CN1668461A - Laminated glazing panel - Google Patents

Laminated glazing panel Download PDF

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Publication number
CN1668461A
CN1668461A CNA03817152XA CN03817152A CN1668461A CN 1668461 A CN1668461 A CN 1668461A CN A03817152X A CNA03817152X A CN A03817152XA CN 03817152 A CN03817152 A CN 03817152A CN 1668461 A CN1668461 A CN 1668461A
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CN
China
Prior art keywords
luffer boards
laminated glass
glass luffer
plastic layer
layer
Prior art date
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Granted
Application number
CNA03817152XA
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Chinese (zh)
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CN1668461B (en
Inventor
S·R·戴
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PEILEKINTEN COMMON CO Ltd
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PEILEKINTEN COMMON CO Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/1271—Supports; Mounting means for mounting on windscreens
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A laminated glazing panel is disclosed comprising two glass plies and a plastic ply having one or more light emitting diodes mounted on a circuit board laminated between the glass plies, forming an LED device. The circuit board is ordinarily a flexible circuit board comprising a substrate (of, for example, polyimide or polyester) and a conductive layer (for example, a copper foil or conductive ink). Preferably, the plastics ply has a thickness before lamination of 2 mm or lower and the thickness of the laminated glazing panel is 8 mm or lower. A plurality of light emitting diodes may be mounted on the flexible circuit board and laminated between the glass plies; the resultant glazing panel may further comprise indicia on at least one ply. Also disclosed are two processes for the production of a laminated glazing panel, each comprising positioning an LED device in a cut-out in a plastic ply and interleaving the plastic ply between two glass plies, prior to laminating the plies. One or more plastic plies may be used, and the LED device may be coated in a plastic material. Laminated glazing panels of the invention may be used in a window, door or screen.

Description

The laminated glass luffer boards
The present invention relates to the laminated glass luffer boards.More particularly, the present invention relates to comprise layer glass layer, one deck plastic layer and between glass coating the laminated glass luffer boards of stacked one or more photodiodes.
The laminated glass luffer boards generally include the layer glass layer and between described glass coating staggered one deck plastic layer (generally being polyvinylbutyral), just plastic layer extends between glass coating, and basically with they common extensions.The so-called interlayer of described plastic layer.For fear of wakeing suspicion, term " plastics " is generally and makes the used material of interlayer as used herein, rather than the mechanical property of interlayer.The laminated glass luffer boards use in window (particularly automotive window), door and screen.
The laminated glass luffer boards are usually by laminating method processing, and described laminating method is included in and makes synthetic glass layer/interlayer/glass layer structure stand quite high temperature (generally above 100 ℃) and pressure (generally surpassing 5 normal atmosphere) in the autoclave.During described lamination process, interlayer tends to slippage or flows, and guaranteeing with glass coating excellent contact being arranged, thereby has the good optical performance.The laminated glass luffer boards also can be by the processing of cast-in-place method, and wherein fluid interlayer material is introduced between glass coating, and cured in situ processing (as by heat or ultraviolet radiation), to make plastic sandwich.The cast-in-place method is not preferable methods for the laminated windows panel products, because the machinery of plywood and fracture property are not suitable for using in window, door or screen.
Usually preferably provide device, as the laminated glass luffer boards of telltale, light source or transmitter with practicality of improving described plywood.US3,317,906 disclose a kind of improved safe floor lamination of indicator of instrument device incorporated therein.Disclosed device indicating comprises the pointer with electromagnetic drive and the mechanism of diagraph, and described device is between a pair of plywood that is disposed on circle in the plastic sandwich.
Than above-mentioned reinforcement mechanism more the sensitive device also be arranged in the laminated glass luffer boards so that improve the practicality of described plywood once more.
US4,968,895 disclose a kind of laminated glass, its with the form of photorectifier thickness in conjunction with this sensitive device, so that have a mind to the recess that produces at the plastic sandwich endoadaptation of plywood.This has just inspired photorectifier should be positioned near the interlayer in one of them edge of glass, extends beyond glass edge with the diode wire that allows to be used to be connected on the circuit.
By one or more photodiodes (" LEDs ") are set in described plywood, so that a kind of laminated glass luffer boards with improved practicality to be provided by necessary requirement, and need provide a kind of being used for that one or more photodiodes are combined in the simple and efficient method in road in the laminated glass luffer boards.
Surprisingly, the inventor disclose be installed on the circuit card and between the layer glass layer stacked one or more photodiodes, it can be fit to lamination process.
Therefore, the invention provides a kind of laminated glass luffer boards, it comprise layer glass layer, one deck plastic layer and between described glass coating stacked one or more photodiodes, wherein said one or more photodiodes are installed on the circuit card.
The one or more photodiodes that are installed on the circuit card are preferably formed a light-emitting diode assembly.Surprisingly, this light-emitting diode assembly (" LED matrix ") can be fit to lamination process, because photodiode and circuit complicated usually, fine pathways often are easy to the mechanism that breaks down under the situation of high temperature and high pressure.For example, the diffusion of the boiling of spuious moisture or pore or bubble, and inharmonious between thermal expansivity can both breaking circuits, or damage light-emitting diode assembly.
Owing to many reasons, so best stacked light-emitting diode assembly.Photodiode can be used as indicating unit and uses, and can produce multi-wavelength's suitable intensive light.For example, when plate uses as window, and indicating unit is for exterior lighting under the visual situation, and light intensity is extremely important, and photodiode has very long work-ing life, and it is comparable to the expected service life of laminated glass luffer boards.In addition, stacked light-emitting diode assembly particularly has a plurality of photodiodes that are installed on the circuit card, can save the requirement that is connected to many circuit on each photodiode, and this requirement is very common; Or rather, the wall scroll circuit is connected on the circuit card, can powers for photodiode fully via suitable coupling device.
One or more photodiodes are installed on the circuit card, and described circuit card preferably includes the flexible PCB with substrate and conducting stratum.
One or more photodiodes can be installed, and can on flexible PCB, be electrically connected, and can not change them.Surprisingly, these light-emitting diode assemblies (circuit that usually has rapid wear) also can be fit to lamination process, although there are some problems, boiling as softening agent, but may cause opening circuit of one or more members in the light-emitting diode assembly, or one or more photodiode lost efficacy (depending on stacked particular case) itself.
The material of flexible PCB should be attached to stacked interlayer well, to prevent totally reducing of laminated windows plate.Therefore can preferably not be subject to the influence of moisture or the material of impermeable moisture, because any circuit board material all might change the ability of intensity, bond properties and the gas dissolved of sandwich material then with moisture transmission to laminate.
Substrate included in flexible PCB is preferably polymeric material.Especially, usually use two kinds of materials for this purpose, just polyimide and polyester.Polyimide is tawny normally, and it uses very favourable, because it can resist welding process, one or more photodiodes can be connected on the conducting stratum by welding process.Polyester can be transparent or semitransparent, because circuit card has high light transmission and low visibility, so can preferred polyester.Yet, when using welding to be attached to one or more photodiodes on the conducting stratum, because polyester tends to cracking, so preferably use conductive adhesive.
Conducting stratum preferably adheres to on-chip tinsel.Described tinsel is generally and is attached to on-chip copper tinsel, is corroded subsequently, to produce required circuit path.Can use polyester film, acrylic film and Resins, epoxy are attached to tinsel on the substrate; Adhere to and usually need enough heat and pressure (wherein each parameter in heat and the pressure is all being determined as the case may be).In case corrosion, on-chip metal foil pathways can further be covered and insulation as polyester, vinylformic acid or Resins, epoxy by material layer.
Directly the conductive ink of contact substrate is the material of another kind of form, and it can make and be used for forming conducting stratum.Conductive ink can be deposited on the substrate, for example in silk screen print method.Conductive ink may be difficult to welding, so usually use polyester substrate (preferably conductive adhesive, as discussing in front, be used for the combination of one or more photodiodes).
Flexible PCB preferably also comprises rigid layer, and it can provide extra rigidity for circuit card by the thickness that increases described circuit card.Can use any of many rigid materials, it comprises metal sheet, paper phenol thin plate and sheets of glass or Resins, epoxy thin plate.
Flexible PCB preferably extends outwardly beyond the edge of laminated glass luffer boards, circuit card is connected on the power supply allowing to.Yet, circuit card can be selected to terminate in the laminated glass luffer boards, can be connected on the electrical current carriers or this its and to electrically contact with electrical current carriers, described electrical current carriers and glass port are as a whole, conducting plates for example, or the thin surface coating of metal or conductive metal oxides, itself be connected on the power supply or and electrically contact with power supply.
Depend on the use of laminated glass luffer boards expection, many photodiodes can be installed on the circuit card.Many photodiodes (for example becoming row to arrange) allow the quite complicated information of text or other to show onboard.As selectable scheme, photodiode can be around the part or all of setting of the periphery of laminated windows plate, so that for safety or aesthetic former thereby the skeletal lines through decorating of plate is provided.In order to improve the practicality of this plate, plate can also be included in the mark on one deck at least, with the transmission information relevant with photodiode, and perhaps when the laminated glass luffer boards have been finished, the outward appearance of modifier.
Plastic sandwich can comprise the otch in it, to help to be installed in the stacked of one or more photodiode successes on the circuit card in the glass luffer boards.The preferred laminated plastics layer that uses comes the stacked one or more photodiodes that are installed on the interior circuit card of glass luffer boards.Be used under the stacked situation at three layers, its middle layer is provided with otch.
One or more photodiodes and circuit card can scribble material with the plastic layer compatibility to small part.Be used for stacked and be provided with under the situation of otch at the monolayer plastic layer, coating on the light-emitting diode assembly is easy to device is sticked on the plastic layer on every side, and guarantee the low visibility of the connection between two-layer, and be easy to directly photodiode be adhered to contiguous glass coating.Being used for stacked and middle layer at the three-layer plastic layer is provided with under the situation of otch, coating on the light-emitting diode assembly is easy to device is sticked on the plastic layer on every side, and guarantee the low visibility of the connection between two-layer, and be easy to directly photodiode be adhered to contiguous plastic layer, and compensation any not enough relative thickness between light-emitting diode assembly itself and intermediate plastic layer.Therefore light-emitting diode assembly more preferably scribbles the material similar to the material of plastic layer.
Plastic layer generally includes polyvinylacetal, is preferably polyvinylbutyral (polyvinylbutyral).Plastic layer preferably had 2mm or thinner thickness before stacked, plastic layer more preferably has 1mm or minimal thickness more before stacked, most preferably is 0.8mm.The thickness of light-emitting diode assembly is generally less than the thickness of plastic layer, so that its sealing basically after stacked.Because it is this thin plastic layer can be constructed thin stacked, therefore very favourable.The thickness of laminated glass luffer boards is preferably 8mm or thinner.
On the other hand, the invention provides a kind of method that is used for processing laminated glass luffer boards, described laminated glass luffer boards are included in plastic layer staggered between the glass coating, and make described layer carry out stacked, wherein before stacked, in plastic layer, reserve cutout regions, with containment circuit board, one or more photodiodes are installed on the described circuit card, described circuit card and one or more photodiode scribble material with the material compatibility of plastic layer to small part together, and described circuit card is positioned at the cutout regions in the plastic layer.
On the other hand, the present invention also provides a kind of method that is used for processing laminated glass luffer boards, described laminated glass luffer boards comprise that to make the two layers of plastic layer paired, reserve cutout regions in the upper plastic layer, with containment circuit board, one or more photodiodes are installed on the described circuit card, locate described circuit card in cutout regions, connect another plastic layer and paired plastic layer, thereby form composite bed, staggered composite bed and stacked described layer between two glass coatings.
The size of cutout regions and light-emitting diode assembly big or small close; Accurate deviation dimensionally greatly is 0.5mm.
The circuit card that another aspect of the present invention is described and one or more photodiode preferably scribble material with the material compatibility of plastic layer to small part, preferably scribble the material identical materials with plastic layer in addition.
Usually, one or more photodiodes whole thickness that the coated circuit board at place is installed can be compared with the thickness of the plastic layer that is positioned.The thickness of many photodiodes greatly is 500um, but the mean thickness of flexible PCB is 200um, thereby light-emitting diode assembly can reach 0.7mm in the thickest part.Plastic layer usually is polyvinyl butyral acetal (" PVB "), is 0.25mm and 0.38mm though require the thickness of layer, and the thickness of plastic layer is generally 0.76mm.
Laminated glass luffer boards of the present invention have many purposes, it comprise be used in window (particularly automotive window), the door or screen on.Photodiode can make the laminated glass luffer boards have various functions.These functions for example comprise: illumination, photodiode, its transmission signal or provide aesthetic function and transmitter of serving as a mark by limiting image (comprising mobile image), it comprises humidity sensor (for example, optics humidity sensor) and proximity sensor.
The present invention illustrates by following accompanying drawing, but be not limited only to this, wherein: Fig. 1 shows the section of the light-emitting diode assembly folded in laminated glass luffer boards middle level, Fig. 2 shows the orthographic plan that is installed in the photodiode on the flexible PCB, and Fig. 3 shows when it and in a single day is installed in circuit card and when folded, is used as the layout of the photodiode of mark in laminated glass luffer boards middle level.
Fig. 1 shows the laminated glass luffer boards 1 with light-emitting diode assembly 4, and it comprises the photodiode 2 that is installed on the flexible PCB 3, and described laminated glass luffer boards 1 carry out stacked between upper glass layer 5 and lower-glass layer 6.Described light-emitting diode assembly 4 is positioned in the polyvinylbutyral layer 7.By the electric connector (not shown) being connected on the flexible PCB 3 of glass luffer boards 1 exterior lateral area, realize the electrical connection of light-emitting diode assembly at connecting zone 8.
Fig. 2 illustrates in greater detail the light-emitting diode assembly 4 before stacked.Photodiode 2 is installed on the conducting path 9 on the flexible PCB 3 (by Nitto UK Ltd supply).Described flexible PCB 3 can be connected on the power supply (not shown) at connecting zone 8 places.
Fig. 3 shows the example that can be arranged on the mark on vehicle (as the truck) windshield glass.According to the present invention, the mark of each example is combined in one or more photodiodes of windshield glass inner stacks.Fig. 3 (a) shows the photodiodes 11,12 of two 5 row, 7 row.Use the suitable electrical addressing and the car speed of mensuration, the speed of described ranks indication automobile is by numeral 30 expressions.Fig. 3 (b) shows the typographic(al) mark 13 of expression oil.When it was lighted, photodiode 2 provided low oil warning.Fig. 3 (c) shows the typographic(al) mark of expression fuel.When it was lighted, photodiode 2 provided the low fuel warning.Fig. 3 (d) shows the typographic(al) mark of expression lock.When it is lighted, the indication that photodiode 2 provides vehicle to lock.Fig. 3 (e) shows the typographic(al) mark of expression vehicle alarm.When it was lighted, photodiode 2 provided the indication of vehicle alarm operation.
Under the situation of warning horn or warning label, require the flicker photodiode, to attract user's attention.The printing of mark (being figure) part can be printed onto stacked glass surface Anywhere or the surface of circuit card.
Flexible PCB is made multiple conductive path layer and insulating substrate layer in a variety of forms.Described photodiode is preferably thinner than plastic layer, thereby about preferably thin 1mm.Suitable photodiode can obtain from commerical prod, for example be red, green, yellow, orange, orange red and scarlet (for example from Brea, CA, the Idea of USA, Inc.).
Process laminated glass luffer boards of the present invention as follows.PVB layer 7 spreads upon on the glass coating 5.Part or all of otch corresponding to the shape of flexible PCB 3 is produced in the PVB layer 7.The flexible PCB 3 that scribbles the PVB material has one or more photodiodes 2 mounted thereto, and is positioned in the otch of PVB layer 7.Second glass coating 6 spreads upon the top of PVB layer 7.Generally known in prior art, promptly general temperature is approximately 100 ℃ to 150 ℃, and pressure is approximately under 5 to 15 atmospheric situations, and is described stacked by the degassing and hot-pressing processing.
Selectable working method comprises by they are rolled makes two-layer PVB layer 7 butt joint together.Described layer extends basically jointly.Described render and set is on glass coating 5.Part or all of otch corresponding to the shape of flexible PCB 3 is produced in the upper strata PVB layer 7.Flexible PCB 3 has one or more photodiodes 2 mounted thereto, and is positioned in the otch of upper strata PVB layer 7.Another PVB layer 7 is positioned at the top of two-layer PVB layer 7.Second glass coating 6 is positioned at the top of PVB layer 7.Generally known in prior art, promptly general temperature is approximately 100 ℃ to 150 ℃, and pressure is approximately under 5 to 15 atmospheric situations, and is described stacked by the degassing and hot-pressing processing.

Claims (19)

1. laminated glass luffer boards, it comprises layer glass layer, one deck plastic layer and carries out stacked one or more photodiodes that between glass coating wherein said one or more photodiodes are installed on the circuit card.
2. laminated glass luffer boards as claimed in claim 1, wherein said circuit card comprises the flexible PCB with substrate and conducting stratum.
3. laminated glass luffer boards as claimed in claim 2, wherein substrate comprises polyimide.
4. laminated glass luffer boards as claimed in claim 2, wherein substrate comprises polyester.
5. as each described laminated glass luffer boards of claim 2-4, wherein conducting stratum is for adhering to on-chip tinsel.
6. as each described laminated glass luffer boards of claim 2-4, wherein conducting stratum is the conductive ink that directly contacts substrate.
7. as each described laminated glass luffer boards of claim 2-6, wherein flexible PCB also comprises rigid layer.
8. as each described laminated glass luffer boards of claim 2-7, wherein flexible PCB preferably extends outwardly beyond the edge of laminated glass luffer boards, circuit card is connected on the power supply allowing to.
9. as each described laminated glass luffer boards of above-mentioned claim, wherein also be included in mark on one deck at least.
10. as each described laminated glass luffer boards of above-mentioned claim, wherein plastic layer comprises the otch in it, and is successfully stacked with the one or more photodiodes that help to be installed on the circuit card in the glass luffer boards.
11., wherein use the laminated plastics layer to come the stacked one or more photodiodes that are installed on the interior circuit card of glass luffer boards as each described laminated glass luffer boards of above-mentioned claim.
12. as claim 11 or 12 described laminated glass luffer boards, wherein one or more photodiodes and circuit card to small part scribbles the material with the plastic layer compatibility.
13. as each described laminated glass luffer boards of above-mentioned claim, wherein plastic layer had 2mm or thinner thickness before stacked.
14. as each described laminated glass luffer boards of above-mentioned claim, wherein the thickness of laminated glass luffer boards is 8mm or thinner.
15. method that is used for processing laminated glass luffer boards, described laminated glass luffer boards are included in plastic layer staggered between the glass coating, and make described layer carry out stacked, wherein before stacked, reserve cutout regions in plastic layer, with containment circuit board, one or more photodiodes are installed on the described circuit card, described circuit card and one or more photodiode scribble material with the material compatibility of plastic layer to small part together, and described circuit card is positioned in the cutout regions in the plastic layer.
16. a method that is used for processing laminated glass luffer boards comprises: make the two layers of plastic layer paired; Reserve cutout regions in the upper plastic layer, with containment circuit board, one or more photodiodes are installed on the described circuit card; Locate described circuit card in cutout regions; Connect another plastic layer and paired plastic layer, thereby form composite bed; Staggered composite bed and stacked described layer between two glass coatings.
17. the method that is used for processing laminated glass luffer boards as claimed in claim 16, wherein said circuit card and one or more photodiode to small part scribble the material with the material compatibility of plastic layer.
18. as claim 15 or the 17 described methods that are used for processing laminated glass luffer boards, wherein one or more photodiodes are installed the whole thickness of the coated circuit board at place and can be compared with the thickness of the plastic layer that is positioned.
19. as the purposes of each described laminated glass luffer boards of claim 1-14, it uses in window, door or screen.
CN03817152.XA 2002-07-19 2003-07-17 Laminated glazing panel Expired - Lifetime CN1668461B (en)

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CN112135729B (en) * 2018-03-20 2023-07-28 Agp美洲股份公司 Low-distortion automobile interlayer camera heating system
CN112135729A (en) * 2018-03-20 2020-12-25 Agp美洲股份公司 Low-distortion automobile interlayer camera heating system
CN108973609B (en) * 2018-07-16 2020-04-10 福耀玻璃工业集团股份有限公司 Electric heating window glass capable of displaying light
CN108973609A (en) * 2018-07-16 2018-12-11 福耀玻璃工业集团股份有限公司 A kind of electric heating glass pane for capableing of luminescence display
CN111225793A (en) * 2018-09-25 2020-06-02 法国圣戈班玻璃厂 Composite glass plate and method for manufacturing same
CN111225793B (en) * 2018-09-25 2023-07-18 法国圣戈班玻璃厂 Composite glass sheet and method for manufacturing same
CN112770905A (en) * 2018-10-09 2021-05-07 大众汽车股份公司 Protective glass for vehicle
CN112770905B (en) * 2018-10-09 2022-09-23 大众汽车股份公司 Cover glass for vehicle

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ATE504437T1 (en) 2011-04-15
EP1534513A1 (en) 2005-06-01
JP2005533737A (en) 2005-11-10
JP4538318B2 (en) 2010-09-08
BRPI0312740B1 (en) 2015-12-15
US20050238857A1 (en) 2005-10-27
CN1668461B (en) 2014-07-30
EP1534513B1 (en) 2011-04-06
DE60336656D1 (en) 2011-05-19
GB0216787D0 (en) 2002-08-28
BR0312740A (en) 2005-04-26
US8613997B2 (en) 2013-12-24
WO2004009349A1 (en) 2004-01-29
AU2003254467A1 (en) 2004-02-09

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