bottom surface shallow slots 312 appropriate locations and brilliant pad location hole 13 corresponding side frame projections 34.As Fig. 1, shown in Figure 3, behind side frame plate 30 bottom surfaces coating one deck viscose, earlier the positioning convex column on the side frame plate 30 33 is combined with substrate orientation hole 12, can combine side frame projection 34 in the lump this moment with brilliant pad location hole 13, thereby whereby side frame plate 30 correspondences are incorporated on the wafer substrate 10, this moment, the shallow slot 312 of side frame 31 bottom surfaces was promptly brought into play its regulating action, unnecessary viscose enters to 10 extruding of subject wafer substrate in the shallow slot 312, thus, side frame plate 30 bottom surfaces can fully steadily fit in wafer substrate 10.
Step 3
In conjunction with image sensing wafer 20
On each crystalline substance pad 11, stick and establish image sensing wafer 20, and make image sensing wafer 20 be connected to brilliant each pin that fills up around 11 via the lead-in wire bonding.
Step 4
In conjunction with glass plate 40
As Fig. 1, shown in Figure 3, after being coated with one deck viscose in side frame plate 30 tops then comprehensively, glass plate 40 is fitted in the end face of side frame plate 30, at this moment, the shallow slot 311 of side frame 31 end faces is also brought into play its regulating action, make unnecessary viscose will be subjected to glass plate 40 to push and enter in the shallow slot 311, thus, glass plate 40 can fully steadily fit in side frame plate 30 tops.
Step 5
Cutting
As shown in Figure 3, solidify and glass plate 40 fits tightly after on the side frame plate 30 at colloid, cut with two stage manner: the phase I is the rib 32 along A, B dotted line cutting glass plate 40 and side frame plate 30, the main purpose in this stage is to make glass plate 40 become with side frame 31 unidimensional individuality such as have, and the side frame 31 that connects each other also must be separated: second stage is for to cut at substrate 30 along the C dotted line, form independently image sensor whereby, after finishing cutting, promptly constitute image sensor of the present invention as described in Figure 4.
As shown in Figure 4, image sensor of the present invention comprises the wafer substrate 10 that forms brilliant pad 11, is located on side frame 31 around the brilliant pad 11, is arranged at the image sensing wafer 20 on the wafer substrate 10 brilliant pads 11 and is bonding on the glass plate 40 that side frame 31 upper surfaces are sealed in image sensing wafer 20 side frame 31 inside whereby.
Form so as to lens group location hole 14 on the wafer substrate 10 of side frame 31 peripheries in conjunction with lens group 50.
Form several brilliant pad location holes 13 on the wafer substrate 10 around the brilliant pad 11; Be convexly equipped with in the side frame 31 bottom surface shallow slots 312 with wafer substrate 10 on brilliant pad location hole 13 corresponding side frame projections 34.
During use, as Fig. 1, shown in Figure 5, image sensor of the present invention is used in the lump in conjunction with lens group 50, on substrate 10 each brilliant pad 11 around be provided with lens group location hole 14, when carrying out the cutting process of second stage, i.e. reservation has wafer substrate 10 parts of lens group location hole 14; Be provided with lens group reference column 51 in lens group 50 bottoms, be sticked in the lens group location hole 14 with correspondence.
The encapsulation process of image sensor of the present invention is for utilizing side frame plate 30 and glass plate 40 first generalization assemblings, thereafter constitute number image sensor individuality through cutting step again, compared to commonly using earlier with the substrate cut individuation, be bonding on side frame, glass dustproof sheet on the substrate one by one in the manpower mode again, the present invention is not only promoted packaging efficiency, and encapsulation process do not have and involve a large amount of manual work, and its finished product yield is easier to control, really having possessed remarkable efficacy and promoted, files an application in the whence in accordance with the law.
Claims (7)
1, a kind of image sensor package method, it comprises that formation supplies in conjunction with the brilliant pad of image sensing wafer step, in conjunction with the side frame step, in conjunction with the image sensing wafer step and in conjunction with the glass plate step; It is characterized in that the brilliant pad of described formation step is for being processed to form several brilliant pads in advance on wafer substrate; In conjunction with the side frame step for being incorporated on the wafer substrate that form several brilliant pads with mutual several rectangle side frame individualities connected to one another, and make each side frame individuality respectively correspondence be located on around each brilliant pad, and form shallow slot respectively in each side frame end face; In conjunction with the glass plate step is in side frame plate top applying glass plate; After in conjunction with the glass plate step, also comprise cutting glass plate, side frame plate and substrate to form the cutting step of independent image sensor.
2, image sensor package method according to claim 1, it is characterized in that described cutting step comprise cutting glass plate and side frame plate phase I and substrate is cut to form the independently second stage of image sensor; Phase I is to make glass plate become with side frame unidimensional individuality such as have, and separates the side frame individuality that connects each other.
3, image sensor package method according to claim 1 and 2 is characterized in that described in conjunction with being coated with on the side frame plate in the glass plate step so as to binding the viscose of glass plate.
4, image sensor package method according to claim 1 and 2 is characterized in that described several substrate orientation holes and the side frame plate reference column that forms brilliant pad and form corresponding combination in conjunction with wafer substrate in the side frame step and side frame plate surface respectively.
5, a kind of image sensor, it comprises the wafer substrate that forms brilliant pad, be located on side frame around the brilliant pad, be arranged at the image sensing wafer on the brilliant pad of substrate and be bonding on the glass plate that the side frame upper surface is sealed in image sensing wafer side frame inside whereby; It is characterized in that described side frame upper surface forms the shallow slot of scalable viscose amount.
6, image sensor package method according to claim 5 is characterized in that forming so as to the lens group location hole in conjunction with lens group on the wafer substrate of described side frame periphery.
7, image sensor package method according to claim 5 is characterized in that forming around the brilliant pad on the described wafer substrate several brilliant pad location holes; The side frame bottom surface forms shallow slot, and in shallow slot, be convexly equipped with wafer substrate on the corresponding side frame projection of brilliant pad location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100085398A CN1674262A (en) | 2004-03-25 | 2004-03-25 | Image sensing device and encapsulating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100085398A CN1674262A (en) | 2004-03-25 | 2004-03-25 | Image sensing device and encapsulating method thereof |
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| Publication Number | Publication Date |
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| CN1674262A true CN1674262A (en) | 2005-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2004100085398A Pending CN1674262A (en) | 2004-03-25 | 2004-03-25 | Image sensing device and encapsulating method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100533195C (en) * | 2006-10-30 | 2009-08-26 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation method of lens module |
| CN101523892B (en) * | 2006-10-18 | 2011-10-12 | 浜松光子学株式会社 | Imaging device holding structure and imaging device |
| CN101704497B (en) * | 2009-11-11 | 2012-08-29 | 中国科学院上海微系统与信息技术研究所 | Structure of single-etch tank hermetically packaged by MEMS in wafer level and method thereof |
| CN108464000A (en) * | 2015-12-09 | 2018-08-28 | 提坦医疗公司 | Three-dimensional imaging sensor device and method for manufacturing the imaging sensor pair used in three-dimensional imaging |
-
2004
- 2004-03-25 CN CNA2004100085398A patent/CN1674262A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101523892B (en) * | 2006-10-18 | 2011-10-12 | 浜松光子学株式会社 | Imaging device holding structure and imaging device |
| CN100533195C (en) * | 2006-10-30 | 2009-08-26 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation method of lens module |
| CN101704497B (en) * | 2009-11-11 | 2012-08-29 | 中国科学院上海微系统与信息技术研究所 | Structure of single-etch tank hermetically packaged by MEMS in wafer level and method thereof |
| CN108464000A (en) * | 2015-12-09 | 2018-08-28 | 提坦医疗公司 | Three-dimensional imaging sensor device and method for manufacturing the imaging sensor pair used in three-dimensional imaging |
| CN108464000B (en) * | 2015-12-09 | 2020-10-02 | 提坦医疗公司 | Stereoscopic imaging sensor device and method for manufacturing image sensor pair used in stereoscopic imaging |
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